201107603 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種減壓系統、及使用該減壓系統的真空處 理裝置。該減壓系統係具備：例如低溫泵(cryo-pump)或低溫 捕集器（cryo-trap)等之複數個減壓裝置；以及對該複數個減 壓裝置供給經壓縮過的冷媒之壓縮裝置。 【先前技術】 習知作為形成極高真空的裝置，已知有一種記載於例如專 利文獻1的低溫泵或記載於專利文獻2的低溫捕集器等使氣體 凝縮於極低溫面並予以捕捉的減壓裝置。在利用冷媒膨脹時之 吸熱而形成極低溫面的此種減壓裝置中，將經壓縮過的冷媒送 給至減壓裝置_縮裝置是不可缺少的，社述減壓I置係藉 由與此種壓縮裝置之間的協力運作來實現超高真空。 ...在製造液晶顯示器等之顯示裝置、CPU $記憶體等之半 導體裝置等的製造裝置巾，射_由上述減壓妓及壓縮裝 置所構成的職單元，作為構献製造裝氣、 製造裝置的叢集___ =了 =況下’顏裝置需要的個數與真空室之個數相 同且為了達成縮小製造裝置本身所佔有的 個減壓裝置共U台 彳此種複數 全挪衣直的形式來構成減壓系統。 [專利文獻] (專利文獻丨)日树開纖-7G737號公報 201107603 (專利文獻2)曰本特開2009-19500號公報 【發明内容】 (發明所欲解決的課題） 、然而近年來’從保護地球環境的觀點來看，即使是上述製 造裝置，也被強烈期待能省能源化。另—方面，在幻台壓縮 襄置達成複數個減愿裝置之職能力的上述減壓系統中，雖然 可縮!衣k裝置本身所佔有的空間，但是經壓縮裝置壓縮過的 冷媒之供給量在各魏個賴錢巾僅能達__程度。由 運轉動作狀態不同之複數健空室所構成的上述叢集型之製 造裝置，對於各複數個減壓裝置中所需求的排氣能力通常為不 同，若如上舰，冷叙供給#在各減㈣置_為相同的程 度，則就連不需要的冷媒也會供給至減壓裝置。因此，在以！ 台_裝置達成複數個減塵裝置之排氣能力的減麗系統中，由 於不免會使不需要的冷媒從麗縮裝置屋送，所以此麵送機制 會大大地妨礙壓縮裝置的省電力化、甚至減㈣統的省能源 化0 本發明係前於上频況_發絲者，其目的在於提供 一種減消耗電力，並以1台壓縮裝置達成複數個減職置 之排氣能力的減壓系統及真空處理褒置。 (解決課題的技術手段） 本發明之一態樣，係提供一種減麼系統。減壓系統係具 備：複數個減廢裝置，其係各別包含冷卻部，用以接收經壓縮 201107603 過的冷媒’且當使該經壓縮過的冷媒絶熱膨脹時可補充氣體； 壓縮裝置’其係包含具有交流電動機的壓縮部，且以相應於前 述交流電動機之婦速度的流量，從前賴縮部供給前麟壓 縮過的冷媒至前述複數個減壓裝置之各冷卻部；溫度檢測部， 其係檢測前述各減壓裝置的冷卻部之溫度；變頻裴置，其係可 對供給至前述交流電動機的交流電源之頻率進行變更；以及頻 率控制部’其係控制前述變頻裝置之輸出頻率，且前述頻率控 制部，係在前述複數個減魏置巾之至少—個_裝置的冷卻 部之溫度為第1臨限值以上時，相對地提高前述變頻裝置之輸 出頻率，而在前述複數個減壓裝置全部的冷卻部之溫度下降至 未滿前述第1臨限值時，相對地降低前述變雜置之輸出頻 率。 【實施方式】 以下，係參照圖1至圖6說明本發明之減壓系統、及使用 該減壓系統的真空處理裝置之一實施形態。圖！係顯示作為真 工處理裝置的半導體裝置之製造裝置1G的概略構成圖。圖2⑷ 係顯示真空排氣部之構成的概略構成圖；圖2 (b)係顯示高真 空排氣部之構成的概略構成圖。 如圖1所示，半導體裝置之製造裝置1〇，係一種對基板 W形成由預定金屬等所構成的膜之裝置。製造裝置1〇係具 有：包含例如進行濺鍍處理等之複數個室(chamber)的第！處理 部11 ;包含例如對基板W進行熱處理等之複數個室的第2處 201107603 理部12;以及連接此等第1及第2處理部11、12的缓衝室13。 第1處理部11，係具有剖面呈多角形狀的搬運室15。在 該搬運室15中’設有2個負載鎖定室㈣1〇也—γ)16&、 16b、4個至17、18、19、2〇、及1個緩衝室13，此等經由與 各自對應的_ 21來連接。各個室，係藉由與之對應的閘閥 21的開啟來與搬運室15連通，反之，藉由與之對應的閘閥21 的關閉來切斷與搬運室的連通。在製造中，係經由 負載鎖定室16a而搬入基板w，並經由負載鎖定室i6b將基板 w搬出至製造裝置1G之外部。4個室17、i8、m，係一 種在真空環境下執行雌板1之各種處理的室，例如室17、 20係使用雜法將由紹所構成的金屬膜形成於基板w，而室 18、19則是使用長拋猶法(1〇ng thr〇w sputteri啤m她⑽將由 銘所構成的金屬獅成於基板w。在搬運室15之内部，係搭 載有用以搬運基板w的搬運機器人22。搬運機器人22，係進 行從搬運室！5朝負載鎖定室16a、16b、室17、i8、19、2〇 及緩衝室13之(以及反方向之)基板w的搬運。 第2處理部，係與第】處理部n烟，具有剖面呈多 角形狀的搬運室25。在該搬運室25中，係在緩衝室13已連 通的狀態下連接，並且室26、27、28、29、3()、％經由與各 自對應的·〗21而連接。各敏，係藉由與之對應的間間η 與搬運室25的連通’反之，藉由與之對應的閑間Μ 的關閉來切斷與搬運室25的連通。在第2處理部U之室％ t ,係對因各種處理而變成高溫的基板w進行冷卻處理201107603 VI. Description of the Invention: [Technical Field] The present invention relates to a pressure reducing system and a vacuum processing apparatus using the same. The pressure reducing system includes a plurality of pressure reducing devices such as a cryo-pump or a cryo-trap, and a compression device that supplies the compressed refrigerant to the plurality of pressure reducing devices. . [Prior Art] As a device for forming an extremely high vacuum, there is known a cryopump described in Patent Document 1, or a cryotrapper described in Patent Document 2, which condenses a gas on a very low temperature surface and captures it. Pressure reducing device. In such a decompression device that forms a very low temperature surface by utilizing heat absorption during expansion of the refrigerant, it is indispensable to supply the compressed refrigerant to the decompression device, and the decompression device is used by The synergy between such compression devices operates to achieve ultra-high vacuum. In the manufacture of a display device such as a display device such as a liquid crystal display or a semiconductor device such as a CPU or a memory device, the device is composed of the above-described decompression device and the compression device, and is used as a component to manufacture air and manufacture. The cluster of devices ___ = = the condition that the number of the device needs to be the same as the number of vacuum chambers, and in order to achieve the reduction of the pressure reducing device occupied by the manufacturing device itself, the total number of vacuum devices is U. Form to form a decompression system. [Patent Document] (Patent Document) Japanese Unexamined-Japanese Patent Publication No. Hei. No. 2009-07603 (Patent Document 2) Japanese Patent Laid-Open Publication No. 2009-19500 (Summary of the Invention) From the viewpoint of protecting the global environment, even the above-mentioned manufacturing equipment is strongly expected to save energy. On the other hand, in the above-described decompression system in which the phantom compression device achieves the functions of a plurality of reduction devices, although the space occupied by the device itself can be reduced, the supply of the refrigerant compressed by the compression device is In each Wei Lai money towel can only reach __ degree. The above-described cluster type manufacturing apparatus including a plurality of vacuum chambers having different operation states has different exhaust capacities required for each of the plurality of pressure reducing devices, and if the ship is the same, the cold supply is reduced by (four). When the _ is the same level, even the unnecessary refrigerant is supplied to the decompression device. So, in the! In the fascinating system in which the venting capability of the plurality of dust-reducing devices is reached, the unnecessary refrigerant is inevitably sent from the condensing device, so that the surface feeding mechanism greatly hinders the power saving of the compression device. Even the energy saving of the (four) system is based on the upper frequency condition _ hair feeder, the purpose of which is to provide a reduced power consumption, and a plurality of compression devices to achieve the decompression of the exhaust capacity System and vacuum processing equipment. (Technical means for solving the problem) In one aspect of the present invention, a subtractive system is provided. The decompression system is provided with: a plurality of waste reduction devices each including a cooling portion for receiving the compressed refrigerant "201107603" and replenishing the gas when the compressed refrigerant is adiabatically expanded; the compression device And a compression unit having an AC motor, and supplying a refrigerant compressed by the front lining to the respective cooling units of the plurality of pressure reducing devices from a front flow rate portion corresponding to a flow rate of the AC motor speed; and a temperature detecting portion Measuring a temperature of a cooling unit of each of the pressure reducing devices; a frequency conversion device that changes a frequency of an alternating current power supply to the alternating current motor; and a frequency control unit that controls an output frequency of the frequency conversion device, and The frequency control unit relatively increases the output frequency of the inverter device when the temperature of the cooling unit of at least one of the plurality of defrosting towels is equal to or greater than the first threshold value, and the plurality of subtractions are When the temperature of all the cooling units of the pressure device drops below the first threshold value, the output frequency of the variable is relatively lowered. [Embodiment] Hereinafter, an embodiment of a pressure reducing system of the present invention and a vacuum processing apparatus using the same will be described with reference to Figs. 1 to 6 . Figure! A schematic configuration diagram of a manufacturing apparatus 1G of a semiconductor device as a processing device is shown. Fig. 2 (4) is a schematic configuration diagram showing the configuration of the vacuum exhaust unit, and Fig. 2 (b) is a schematic configuration view showing the configuration of the high vacuum exhaust unit. As shown in Fig. 1, a manufacturing apparatus for a semiconductor device is a device for forming a film made of a predetermined metal or the like on a substrate W. The manufacturing apparatus 1 includes: a plurality of chambers including, for example, a sputtering process; The processing unit 11 includes, for example, a second portion of a plurality of chambers for heat-treating the substrate W, and the like, and a buffer chamber 13 that connects the first and second processing units 11 and 12. The first processing unit 11 has a transfer chamber 15 having a polygonal cross section. In the transfer chamber 15, 'two load lock chambers (four) 1 〇 - γ) 16 & 16 b, 4 to 17, 18, 19, 2 〇, and 1 buffer chamber 13 are provided, and these are corresponding to each other. _ 21 to connect. Each of the chambers is in communication with the transfer chamber 15 by the opening of the gate valve 21 corresponding thereto, and the communication with the transfer chamber is interrupted by the closing of the gate valve 21 corresponding thereto. In the manufacturing, the substrate w is carried in via the load lock chamber 16a, and the substrate w is carried out to the outside of the manufacturing apparatus 1G via the load lock chamber i6b. The four chambers 17, i8, and m are chambers for performing various processes of the female panel 1 in a vacuum environment. For example, the chambers 17 and 20 are formed by using a metal film formed of a ruthenium on the substrate w, and the chambers 18 and 19 are used. In the inside of the transfer chamber 15, a transport robot 22 for transporting the substrate w is mounted inside the transfer chamber 15 by using a long throwing method (1〇ng thr〇w sputteri beer). The transport robot 22 transports the substrate w from the transport chamber !5 to the load lock chambers 16a and 16b, the chambers 17, i8, 19, 2 and the buffer chamber 13 (and in the opposite direction). The first processing unit n has a transfer chamber 25 having a polygonal cross section. The transfer chamber 25 is connected in a state in which the buffer chamber 13 is in communication, and the chambers 26, 27, 28, 29, 3 () % is connected to each other by the corresponding 21. Each sensitivity is connected to the transfer chamber 25 by the inter-interval η corresponding thereto, and vice versa, by the closing of the idle space corresponding thereto. The communication chamber 25 is connected. The chamber % t in the second processing unit U is subjected to the substrate w which becomes high temperature by various processes. But processing
SJ 7 3 201107603 處%、3卜係—種在真空環境下執行對基板w之各種 向：至，如，此等各個室，係執行一邊職板w施加偏 =:邊使缝錢粒子沉積於同一基板w上以形成金屬膜 屬綠_賴處理。又室28、29亦為—種在真空環 還鳥=雌板W之各種處_室，例如室28係在氫氣等之 境下執行對基板w之熱處理，室29則是執行將 運ς i W之表面的氣體粒子予以去除的脫氣處理。在搬 撫、^5切部，也搭載錢哺運基板w馳運機器人32。 、器人32，係進行從搬運室25朝緩衝室13、及室26、 28 29、30、31(以及反方向)之基板W的搬運。 隔菩2話說，上述的半導體裝置之製造裝置1G，係一種在 ^^室13而連結的搬運冑15及搬運室25及其搭載的複 =的所縣集型之裝置，且在各為真空室的搬運室^與 =之間經由緩衝室13使基板w往來搬運。然後被搬 、負载鎖定室16a的基板W，係藉由搬運 而依序搬運至真空之各個室，在搬運目的地的室中施 卞一二環境下的各種處理。 然而，對此種基板W進行的輙處理等之各處理，係在 ==為真空環境後才進行。因此，在各個室中，係連接有使 =成為真空狀態的真空排氣部34、或使該室内成為真空 ς八空狀態還高的高真空狀態之高真空排氣部…換句話 構成製造裝置10的室之中，其所需要的真空度非為高 —的室内連結有真空排氣部34，而在其所需要的真空度為 201107603 高真空度的室内連結有高真空排氣部35。例如圖！所示，第i 處理部11之負載鎖定室16a、16b、第2處理部12之室26、 8 29中’連接有真空排氣部34。另一方面，在第^處理部 =之搬運室15、室17、18、19、20及第2處理部12之搬運 室25、室27、30、31中’連接有高真空排氣部35。 如圖2⑻所示’真空排氣部34係由如下所構成：對室内 進行粗抽排氣的粗抽泵浦36 ;對經粗抽排氣過的室内進一步 /進行排氣糾彡絲空狀態_輪分子泵浦37;為了擔保渴輪 刀子泵浦37之排氣能力而對該渦輪分子泵浦37之背壓側進行 粗抽排氣的粗抽泵浦38 ;以輯此等各構成要素與室之間進 饤開閉的魏侧39。賴在室⑽成以狀‘树，首先粗 =泵浦36及粗抽泵浦38會驅動而粗抽室内與渦輪分子泵浦 Γ抽泵浦36與㈣的閥39會關閉，而 =::室之間_39會打開’藉此— 如圖2(b)所示，在高真空排氣部35中 =内成為高真空狀態，除了上述的真空排氣部3 以 外，還在渦輪分子泵浦37之吸入側 構成乂 為減壓裝置的低溫捕集器4。。低溫捕，; 顯被該冷賴冷卻的軸所構成的冷卻㈡ ’該冷娜41係猶述冷賴供· =、 且連接於構賴餘統__置42(參_ (冷媒）， 低溫捕集器40，係-種使並未藉由高真空排氣部％之粗 201107603 抽泵浦36及渦輪分子泵浦37來排氣而殘留於室内的例如水蒸 氣等之氣體’凝縮於冷卻面板之極低溫面並予以捕捉的裝置。 在上述的冷卻部41之冷凍機中，供給有藉由壓縮裝置42而經 壓縮過的尚壓氦氣，且藉由該高壓氦氣絶熱膨脹時之吸熱而使 冷卻面板冷卻至123K。藉此可實現冷卻面板的極低溫面。又， 在此等冷卻面板中，分別設置有作為溫度檢測部的溫度感測器 50 ’用以檢測該冷卻面板之溫度(參照圖4)。另外以下所謂 的冷卻部41之溫度，係顯示於該冷卻面板之溫度。 其次’參照圖3至圖6說明應用於半導體裝置之製造裝置 10的減壓系統。另外，半導體裝置之製造裝置1〇係具有：對 應第1處理部11之高真空處理部35的減壓系統；以及對應第 2處理部12之高真空排氣部35的減壓系統。此等的減壓系統， 由於只有冷卻部41之數量不同而其基本的構是相同的， 所以以下針對第1處理部n中之減㈣統加以說明，而省略 第2處理部12中之減壓系統。圖3係顯示此種第丨處理部n 之減壓系統中冷媒流動配管之系統圖；圖4係顯示與構成第^ 處理部11之減壓系統的壓縮裝置42有關之電氣概略構成的方 塊圖。 如圖3所示，構成減壓系統的壓縮裝置幻，係具有接受 交流電動機43之驅動力以壓縮作為冷媒之氦氣的壓縮部44。 經該壓縮部44壓縮而變成高壓的氦氣，一旦被貯留於蓄壓器 (accumUlat〇r)45之後，會供給至各冷卻部41之冷凍機。換句 話說，該壓縮裝置42，係以1台對第〗處理部u中的5個高 201107603SJ 7 3 201107603 At the %, 3, and the following, the various directions of the substrate w are performed in a vacuum environment: to, for example, each of the chambers is subjected to a side plate w application bias =: while the sewn particles are deposited The formation of the metal film on the same substrate w is green. The chambers 28 and 29 are also in various places in the vacuum ring and the bird = the female board W. For example, the chamber 28 performs heat treatment on the substrate w under the condition of hydrogen gas, and the chamber 29 is executed. Degassing treatment to remove gas particles from the surface of W. In the handling, the 5th cut, the money is also used to transport the substrate w. The person 32 carries the conveyance of the substrate W from the transfer chamber 25 to the buffer chamber 13, and the chambers 26, 28 29, 30, 31 (and the reverse direction). In the above-mentioned semiconductor device manufacturing apparatus 1G, the conveyance cassette 15 and the conveyance chamber 25 which are connected to the room 13 and the apparatus of the prefecture type which are mounted on the slab are provided, and each of them is vacuum The substrate w is transported between the transfer chambers of the chamber and the buffer chamber 13 via the buffer chamber 13. Then, the substrates W to be transported and loaded in the lock chamber 16a are sequentially transported to the respective chambers of the vacuum by the conveyance, and various processes in the environment of the transfer destination are performed. However, each treatment such as enthalpy treatment for the substrate W is performed after == is a vacuum environment. Therefore, in each of the chambers, a vacuum exhaust unit 34 that makes a vacuum state or a high vacuum exhaust unit that has a high vacuum state in which the chamber is in a vacuum state is connected. In the chamber of the apparatus 10, the vacuum degree is not high, and the vacuum exhausting portion 34 is connected to the chamber, and the high vacuum exhausting portion 35 is connected to the chamber having a vacuum degree of 201107603. . For example! As shown, the vacuum exhaust unit 34 is connected to the load lock chambers 16a and 16b of the i-th processing unit 11 and the chambers 26 and 8 29 of the second processing unit 12. On the other hand, in the transfer chamber 15 of the second processing unit, the chambers 17, 18, 19, 20 and the transfer chamber 25 of the second processing unit 12, the chambers 27, 30, and 31 are connected to the high vacuum exhaust unit 35. . As shown in Fig. 2 (8), the vacuum evacuation unit 34 is configured as follows: a rough pumping pump 36 for roughing and exhausting the inside of the room; and further performing/exhausting the air in the room where the rough exhausting has been performed _ wheel molecular pump 37; rough pumping 38 for rough pumping of the back pressure side of the turbomolecular pump 37 in order to guarantee the exhaust capacity of the thirteen wheel pump 37; to compose these components The Wei side 39 is opened and closed between the chamber and the chamber. Lai in the room (10) into a shape of 'tree, first coarse = pump 36 and rough pump 38 will drive while the pumping chamber and turbo molecular pump pump pump 36 and (four) valve 39 will close, and =:: Between the chambers _39 will open 'by this - as shown in Fig. 2 (b), in the high vacuum exhaust portion 35 = inside the high vacuum state, in addition to the vacuum exhaust portion 3 described above, also in the turbomolecular pump The suction side of the pump 37 constitutes a low temperature trap 4 which is a pressure reducing device. . Low temperature trapping;; cooling caused by the shaft cooled by the cold (2) 'The cold na 41 series is still cold supply · =, and connected to the structure of the remaining __ set 42 (reference _ (refrigerant), low temperature The trap 40 is configured to condense a gas such as water vapor that has not been exhausted in the room by the high-vacuum exhaust portion % 201107603 pump 36 and turbo molecular pump 37 A device for capturing the extremely low temperature surface of the panel. In the refrigerator of the cooling unit 41, the compressed helium gas compressed by the compression device 42 is supplied, and the high pressure helium gas is adiabatically expanded. The cooling panel is cooled to 123K by heat absorption, thereby achieving a very low temperature surface of the cooling panel. Further, in the cooling panels, temperature sensors 50' as temperature detecting portions are respectively provided for detecting the cooling panel. Temperature (see Fig. 4) The temperature of the cooling unit 41 is shown in the temperature of the cooling panel. Next, a pressure reducing system applied to the manufacturing apparatus 10 of the semiconductor device will be described with reference to Figs. 3 to 6 . The manufacturing device of the semiconductor device has : a pressure reducing system corresponding to the high vacuum processing unit 35 of the first processing unit 11; and a pressure reducing system corresponding to the high vacuum exhaust unit 35 of the second processing unit 12. The pressure reducing system has only the cooling unit 41 Since the basic configuration is the same in the number, the subtraction (four) in the first processing unit n will be described below, and the decompression system in the second processing unit 12 will be omitted. Fig. 3 shows the third processing unit. FIG. 4 is a block diagram showing an electrical schematic configuration of a compression device 42 constituting a pressure reducing system of the first processing unit 11. As shown in FIG. The compression device of the system has a compression portion 44 that receives the driving force of the AC motor 43 to compress helium gas as a refrigerant. The helium gas that is compressed by the compression portion 44 and becomes high pressure is once stored in the accumulator (accumUlat〇). After r)45, it is supplied to the refrigerator of each cooling unit 41. In other words, the compression device 42 is one of the five high-level processing units u in the first processing unit u.
-工排風部35之各冷卻部41 ’供給經塵缩過的高塵之氣氣。 被供給至各冷卻部Μ的高壓氦氣，係在各冷卻部4】之冷滚機 中絶熱膨脹而變成低麼，且在一旦被貯留於 私之後，會再次被送__裝置42之顯部4二τ W 如圖，_裝置42，係具有頻率控制部μ、變頻 裝置52及讀縣機43。設置於第丨處理部u之各冷卻 41的溫度感測器50 ’係與頻率控制部51電性連接，將春時對 冷卻部41之溫度的檢測信號輸出至頻率控制部Μ。頻^控制 部51，係產生或事先儲存如下之各種參照電壓 •相當於冷卻部41之溫度之目標值的電麗位準 •相當於冷卻部41之溫度之第1臨限值的電壓位準 •相當於溫度比第1臨限值還高之第2臨限值的電壓位準 且將相田於各/皿度感測器5〇之檢測結果的電壓位準與此 等的參照電壓進行比較。 ，另外，所謂冷卻部41之溫度之目標值，係指冷卻面板可 怪常地充分發揮冷號力時的冷卻部41之溫度，例如被設定 在123K。又所謂第i臨限值，係指作為冷卻的冷卻面板 需要被更有鱗地冷辦，冷卻部Μ的溫度，例如被設定在 128K。又所謂第2臨限值，係指將作為冷卻對象之冷卻面板 之溫度強雜地急遽冷卻時，冷卻部41的溫度，例如被設定 在 138K。 頻率控制部51 ’係在壓練置42剛運轉動作後以預定之 201107603 檢測週期(本實施賴中為5分断縣自各溫度感測器5〇 之檢測錢，域雜置52會將供給至技機43的交流 電源之頻率的控謝旨令值輸出至變_置52。另外，上述所 謂的預定之檢測週期，係指各冷卻部41足以受到變頻裝置幻 經變更過之輸出頻率之影響的時間。 變頻裝置52，係-旦將從外部電源53(本實施例中為 AC^V’Hz)供給較流電源無核流，且再次轉換成交 流，藉此變更供給至交流電域43的交流電狀頻率的袭 置。變頻裝置52 ’係、可將來自外部電源53的交流電源之頻率 在下限值之3舰與上限值之職之間進行變更，且接受來 自頻率控制部51之控制指令值，將根據該控制指令值的頻率 之父流電源供給至交流電動機43。另外，變頻裝置W之輪出 頻率的上限值’係指各冷卻部41之全部溫度強制性地冷卻至 目標值之123K以下的頻率。 交流電動機43 ’係接受從變頻褒置％供給的交流電源並 以相應於該交流電源之頻率的旋轉速度進行旋轉，且將相應於 該旋轉速度的量之氦氣供給至各冷卻部41。詳言之，當從變 頻裝置52供給的交流魏之解變騎，炫電誠Μ田之旋 轉速度就會變高，絲給至各冷㈣41的氦氣之供給量會增 加。如此當氦氣之供給量增加時，經由蓄㈣Μ而連繫的全 4冷卻之冷卻能力就會提高。反之’當變頻裝置&供給 的交流電源之鮮變低時，交流鶴機43之旋轉速度就會^ 低’且供給至各冷卻部41的氦氣之供給量會減^這樣的話， [S1 201107603 當氦氣之供給量減少時，經由蓄壓器45而連繫的全部 41之冷卻能力就會降低。換言之，在上述的減壓系統中，^ 變頻裝置52供給至交流電動機43的交流電源之頻率可 率控綱51來㈣，对配合敕流電源之辦而控^ ^ 卻部41之溫度。 分今 參照圖5說明藉由此種頻率控制部51而執行的變頻 52之輸出頻率的控制。圖5係顯示依頻率控制部51來控制 頻裝置52之輸出頻率之流程的流程圖。另外，該—系列的产 ，、，係在上述預定之每—檢測週期、即頻率控卿Μ每次二 得冷卻部41之溫度時所執行者，雖然可藉由頻率控制部5 搭載的專敗邏輯電路而實現，但是並秘於此，也可藉由搭 載於例如通用電腦的程式等來實現。 9 ° 如圖5所示，頻率控制部5卜係根據來自各溫度感測器 5〇之檢測信號’取得各冷卻部之溫度(步驟si〇i)。接著頻 率控制部5卜係判斷全部冷卻部41中之至少！個冷卻部Μ 的溫度是否為第2臨限值之138K社、換句話制斷是否存 在需要強制冷卻齡卻部Μ(步驟sl〇2)。當頻率控制部W判 斷王。P冷部部41中之至少j個冷卻部41的溫度為第2臨限值 以上時(步驟S1〇2 :是），該頻率控制部Μ就會將指示將變頻 裝，52讀出頻率設定在上限值之观z的控制指令值輸出 至變頻裝置52(步驟S1G3)。紐辭控卿51會使交流電動 機43執行對全部冷卻部41之強制性的冷卻，並結束一 處理。 13 201107603 此時，當強制性的冷卻指令從頻率控制部si輸 ;置52時’供給至交流電動機43的交流電源之輸出頻率 該輸婦的上限值之簡z。然後⑽為上; 的輸出頻率供給交流電源時，在交流電動機Μ的旋轉 ，綠大’而_裝置42中供給至各冷卻部41的氛氣二 給里會k成最大。換句話說’當全部冷卻部“中之至個 度達到第2臨限值以上時’對於達到該第2臨 树嫩她—可 另一方面，當頻率控制部Μ判斷全部冷卻部41 為未滿第2臨限值、換句話說不需要對冷料41進行強2 的冷卻時(步驟S1〇2:否），頻率控制料就會判斷全部冷卻 部41中之至少丨個冷卻部41的溫度是否為前述第1臨限值之 服以上(步驟難）。當頻率控制部y判斷全部冷卻部w 中之至少1個冷卻部41的溫度為第1臨限值以上時(步驟 S104 :是），辭控_ 就會判_見麵交流電源之頻率是 否為上限值之5GHz、換句織·是否可更增加交流電源之 鮮(步驟S105)。然後若現在的交流電源之頻率為上限值之 50Hz(步驟Sl〇5 :是），則頻率控制部M會判斷不可增加交流 電源之頻率，且將維持交流電源之頻率於上限值之5舰的^ 制指令值輸出至變敏置52，並結束—_的處理。相對= 此’若現在的交流電源之頻率非為上限值之5〇Ηζ(步驟⑽： 否），則將使得使交流電源之頻率從現在的值上升5Ηζ之和制 指令值輸出至變雜置52(步驟㈣，並結束—系列的歧⑴ 201107603 此時’當使得使現在的輸出解上升服之控制指令值 ^頻率_卩Μ輸出錢絲置52時，供給至交流電動機 43的交流電源之頻率就會比躲的值高出5Hz，而在交流電 動機43方面，會提高該上升鮮部分的雜速度。然後當交 流電動機43的旋轉速度變高時，從壓縮裝置42朝各冷ς部 41供給的氦氣之供給量也會增大’而可對冷卻部W進行更進 一步的冷卻。 另-方面，當頻率控制部51判斷全部冷卻部41之溫度為 =第i臨限值之咖時(步驟sl〇4 :否），頻率控制部Μ '7、曰判斷現在的df：社辭是否為變難置M的下限值 =3〇Hz、換句話說判斷是否可更進—步減少交流電源之頻率 ^驟贿）。紐若現在的交流電社鮮為下限值之 z(步驟S1〇7 :是）’頻率控制部51就會判斷不可減少交流 電源之頻率’且將為了轉交流電狀 _指令值輸__置52，並結束，的處理。相 ,;b S現在的電源之頻率非為下限值之遍z(步驟 107 :否）’則將使交流電源之鮮從現在雜減少5Hz之控 制指令值輸出至變頻裝置52(步驟測），並結束一系列的處 理。 ^田使現在的輸出頻率減少5Hz之控制指令值從頻 六：::”1輪出至變頻裝置52時’供給至交流電動機43的 fa源之頻率就會比現在的值降低5Hz，而在交流電動機 方面，會降低該減少頻率部分的旋轉速度。然後當交流電 201107603 動機43的旋轉速度變低時，從壓縮裝置42朝各冷卻 給的氦氣之供給量也會齡，岐並非必要對冷卻部4供 更進-步的冷卻時’可減少在壓縮裝置42所消耗的電力。仃 之至少:部冷卻部” 丨而要進仃更進一步的冷卻時，變頻，罟 之輸出頻率就可藉由頻率控制部Μ提高姬二 全部冷卻料的氣氣之供給量會以微來增大，^ 冷卻能力會配合此而增強。另—方面，當沒== 進行更進一步的冷卻時，變頻裴置52之輸出頻 率就可猎由解控制部51降低5Hz。然後供給 ^=："：減少5HZ，且全部冷卻料之 曰配口此而減少。故而，會在全部冷卻部4 :時的溫度之有效率的冷卻，-邊削減壓縮裝置 變頻裝6之時序咖依鮮控制部51來控制 夂:、二、，'&出頻率的一例。圖6係顯示第1處理部η的 變=置mi切##、觸該_移而設定的 之輪出頻率的時序圖。圖6中的時序tl〜tl 顯示檢測各冷卻部4i之溫度的每—檢測 : 從：=為等待處理的~態(時二： 二丁各個至之處理的狀態(時序tlG)。另外，在立是 ==能力的上_狀態_)中，供‘ 机電賴43的父流電源之頻率可藉由頻率控制部”經常設定 [S] 16 201107603 在下限值之30Hz。 、如圖6所示，在處於閒置狀態的時序t〇、及從時序隸 =期的時序U中，全部冷卻部41之溫度騎2臨限值 (口 K) ’進而為未滿第i臨限值(1麗）。然後在各個室中尤其 疋在不需要較大排氣能力的此等時序to及時序tl中 二 電，機43供給下限值之施的交流電源。耻，在時二L 序tl _ ’可持續維持變頻裝置52之輸出頻率於下限值之 二火’在室17中需要例如較大的排氣能力，歸應於室 17的冷部部41之溫度變成第1臨限值以上。結果’在時序t2 令’係在醉控制部51中騎全部冷卻部41中之至少工· =41之溫度為第i臨限值以上。此外，在頻率控制部η中 現在的變縣置52之輸出鮮為下限值之施ζ的判 斷，猎此，用以使輸出頻率比現在的__ζ)_ % # 制指令值會從_麵卿51輸人至變織置52。結果，^ ==動機43供給頻率為35Ηζ之交流電源，且藉由輸出 仏升5ΗΖ，可提南交流電動機43之旋轉速度，並增加供 冷料Μ的域讀給#，赌綠部冷卻部41之^ 、立接著在至17中持續需要較大的排氣能力，且室口的冷 =4i之溫度’錢續的檢顺射轉帛〗紐值以上的 t f果，在時序t3 _，當在頻率控制部对持續判斷全 令Ρα|Μ1中之至少J個冷卻部41之溫度為第工臨限值以 17 201107603 上。此外’在頻率控制部51中完成現在的變頻裝置52之輸出 頻率(35Hz)為未滿足上限值之5〇Hz的判斷，藉此，用以使輸 出頻率比現在的頻率(35Ήζ)上升5Hz之控制指令值會從該頻 率控制部51輸人至變縣置52。結果，可對交流電動機43 供、。頻率40Hz之交流電源，進而提高交流電動機43之旋轉 速度，而更進—步提高全部冷卻部41之冷卻能力。 a 可在室17中確保充分的排氣能力，但是當在 至20中另外需要較大的排氣能力時，就如圖6所示，雖然室 f的冷部部41之溫度變成未滿第】臨限值，但是與此不同 的^20中的冷卻部41之溫度則變成第1臨限值以上。因此， 在广序W中’於頻率控制部51，持續完成全部冷卻部41中之 =1個冷卻部41之溫度在連續的檢測週期中為第1臨限值 i置靖。又，在鮮控制部51中完舰在的變頻 此，用頻率(40Hz)為未滿足上限值之5〇Hz的判斷，藉 值會從該頻卿GHz)上綠之控制指令 43-2 内容的方錢喊高好， 室2G之處理 之冷卻能力會更加提:;。動機43之旋轉速度，而各冷卻部 卻部41之、、w二二濟只較大的排氣能力’且室20的冷 狀態。以上的 部冷卻部41中之至少i個^頻率控制部51中持續判斷全 個冷部部41之溫度為第w限值以 201107603The respective cooling portions 41' of the work ventilating portion 35 supply the gas of the dusty high dust. The high-pressure helium gas supplied to each cooling unit 绝 is adiabatically expanded in the cold rolling machine of each cooling unit 4 and becomes low, and once stored in private, it is sent again to the display unit of the device 42. 4 τ W As shown in the figure, the device 42 has a frequency control unit μ, an inverter unit 52, and a county machine 43. The temperature sensor 50' of each of the coolings 41 provided in the second processing unit u is electrically connected to the frequency control unit 51, and outputs a detection signal for the temperature of the cooling unit 41 in the spring to the frequency control unit Μ. The frequency control unit 51 generates or stores in advance various reference voltages: a battery level corresponding to a target value of the temperature of the cooling unit 41, and a voltage level corresponding to a first threshold value of the temperature of the cooling unit 41. • Corresponds to the voltage level of the second threshold value higher than the first threshold value and compares the voltage level of the phase detection result of each phase sensor 5〇 with these reference voltages. . In addition, the target value of the temperature of the cooling unit 41 is the temperature of the cooling unit 41 when the cooling panel can sufficiently exhibit the cold force, and is set to, for example, 123K. The ith threshold is a cooling panel that is cooled and needs to be cooled more scalarly. The temperature of the cooling unit , is set to, for example, 128K. In addition, when the temperature of the cooling panel to be cooled is rapidly cooled, the temperature of the cooling unit 41 is set to, for example, 138 K. The frequency control unit 51' is based on the predetermined 201107603 detection cycle immediately after the operation of the press set 42 (in this implementation, the load is 5 points from the temperature sensor 5〇, and the domain miscellaneous 52 will be supplied to the technology. The control value of the frequency of the AC power source of the machine 43 is output to the variable _ 52. In addition, the above-mentioned predetermined detection period means that each of the cooling units 41 is sufficiently affected by the output frequency of the imaginary change of the inverter device. The frequency conversion device 52 supplies a non-core flow from the external power source 53 (AC^V'Hz in this embodiment) to the flow-through power source and converts it into an alternating current, thereby changing the alternating current supplied to the alternating current domain 43. The frequency conversion device 52' can change the frequency of the AC power source from the external power source 53 between the third ship and the upper limit value of the lower limit value, and accept the control command from the frequency control unit 51. The value is supplied to the AC motor 43 based on the frequency of the control command value. The upper limit value of the frequency of the inverter device W is determined to mean that all the temperatures of the respective cooling units 41 are forcibly cooled to the target value. 123K The following frequency: The AC motor 43' receives the AC power supplied from the inverter unit % and rotates at a rotation speed corresponding to the frequency of the AC power source, and supplies helium gas corresponding to the rotation speed to each of the cooling In other words, in the case of the exchange of the Wei Wei, which is supplied from the inverter device 52, the rotation speed of the Hyun Tetsu Shouta will become higher, and the supply of helium to the cold (four) 41 will increase. When the supply amount of helium gas increases, the cooling capacity of all four coolings connected by the storage (four) crucible is increased. Conversely, when the frequency of the alternating current power supplied by the inverter device & is low, the rotation speed of the AC crane 43 If the amount of helium supplied to each of the cooling units 41 is reduced by ^, [S1 201107603, when the supply amount of helium is reduced, the cooling capacity of all 41 connected via the accumulator 45 is reduced. In other words, in the above-mentioned decompression system, the frequency of the AC power supply supplied to the AC motor 43 by the inverter device 52 can be controlled by the frequency control unit 51 (4), and the control unit 41 is matched with the trickle power supply. Temperature Fig. 5 illustrates the control of the output frequency of the inverter 52 executed by the frequency control unit 51. Fig. 5 is a flow chart showing the flow of controlling the output frequency of the frequency device 52 by the frequency control unit 51. The production, and the execution of each of the above-mentioned predetermined detection periods, that is, the frequency control of the temperature of the cooling unit 41, can be realized by the dedicated logic circuit mounted by the frequency control unit 5. However, this can also be achieved by a program such as a general-purpose computer. 9 ° As shown in FIG. 5, the frequency control unit 5 is obtained based on the detection signals from the temperature sensors 5〇. The temperature of each cooling unit (step si〇i). Next, the frequency control unit 5 determines at least all of the cooling units 41! Whether the temperature of the cooling unit Μ is the second threshold value of 138K, in other words, whether or not there is a forced cooling age is required (step sl1). When the frequency control unit W judges the king. When the temperature of at least the j cooling units 41 in the P cold portion 41 is equal to or greater than the second threshold (step S1〇2: Yes), the frequency control unit 将 sets the frequency conversion setting and the 52 reading frequency setting. The control command value of the upper limit z is output to the inverter device 52 (step S1G3). The New Controller 51 causes the AC motor 43 to perform mandatory cooling of all of the cooling units 41, and ends a process. 13 201107603 At this time, when the mandatory cooling command is output from the frequency control unit si; the output frequency of the AC power supplied to the AC motor 43 is set to a simple z of the upper limit value of the woman. Then, when the output frequency of (10) is upper; when the AC power is supplied, the rotation of the AC motor ,, the green ’, and the liquefaction of the chiller 2 supplied to the respective cooling units 41 in the device 42 will be maximized. In other words, when the degree of the total cooling unit reaches the second threshold or more, it is determined that the second control unit is reached. On the other hand, when the frequency control unit determines that all the cooling units 41 are not When the second threshold value is exceeded, in other words, when the cold material 41 is not required to be cooled by the strong 2 (step S1〇2: NO), the frequency control material judges at least one of the cooling units 41 in all the cooling units 41. Whether the temperature is equal to or greater than the first threshold value (step is difficult). When the frequency control unit y determines that the temperature of at least one of the cooling units 41 is equal to or greater than the first threshold value (step S104: Yes) ), resignation _ will judge _ whether the frequency of the AC power supply is 5 GHz of the upper limit value, whether it is possible to increase the frequency of the AC power supply (step S105). Then if the frequency of the current AC power supply is the upper limit When the value is 50 Hz (step S1:5: YES), the frequency control unit M determines that the frequency of the AC power source cannot be increased, and outputs the control command value of the five ships that maintain the frequency of the AC power source to the upper limit value to the variator 52, and end the processing of -_ relative = this 'if the frequency of the current AC power If the upper limit value is 5〇Ηζ (step (10): No), the frequency of the AC power supply will be increased from the current value by 5 和 and the command value will be output to the variable mismatch 52 (step (4), and the end - series of differences (1) 201107603 At this time, when the control command value of the current output solution is increased, the frequency of the AC power supplied to the AC motor 43 is 5 Hz higher than the value of the hiding. On the other hand, in the case of the AC motor 43, the hybrid speed of the rising portion is increased. Then, when the rotational speed of the AC motor 43 is increased, the supply amount of the helium gas supplied from the compression device 42 to each of the cold head portions 41 is also increased. Further, the cooling unit W can be further cooled. On the other hand, when the frequency control unit 51 determines that the temperature of all the cooling units 41 is the i-th threshold (step sl1: No), the frequency control is performed. Department Μ '7, 曰 judge the current df: whether the social affair is the lower limit of the difficulty of setting M = 3 〇 Hz, in other words, whether it can be further improved - step to reduce the frequency of AC power ^ sudden bribe. The current AC company is rarely the lower limit z (step S1〇7: yes) The frequency control unit 51 determines that the frequency of the AC power supply cannot be reduced and that the AC power_command value is set to 52 and ends. The phase of the current power supply is not the lower limit value. In the case of z (step 107: NO), the control command value for reducing the AC power supply from the current noise by 5 Hz is output to the inverter device 52 (step measurement), and the series of processing ends. When the control command value of 5 Hz is reduced from frequency 6:::"1 to the inverter device 52, the frequency of the fa source supplied to the AC motor 43 is reduced by 5 Hz from the current value, and in the case of the AC motor, the frequency is lowered. Reduce the rotational speed of the frequency portion. Then, when the rotational speed of the alternating current 201107603, the rotational speed of the motive 43 becomes low, the supply amount of the helium gas from the compression device 42 toward each cooling is also aged, and it is not necessary to supply the cooling portion 4 with further cooling. The power consumed by the compression device 42. At least: the cooling part of the section. In order to further reduce the cooling, the frequency of the inverter and the output frequency of the crucible can be increased by the frequency control unit. Large, ^ cooling capacity will be enhanced with this. On the other hand, when there is no == for further cooling, the output frequency of the inverter device 52 can be reduced by the solution control unit 51 by 5 Hz. Then supply ^=:" ;: 5HZ is reduced, and the enthalpy of all the cooling materials is reduced. Therefore, the temperature of all the cooling units 4 is effectively cooled, and the timing of the compression device is reduced. 51. An example of the frequency of the 夂:, 2, and '&" is shown. Fig. 6 is a timing chart showing the frequency of the rotation of the first processing unit η = set mi cut ##, which is set by the touch. The timings t1 to t1 in Fig. 6 show the detection of the temperature of each of the cooling units 4i: From: = the state to be processed (the second state: the state of the processing to each of the two (timing tlG). The vertical is == capability of the upper_state_), the frequency of the parental power supply for the 'electromechanical Lai 43 can be used by the frequency Control unit "is often set [S] 16 201107603 lower limit of 30Hz. As shown in FIG. 6, in the time t〇 in the idle state and the time sequence U in the timing period, the temperature of all the cooling units 41 rides 2 threshold (port K)' and is further less than the first i Limit (1 丽). Then, in each of the chambers, especially in the timings to the timing t1 and the timing t1, the machine 43 supplies the AC power of the lower limit value. Shame, in the second order L1 _ 'sustainably maintain the output frequency of the frequency conversion device 52 at the lower limit of the second fire' requires a large exhaust capacity in the chamber 17, for example, in the cold portion 41 of the chamber 17. The temperature becomes equal to or greater than the first threshold. As a result, at the time t2 command, the temperature of at least the work = 41 in all the cooling units 41 in the drunk control unit 51 is equal to or greater than the i-th threshold. In addition, in the frequency control unit η, the output of the current variable county 52 is rarely determined by the lower limit value, so that the output frequency is higher than the current __ζ)_%# command value will be from _ Faced 51 lost to the woven 52. As a result, ^ == motive 43 supplies an AC power source having a frequency of 35 ,, and by outputting 5 ΗΖ, the rotation speed of the AC motor 43 can be increased, and the field reading for the chiller is increased, and the gambling department is cooled. 41, ^ then continue to require a large exhaust capacity in the 17th, and the temperature of the chamber mouth = 4i temperature 'money continued to check the 帛 帛 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽When the temperature control unit continues to determine the temperature of at least the J cooling units 41 in the total order Ρα|Μ1 is the working limit value of 17 201107603. Further, the frequency control unit 51 completes the determination that the output frequency (35 Hz) of the current inverter device 52 is 5 Hz which does not satisfy the upper limit value, thereby increasing the output frequency by 5 Hz from the current frequency (35 Ήζ). The control command value is input from the frequency control unit 51 to the variable county 52. As a result, the AC motor 43 can be supplied. The AC power source having a frequency of 40 Hz further increases the rotational speed of the AC motor 43, and further improves the cooling capacity of all the cooling units 41. a sufficient exhaust capacity can be ensured in the chamber 17, but when a large exhaust capacity is additionally required in the case 20, as shown in Fig. 6, although the temperature of the cold portion 41 of the chamber f becomes underfilled The threshold value is set, but the temperature of the cooling unit 41 in the ^20 which is different from this is equal to or greater than the first threshold value. Therefore, in the wide-order W, the temperature of the =1 cooling unit 41 in all the cooling units 41 in the frequency control unit 51 is continuously set to the first threshold value i in the continuous detection period. In addition, in the fresh control unit 51, the inverter is completed, and the frequency (40 Hz) is judged to be 5 Hz which does not satisfy the upper limit value, and the borrowing value is from the frequency GHz) to the green control command 43-2. The content of the party's money shouts high, the cooling capacity of the room 2G processing will be more mentioning:; The rotational speed of the motive 43 is different from that of the cooling unit portion 41, w, and only a large exhaust capacity and the cold state of the chamber 20. At least one of the plurality of frequency control units 51 in the above-described partial cooling unit 41 continuously determines that the temperature of all the cold portion 41 is the w limit value 201107603
上。此外，在頻率控制部51中完成現在的變頻裝置52之輸出 頻率_ζ)為未滿足上限值之馳的判斷，藉此，用以使輪 出頻率比現在的鮮(45Hz)上升服之控偏令值會從該頻 率控制部51輸人至變頻裝置52。結果，可對交流電動機43 供給頻率地值簡z之交流賴、，觀各冷4 能力會變成最大。 "P 換句話說，在時序t2〜t5中，判斷全部冷卻部Μ中之至少 1個冷卻部41之溫度為第1臨限值以上。因此，在變頻^ 52於各％序t2〜t5中，持續輸入用以使輪出頻率上升此的 ，制指令值。在此，使用此種賴縮過的氦氣而被冷卻的冷卻 部41，其溫度並不會按照氦氣供給量之增減而立即產生變化。 \7li 、#…在冷狀絶熱舰職需要長時_航或並孰傳 長時間的情況，由冷媒供給量之增減反映出達成冷卻部 从皿度需要花費相當的咖。因此若是冷卻部q之溫度急遽 也上升的情況’較佳為配合地大幅增大冷媒之供給量，而 $部41之溫舰慢地上升的叙，聰佳為齡地小幅增 大冷媒之供給量、或直接壓制該增大。 上所述，在本實施形態中，在至少】個冷卻部Μ連 •交成第1臨限值以上的情況下、即對其中丨個冷卻部41需要 ^-步的冷卻之情況’供、给至交流轴機43的交流電源之 =會階紐地上升。_，基於前相提雅_率造成各 ，部41之溫度變化後’可再進—步完成輪出頻率之上升。 右為此種控财法，射避免_裝置52的輸㈣率之過戶 201107603 上升 就可削減壓縮裝置42 ，且只要避免該頻率的 所消耗的電力。 上升， 二 而，在時序t6中，户 成為未滿第1臨限值之服。因 以上溫外AS λ解控卿51會靖財具帛1臨限值 的im。此外，在頻率控制部51中完成了現在 斷》萨此，用^頻率(5〇Hz)為比下限值(3〇Hz)還高的判 ^错此’ Μ使輸出頻率歧 令值會從簡置m ^ 動機43之旋轉逮度 置52結果’父流電 冷卻能力_餘。 在王部冷卻部41中，不會造成 全^^4_ ’ W㈣她㈣編力，且在 之12张祕总之z皿度在連續的檢測週期令為未滿第1臨限值 率減、、t7〜t9巾’該情·來使輸出辭比現在的頻 之控，指令值會從該頻率控制部51輸入至變頻裝 之頻車中，#變_置52所輪出的交流電源 = ㈣時，則在時序⑽以後，供給至交流 電動機43的⑽獅之鮮會轉在下限值之卿z。 換句話說，在時序t6〜U〇令，會連續完成各冷卻部41之 全部溫度為未滿第〗臨限值之觸。因此，在變頻裝置&， 在各時序t6〜tl0中係輸入有使輸出頻率_在的頻率減少服 之控制指令值。如上所述’使用此__過的氦㈣被冷卻 的冷卻部41並雜贿氣供給量之增_立即财溫度產生 f S： 20 201107603 變化。鼠，如上所述’在冷卻料之全部溫銳續未 1臨限值的情況、即不需要對冷卻部4丨進行更進—步之冷卻 的情況，供給至交流電動機43較流電狀解會階紐地 減少。藉此，基於因減少前次之輸出解而造成各冷卻部41 之溫度變化，可更進—步完成輸出頻率之減少。藉此，可使變 頻，置52之輸出頻率按照#時的冷卻部41之溫度而減少，且 可藉由減少其輸出解，來減低在壓縮裝置42所消耗的電 力。然後，在具備此種減壓系統的製造裝置ω中，可藉由該 減壓系統賴低的絲電力，來減傾製造裝置W的消耗電 力。 順便-提’若在時序t6中暫時完成各至少丨個冷卻部Μ 之温度為第1臨限仙上_斷，聽給至交流電動機犯的 交流電源之頻率，係繼續維持在上限值之5服。又例如，在 時序t8中，在暫時完成各至少i個冷卻部μ之溫度為第1臨 限值以上的判斷之情況，用以使輸丨頻率比現在的頻率(侧ζ) 上升5ΗΖ之控制指令值將從頻率控制部51輸入至變頻裝置 52。又例如，在時序t〇〜1〇中之任一個時序中，若暫時完成各 冷部部41之至少1個溫度為第2臨限值之138K以上的判斷， 則用以使其輸出頻率強制設定在上限值之50Hz的控制指令值 將輸入至變頻裝置52。 如以上所說明，依據本實施形態的減壓系統'及使用該減 壓系統的製造裝置10，可獲得下述效果。 (1)當全部冷卻部41中之至少1個冷卻部41的溫度為第1臨 201107603 限值以上時，_裝置52 提高，而當各冷卻部41之全精由頻率控制部51來 頻裝置幻之輪出頻率可同師由:^滿第1臨限值時’變 此種輪出頻率之控制方法，^頻要^部&來降低。若為 步的冷卻時，⑲加料/ ”要對切部41進行更進-可增強各特m41的統後給量，而 卻部4〗進行更進牛 b另方面，當沒有必要對冷 氣氣之^量=卻時，可減少供給至各冷卻部Μ的 可-邊對二41之冷卻能力。故而， 邊在降低輸出率佳地冷卻，一 力。 則减在m裝142所消耗的電 (2)頻率控制部51，係 "之溫度，且當全部得各冷卻部 度如臨限值以上時，使對變頻裝置^固冷卻部41的溫 限值在每_檢_期階段性地上升^ 上 輸出頻率崎齡冷卻部41之、，料卩/朗“别次之 的輸出齡夕以 賴化後，再執行更進一步 輸出頻率的辦。若為此種構成，則可避免變頻裝置52之 減在_裝^^上升，且藉由避免該過度的頻率上升，就可削 减在Μ縮裝置42所消耗的電力。 每-檢測週期取_部 度為未滿第^的溫 在預疋之母-檢測週期階段性地減少。因此，基於藉由減少 m 22 201107603 前次之輸出解而造成各冷卻部41之溫度變化後，再執行更 進-步的輸出解之減少。結果，可使變織置52之輸出頻 率按照當時的冷卻部41之溫度而減少，且可藉由減少該輸出 頻率，而減低在壓縮裝置42所消耗的電力。 ⑷頻率㈣部51，騎全部冷卻料巾之至少1個冷卻部 41的溫度為第2臨限值以上時’將變頻裝置52之輸出頻率設 為上限值之5GHz。若為此種構成，"要最優紐行冷卻部 41之冷卻時，可將冷_之冷卻能力設為紅，且可對冷卻 部41快速地冷卻。 另外’上述實郷態也可變更如下來實施。 在上述貝滅’雖輕減壓細翻於作為直空處理 裝置的半導财置之製妓置Η)，峡料祕/，、只要是 利用減織置及壓職置的敍，本㈣也可應職其他的裝 置。 <員犯风又頸率控制部51，係當全部冷卻部Μ中之 ^少1個冷卻部41的溫度騎2 _值以上時，將變頻裝置 ^輸出頻率設定在該變可輸出的上限值。然而，也 ^根據該第2臨限值的控制。在上述實施形態中，係當全 中之至少1個冷卻部41的溫糊i臨限值以上 據第^ Μ進行更進—步的冷卻。因而，即便省略根 ^限值的控制，本發明至少也可獲得上述⑴〜(3)之效果。 述實施形也之頻率控制部5卜係當根據各冷卻部Μ之 201107603 溫度，在全部冷卻部4 以將變縣置52之細==下較未滿第1臨限值時，就 階段性地降低的方式==在上述母—檢測週細向下限值 ,ljjkp51 ,1.,工工制輸出頻率。取代該控制方法，頻率控 時將響健!全部冷卻部41之溫度τ降至未滿第1臨限值 =Γ2之輪出頻率設定在下限值。即使此種構成， 本發明至少也可獲得上述⑴、⑵之效果。 •上述實施形態之頻率控制部5卜係當根據各冷卻部W之 溫度’在全部冷卻部41中之至少1個冷卻料的溫度為第i 匕限值以上時，就簡變頻裝置52之輪㈣率在每—檢測週 』向上限倾祕地提高的方式控制輸^鮮。取代該控制 方法，作為用崎冷卻部進行更進-步的冷卻之其他方 法’有例如.頻率控制部5卜也可以下限值與上限值之二個 值來控繼齡置52之_解。姐奴下，解控制部 Μ係當至少1個冷卻部Μ之溫度為第丄臨限值以上時，藉由 將變頻裝置52之輸itj鮮設定在上限值也可提高冷卻效果。 7•上述實施形態之頻率控制部51係在預定之每—檢測週期 取得各冷卻部4丨之溫度’且雜棘得的溫度翻變頻震置 52之輸出頻率。不限於此，頻率控制部51也可連續地取得冷 卻部41之溫度，而控制變頻裝置52之輸出頻率。 7 •上述實施形態之頻率控制部51，可非是在冷卻部41之至 少1個溫度為第1臨限值以上時階段性地提高變頻裝置52之 輪出頻率，而是也可以變成相應於該冷卻部41之溫度的頻率 之方式來設定變頻裝置52之輸出頻率。此時，當具有第i臨 24 201107603 限值以上之溫度的冷卻部41有複數個時，例如頻率控制部 51，也可以變成相應於此等冷卻部41中之最高溫度的頻率L 方式來設定變頻裝置52之輸出頻率。 •上述實施形悲中’作為壓縮裝置42之供給對象的冷卻部 之健，只要是配合壓縮裝置42之填裝能力的2個以上^ 個數，則該個數就未被特別限定。 •上述實施形態之減壓系統中’雖然使用低溫捕集器4〇作 為減壓裝置，但是也可使用低溫泵作為減壓裝置。另外，在使 用低溫泵作為減壓裝置時，較佳為適當變更第丨臨限值及第2 臨限值。 •圖5中，也可省略步驟S1G5(與上限值之5舰作比較)及 步驟si〇7(與下限值之30Hz作比較）。亦即，也可在至少i個 冷卻部41之溫度為第i _值(12张)以上時，立即相對地(例 如5Hz)提高輸出頻率，而在全部冷卻部41之溫度為未滿第】 臨限值(128K)時，立即相對地(例如5Hz)降低輸出頻率。 本發明已由上述相關實施例加以描述，然而上述實施例僅 為實施本發明之範例。必需指出岐，已揭露之實施例並未限 制本土明之範圍。相反地’包含於巾請專利範圍之精神及範圍 之修改及鱗設置均包含於本發明之範圍内。 【圖式簡單說明】 圖1係顯不作為本發明之真空處理裝置的半導體裝置之製造 裴置的概略構成圖； 25 201107603 圖2中’(a)係顯示圖1 成圖；（b)係顯示圖1 構成圖； 之真工處理裝置之真空排氣部的概略構 之真工處理裝置之〶真空排氣部的概略 圖3係顯示圖1之第1 系統圖； 處理部之減職統巾的冷觀動配管的 圖4係顯示與構成圖1之第1虚採邱法 關之電氣概略構成的方/圖1處理权趨錢的壓縮裝置有 圖5係顯示圖4之以頻率控制部來控制變頻裝 流私的流程圖； 置之輸出頻率之 圖6係顯不圖1之第1處理部的各個室 與變頻裝置之輪出頻率的時序圖。 中的冷卻部之溫度推移 【主要元件符號說明】 10半導體裝置之製造裝置 11第1處理部 12弟2處理部 13緩衝室 15、25搬運室 16a、16b負载鎖定室 17〜20、26〜31室 21閘閥 22、32搬運機器人 34真空排氣部 35高真空排氣部 36、38粗抽泵浦 ' [S] 26 201107603 37渦輪分子泵浦 39 閥 40低溫捕集器 41 冷卻部 42壓縮裝置 43交流電動機 44壓縮部 45蓄壓器 46低壓氣體貯留部 50溫度感測器 51頻率控制部 52變頻裝置 53 外部電源on. Further, the frequency control unit 51 completes the determination that the output frequency _ζ of the current inverter device 52 is not satisfied with the upper limit value, thereby making the rotation frequency higher than the current fresh (45 Hz). The deviation control value is input from the frequency control unit 51 to the inverter device 52. As a result, the alternating current motor 43 can be supplied with the frequency of the ground value, and the capacity of each cold 4 becomes maximum. "P In other words, in the timings t2 to t5, it is determined that the temperature of at least one of the cooling units 41 in all the cooling units is equal to or greater than the first threshold. Therefore, in the inverters 52 in the respective % sequences t2 to t5, the command value for continuously increasing the wheeling frequency is continuously input. Here, the temperature of the cooling portion 41 which is cooled by using such a deflated helium gas does not immediately change in accordance with the increase or decrease in the amount of helium gas supplied. \7li, #... In the case of a cold heat insulation ship, it takes a long time to _ aeronautical or rumored. For a long time, the increase or decrease in the supply of refrigerant reflects the need to spend a considerable amount of money on the cooling unit. Therefore, if the temperature of the cooling unit q rises sharply, it is preferable to increase the supply amount of the refrigerant greatly, and the temperature of the unit 41 is slowly rising, and Congjia slightly increases the supply of the refrigerant. The amount, or directly suppress the increase. As described above, in the present embodiment, when at least one of the cooling units is connected to the first threshold or more, that is, the cooling of the cooling units 41 is required to be supplied. The AC power supply to the AC axis machine 43 rises. _, based on the pre-phase ya _ rate caused by the temperature change of each part, the part can be re-entered to complete the increase of the frequency of the round. Right is this kind of money control method, and the transmission avoidance_transfer (four) rate of the transfer of the device (2011) increases the compression device 42, and only avoids the power consumed by the frequency. Rising, second, at time t6, the household becomes a service that is less than the first threshold. Because of the above temperature, the AS λ solution control 51 will be the capital of the 财1 threshold. Further, in the frequency control unit 51, the current frequency is completed, and the frequency (5 〇 Hz) is higher than the lower limit value (3 〇 Hz), and the output frequency is different. From the simple set m ^ motivation 43 the rotation catch set 52 results 'parent convection cooling capacity _ remaining. In the king cooling unit 41, it does not cause the whole ^^4_ 'W (four) her (four) editing force, and the 12 pieces of the total length of the z in the continuous detection period is less than the first threshold rate reduction, T7~t9 towel's situation, the output word is controlled by the current frequency, and the command value is input from the frequency control unit 51 to the frequency converter of the frequency conversion device, and the AC power source that is turned off by the #变_52 is (4) At the time, after the time series (10), the (10) lion's freshness supplied to the alternating current motor 43 is turned to the lower limit value. In other words, at the timing t6 to U, the touch of all the temperatures of the respective cooling units 41 is not completed. Therefore, in the inverter device &, the control command value for reducing the frequency of the output frequency_ is input in each of the timings t6 to ttl. As described above, the use of this __ 过 四 四 四 被 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 。 。 。 。 。 。 As described above, the mouse is supplied to the AC motor 43 in a case where the temperature of the cooling material is not exceeded, that is, the cooling unit 4 is not required to be further cooled. New Zealand is reduced. Thereby, the output frequency can be further reduced based on the temperature change of each of the cooling units 41 due to the reduction of the previous output solution. Thereby, the frequency can be changed, and the output frequency of the set 52 is reduced by the temperature of the cooling unit 41 at #, and the power consumed by the compression means 42 can be reduced by reducing the output solution. Then, in the manufacturing apparatus ω having such a pressure reducing system, the power consumption of the tilting manufacturing apparatus W can be reduced by the low power of the power of the pressure reducing system. By the way, if the temperature of each of the at least one cooling unit 暂时 is temporarily completed at the time t6, the frequency of the AC power supplied to the AC motor is maintained at the upper limit. 5 suits. Further, for example, in the case of the timing t8, when the temperature of each of the at least i cooling units μ is determined to be equal to or greater than the first threshold value, the control for increasing the transmission frequency by 5 比 from the current frequency (side ζ) is performed. The command value is input from the frequency control unit 51 to the inverter device 52. Further, for example, in any one of the timings t〇 to 1〇, if at least one of the temperatures of the cold portion 41 is temporarily determined to be 138K or more of the second threshold, the output frequency is forced. The control command value set at 50 Hz of the upper limit value is input to the inverter device 52. As described above, according to the pressure reducing system of the present embodiment and the manufacturing apparatus 10 using the pressure reducing system, the following effects can be obtained. (1) When the temperature of at least one of the cooling units 41 is equal to or greater than the first value 201107603, the _device 52 is increased, and when the cooling unit 41 is fully tuned by the frequency control unit 51 The frequency of the magic wheel can be reduced by the same teacher: ^ When the first limit value is exceeded, the control method of the frequency of the wheel is changed, and the frequency is reduced by ^ & If it is the cooling of the step, 19 feeding / "to make more progress on the cutting portion 41 - can enhance the post-mattering amount of each special m41, but the part 4" is more advanced, when there is no need for cold air When the amount = the time, the cooling ability of the edge-to-side pair 41 supplied to each of the cooling units 可 can be reduced. Therefore, while the output rate is lowered, the cooling is performed at a good pressure. (2) The frequency control unit 51 is a temperature of "the temperature", and when all the cooling degrees are equal to or greater than the threshold value, the temperature limit of the inverter unit 41 is set to a temperature limit of each stage. Ground rise ^ On the output frequency of the age-stable cooling unit 41, the material 卩 / 朗 "the next output age to the next level, then perform further output frequency. According to this configuration, it is possible to prevent the reduction of the inverter device 52 from rising, and by avoiding the excessive frequency rise, the power consumed by the collapse device 42 can be reduced. The temperature per _ portion of the detection period is less than the second temperature. The mother-pre-detection cycle is phased down. Therefore, based on the temperature change of each of the cooling units 41 caused by the reduction of the previous output solution of m 22 201107603, the further reduction of the output solution is performed. As a result, the output frequency of the variable woven fabric 52 can be reduced in accordance with the temperature of the cooling portion 41 at that time, and the power consumed by the compression device 42 can be reduced by reducing the output frequency. (4) The frequency (four) portion 51, when the temperature of at least one of the cooling units 41 of all the cooling tissues is equal to or greater than the second threshold value, the output frequency of the inverter device 52 is set to 5 GHz of the upper limit value. In the case of such a configuration, when the cooling of the cooling unit 41 is optimal, the cooling capacity of the cooling unit can be set to red, and the cooling unit 41 can be rapidly cooled. Further, the above-described actual state can also be implemented as follows. In the case of the above-mentioned shellfish, although the light decompression is finely turned over to the semi-conducting food system as a direct-air treatment device, the gorge secret /, as long as it is the use of the reduction of the weaving and pressing the position, this (four) Can also apply to other devices. When the temperature of the one cooling unit 41 is less than or equal to the value of the temperature of the cooling unit 41 in all the cooling units, the output frequency of the inverter device is set to the output of the variable output. Limit. However, it is also based on the control of the second threshold. In the above embodiment, the cooling of the at least one of the cooling units 41 is performed at a temperature equal to or higher than the limit. Therefore, even if the control of the root limit value is omitted, the effects of the above (1) to (3) can be attained at least in the present invention. The frequency control unit 5 of the embodiment is also based on the temperature of the 201107603 of each cooling unit, and is less than the first threshold when all the cooling units 4 are set to 52. The method of ground reduction == in the above-mentioned mother-detection week fine downward limit, ljjkp51, 1., industrial output frequency. In place of this control method, the frequency control will be strong! The temperature τ of all the cooling units 41 is reduced to less than the first threshold = Γ2 is set to the lower limit. Even with such a configuration, at least the effects of the above (1) and (2) can be obtained by the present invention. The frequency control unit 5 of the above embodiment is a wheel of the simple conversion device 52 when the temperature of at least one of the cooling elements 41 is equal to or greater than the i-th limit value based on the temperature of each cooling unit W. (4) The rate is controlled in the way that the detection period is increased to the upper limit. In place of this control method, as another method of performing further stepwise cooling by the Saturation cooling unit, for example, the frequency control unit 5 may control the secondary setting 52 by two values of the lower limit value and the upper limit value. solution. When the temperature of at least one of the cooling units is equal to or greater than the first threshold, the cooling effect can be improved by setting the input of the inverter 52 to the upper limit. 7. The frequency control unit 51 of the above-described embodiment acquires the temperature of each of the cooling units 4'' at a predetermined detection period and the output frequency of the turbulence 52 of the temperature. Not limited to this, the frequency control unit 51 can continuously obtain the temperature of the cooling unit 41 and control the output frequency of the inverter unit 52. In the frequency control unit 51 of the above-described embodiment, the frequency of the frequency converter 52 can be increased stepwise when at least one of the temperatures of the cooling unit 41 is equal to or greater than the first threshold. The output frequency of the inverter device 52 is set in such a manner as to the frequency of the temperature of the cooling unit 41. In this case, when there are a plurality of cooling units 41 having a temperature equal to or higher than the upper limit of the 201107603 limit, for example, the frequency control unit 51 may be set to a frequency L corresponding to the highest temperature of the cooling units 41. The output frequency of the frequency conversion device 52. In the above-described embodiment, the number of the cooling units to be supplied to the compression device 42 is not particularly limited as long as it is two or more numbers that match the filling ability of the compression device 42. In the pressure reducing system of the above embodiment, the low temperature trap 4 is used as the pressure reducing device, but a cryopump may be used as the pressure reducing device. Further, when a cryopump is used as the decompression device, it is preferable to appropriately change the first threshold and the second threshold. • In Figure 5, step S1G5 (compared to the upper limit of 5 ships) and step si〇7 (compared to the lower limit of 30 Hz) may also be omitted. In other words, when the temperature of at least the i cooling units 41 is equal to or greater than the i-th value (12 sheets), the output frequency may be increased relatively (for example, 5 Hz), and the temperature of all the cooling units 41 may be less than the first] At the threshold (128K), the output frequency is immediately reduced relative to (for example, 5 Hz). The present invention has been described by the above related embodiments, but the above embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the local disclosure. To the contrary, modifications and scales of the spirit and scope of the invention are included in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram showing a manufacturing apparatus of a semiconductor device which is not a vacuum processing apparatus of the present invention; 25 201107603 In FIG. 2, '(a) shows a diagram of FIG. 1; (b) shows Fig. 1 is a schematic view showing a schematic diagram of a vacuum exhaust unit of a vacuum processing unit of a real processing apparatus; a schematic diagram of a vacuum exhaust unit; Fig. 3 is a first system diagram of Fig. 1; Fig. 4 of the cold observing piping is shown in Fig. 1 and shows the electric schematic configuration of the first virtual mining method of Fig. 1. Fig. 5 shows the compression device of the processing power of Fig. 1. Fig. 5 shows the frequency control unit of Fig. 4. A flow chart for controlling the inverter load flow; FIG. 6 showing the output frequency is a timing chart showing the frequency of the rotation of each chamber of the first processing unit and the inverter device of FIG. Temperature change of the cooling unit in the middle [Description of main components] 10 Manufacturing apparatus of the semiconductor device 11 First processing unit 12 Brother 2 Processing unit 13 Buffer chambers 15, 25 Transfer chambers 16a, 16b Load lock chambers 17 to 20, 26 to 31 Chamber 21 gate valve 22, 32 transport robot 34 vacuum exhaust unit 35 high vacuum exhaust unit 36, 38 rough pumping '[S] 26 201107603 37 turbo molecular pump 39 valve 40 cryogenic trap 41 cooling unit 42 compression device 43 AC motor 44 Compression unit 45 Accumulator 46 Low-pressure gas storage unit 50 Temperature sensor 51 Frequency control unit 52 Frequency conversion device 53 External power supply