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TW201009369A - Test apparatus and semiconductor device - Google Patents

Test apparatus and semiconductor device Download PDF

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Publication number
TW201009369A
TW201009369A TW098123441A TW98123441A TW201009369A TW 201009369 A TW201009369 A TW 201009369A TW 098123441 A TW098123441 A TW 098123441A TW 98123441 A TW98123441 A TW 98123441A TW 201009369 A TW201009369 A TW 201009369A
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TW
Taiwan
Prior art keywords
test
circuit
signal
bist
control
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TW098123441A
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Chinese (zh)
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TWI377355B (en
Inventor
Daisuke Watanabe
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Advantest Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/31903Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31908Tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3183Generation of test inputs, e.g. test vectors, patterns or sequences
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/48Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C2029/0401Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals in embedded memories

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A semiconductor device (DUT200) includes an interface circuit (202) connected to an ATE 100 through a test control bus BUS3 which differs from main buses BUS1 and BUS2, to receive control signal SCNT output from the ATE100, and to control the multiple BIST circuits BIST1-BIST5 based on the control signal SCNT. Further, the configuration of DUT200 allows the ATE100 to read out the test result SR assigned by the control signal SCNT via the test control bus BUS3. A BISI synchronous control unit 22 generates a first control signal for controlling individual BIST circuit of the multiple BIST circuits in the DUT200, and a second control signal for reading out the test result signal generated by the BIST circuit via an interface circuit in the semiconductor device, and to supply the first and second control signals to DUT200 via the test control bus BUS3.

Description

201009369 31916pif 六、發明說明: 【發明所屬之技術領域】 本發明有關於一種半導體元件的測試技術。 【先前技術】 為了以低成本測試半導體元件,而利用内建式自測試 (Built-In Self Test,BIST)電路。若利用 BIST 電路,則 即便不使用昂貴的半導體自動測試裝置(以下,稱作ate ❹ (aut〇matedtestequipment))’亦可藉由以低速對被測元件 (以下,稱作DUT (Device Under Test))讀寫,經限定的 輸入輸出信號來進行故障部位的診斷或良否判定。尤其, 關於記憶體電路或邏輯電路的BIST積累有較多的經驗或 研究成果,已被實用為量產測試。於1990年,所謂 IEEE1149.1的規格經聯合測試行動組(J〇int Test Acti〇n Group ’ JTAG)闡述’將邊界掃描(b〇undary scan)測試201009369 31916pif VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a testing technique for a semiconductor element. [Prior Art] In order to test a semiconductor element at low cost, a Built-In Self Test (BIST) circuit is utilized. If the BIST circuit is used, the device under test (hereinafter referred to as DUT (Device Under Test) can be used at a low speed even without using an expensive semiconductor automatic test device (hereinafter referred to as ate ❹ (aut〇mated testequipment)). ) Read and write, limited input and output signals to diagnose or determine the fault location. In particular, BIST has accumulated a lot of experience or research results on memory circuits or logic circuits, and has been practically used for mass production testing. In 1990, the so-called IEEE1149.1 specification was elaborated by the Joint Test Action Group (J〇int Test Acti〇n Group 'JTAG), which tested the boundary scan (b〇undary scan).

的方式與邊界掃描測試所需的輸入輸出信號統一。JTAG 規格(亦簡稱為JTAG)是藉由包含測試資料輸入TDI(Test Data Input)、測試資料輸出 TD〇 ( Test Data 〇utpm )、測試 時脈 TCK (Test Clock)、測試模式選擇 TMS (Test_ModeThe way is consistent with the input and output signals required for the boundary scan test. JTAG specification (also referred to as JTAG) is input TDI (Test Data Input), test data output TD〇 (Test Data 〇utpm), test clock TCK (Test Clock), test mode selection TMS (Test_Mode)

Select)、測試重置TRST (Test Rese〇 (選項)的5位元的 輸入輸出信號,而於裝入至DUT中的BIST電路中進行存 取,進行邊界掃描測試的規格。 對於記憶體或邏輯電路的BIST中大多數進行的邊界 掃描測試方法如下,即,將設置於電路的某一邊界部分上 的夕個正反器(flip f|〇P)或鎖存器串聯連接,形 5 201009369 31916pif 成菊鍊(daisy chain)來讀耷咨 料輸入埠(port)以低速輪二體而言,自測試資 態下的邊界較的正反ϋ ’將DUT的某一狀 望值進行比較。因而,於僅資料串列讀出,與期 信號的資源(獅職),時’作為咖 模裝置或者電子計算機(45::=並列料的小規 然而,大多數的贿為了保證品質,不僅必須進行 BIST測試’而且必須進行直流電咖⑽,⑽ 測試或輸人漏電(leak)測試,故尚未能實現完全不使用 ATE的測試。因而,用以進行Dc測試等的ate的若干個 輸入輸出埠,將分配給;DUT的;rTAG帛埠(_為測試存 取埠TAP),可於一個ATE中執行BIST測試與DC測試等 的兩者。一般而言,ATE可進行越高速信號輸入輸出的機 種越昂貴’導致測試成本增大。故而,當僅進行BIST與 規定的DC測試,保證必要的最低限度品質,使元件出廠 時,使用僅能產生低速信號的廉價ATE足矣。現況中亦存 在針對BIST用而最佳化的BIST測試器(tester)等。 BIST的有效性於邏輯或記憶體電路中得到充分證 明。因此,嘗試著將BIST擴展到類比電路中,來實現數 位一類比混載大型積體電路(Large Scale Integration,LSI) 的合成性BIST。已經作為類比電路區塊之一的高速I/F電 路,在稱作回送(loopback)測試的BIST方式中有大量研 究’量產測試亦已實用化。而且’類比/數位(analog/digital, A/D )轉換器或數位/類比(digital/analog,D/A )轉換器等Select), test the TRST (Test Rese〇) 5-bit input and output signal, and access it in the BIST circuit loaded into the DUT to perform the boundary scan test specification. For memory or logic Most BFD tests performed in the BIST of a circuit are as follows, that is, a flip-flop (flip f|〇P) or a latch connected to a certain boundary portion of the circuit is connected in series, shape 5 201009369 31916pif The daisy chain is used to read the 埠 料 埠 埠 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 port port port port port port port port port port port port port port dai In the case of only the data series, the resources of the period signal (Shishi), when the 'as a coffee model device or an electronic computer (45::= the side by side of the small rule, however, most of the bribes in order to ensure quality, not only must Performing the BIST test' and having to perform the DC coffee (10), (10) test or the input leakage test, it has not been able to achieve the test without using ATE at all. Therefore, several inputs and outputs of the ate for performing the Dc test, etc. Will be assigned to; DU T's; rTAG帛埠 (_ is the test access 埠 TAP), which can perform both BIST test and DC test in one ATE. In general, the more expensive the ATE can perform higher-speed signal input and output, the more expensive it is. The test cost increases. Therefore, when only the BIST and the specified DC test are performed, the minimum quality required is ensured, and when the component is shipped, an inexpensive ATE that can only generate a low-speed signal is used. In the current situation, the BIST is used most. BIST tester, etc. The effectiveness of BIST is well proven in logic or memory circuits. Therefore, try to extend BIST to analog circuits to implement digital analog-to-digital hybrid circuits (Large). Scale Integration, LSI) Synthetic BIST. A high-speed I/F circuit that has been used as one of the analog circuit blocks. There is a lot of research in the BIST method called loopback test. The mass production test has also been put into practical use. 'analog/digital (A/D) converter or digital/analog (D/A) converter, etc.

Ο 201009369 31916pif 的數位區塊與類比區塊的邊界部分的BIST、或無線通信用 LSI的如端或後端的BIST將來亦會實現實用化。 鑒於如此狀況,不遠的將來,記憶體、邏輯、類比、 A/D轉換、D/A轉換、高速I/F等製成單片的系統單晶片 (System On a Chip ’ SoC)或者系統級封裝(System in a Package ’ SiP)中,單一的DUT有可能搭載多種BIST。 越疋因半導體製程的微細化發展,而可忽視設置BBT電 路導致電路面積增加(負擔(。磁ead)),則可藉由BIST 來校驗的測試項目越多,更可安裝大量的bist電路。進 而,作為BIST的優點’可列舉能夠獲知自外部谭無法觀 :二的DU:的,電路狀態。對使多個功能積體化的 二70件而5,&將成為不良分析或提高良率的極為有效 於如此情況下,發明者們對安裝有多個bist的腿 的測試進行研究㈣果,達成認識町課題。 控制命令======= = 2源ΒΓ費㈣繁5貞化。此情形將導致測試時間增多或測 2.當進行BIST電路彼此的聯動動 n要m亦對各贿電路進行摊,使得 料料科(>觀存取埠(TeSt 7 201009369 31916pif 3.將來,也許必須使多個BIST與通常測 DUT的通常的輸入輪出琿進行存取的測試)聯 于 ==下’未設想贿與通常測試的聯動: 【發明内容】 本發明是鑒於如此的情況而開發的,其 一種對多個BIST電路進行統合控制的方式。牡於扠供 本發明的某-態樣是㈣於—種半導 裝置。作為被測元件(DUT)的半導體元件,星 能區塊、多個腿電路、及介面電路。多個功 經由主匯祕(mam bus)而進行信號的輸入輸出 =定龍號處理。多個BIST電路針對多個功能區塊的 母-功此區塊Μ置’對相應的魏區塊進行 成與測試結果對應的數位測試結果錢。介面電路經 主匯流排不同的測試控制匯流排而與測試裝 、接 ❿ 收自測試裝置中輸出的控制信號。介面電路構成、= 基於控制信號來對多個BIST電路進行控制,並且 由 =信號所指定關試結果信號,可經由測試控制匯流排 而由測試裝置讀出。測試裝置具備測試單元與控制單元。 :試單it經由主匯流排’而與半導體元件進行信號的收 ’使至少-個功能區塊執行規定的錢處理。控制單元 ίίΪ 1控制信號與第2控健號,並經由測試控制匯流 =而將上述第旧繼軸第2控制錢供給至半導體元 件中,上述第1㈣信制以對半導體元件_上述多個 8 201009369 31916pit BIST電路進行個別地控制,而上述第2控制信號用以將藉 由BIST電路所生成的測試結果信號自半導體元件内的介 面電路中讀出。 根據該態樣’便可將多個BIST電路的介面統一化, 對設置於DUT中的BIST電路進行控制,並且可獲取藉由 各BIST電路所生成的測試結果信號。「測試結果信號」既 y為作為檢查對象的功能區塊的良否判定結果,亦可為測 試過程中所得的中間資料。而且,所謂「收發」意指發送、 接收中的至少一者。 藉由控制單元所生成的第1控制信號,可至少包含對 疋否使多個BIST電路中的任-BIST電路為主動電路進行 設定的選擇信號。 多個BIST電路的至少-個,為可切換成為多個模式 之構成。選擇信號可包含設定模式的模式資料。 控制單元更可生成包含應供給至各BIST電路之測試 圖案的第3控制信號’並經㈣試控舰賴而將該第3 Φ 控制信號供給至半導體元件。 此時,可對功能區塊供給由測試農置所生成的測試圖 案,獲取處理該測試圖案的結果。 控制單元進而可生成指示BIST電路的測試開始、停 止的第4控制信號,並經由測試控制匯流排而將該第4控 制信號供給至半導體元件中。 控制單7L可生成選項(GptiGn)信號,該選項信號用 於對多個BIST電路中的至少一個進行固有的控制。測試 201009369 控制匯流排,可包括用以傳輸選項信號且與第1、第2控 制信號不同的其它信號線。 因為設置有選項信號,故而DUT200的設計者便可對 被要求多位元傳輸的BIST電路分配選項信號。 於測試單元與半導體元件進行信號的收發,且至少一 個功能區塊執行規定的信號處理的狀態下,控制單元可使 與至少一個功能區塊對應的BIST電路為主動電路,對至 少一個功能區塊進行測試。 此時’可利用經由主匯流排所收發的信號,來執行内 部自我測試(BIST)。 測試裝置可進而具備同步控制單元,該同步控制單元 ,收藉由控制單元所生成的控制信號,並與測試單元的測 試速率同步輸出該控制信號。 執行内部自我測試(BIST)。 多個BIST電路中具有同— 此時因為將控制彳§號與測試速率同步供給至DUT 而可面即時(real time)改變測試速率,一面同步 功能的BIST電路,可於多 可經由校正(calibration)用藤 此時,Ο 201009369 The BIST of the 31916pif digital block and the boundary part of the analog block, or the BIST of the wireless communication LSI, such as the end or the back end, will also be put into practical use. In view of this situation, in the near future, memory, logic, analog, A/D conversion, D/A conversion, high-speed I/F, etc. can be made into a single-chip system on a chip (SoC) or system level. In a System in a Package 'SiP, a single DUT may carry multiple BISTs. Due to the miniaturization of the semiconductor process, it is negligible to increase the circuit area (burden (.magnetic ead)) by setting the BBT circuit. The more test items that can be verified by BIST, the larger the bist circuit can be installed. . Further, as an advantage of BIST, it can be exemplified that the circuit state can be known from the outside: For the case of two 70 pieces that make a plurality of functions integrated, 5, & will be extremely effective for poor analysis or improvement of yield. In this case, the inventors studied the test of legs with multiple bist (4). We reach the problem of understanding town. Control command ======= = 2 source fee (four) complex 5 贞. This situation will lead to an increase in test time or measurement. 2. When the BIST circuits are linked to each other, m is also required to spread the bribe circuits, so that the materials section (> view access (TeSt 7 201009369 31916pif 3. In the future, It may be necessary to have multiple BISTs tested with the usual input rounds of the normal DUTs for access). ===Unexplained linkages between the bribes and the usual tests: [Invention] The present invention is in view of such circumstances. Developed, a way to control multiple BIST circuits in an integrated manner. A certain aspect of the invention is (4) a semiconductor device. As a semiconductor component of the device under test (DUT), the star energy region Block, multiple leg circuits, and interface circuits. Multiple functions are input and output of signals via the main bus (mam bus) = fixed dragon processing. Multiple BIST circuits are for the parent-work area of multiple functional blocks. The block device 'make the corresponding Wei block into a digital test result corresponding to the test result. The interface circuit is controlled by the main bus bar with different test control bus bars and the test device and the control signal outputted from the test device. .interface The circuit configuration, = control of a plurality of BIST circuits based on the control signal, and the test result signal specified by the = signal can be read by the test device via the test control bus. The test device is provided with a test unit and a control unit. The test order is performed by the main bus bar and the signal is received by the semiconductor component to enable at least one functional block to perform the specified money processing. The control unit ίίΪ 1 control signal and the second control key, and control the convergence via the test = The second control second control money is supplied to the semiconductor element, and the first (four) information system controls the semiconductor element_the plurality of 8 201009369 31916pit BIST circuits individually, and the second control signal is used for The test result signal generated by the BIST circuit is read out from the interface circuit in the semiconductor component. According to the aspect, the interfaces of the plurality of BIST circuits can be unified, and the BIST circuit disposed in the DUT can be controlled and obtained. The test result signal generated by each BIST circuit. The "test result signal" is both y and the quality of the function block to be inspected. The result may also be intermediate data obtained during the test. Moreover, the term “receiving and receiving” means at least one of transmission and reception. The first control signal generated by the control unit may include at least The BIST circuit of the BIST circuit is a selection signal for setting the active circuit. At least one of the plurality of BIST circuits is configured to be switchable into a plurality of modes. The selection signal may include mode data of the setting mode. A third control signal 'including a test pattern to be supplied to each BIST circuit' can be generated and supplied to the semiconductor element via the (4) trial control ship. At this time, the functional block can be supplied by the test farmer. The generated test pattern is set to obtain the result of processing the test pattern. The control unit may further generate a fourth control signal indicating the start and stop of the test of the BIST circuit, and supply the fourth control signal to the semiconductor element via the test control bus. The control unit 7L can generate an option (GptiGn) signal for inherent control of at least one of the plurality of BIST circuits. Test 201009369 Control bus, which can include other signal lines that are used to transmit option signals and are different from the first and second control signals. Because the option signal is set, the designer of the DUT 200 can assign an option signal to the BIST circuit that is required to transmit multiple bits. In a state in which the test unit and the semiconductor component perform signal transmission and reception, and at least one functional block performs predetermined signal processing, the control unit may make the BIST circuit corresponding to the at least one functional block into an active circuit, and at least one functional block. carry out testing. At this time, the internal self-test (BIST) can be performed using signals transmitted and received via the main bus. The test device may further comprise a synchronization control unit that receives the control signal generated by the control unit and outputs the control signal in synchronization with the test rate of the test unit. Perform an internal self test (BIST). The same is true in multiple BIST circuits. At this time, the test rate can be changed in real time because the control 彳§ is synchronously supplied to the DUT. The BIST circuit of the synchronous function can be calibrated. ) With the vine at this time,

成的校正信號來校正 個功能區塊之間共用化。 至少一個BIST電路, 流排而輸入/ 生成校正信ϊ 的結果所產生的測試結果信號, 生成用以對BIST電路進行校正 201009369 31916pif BIST電路。 f發明的其它態樣是—種半導體元件。該體 具備夕個功能區塊、多個BIST雷技b人 功評電路、及介面電路。多個The resulting correction signal is used to correct the sharing between the functional blocks. At least one BIST circuit, which outputs a test result signal generated by the result of input/generation of the correction signal, is generated to correct the BIST circuit 201009369 31916pif BIST circuit. Another aspect of the invention is a semiconductor component. The body has a function block, multiple BISTs, and a user circuit. Multiple

由流排而進行信號的輸入輸出,並執行規 處理。多個BIST電路針對多個功能區塊中的每 塊岐置,對相應的魏輯進行測試生成與 :★、結果對應的數位測試結果信號。介面電路經由與主匯 k排巧的賴控継流排,而接收自測試裝置中輸出的 控制i»號。介面電路構成為⑴可基於控制信號對多個 BIST電路進行控制,並且⑵藉由控制信號所指定的測 試結果信號,可經由測試控制匯流排而由測試裝置讀出。 根據該態樣,可使多個BIST電路的介面統一化,並 藉由測試裝置對設置於DUT中的多個BIS T電路進行統合 控制,而且,可將由各BIST電路生成的測試結果信號自 測試裝置中讀出。 控制信號可至少包含:選擇信號,對是否使多個B j s τ 電路中的任一 BIST電路為主動電路進行設定;及測試資 料輸入#號,包含應供給至設定為主動電路的BIST電路 的測試圖案。藉由選擇信號而設定為主動電路的BIST電 路’可接收測試資料輸入信號對相應的功能區塊進行測試。 多個BIST電路的至少一個,可構成為多個模式能夠 進行切換。介面電路可根據選擇信號中所包含的模式資 料’來設定BIST電路的模式。 藉由選擇信號而設定為主動電路的BIST電路,可根 11 201009369 31916pif 據控制信號中所包含的啟動停止信號,來使測試開始或停 止。Signal input and output are performed by the flow line, and the processing is performed. A plurality of BIST circuits are configured for each of the plurality of functional blocks, and the corresponding Wei series is tested to generate a digital test result signal corresponding to: ★, the result. The interface circuit receives the control i» number output from the test device via the main control bus and the main control bus. The interface circuit is configured to (1) control a plurality of BIST circuits based on the control signal, and (2) the test result signal specified by the control signal can be read by the test device via the test control bus. According to this aspect, the interfaces of the plurality of BIST circuits can be unified, and the plurality of BIS T circuits disposed in the DUT can be integrated and controlled by the testing device, and the test result signals generated by the BIST circuits can be self-tested. Read out in the device. The control signal may include at least: a selection signal for setting whether any BIST circuit of the plurality of B js τ circuits is an active circuit; and a test data input # number, including a test to be supplied to the BIST circuit set as the active circuit pattern. The BIST circuit set to the active circuit by selecting the signal can receive the test data input signal to test the corresponding functional block. At least one of the plurality of BIST circuits may be configured to be switchable in a plurality of modes. The interface circuit can set the mode of the BIST circuit based on the mode data contained in the selection signal. The BIST circuit set as the active circuit by selecting the signal can be used to start or stop the test according to the start-stop signal included in the control signal.

於至少一個功flb區塊執行規定的信號處理的狀態 下,與至少一個功能區塊對應的BIST電路可對至少二 個功能區塊進行測試。 V 多個BIST電路中具備同一功能的msT電路,可 個功能區塊之間共用化。 至少-個BIST電路可經由校賴隨排而輸入校正 ❿ L號缺該BIST電路可將處理校正信號的結果作為測試結 果k號而輸出。 =,將以上構成要素的任意組合或者本 f素或表現於方法、裝置等之_互 ^ 發明的有效態樣。 &β丌為本 [發明之效晏] 根據本發_態樣,提供_種對多個msT電 集成控制的技術。 進仃 ❹ 皋眚本Γ明之上述特徵和優點能更明㈣懂,下文特 施例,並配合所附圖式作詳細說明如下。 【實施方式】 切Π—面基於較佳的實施形態並參照圖式,-面掛 要素、構理#2_所示_—或相等的構成 明。而a,參處/軚同一符號,並適當省略重複的說 實施形態中所並明加以限定者, 特徵或其組合,未必為發明的本質 12 201009369 31916pit 性内容。 圖中,作為進行各種處理的功能區塊所揭示的各要 素,就硬體(hardware)而言’可由中央處理單元(central processing unit,CPU )、記憶體、其它大型積體電路(large scale integration’ LSI)而構成,就軟體(software)而言, 可由下載於記憶體中的程式等而實現。因而,熟悉此技藝 者當理解其等的功能區塊可以各種形式僅由硬體或僅由軟 體’或者該等的組合而實現,而不必僅限於其中任一者。 ❹ 圖1是表示實施形態的包含半導體自動測試裝置(以 下’稱作ATE) 100以及DUT200的測試系統3〇〇的方塊 圖。圖1僅表示與本發明關聯的構件,從而省略了電源供 給等的與發明的本質並無關係的信號線或區塊。 本實施形態的ATE100是以具有先前所未有之特徵的 實施形態的DUT200為前提而構成,而且,同樣地,實施 形態的DUT200是以具有先前所未有之特徵的ATEl〇〇為 前提而構成。亦即’本發明是在ATE1〇〇以及DUT2〇〇的 © 兩者中安裝與先前不同的新穎的架構(architecture),對多 個BIST電路進行簡易控制,而且,本發明旨在實現先前 的JTAG所未能實現的各種測試方式。 首先,對DUT200的構成進行說明,接著,對ATE1〇〇 的構成進行說明。 DUT200具備多個功能區塊FB1〜FB5、多個BIST電 路BIST1〜BIST5、BISI控制電路202、輸入輸出緩衝器 204以及輸入輸出緩衝器208。 13 201009369 31916pif 多個功能區塊FBI〜;FB5以及輸入輸出緩衝器2〇8, f通常動作時(亦即安裝於組件中的狀態),經由數位主匯 流排BUS1、類比主匯流排BUS2,而在與外部電路之間進 打信號的收發,一面相互同步.協調,一面執行規定的信號 處理。信號處理的内容並無特別限定,可設想任意的LSI 為 DUT200。 以下為了便於理解,而對DUT200為類比數位混載的 積體電路的情形進行說明。DUT200經由與數位輸入/輸出 (Input/Outpm,I/O)埠P4連接的數位主匯流排BUS1, 而進行數位信號的收發,並經由與類比I/O埠P5連接的類 比主匯流排BUS2 ’而進行類比信號的收發。 經由數位主匯流排BUS1而傳輸的數位信號,是電晶 體·傳輸邏輯(Transistor Transfer Logic,TTL)、二極體-電晶體邏輯(Diode-Transistor Logic,DTL)、射極麵合邏 輯(Emitter Coupled Logic,ECL)、電流型邏輯(cUITent Mode Logic,CML)互補金氧半導體、(Complementary Metal Oxide Semiconductor,CMOS)、殘餘連續終結邏輯 (Stub Series Terminated Logic,SSTL)、>(氐壓差動信號 (Low Voltage Differential Signaling ’ LVDS)等先前的標 準邏輯I/O的2值數位信號。經由數位主匯流排BUSl的 數位信號,可由現有的ATE100的輸入輸出埠(數位1/〇 埠P1)而傳遞。 與此相對,經由類比主匯流排BUS2而傳輸的類比信 號是高速I/F輸入輸出信號、光信號、多值調變信號(ASK、 201009369 31916ρΐί FSK、PSK)、射頻(radio frequency,RF)類比信號(振 幅調變、頻率調變、相位調變)、無線信號,而並非是單純 的2值數位信號。當類比信號為光信號時,類比主匯流排 BUS2為光纖,當類比信號為RF類比信號時,類比主匯流 排BUS2為具有規定的特性阻抗(50Ω或75Ω)的纜線 (cable)或者傳輸線路,當類比信號為無線信號時,類比 主匯流排BUS2為空氣。因而,本說明書中的類比主匯流 排BUS2 ’應以包含有線、無線的廣義概念來把握❶為了 ® 收發類比信號’ ATE100具有與數位1/〇埠pi不同的類比 I/O埠P2。數位主匯流排BUS卜類比主匯流排BUS2的匯 流排寬度(位元數)為任意的。 普通的類比數位混載電路大致分為數位區塊214、類 比區塊216。 以下為了便於理解,將功能區塊FBI設為記憶體電 路,FB2設為邏輯電路,FBL3設為D/A.A/D轉換電路, FB4。設為類比電路,fB5設為類比1/〇電路。輸入輸出緩 ® 衝器208是用以於與連接於數位主匯流排BUS1的外部電 路之間進行資料的輸入輸出的緩衝。邏輯電路FB2是經由 輸=輸出緩衝器208而接收自外部輸入的數位信號,進行 規定,信號處理。記憶體電路FBI可藉由邏輯電路FB2 而進行存取,並保持各種資料。 亦即,輸入輸出緩衝器208、記憶體電路FB1、邏輯 '路FB2與d/a.a/d轉換器FB3的一部分屬於數位區塊 15 201009369 31916pif 類比I/O電路FB5經由類比主匯流排BUS2而與連接 的外部電路之間進行資料的輸入輸出。可設想類比I/O電 路FB5為收發低清晰度多媒體介面(j^gh DefinitionThe BIST circuit corresponding to the at least one functional block may test at least two functional blocks in a state where the at least one work flb block performs the prescribed signal processing. V The msT circuit with the same function in multiple BIST circuits can be shared among functional blocks. At least one BIST circuit can be input and corrected by the calibration ❿ L. The BIST circuit can output the result of processing the correction signal as the test result k number. =, any combination of the above constituent elements or the effective form of the invention of the method, device, etc. &β丌 is the [effect of the invention] According to the present invention, a technique for integrated control of a plurality of msTs is provided. The above features and advantages of the present invention can be more clearly understood. (IV) Understand the following specific examples, and the following description will be described in detail with reference to the accompanying drawings. [Embodiment] The cut-and-face is based on a preferred embodiment and refers to the drawings, the surface-mounted elements, the structure #2_, or the equivalent composition. And a, the same reference numerals are given to the same symbols, and the description is omitted as appropriate. The features, or combinations thereof, are not necessarily the essence of the invention. 12 201009369 31916pit Sexual content. In the figure, each element disclosed as a functional block for performing various processes can be represented by a central processing unit (CPU), a memory, or other large scale integration. In the case of 'LSI,' software can be realized by a program downloaded in a memory or the like. Thus, those skilled in the art can understand that the functional blocks can be implemented in various forms only by hardware or only by software ' or a combination of the same, and are not necessarily limited to any of them. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing a test system 3A including a semiconductor automatic test apparatus (hereinafter referred to as ATE) 100 and a DUT 200 according to an embodiment. Fig. 1 shows only the components associated with the present invention, thereby omitting signal lines or blocks which are not related to the essence of the invention, such as power supply. The ATE 100 of the present embodiment is constructed on the premise of the DUT 200 having an embodiment having no prior characteristics, and similarly, the DUT 200 of the embodiment is constructed on the premise that the ATE is not previously characterized. That is, the present invention installs a novel architecture different from the previous one in both ATE1〇〇 and DUT2〇〇, and performs simple control on multiple BIST circuits, and the present invention aims to implement the previous JTAG. Various test methods that have not been implemented. First, the configuration of the DUT 200 will be described. Next, the configuration of the ATE1〇〇 will be described. The DUT 200 includes a plurality of functional blocks FB1 to FB5, a plurality of BIST circuits BIST1 to BIST5, a BISI control circuit 202, an input/output buffer 204, and an input/output buffer 208. 13 201009369 31916pif Multiple function blocks FBI~; FB5 and input/output buffers 2〇8, f are normally operated (ie, installed in the component), via digital main bus BUS1, analog main bus BUS2, and The signal is transmitted and received with the external circuit, and the predetermined signal processing is performed while synchronizing and coordinating. The content of the signal processing is not particularly limited, and any LSI is assumed to be the DUT 200. Hereinafter, in order to facilitate understanding, a case where the DUT 200 is an integrated circuit in which analog digital mixing is performed will be described. The DUT 200 transmits and receives digital signals via a digital main bus BUS1 connected to a digital input/output (Input/Outpm, I/O) 埠 P4, and is connected via an analog main bus BUS2 ' connected to the analog I/O 埠 P5. And the analog signal is sent and received. The digital signals transmitted via the digital main bus BUS1 are Transistor Transfer Logic (TTL), Diode-Transistor Logic (DTL), and Emitter Coupled (Emitter Coupled). Logic, ECL), cuiTent Mode Logic (CML) Complementary Metal Oxide Semiconductor (CMOS), Stub Series Terminated Logic (SSTL), > (Low Voltage Differential Signaling 'LVDS), etc. The binary signal of the previous standard logic I/O. The digital signal via the digital main bus BUS1 can be transmitted by the input/output 现有 (digit 1/〇埠P1) of the existing ATE100. In contrast, the analog signals transmitted via the analog main bus BUS2 are high-speed I/F input/output signals, optical signals, multi-value modulated signals (ASK, 201009369 31916ρΐί FSK, PSK), radio frequency (RF). Analog signal (amplitude modulation, frequency modulation, phase modulation), wireless signal, not a simple binary digital signal. When analog signal In the case of an optical signal, the analog main bus BUS2 is an optical fiber. When the analog signal is an RF analog signal, the analog main bus BUS2 is a cable or a transmission line having a specified characteristic impedance (50 Ω or 75 Ω), when the analog signal For the wireless signal, the analog main bus BUS2 is air. Therefore, the analog bus BUS2 ' in this specification should be based on the general concept of wired and wireless to grasp the analog signal for the transceiver. ATE100 has the digit 1/〇.埠pi different analog I/O埠P2. The digital bus BUS is analogous to the bus bar width (number of bits) of the main bus BUS2. The ordinary analog digital mixing circuit is roughly divided into digital blocks 214, analogy Block 216. In order to facilitate understanding, the function block FBI is set as the memory circuit, FB2 is set as the logic circuit, FBL3 is set as the D/AA/D conversion circuit, FB4. It is set as the analog circuit, and fB5 is set to analogy 1/ The input/output buffer 208 is used for buffering the input and output of data between the external circuit connected to the digital main bus BUS1. The logic circuit FB2 is buffered via the output = output 208 received from the externally input digital signal, performs predetermined signal processing by the memory circuit FBI can access the logic circuit FB2, and retain various data. That is, the input/output buffer 208, the memory circuit FB1, the logic 'path FB2, and a part of the d/aa/d converter FB3 belong to the digital block 15 201009369 31916pif analog I/O circuit FB5 via the analog main bus BUS2 Input and output of data between connected external circuits. It is conceivable that the analog I/O circuit FB5 is a low-definition multimedia interface (j^gh Definition).

Multimedia Interface ’ HDMI)規格的信號的高速I/F電路、 收發光信號的光I/O電路、收發多值調變信號的1/()電路。 或者’類比I/O電路FB5亦可為接收無線信號的天線或無 線介面等。 類比電路FB4包含RF收發電路、正交調變解調電 路、多值調變解調電路、快速傅利葉轉換(Fast Fcmrie ® Transform,FFT)電路,快速傅利葉反轉換(Inverse FFT, IFFT)電路、濾波器、振盪器、等化器、混頻器、電源電 路、帶隙調節器等中的與DUT200的功能對應的若干個電 路。 類比電路FB4、類比I/O電路FB5以及D/A.A/D轉 換器FB3的一部分屬於類比區塊216。 D/A*A/D轉換器FB3的D/A轉換器,將邏輯電路FB2 侧所生成的數位信號轉換為類比信號,供給至類比區塊 ❹ 中。而且,D/A.A/D轉換器FB3的A/D轉換器,將類比 區塊側所生成的類比信號轉換為數位信號,供給至數位區 塊中。亦即,D/A.A/D轉換器FB3作為數位區塊214與類 比區塊216之間的介面的功能。 多個BIST電路BIST1〜BIST5,針對功能區塊FB1 〜FB5中的每一功能區塊而設置。各BIST電路對相應的 功能區塊進行測試’生成與測試結果對應的數位測試結果 16 201009369 31916pif 信號SR °「測試結果信號」既可為作為檢查對象的功能區 塊FB的良否的判定結果,亦可為測試過程中所得的中間 資料。 BIST電路的測試項目或内容,根據功能區塊FB1〜 FB5的信號處理内容而定。換言之,DUT200的設計者設 計各BIST電路,以便保證對應的功能區塊的正常動作, 或者發現故障部位。BIST電路BIST1、BIST2以及BIST3 ❹的一部分稱作數位BIST群210,BIST電路BIST3的一部 分與BIST4、BIST5稱作類比BIST群212。 具體而言’由於BIST電路BIST1、BIST2是對記憶 體電路FB卜邏輯電路FB2進行測試的電路,故而,可以 先前的邊界掃描測試電路構成。而且,BIST電路BIST1、 BIST2的控制可依據JTAG規格來設計。 另一方面,BIST電路BIST3〜BIST5的測試對象D/A. A/D轉換器FB3、類比電路FB4、類比I/O電路FB5,無 法應用邊界掃描測試。亦即,無法基於JTAG規格進行充 ® 分控制’必須進行比邊界掃描測試更高度的控制。 詳情將於下文敍述’但可將對應於類比電路的BIST 電路看作是將混頻器電路、任意波形產生器、或者數化器 等所謂測量設備積體化的電路。因而,根據該觀點,對應 於類比電路的BIST電路(亦稱為類比BIST電路)可利用 組装測定器(Built-in Instruments,内建儀器)。 再者,輪入輸出緩衝器208為單純的緩衝,尤其因無 需用BIST測試,故未設置於個別的BIST電路。、 17 201009369 31916pif DUT2〇〇具備有與主匯流排BUS 1、BUS2不同的測試 控制匯,排BUS3連接的測試用1/0槔P6。輸入輸出緩衝 器204是為了經由測試用I/O埠P6將2值數位信號輸入輪 出而設置的。 1 ❹ 介面電路202經由測試控制匯流排BUS3,而接收自 ATE1〇()中輸出的第1控制信號SCNT1、第2控制信號 SCNT2。介面電路202基於第1控制信號SCNT1,來對多 個BIST電路BIST1〜BIST5進行控制。而且,介面電路 202構成為可經由測試控制匯流排Bus3,而將藉由bbt 電路所生成的測試結果信號SR中的由第2控制 SCNT2所扣定的測試結果信號SR輸出至卿侧。^ 介面電路202不僅對先前的記憶體BIST、邏輯bist, ^且對類比BIST進行統合控制。藉由介面電路2〇2而使 ^號,輸人輸出形式或控制命令*同的多個電路的 ’從而提供細100與dut2〇〇之間的組裝 :疋 ^ >ib © ( Built-in Instruments Standard =re’人内建儀器標準介面,以下,簡稱為bisi)。根據 該觀點,介面電路202亦稱為BISI控制電路。 藉由設置腦控制電路2G2,岐⑽ =〇聯動動作及同步動作,從而提供能夠同時執行多、 的職環境。_BISI控制電路⑽的動作將於下 又敎述。 ATP遍t為DU1·的構成。接著,對測試DUT200的 ATE100的構成進行說明。 18 201009369 31916pif ATElOO具備測試程式1〇、BISI命令控制部12、功能 測元14、RF測試單元16、光I/O測試單元18、DC 測試早=20、以及BISI同步控制單元22。 測忒程式1〇是預先由使用者進行程式設計的對測 Ϊ處理的序顺狀義。趣·根據油m城10所規 疋的序列來對DUT200進行測試。 ATE100的數位1/0埠P1經由數位主匯流排BUS1而 ❹ 、DUT200的數位I/O埠P4連接。ATE100的類比I/O埠 P2經由類比主匯流排BUS2而與dut2〇〇的類比ι/〇埠p5 ,接°進而’ ATE100的測試用1/〇埠p3經由測試控制匯 流排BUS3而與DUT200的測試用1/〇埠p6連接。 ATE100與DUT200經由數位主匯流排BUS1而進行 數位俏號的收發。亦即,ATE100可對DUT200輸出(寫 入)資料,或者自DUT200中讀出資料。 而且’ ATE100與DUT200經由類比主匯流排BUS2 而進行類比信號的收發。亦即,ATE1〇〇對DUT2〇〇提供 ❹ 類比信號,或者接收自DUT200中輸出的類比信號。 功能測試單元14經由數位主匯流排BUS1以及類比 主匯流排BUS2的至少一者,而進行DUT200的功能測試。 作為功能測試例示有以下形態。 功能測試1.功能測試單元14經由數位主匯流排BUS1 而將規定的圖案資料輸出,並寫入至DUT2〇〇的記憶體電 路FBI中。然後,經由數位主匯流排BUS1而自記憶體電 路FBI中將已寫入的資料讀出,並判定與其期望值是否一 19 201009369 31916pif 其結果’判定記憶體電路FBI的資料存取功能是否正 常0 力月匕測試2.功月包測試單元14經由數位主匯流排B U S1 而將毅賴案資料輪出,並使 執= 信號處理。經由數位主ΏΤΤΓ11 做狀的 « ^ . 匯〉爪排BUS1而將獲得信號處理結 果的貝㈣出,判定與期望值是否-致。其結果,判定邏 輯電路FB2是否正常發揮功能。 果〜邏 ❿ 力倉t·測試3.功能測試單& 14經由類比主匯流排 $脱’ΓΓ對規定的圖案資料機所得賴比信號輸出。 藉由記憶體電路FB1〜類比I/O雷政 拥π妹虑搜从从田 電路5來執行信號處 理心號處=的結果,若存在經由數位主 對麗腦輸出數位信號的情形,則亦存在 = 流排BUS2而對ΑΤΕ1⑻輸出類比信號的情形 = 單元η將mrnoo的信號處理的結果,與期望 較’判定DUT200整體是否正常發揮功能。此時,亦可經 由數位主匯流排BUS1㈣邏輯電路啦的信 行 ❹ 控制。 心逍订 DC測試單S 20進行DC須m。%測試通 測試單元20與功能測試單元η的協調動作來執行。 功能測試單元14來生成規定的圖案資料或命令並經 位主匯流排BUS1而提供給邏輯電路fb2,七水# 取考藉由功能 測試單元14來生成規定的圖案資料經調變的類比信^ 經由類比主匯流排BUS2而提供給類比電路FB4妗果, 邏輯電路FB2被設定為規定的狀態,且數位1/〇埠''I中 20 201009369 31916pif 產生固定的信號位準(高位準或者低 20對該狀態下蓋生於數位I/〇 3 ⑽位準或者電流位準)進行 =所測定的電位若低於規定的臨限值位 (’虽^位I/O埠P4應為低位準時’藉由Dc測試^元 20所測疋的電位若高於臨限值位準VL則為不良。A high-speed I/F circuit for signals of the Multimedia Interface' HDMI), an optical I/O circuit for receiving a light-emitting signal, and a 1/() circuit for transmitting and receiving a multi-value modulated signal. Alternatively, the analog I/O circuit FB5 may be an antenna or a wireless interface that receives a wireless signal. Analog circuit FB4 includes RF transceiver circuit, quadrature modulation and demodulation circuit, multi-value modulation and demodulation circuit, Fast Fourier transform (FFT) circuit, fast Fourier transform (IFFT) circuit, filtering A number of circuits corresponding to the functions of the DUT 200 in the oscillator, oscillator, equalizer, mixer, power supply circuit, bandgap regulator, and the like. The analog circuit FB4, the analog I/O circuit FB5, and a portion of the D/A.A/D converter FB3 belong to the analog block 216. The D/A converter of the D/A*A/D converter FB3 converts the digital signal generated on the side of the logic circuit FB2 into an analog signal and supplies it to the analog block ❹. Further, the A/D converter of the D/A.A/D converter FB3 converts the analog signal generated on the analog block side into a digital signal and supplies it to the digital block. That is, the D/A.A/D converter FB3 functions as an interface between the digital block 214 and the analog block 216. A plurality of BIST circuits BIST1 to BIST5 are provided for each of the functional blocks FB1 to FB5. Each BIST circuit tests the corresponding functional block. 'Generates the digital test result corresponding to the test result. 16 201009369 31916pif The signal SR ° "test result signal" can be the result of the determination of the quality of the function block FB to be inspected. It can be the intermediate data obtained during the test. The test items or contents of the BIST circuit are determined according to the signal processing contents of the function blocks FB1 to FB5. In other words, the designer of the DUT 200 designs each BIST circuit to ensure proper operation of the corresponding functional block or to find a faulty location. A portion of the BIST circuits BIST1, BIST2, and BIST3 称作 is referred to as a digital BIST group 210, and a portion of the BIST circuit BIST3 and BIST4, BIST5 are referred to as an analog BIST group 212. Specifically, since the BIST circuits BIST1 and BIST2 are circuits for testing the memory circuit FB and the logic circuit FB2, the previous boundary scan test circuit can be constructed. Moreover, the control of the BIST circuits BIST1, BIST2 can be designed according to the JTAG specification. On the other hand, the test object D/A of the BIST circuit BIST3 to BIST5, the A/D converter FB3, the analog circuit FB4, and the analog I/O circuit FB5 cannot apply the boundary scan test. That is, it is not possible to perform charge control based on the JTAG specification, and it is necessary to perform a higher degree of control than the boundary scan test. The details will be described later, but the BIST circuit corresponding to the analog circuit can be regarded as a circuit that integrates a so-called measuring device such as a mixer circuit, an arbitrary waveform generator, or a digitizer. Thus, from this point of view, a BIST circuit (also referred to as an analog BIST circuit) corresponding to an analog circuit can utilize an assembly analyzer (Built-in Instruments, built-in instrument). Furthermore, the round-in output buffer 208 is a simple buffer, especially since it does not require a BIST test and is not provided in an individual BIST circuit. 17 201009369 31916pif DUT2〇〇 has a different test control sink than the main bus BUS 1 and BUS2, and the test for BUS3 connection is 1/0槔P6. The input/output buffer 204 is provided for inputting a binary digital signal input via the test I/O 埠 P6. The interface circuit 202 receives the first control signal SCNT1 and the second control signal SCNT2 outputted from the ATE1〇() via the test control bus BUS3. The interface circuit 202 controls the plurality of BIST circuits BIST1 to BIST5 based on the first control signal SCNT1. Further, the interface circuit 202 is configured to output the test result signal SR delimited by the second control SCNT2 in the test result signal SR generated by the bbt circuit to the sleek side via the test control bus line Bus3. ^ Interface circuit 202 not only performs control on the previous memory BIST, logical bist, and analog BIST. By means of the interface circuit 2〇2, the input number or the control command* is the same as the multiple circuits' to provide the assembly between the thin 100 and the dut2〇〇: 疋^ >ib © ( Built-in Instruments Standard =re's built-in instrument standard interface, hereinafter referred to as bisi). From this point of view, the interface circuit 202 is also referred to as a BISI control circuit. By providing the brain control circuit 2G2, 岐(10) = 〇 linkage operation and synchronization operation, it is possible to provide a plurality of job environments that can be simultaneously executed. The operation of the _BISI control circuit (10) will be described later. The ATP time t is a configuration of DU1·. Next, the configuration of the ATE 100 of the test DUT 200 will be described. 18 201009369 31916pif ATElOO is provided with a test program 1, a BISI command control unit 12, a function cell 14, an RF test unit 16, an optical I/O test unit 18, a DC test early = 20, and a BISI synchronization control unit 22. The test program 1 is the sequence of the test process that is pre-programmed by the user. Interest • Test the DUT200 according to the sequence of the oil city 10. The digit 1/0埠P1 of the ATE100 is connected via the digital main bus BUS1 and the digital I/O埠P4 of the DUT200. ATE100's analog I/O埠P2 is analogous to the main bus BUS2 and dut2〇〇 analogy ι/〇埠p5, and then 'ATE100's test with 1/〇埠p3 via test control bus BUS3 and DUT200 The test is connected with 1/〇埠p6. The ATE100 and the DUT 200 perform digital transmission and reception via the digital main bus BUS1. That is, the ATE 100 can output (write) data to the DUT 200 or read data from the DUT 200. Moreover, the ATE100 and the DUT 200 perform analog signal transmission and reception via the analog main bus BUS2. That is, ATE1〇〇 provides a ❹ analog signal to DUT2〇〇 or an analog signal received from DUT200. The function test unit 14 performs functional testing of the DUT 200 via at least one of the digital main bus BUS1 and the analog main bus BUS2. The following form is exemplified as a functional test. Functional Test 1. The function test unit 14 outputs a predetermined pattern data via the digital main bus BUS1 and writes it into the memory circuit FBI of the DUT 2 . Then, the written data is read from the memory circuit FBI via the digital main bus BUS1, and it is determined whether the expected value is a 19 201009369 31916pif. The result 'determines whether the data access function of the memory circuit FBI is normal. Lunar Test 2. The power monthly test unit 14 rotates the data based on the digital main bus BU S1 and processes the signal. The X ^ (4) of the signal processing result is obtained by the « ^ . sink > claw row BUS1 which is made by the digital master 11, and the determination and the expected value are determined. As a result, it is determined whether or not the logic circuit FB2 functions normally. Fruit ~ Logic ❿ 仓 · t · Test 3. Functional test list & 14 via the analog main bus 脱 ΓΓ ΓΓ ΓΓ 规定 规定 规定 规定 规定 规定 规定 规定 规定 规定 规定 规定 规定 规定 规定 规定 赖 赖 赖 赖 赖 赖 赖 赖 赖By the memory circuit FB1 ~ analog I / O Lei Zheng π 妹 虑 搜 从 从 从 从 从 从 从 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 从 执行 执行 执行 执行 执行 执行 执行 执行 执行 从 从 从Existence = Flow Row BUS2 and Output of Analog Signal to ΑΤΕ1(8) = The unit η compares the result of the signal processing of mrnoo with the expectation that the DUT 200 as a whole functions normally. At this time, it can also be controlled by the signal line of the digital bus BUS1 (four) logic circuit. The heartbeat set DC test list S 20 is DC required m. The % test passes the coordinated action of the test unit 20 and the functional test unit η to perform. The function test unit 14 generates a predetermined pattern data or command and supplies it to the logic circuit fb2 via the bit main bus BUS1. The seven waters take the analog test unit 14 to generate a modulated analog data of the specified pattern data. Provided to the analog circuit FB4 via the analog main bus BUS2, the logic circuit FB2 is set to a predetermined state, and the digits 1/〇埠''I 20 201009369 31916pif generate a fixed signal level (high level or low 20 In this state, the cover is generated at the digital I/〇3 (10) level or current level) = the measured potential is lower than the specified threshold ('Although the position I/O埠P4 should be low level' It is bad if the potential measured by the Dc test element 20 is higher than the threshold level VL.

或者,對mmoo提供規定圖案的結果,使得類比ι/〇 電路FB5被設為規定的狀態,_比1/〇蜂p5中產生固 定的信號位準①C測試單元2〇對該狀態下 埠朽中的直流信號位準進行測定,並判定良否。' 而且’DC測試單元2〇對數位1/0埠P4或類比1/〇埠 P5提供規定的電壓,對流入至DUT2〇〇侧的Dc漏電流進 行測定,判定DUT200的良否。 再者,圖1中,數位主匯流排BUS1或類比主匯流排 BUS2僅表示有一條,但當設置有多個信號線時,將對所 有的信號線,亦即對多個數位1/〇埠P4或類比1/〇埠p5 進行DC測試。 RF測試單元16,於DUT200對RF信號進行處理時 攻置。RF測試單元16具有生成應供給至DUT2〇〇中的RF 信號的功能。而且,RF測試單元16具有如下功能:接收 自DUT200中輸出的rf信號(類比信號),並將RF信號 解調後提取符號(symbol),或者對眼圖(eye pattem)進 行測定’並對其開口率進行測定,以測定光譜(spectrum), 21 201009369 31916pif 或者進行星座圖對應(consteiiati〇n mapping )。 而且’ RF測試單元16亦在上述的功能測試中併用, 將藉由功能測試單元14所生成的規定的圖案資料轉換為 RF信號’經由類比主匯流排BUS2而輸出至dUT2〇〇中。 光I/O測試單元18,於DUT200對光信號進行處理時 設置。光I/O測試單元18具有接收自DUT200中輸出的光 信號(類比信號),進行解調並提取符號,或者進行各種測 試的功能。 而且,光I/O測試單元18亦在上述的功能測試中併 ⑩ 用,使用藉由功能測試單元14所生成的規定的圖案資料進 行光調變,並經由類比主匯流排(光纜)BUS2而輸出至 DUT200 中。 BISI命令控制部丨2對應於使用者的測試程式丨〇内的 命令’生成第1控制信號SCNT1〜第4控制信號SCNT4。 第1控制信號SCNT1是用以對DUT200内的多個BIST電 路BIST1〜BIST5進行控制的信號。第2控制信號;§(:\112 是用以獲取測試結果信號SR的信號。第3控制信號8〇^13 ❿ 疋包含應供給至各BIST電路中的測試圖案的信號。第4 控制信號SCNT4是指示BIST電路開始、停止測試的啟動 停止信號START/STOP。 該等控制信號SCNT1〜SCNT4(以下,亦簡稱為控制 信號SCNT) ’藉由下述的BISI同步控制單元22來進行重 定時(retiming),並經由測試控制匯流排BUS3而輸出至 BISI控制電路202中。 22 201009369 31916pif 以下’對控制信號SCNT的格式(format)與測試控 制匯流排BUS3的關係進行說明。圖2是表示經由測試控 制匯流排而進行傳輸的控制信號SCNT的格式的圖。測試 控制匯流排BUS3包含測試資料輸入線DATA-IN、測試資 料輸出線DATA-OUT、時脈線CLOCK、BIST選擇線 BIST-SEL、啟動停止線START/STOP、及選項擴展線 Option-Ι〜Option_N。控制信號SCNT1〜SCNT4經由該等 信號線而進行傳輸。 用以對多個BIST電路BIST1〜BIST5中的應執行測 試動作的BIST電路進行指定的bist選擇信號 BIST-SEL,經由BIST選擇線BIST-SEL而被發送。BIST 選擇信號BIST-SEL是上述第1控制信號SCNT1的一部分。 BIST選擇信號BIST-SEL包含BIST位址ADRS_B與 模式資料MD。BIST位址ADRS一B,分配於每一 BIST電 路中。當各BIST電路僅可切換動作的有無時,模式資料 MD成為取指示動作的!(確定)或者取指示停止動作的〇 ❹ (否定)的2值的1位元資料。 BISI命令控制部12’對多個BIST電路BIST1〜BIST5 各自的BIST位址ADRS_B寫入模式資料MD。例如,當 使第1、第2BIST電路BIST卜BIST2為主動電路,使^ 外的BIST電路BIST3〜BIST5為非主動電路時,對第 1BIST電路BIST1的BIST位址與第2BIST電路BIST2的 BIST位址中寫入值為丨的模式資料14£),而對其它bist 電路BIST3〜BIST5的BIST位址中,寫入值為〇的模式資 23 201009369 31916pif 科MD。 招·^各BIST f路可執行多個測試項目 ;式時,則模式資料亦可利用於此作 ^切換模柄個, 類比BIST雷踗寸97位凡寬度。例如’ 楛六分別可以第1至第3的=個 模式進仃動作時’各模式資料 -個 即,模式資料取表示非主動的⑽、; 分別對應的(〇1)、(10)、(11)中的任一值式= 的個數亦可在每—BIST電路中不盡相同。 模式 =如’當對第侧τ電路聰3的職位址寫入模 ^料(1 〇) ’對第4BIST電路BIST4的BIST位址寫入模 式資料(〇1),而對其它肌T電路的BIST位址寫入模式 資料(〇〇)時,則第3BIST電路BIST3被設定為第2模式, 第4BIST電路BIST4被設定為第1模式,而其它BIST電 路則成為非主動電路。 測試資料輸出線DATA-OUT,用於將取得BIST的結 果的資料自DUT200傳輸至ATE100。用以取得測試結果 信號SR的第2控制信號SCNT2,經由測試資料輸出線 DATA-OUT而自ATE100發送至DUT200。如此般,測試 結果信號SR將經由測試資料輸出線DATA-OUT,而自 DUT200 傳輸至 ATE100 〇 於圖2中’將第2控制信號SCNT2表示為位址資料 ADRS_R。ATE100 利用位址資料 ADRS_R,對 DUT200 指定設置於DUT200侧的記憶體或暫存器的位址。其結 24 201009369 31^Ι6ριί 果’儲存於經指定的位址中的測試結果信號SR作為讀出 資料RD而傳輸至ATE100。 包含應供給至各BIST電路中的測試圖案的第3控制 信號SCNT3 ’經由測試資料輸入線DATA-IN而自ATEl〇〇 供給至DUT200。第3控制信號SCNT3包含表示測試圖案 的發送目的地的BIST電路的位址資料ADRS—W、以及^ 供給至BIST電路中的測試圖案即寫入資料%^^ “ ❹ 經由測s式資料輸入線DATA-IN以及測試資料輸出線 DATA-OUT的資料傳輸’既可如I2C匯流排般藉由^雙向 傳輸的單一線路來安裝,亦可藉由個別的2條線路來安裝\ 則試資料輸入線購剔、測試資料輸出線 DATA-OUT、BIST選擇線BIST_SEL的資料傳輸的 時脈,經由時脈線CL〇CK來傳輸。 的開始時間'停止時間的第4控制信號 停止信號)’經由啟動停止信號線 ^TART/STOP來簡。若啟動停止錄STart/st〇 定’則設定為主動電路的BIST電路的BIST開始祕 停止信號START/STOP為否定,則BIST停止/ 選項擴展線〇pti〇n-i〜0pti〇n_N,用於對各b ίτΪτ固有的Ϊ制。選項擴展線既可作為輪入琿用於類比 電路所需的高度且複雜的控制 作為=用於自 -般 稱成為可於每-時脈(測試速率)即 25 201009369 31916pif 的動作頻率。例如,_〇某-期間以 速率)進行動作,而某-期間則以通常= 的動作時脈(半速率)進行動作。因而, 排B,於與職之間收發的資料的週二亦$ 由測试程式10而自由地即時變更。 在如此狀況下,BISI同步控制單元22使經由測試控 制匯流排BUS3所傳輸的資料與測試週期同步。圖3的 DATA-IN是藉由BISI命令控制部12所生成的資料,並與 規定的時脈信號CLOCK同步。BISI同步控制單元22接/收 與時脈CLOCK同步的測試資料輸入信號DATA_IN,並使 其與測試週期CYC_TEST同步。經同步的測試資料輸入信 號DATA-IN_SYNC,經由測試控制匯流排BUS3而供給至 DUT200 中。 、口 以上為ATE100的整體構成。 圖4是表示包含多個功能區塊FB與多個BIST電路的 DUT200的具體性構成例的方塊圖。圖4的DUT200為超 外差(superheterodyne)方式的接收電路。 DUT200包含記憶體電路30、基頻(baseband)電路 32、A/D 轉換器 34、低通滤波器(Low-Pass Filter,LPF) 36、混頻器38、局部振盡器40、影像除去濾、波器42、低 雜訊放大器(Low Noise Amplifier,LNA) 44、帶通遽波 器(Band-Pass Filter,BPF)46、用以對該等進行測試的記憶 體BIST電路50、邏輯BIST電路52、以及類比BIST電路 26 201009369 31916pif 54、56、58、60、62、64。 類比I/O埠P5中輸入有輸入RF信號处匕。BPF46 以載波頻率為中心對RF信號(RFin )進行濾波(filtering )。 LNA44將經濾'波的RF信號rf 1放大而生成处信號处2。 影像除去濾波器42 ’以不會因後段的降頻轉換 (downconversion)產生影像串擾的方式,而使影像頻率 哀減’生成RF信號RF3。局部振盪器4〇以與rf頻率(載 _ 波頻率)相同的局部頻率進行振盪。混頻器38使影像除去 濾波器42的輸出RF3與局部信號LO混頻,並進行降頻 轉換。當輸入RF信號RFin經正交調變時,則自混頻器 中輸出與類比基頻信號的同相成分BB_I的正交成分 BB-Q。類比基頻信號BB藉由LPF36來進行濾波,並藉 由A/D轉換器34而轉換為數位值。A/D轉換器34的輸出 將輸入至基頻電路32中,進行解調處理。 圖4的^己憶體電路3〇以及基頻電路,分別與圖^ 的記憶體電路FBI及邏輯電路FB2對應。而且,圖4的 ® A/D轉換器34與圖1的D/A.A/D轉換器FB3對應。圖4 的LPF36、混頻器38、局部振盪器40、影像除去濾波器 42、LNA44、BPF46分別與圖!的類比電路FB4對應。 ^記憶體BIST電路5〇是用以對記憶體電路30進行測 試的BIST電路,邏輯BIST電路52是用以對基頻電路32 進行測試的BIST電路。記憶體BIST電路5〇以及邏輯BIST 電路52執行例如邊界掃描測試。 類比BIST電路54、56、58、60、62、64與圖1的類 27 201009369 31916pif 比BIST群212對應。 類比贿電路54為任意波形產生器,對a 34的輸入端子供給類比波形。當類比msT電路μ == 換^將類比波形轉換為數位 器34是否正常動作。或者,基頻電路32未」= 便自數位I/O崞Ρ4將數位值輸出至ατει 不)中,由ΑΤΕ100進行良否判定。 Φ 由類比BIST電路56、58、6〇、62、64進行的bist, 於對類比I/O埠P5提供RP信號的狀態下執行。 ❹ 類比BIST電路64是為了對BPF46進行測試而設置。 類比BIST電路64包含例如頻譜分析儀(⑽議 analyzer)與A/D轉換器。於藉由類比BIST電路64進行 測試時,ATE100 (未圖示)對類比1/〇埠朽提供規定的 RF信號。類比BIST電路64的頻譜分析儀,將藉由BPF46 所渡波的RF信號RF1的每-頻帶中的強度轉換為數位 值°將如此所得的光譜資料與期望值加以比較後,類比 BIST電路64判定BpF46的良否。或者,光譜資料藉由介 面電路202而作為測試資料輸出信號DATA-OUT輸出。 類比BIST電路62是為了對LNA44進行測試而設 置,其為例如數化器。類比BIST電路62在對類比1/〇埠 P5提供Rp信號的狀態下,將自LNA44中輸出的处信號 進行數位化,以測定RF信號RF2的振幅位準。振幅 位準作為測試資料輸出信號DATA-OUT而輸出至ATE100 28 201009369 31916pif 中’ ATE100基於波形位準,來判定LNA44是否按照f 進行動作。 又 類比BIST電路60以及類比BIST電路58,分別為了 測試影像除去濾波器42、局部振盪器40而設置,其構成 及動作與類比BIST電路64相同。因而,可將該等類比 BIST電路6G、58、64構絲單—的電路,並根據上述模 式來切換測定對象的類比電路。 類比BIST電路56是為了測試LPF36而設置,其構 成、動作與類比BIST電路62相同。類比BIST電路%、 62亦可構成為單一的電路。 類比BIST電路本質上為駭n ’但目只要能夠測試 對應的功能區塊即可,故可簡易地構成。例如,以頻譜分 析儀為例,於通用的頻譜分析儀中,需要高頻率解析戶^二 版〜)與寬頻頻帶(自DC至數GHz),但類比ΒΙ&電 路只需能夠以輸入至DUT200中的頻帶為中心測定規定的 範圍即可,故能夠確認對應的類比電路的正常動作即可, 參因此解析度較低亦無妨。例如,將RF信號的頻寬記為 時,則頻率解析度可為Af/n (η為1〇、或者1〇以下的實 數)。 而且,數化器或A/D轉換器、D/A轉換器,亦可以校 驗對應的功能區塊所需的充分的精度進行設計。 BIST電路是DUT200實際動作時不=要的電路因 此應極大收縮(shrink)。然而,為了準確地測試DUT2〇〇 的各類比電路區塊,亦有時必須進行校正(calibrati〇n)。 29 201009369 31916pif 尤其使藉由微細化製程所實現的測定電路需要高準確度、 高精度地發揮功能時’則需要用以補償對於製程偏差或溫 度波動的誤差為主要原因的校正功能。 以下,就DUT200的類比BIST電路的校正機構加以 說明。圖5是表示具備類比BIST電路校正功能的DUT200 的構成的方塊圖。如上所述,圖5的DUT200中,單一的 類比BIST電路58由多個類比電路40、42、46而被共用。 DUT200中設置有校正埠!>7,且經由校正用匯流排 BUS4而輸入有來自ATE1〇〇的測試單元(圖5中為RF測 ❿ 試單元16)的校正信號CAL。再者,可共用校正用匯流排 BUS4與類比主匯流排BUS2。 於多個類比電路40、42、46與類比BIST電路58之 間,設置有開關矩陣(switchmatrix) 70。開關矩陣7〇的 多個輸入端子與各類比電路4〇、42、46的輸出端子以及校 正埠P7連接。開關矩陣7〇的輸出端子與類比BIST電路 58連接。 根據上述BIST選擇信號BIST-SEL·的模式資料MD, ❿ 來控制開關矩陣70的狀態。 ▲ η根據以上構成’可經由開關矩陣7〇而將已知的校正 乜號CAL輸入至類比bist電路58中。自類比BIST電路 58輪出與校正信號CAL相應的測定資料D1〇。測定資料 =10經由BISI控制電路2〇2 *向ATm〇〇輸出。ATE1〇〇 ^據校正信號CAL與測定資料mG的關係,來對類比BIST 路58進仃校正。校正既可藉由根據測試程式1〇而動作 30Or, the result of providing a prescribed pattern to mmoo is such that the analogy ι/〇 circuit FB5 is set to a prescribed state, and a fixed signal level is generated in the _1/〇 bee p5. 1C test unit 2 〇 状态 〇 The DC signal level is measured and judged whether it is good or not. 'And' the DC test unit 2 提供 provides a predetermined voltage for the digit 1/0埠P4 or the analog 1/〇埠 P5, and measures the Dc leakage current flowing to the side of the DUT2 to determine whether the DUT 200 is good or not. Furthermore, in FIG. 1, the digital main bus BUS1 or the analog main bus BUS2 only indicates one, but when a plurality of signal lines are provided, all the signal lines, that is, a plurality of digits 1/〇埠DC test with P4 or analog 1/〇埠p5. The RF test unit 16 is attacked when the DUT 200 processes the RF signal. The RF test unit 16 has a function of generating an RF signal that should be supplied to the DUT2. Moreover, the RF test unit 16 has a function of receiving an rf signal (analog signal) output from the DUT 200, demodulating the RF signal, extracting a symbol, or measuring an eye pattem and The aperture ratio is measured to determine the spectrum, 21 201009369 31916pif or to consconiiati〇n mapping. Further, the 'RF test unit 16 is also used in the above-described functional test to convert the predetermined pattern data generated by the function test unit 14 into an RF signal' to be outputted to the dUT2 via the analog main bus BUS2. The optical I/O test unit 18 is set when the DUT 200 processes the optical signal. The optical I/O test unit 18 has a function of receiving an optical signal (analog signal) output from the DUT 200, demodulating and extracting symbols, or performing various tests. Moreover, the optical I/O test unit 18 is also used in the above-mentioned functional test, using the prescribed pattern data generated by the functional test unit 14 for optical modulation, and via the analog main bus (fiber cable) BUS2. Output to the DUT200. The BISI command control unit 生成2 generates the first control signal SCNT1 to the fourth control signal SCNT4 in response to the command ' in the test program 使用者 of the user. The first control signal SCNT1 is a signal for controlling a plurality of BIST circuits BIST1 to BIST5 in the DUT 200. The second control signal; § (: \112 is a signal for obtaining the test result signal SR. The third control signal 8〇13 13 ❿ 疋 contains signals to be supplied to the test pattern in each BIST circuit. The fourth control signal SCNT4 It is a start/stop signal START/STOP indicating that the BIST circuit starts and stops the test. The control signals SCNT1 to SCNT4 (hereinafter, also simply referred to as control signals SCNT) are retimated by the BISI synchronization control unit 22 described below. And output to the BISI control circuit 202 via the test control bus BUS3. 22 201009369 31916pif The following describes the relationship between the format of the control signal SCNT and the test control bus BUS3. FIG. 2 shows the control via the test. A diagram of the format of the control signal SCNT transmitted by the bus. The test control bus BUS3 includes the test data input line DATA-IN, the test data output line DATA-OUT, the clock line CLOCK, the BIST selection line BIST-SEL, and the start stop. Line START/STOP, and option extension line Option-Ι~Option_N. Control signals SCNT1~SCNT4 are transmitted via these signal lines. The BIST circuit that performs the test operation in BIST1 to BIST5 performs the specified bist selection signal BIST-SEL, and is transmitted via the BIST selection line BIST-SEL. The BIST selection signal BIST-SEL is a part of the above-described first control signal SCNT1. The selection signal BIST-SEL includes the BIST address ADRS_B and the mode data MD. The BIST address ADRS-B is allocated in each BIST circuit. When each BIST circuit can only switch the presence or absence of the action, the mode data MD becomes the instruction action. (determination) or 〇❹ (negative) 2-bit 1-bit data indicating the stop operation. The BISI command control unit 12' writes the pattern data MD to the BIST addresses ADRS_B of the plurality of BIST circuits BIST1 to BIST5. For example, when the first and second BIST circuits BIST and BIST2 are active circuits, and the BIST circuits BIST3 to BIST5 are inactive, the BIST address of the first BIST circuit BIST1 and the BIST address of the second BIST circuit BIST2 are used. In the BIST address of the other bist circuits BIST3 to BIST5, the mode value is written in the BIST address of the other bist circuits BIST3 to BIST5, and the mode is 23, 201009369 31916pif.招·^ Each BIST f way can execute multiple test items; when the mode is used, the mode data can also be used as the ^ switch mode handle, analogous to BIST Thunder inch 97 width. For example, ' 楛 分别 可以 第 第 第 第 = = = 分别 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The number of any of the values in 11) can also be different in each BIST circuit. Mode = as 'When the address of the first side τ circuit Cong 3 is written to the module (1 〇) 'Write the mode data to the BIST address of the 4th BIST circuit BIST4 (〇1), and for other muscle T circuits When the BIST address is written to the mode data (〇〇), the 3rd BIST circuit BIST3 is set to the second mode, the 4th BIST circuit BIST4 is set to the first mode, and the other BIST circuits are the inactive circuits. The test data output line DATA-OUT is used to transfer the data of the BIST result from the DUT 200 to the ATE 100. The second control signal SCNT2 for obtaining the test result signal SR is sent from the ATE 100 to the DUT 200 via the test data output line DATA-OUT. In this manner, the test result signal SR will be transmitted from the DUT 200 to the ATE 100 via the test data output line DATA-OUT, and the second control signal SCNT2 will be represented as the address data ADRS_R. ATE100 uses the address data ADRS_R to specify the address of the memory or scratchpad set on the DUT200 side of the DUT200. The test result signal SR stored in the designated address is transmitted to the ATE 100 as the read data RD. The third control signal SCNT3' including the test pattern to be supplied to each BIST circuit is supplied from the ATEn to the DUT 200 via the test data input line DATA-IN. The third control signal SCNT3 includes the address data ADRS_W of the BIST circuit indicating the transmission destination of the test pattern, and the test data supplied to the BIST circuit, that is, the write data %^^" 经由 via the s data input line The data transmission of DATA-IN and test data output line DATA-OUT can be installed as a single line of bidirectional transmission as I2C bus, or can be installed by two separate lines. The clock of the data transmission of the purchase data, the test data output line DATA-OUT, and the BIST selection line BIST_SEL is transmitted via the clock line CL〇CK. The start time 'the fourth control signal stop signal of the stop time' is stopped by the start. The signal line ^TART/STOP is simplified. If the start stop recording STart/st setting' is set to the BIST circuit of the active circuit, the BIST start stop signal START/STOP is negative, then the BIST stop/option extension line 〇pti〇ni ~0pti〇n_N, used for the inherent control of each b ίτΪτ. The option extension line can be used as a wheel 珲 for the height and complexity of the analog circuit required as = for self-like to become available every Clock ( The test rate) is the operating frequency of 25 201009369 31916pif. For example, the _ 〇 - period is operated at a rate, and the certain period is operated at the normal = action clock (half rate). On Tuesday, the data sent and received between jobs is also freely changed by the test program 10. In this case, the BISI synchronization control unit 22 synchronizes the data transmitted via the test control bus BUS3 with the test cycle. The DATA-IN is the data generated by the BISI command control unit 12, and is synchronized with the predetermined clock signal CLOCK. The BISI synchronization control unit 22 receives/receives the test data input signal DATA_IN synchronized with the clock CLOCK and causes it to Synchronized with the test cycle CYC_TEST. The synchronized test data input signal DATA-IN_SYNC is supplied to the DUT 200 via the test control bus BUS3. The above is the overall configuration of the ATE 100. Figure 4 shows the inclusion of multiple functional blocks FB and A block diagram of a specific configuration example of the DUT 200 of a plurality of BIST circuits. The DUT 200 of FIG. 4 is a superheterodyne type receiving circuit. The DUT 200 includes a memory circuit 30. Baseband circuit 32, A/D converter 34, Low-Pass Filter (LPF) 36, mixer 38, local oscillator 40, image removal filter, waver 42, low A Noise Amplifier (LNA) 44, a Band-Pass Filter (BPF) 46, a memory BIST circuit 50 for testing the same, a logic BIST circuit 52, and an analog BIST circuit 26 201009369 31916pif 54, 56, 58, 60, 62, 64. The input I/O埠P5 has an input RF signal input. The BPF 46 filters the RF signal (RFin) around the carrier frequency. The LNA 44 amplifies the filtered 'wave' RF signal rf 1 to generate a signal 2 at the signal. The image removing filter 42' generates the RF signal RF3 by causing the image frequency to be reduced without causing image crosstalk due to the subsequent downconversion. The local oscillator 4 oscillates at the same local frequency as the rf frequency (carrier frequency). The mixer 38 mixes the output RF3 of the image removing filter 42 with the local signal LO and performs down-conversion. When the input RF signal RFin is quadrature modulated, the orthogonal component BB-Q of the in-phase component BB_I of the analog fundamental signal is output from the mixer. The analog baseband signal BB is filtered by the LPF 36 and converted to a digital value by the A/D converter 34. The output of the A/D converter 34 is input to the baseband circuit 32 for demodulation processing. The memory circuit 3〇 and the base frequency circuit of FIG. 4 correspond to the memory circuit FBI and the logic circuit FB2 of FIG. Further, the ® A/D converter 34 of Fig. 4 corresponds to the D/A.A/D converter FB3 of Fig. 1 . The LPF 36, the mixer 38, the local oscillator 40, the image removing filter 42, the LNA 44, and the BPF 46 of Fig. 4 are respectively shown in the figure! The analog circuit FB4 corresponds to. The memory BIST circuit 5 is a BIST circuit for testing the memory circuit 30, and the logic BIST circuit 52 is a BIST circuit for testing the base frequency circuit 32. The memory BIST circuit 5 〇 and the logic BIST circuit 52 perform, for example, a boundary scan test. The analog BIST circuits 54, 56, 58, 60, 62, 64 and the class 27 201009369 31916pif of FIG. 1 correspond to the BIST group 212. The analogy bribe circuit 54 is an arbitrary waveform generator that supplies an analog waveform to the input terminal of a 34. When the analog msT circuit μ == change ^ converts the analog waveform to whether the digital device 34 is operating normally. Alternatively, the baseband circuit 32 does not "=", and the digital value is output from the digital I/O 崞Ρ 4 to the ατ ει not), and the 良100 determines whether the quality is good or not. Φ The bist by the analog BIST circuits 56, 58, 6, 、, 62, 64 is executed in a state where the RP signal is supplied to the analog I/O 埠 P5. The analog BIST circuit 64 is provided for testing the BPF 46. The analog BIST circuit 64 includes, for example, a spectrum analyzer ((10) analyzer) and an A/D converter. When tested by analog BIST circuit 64, ATE 100 (not shown) provides a defined RF signal for analog 1/cause. The spectrum analyzer of the analog BIST circuit 64 converts the intensity in the per-band of the RF signal RF1 pulsed by the BPF 46 into a digital value. After comparing the spectral data thus obtained with the expected value, the analog BIST circuit 64 determines the BpF46. Good or not. Alternatively, the spectral data is output as a test data output signal DATA-OUT by the interface circuit 202. The analog BIST circuit 62 is provided for testing the LNA 44, which is, for example, a digitizer. The analog BIST circuit 62 digitizes the signal output from the LNA 44 in a state where the Rp signal is supplied to the analog 1/〇埠 P5 to determine the amplitude level of the RF signal RF2. The amplitude level is output as a test data output signal DATA-OUT to ATE100 28 201009369 31916pif ' ATE100 is based on the waveform level to determine whether the LNA 44 operates in accordance with f. Further, the analog BIST circuit 60 and the analog BIST circuit 58 are provided for testing the image removing filter 42 and the local oscillator 40, respectively, and the configuration and operation thereof are the same as those of the analog BIST circuit 64. Therefore, the circuits of the analog BIST circuits 6G, 58, and 64 can be connected, and the analog circuit of the measurement target can be switched in accordance with the above mode. The analog BIST circuit 56 is provided for testing the LPF 36, and its construction and operation are the same as those of the analog BIST circuit 62. The analog BIST circuits %, 62 can also be constructed as a single circuit. The analog BIST circuit is essentially 骇n ’, but it can be easily configured as long as it can test the corresponding functional block. For example, in the case of a spectrum analyzer, in a general-purpose spectrum analyzer, a high-frequency resolution user is required to be used in a wide frequency band (from DC to several GHz), but an analog ΒΙ & circuit can only be input to the DUT 200. It is only necessary to measure the predetermined range in the center band, and it is therefore possible to confirm the normal operation of the corresponding analog circuit, and the resolution may be low. For example, when the bandwidth of the RF signal is expressed as a time, the frequency resolution can be Af/n (η is 1 〇 or a real number of 1 〇 or less). Moreover, the digitizer or A/D converter and D/A converter can also be designed with sufficient precision required to verify the corresponding functional blocks. The BIST circuit is a circuit that is not required when the DUT 200 actually operates. Therefore, the circuit should be greatly shrinkled. However, in order to accurately test the various types of specific circuit blocks of the DUT2, it is sometimes necessary to perform calibration (calibrati). 29 201009369 31916pif In particular, when the measurement circuit realized by the miniaturization process requires high accuracy and high precision, the correction function is required to compensate for errors in process variation or temperature fluctuation. Hereinafter, the correction mechanism of the analog BIST circuit of the DUT 200 will be described. FIG. 5 is a block diagram showing a configuration of a DUT 200 having an analog BIST circuit correction function. As described above, in the DUT 200 of Fig. 5, a single analog BIST circuit 58 is shared by a plurality of analog circuits 40, 42, 46. Correction is set in the DUT200! >7, and the correction signal CAL of the test unit (RF test unit 16 in Fig. 5) from ATE1〇〇 is input via the correction bus BUS4. Furthermore, the correction bus BUS4 and the analog main bus BUS2 can be shared. A switch matrix 70 is provided between the plurality of analog circuits 40, 42, 46 and the analog BIST circuit 58. A plurality of input terminals of the switch matrix 7A are connected to output terminals of the various types of ratio circuits 4, 42, 46 and a correction block P7. The output terminal of the switch matrix 7A is connected to the analog BIST circuit 58. The state of the switch matrix 70 is controlled based on the mode data MD, ❿ of the BIST selection signal BIST-SEL. ▲ η According to the above configuration, the known correction code CAL can be input to the analog bist circuit 58 via the switch matrix 7A. The self-classing BIST circuit 58 rotates the measurement data D1 corresponding to the correction signal CAL. Measurement data = 10 is output to ATm〇〇 via BISI control circuit 2〇2*. ATE1〇〇 is based on the relationship between the correction signal CAL and the measurement data mG to correct the analog BIST path 58. The correction can be performed by the test program 1 30 30

201009369 31916pif 的處理器(CPU)來執行,亦 用以對類比BIST電路58進〜田任一的測試單元來執行。 作為測試資料輸入信號Da=校正的校正控制信號D12, DUT200巾。藉由校正控而自ATE100輪出至 路58。 机就Dl2來校正類比;BIST電 例如,當類比BIST t RF測試單元16將具有已知 j頻譜分析儀功能時, 正信號CAL而提供給校正埠的的处信號作為校 測定頻譜純正錢CAL _ 電路58的 控制信號D12來校正類比咖電路刀%。一時,藉由校正 M 藉由實施形態的ATE1(K)以及職2〇〇而 實現的右干個職的具體例加以制。 電路(職卜咖2)進行記憶體電、邏輯電路 FB2的邊界掃描測試,且第遍τ電路腹3進行驗. A/D轉換器FB3的測試,可以三個模式切換為前提而進行 說明。 測試例1. 當藉由第1BIST電路BIST1而進行記憶體電路Fm 的邊界掃描測試時,首先,藉由6181選擇信號bist_sel 而僅將第1BIST電路BIST1設定為主動電路。亦即,BISI 命令控制部12,以對第1BIST電路BIST的BIST位址寫 入1 ’並對其它BIST位址寫入0的方式,而生成BIST選 擇信號BIST-SEL。 接著,BISI命令控制部12確定啟動停止信號 31 201009369 31916pif START/STOP。接收該啟動停止信號START/ST〇p後,内 置於BIST電路BIST1中的圖案產生器(假隨機圖案產生 器)開始產生規定的測試圖案。該測試圖案將經由形成於 記憶體電路FBI内的正反器或鎖存器的菊鍊。BIST電路 BIST1 ’將菊鍊的輸入圖案與輸出圖案加以比較,並判定 一致·不一致。其結果,判定記憶體電路FB1的良否,表 示判定結果的資料將儲存在DUT2〇〇内的記憶區域(記憶 體或暫存器)的規定的位址中。 接著’ BISI命令控制部12藉由測試資料輸出信號 參 DATA-OUT’而指定儲存表示判定結果的資料的位址,並 將表不判定結果的資料讀出。 測試例2. 第1BIST電路BIST1亦可以其它模式(第2模式)而 進行動作。第2模式中’可取代使用内置於DUT200中的 圖案產生器,而使用内置於ATE1〇〇中的圖案產生器,生 成規定的圖案,並作為測試資料輸入信號D ATA _ in而提供 給 ATE100。 * Ο 此時’首先,藉由BIST選擇信號BIST-SEL來將第 1BIST電路BIST1設定為第2模式。繼之,確定啟動停止 信號START/STOP,並藉由測試資料輸入信號DATA-IN而 使規定的圖案’經由測試控制匯流排BUS3供給至第1 BIST 電路BIST1中。該測試圖案經由記憶體電路FBI内的菊 鍊’而儲存於DUT200内的記憶區域(記憶體或暫存器) 的規定的位址中。 32 201009369 31916pif 接著,BISI命令控制部12藉由測試資料輸出信號 DATA-OUT來指定規定的位址,並將資料讀出。經由菊鍊 的測試圖案,經由測試控制匯流排BUS3而作為測試資料 輸出k號DATA-OUT返回至ATE100中。ATE100將供給 至DUT200中的測試圖案與返回而來的測試圖案加^比 較,判定DUT200的良否。 ~ 關於邏輯電路FB2’亦可藉由第2BIST電路而實現與 測試例1、測試例2相同的測試。 測試例3. 第3BIST電路BIST3在某一模式(第1、第2模式) 中,將D/A轉換器與A/D轉換器串聯連接而進行測試。該 模式中,若將數位信號01提供給D/A轉換器的輸入中, 則該數位信號D1轉換為類比信號A1,且類比信號A1藉 由A/D轉換器而再轉換為數位信號。 第1模式中,數位值D1藉由内置於DUT200中的圖 案產生器而生成。第3BIST電路BIST3將數位值D1與D2 加以比較’將表示比較結果的資料作為測試資料輸出信號 DATA-OUT而輸出至ATE1〇〇中。 於第2模式中,輸入至D/A轉換器的數位值D1,藉 由上述測試資料輸入信號DATA-IN而自ATE100被供給。 自A/D轉換器中輸出的數位值d2,作為測試資料輸出信 號DATA-0UT而返回至ATE100中。ATE100將供給至 DUT200中的測試圖案與返回而來的測試圖案加以比較, 判定DUT200的良否。 33 201009369 31916pif 於第3模式中,A/D轉換器與D/A轉換器分離。如圖 4所示’安裝有任意波形產生器作為類比BIST電路 BIST3 ’且對a/d轉換器的輸入中提供來自任意波形產生 器的已知的類比波形。藉由A/D轉換器所生成的數位信 號’藉由類比BIST電路BIST3自身,或者藉由ATE1〇〇 而與期望值進行比較’以對A/D轉換器進行測試。 依據實施形態對本發明進行了說明,但實施形態僅為 表示本發明的原理、應用,在不脫離申請專利範圍中所規The processor (CPU) of 201009369 31916pif is executed, and is also used to execute the test unit of the analog BIST circuit 58. As the test data input signal Da = corrected correction control signal D12, DUT200 towel. It is rotated from ATE100 to way 58 by correcting the control. The machine corrects the analogy with Dl2; for example, when the analog BIST t RF test unit 16 will have the function of the known j-spectrum analyzer, the positive signal CAL is supplied to the corrected 信号 signal as the calibration spectrum pure money CAL _ The control signal D12 of the circuit 58 corrects the analog circuit knife %. For the first time, the specific example of the right-hand job achieved by correcting M by the ATE1(K) and the job 2 of the embodiment is implemented. The circuit (the job 2) performs the boundary scan test of the memory power and logic circuit FB2, and the first pass of the τ circuit is performed. The test of the A/D converter FB3 can be described by changing the three modes. Test Example 1. When the boundary scan test of the memory circuit Fm is performed by the first BIST circuit BIST1, first, the first BIST circuit BIST1 is set as the active circuit by the 6181 selection signal bist_sel. That is, the BISI command control unit 12 generates the BIST selection signal BIST-SEL by writing 1 ' to the BIST address of the first BIST circuit BIST and 0 to the other BIST address. Next, the BISI command control unit 12 determines the start stop signal 31 201009369 31916pif START/STOP. Upon receiving the start/stop signal START/ST〇p, the pattern generator (false random pattern generator) built into the BIST circuit BIST1 starts generating a prescribed test pattern. The test pattern will pass through a daisy chain of flip-flops or latches formed in the memory circuit FBI. The BIST circuit BIST1 ' compares the input pattern of the daisy chain with the output pattern and determines that it is consistent and inconsistent. As a result, it is determined whether or not the memory circuit FB1 is good or not, and the data indicating the result of the determination is stored in a predetermined address of the memory area (memory or scratchpad) in the DUT2. Then, the BISI command control unit 12 specifies the address of the data indicating the determination result by the test data output signal DATA-OUT', and reads the data indicating the result of the determination. Test Example 2. The first BIST circuit BIST1 can also operate in another mode (second mode). In the second mode, instead of using the pattern generator built in the DUT 200, a pattern generator built in the ATE1 is used to generate a predetermined pattern, and is supplied to the ATE 100 as a test material input signal D ATA _ in. * Ο At this time, first, the first BIST circuit BIST1 is set to the second mode by the BIST selection signal BIST-SEL. Then, the start/stop signal START/STOP is determined, and the predetermined pattern ' is supplied to the first BIST circuit BIST1 via the test control bus BUS3 by the test data input signal DATA-IN. The test pattern is stored in a predetermined address of a memory area (memory or scratchpad) in the DUT 200 via a daisy chain ' in the memory circuit FBI. 32 201009369 31916pif Next, the BISI command control unit 12 specifies a predetermined address by reading the data output signal DATA-OUT and reads the data. The test pattern of the daisy chain is passed through the test control bus BUS3 as a test data output k number DATA-OUT is returned to the ATE 100. The ATE 100 compares the test pattern supplied to the DUT 200 with the returned test pattern to determine whether the DUT 200 is good or not. The same test as in Test Example 1 and Test Example 2 can be realized by the second BIST circuit with respect to the logic circuit FB2'. Test Example 3. The 3BIST circuit BIST3 performs a test by connecting a D/A converter and an A/D converter in series in a certain mode (first and second modes). In this mode, if the digital signal 01 is supplied to the input of the D/A converter, the digital signal D1 is converted into the analog signal A1, and the analog signal A1 is converted into a digital signal by the A/D converter. In the first mode, the digital value D1 is generated by a pattern generator built in the DUT 200. The 3rd BIST circuit BIST3 compares the digital value D1 with D2. The data indicating the comparison result is output to the ATE1〇〇 as the test data output signal DATA-OUT. In the second mode, the digital value D1 input to the D/A converter is supplied from the ATE 100 by the test data input signal DATA-IN. The digital value d2 outputted from the A/D converter is returned to the ATE 100 as the test data output signal DATA-0UT. The ATE 100 compares the test pattern supplied to the DUT 200 with the returned test pattern to determine whether the DUT 200 is good or not. 33 201009369 31916pif In the third mode, the A/D converter is separated from the D/A converter. As shown in Fig. 4, an arbitrary waveform generator is mounted as the analog BIST circuit BIST3' and a known analog waveform from the arbitrary waveform generator is supplied to the input of the a/d converter. The digital signal generated by the A/D converter is tested by the analog BIST circuit BIST3 itself or by comparing the expected value by ATE1 ’ to test the A/D converter. The present invention has been described in terms of embodiments, but the embodiments are merely illustrative of the principles and applications of the present invention, without departing from the scope of the claims.

定的本發明思想的範圍中,可對實施形態變更較多的變形 例或配置。 圖6是表示變形例的DUT2〇〇的構成的方塊圖。圖^ 的DUT200為具有多個bisT電路BIST1〜BIST5樹(tree) 狀連接於BISI控制電路202的構成。相對於此,變形例中, 多個BIST電路BIST1〜BIST5以及別幻控制電路2〇2 , 可經由環狀匯流排而連接。 [產業上之可利用性] 本發明可用於測試技術。 雖然本發明已以實施例揭露如上,然其並非用以限定 Ό 本發明,任何所屬技術領域中具有通常知識者,在不脫離 本發明之精神和範圍内,當可作些許之更動與潤飾,故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是表示實施形態的包含ATE及DUT的測試系 的方塊圖。 ’ 34 201009369 31916pit 圖2是表示經由測試控制匯流排 格式的圖。 得輸的控制信號的 =二ΤΙ步控制單元的動作的時序圖。 圖4疋表不包含多個功能區塊四與多個bist電 DUT的具體性構成例的方塊圖。 圖5疋表示具備類比BIST電路校正功能的DUT的構 成的方塊圖。In the scope of the inventive concept, many modifications and arrangements can be made to the embodiment. Fig. 6 is a block diagram showing a configuration of a DUT 2A according to a modification. The DUT 200 of Fig. 2 has a configuration in which a plurality of bisT circuits BIST1 to BIST5 are connected in a tree shape to the BISI control circuit 202. On the other hand, in the modified example, the plurality of BIST circuits BIST1 to BIST5 and the magic control circuit 2〇2 can be connected via the ring bus. [Industrial Applicability] The present invention can be applied to test technology. While the present invention has been described above by way of example, the invention is not intended to be limited to the scope of the present invention, and may be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing a test system including an ATE and a DUT according to an embodiment. ' 34 201009369 31916pit Figure 2 is a diagram showing the control of the bus bar format via test. Timing diagram of the operation of the control signal that is input = the two-step control unit. Fig. 4 is a block diagram showing an example of the specific configuration of a plurality of functional blocks 4 and a plurality of bist electrical DUTs. Figure 5A is a block diagram showing the construction of a DUT having an analog BIST circuit correction function.

圖6是表示變形例的DUT的構成的方塊圖。 【主要元件符號說明】Fig. 6 is a block diagram showing a configuration of a DUT according to a modification. [Main component symbol description]

100 : ATE P1 :數位I/O埠 P2 :類比I/O埠 P3 :測試用I/O埠 P4 :數位I/O埠 P5 :類比I/O埠 P6 :測試用I/O埠 P7 :校正埠 BUS 1 :數位主匯流排 BUS2 :類比主匯流排 BUS3 :測試控制匯流排 BUS4 :校正用匯流排 10 :測試程式 12 : BISI命令控制部 14 ·功能測試单元 35 201009369 31916pif100 : ATE P1 : Digital I/O 埠 P2 : Analog I/O 埠 P3 : Test I/O 埠 P4 : Digital I/O 埠 P5 : Analog I/O 埠 P6 : Test I/O 埠 P7 : Correction埠BUS 1 : Digital main bus BUS2 : Analog main bus BUS3 : Test control bus BUS4 : Correction bus 10 : Test program 12 : BISI command control unit 14 · Functional test unit 35 201009369 31916pif

16 : RF測試單元 18 :光I/O測試單元 20 : DC測試單元 22 : BISI同步控制單元 200 : DUT 202 : BISI控制電路(介面電路) 204 :輸入輸出緩衝器 208 :輸入輸出緩衝器 FBI :記憶體電路 FB2 :邏輯電路 FB3 : D/A A/D 轉換器 FB4 :類比電路 FB5 :類比I/O電路 210 :數位BIST群 212 :類比BIST群 214 :數位區塊 216 :類比區塊 30 :記憶體電路 32 :基頻電路 FBLK1〜FBLK5:功能區塊 34 : A/D轉換器16: RF test unit 18: Optical I/O test unit 20: DC test unit 22: BISI synchronization control unit 200: DUT 202: BISI control circuit (interface circuit) 204: Input/output buffer 208: Input/output buffer FBI: Memory circuit FB2: logic circuit FB3: D/AA/D converter FB4: analog circuit FB5: analog I/O circuit 210: digital BIST group 212: analog BIST group 214: digital block 216: analog block 30: memory Body circuit 32: base frequency circuit FBLK1~FBLK5: function block 34: A/D converter

36 : LPF 38 :混頻器 40 :局部振盪器 201009369 jiyiopu36 : LPF 38 : Mixer 40 : Local oscillator 201009369 jiyiopu

42 :影像除去濾波器 44 : LNA 46 : BPF 50 :記憶體BIST電路 52 :邏輯BIST電路 54 :類比BIST電路 56 :類比BIST電路 58 ··類比BIST電路 60 :類比BIST電路 62 :類比BIST電路 64 :類比BIST電路 70 :開關矩陣 300 :測試系統42: Image removal filter 44: LNA 46: BPF 50: Memory BIST circuit 52: Logic BIST circuit 54: Analog BIST circuit 56: Analog BIST circuit 58 · Analog BIST circuit 60: Analog BIST circuit 62: Analog BIST circuit 64 : Analog BIST Circuit 70: Switch Matrix 300: Test System

3737

Claims (1)

201009369 31916pif 七、申請專利範圓: 種測試襄置,是半導體元件的測 在於:上料導體元件純: μ,、特徵 出,ίΓίΓ,塊’經由主m流排而進行信號的輸入輸 出並執仃規疋的信號處理; 处多個BIST電路,針對上述多個功能區塊中的每 =區塊而設置’對相應的魏區塊進行測試,並生成 試結果對應的触峨、絲信號;…201009369 31916pif VII. Application for patent circle: The test device is a test of semiconductor components: the material of the conductor is pure: μ, the characteristic is out, ίΓίΓ, the block is input and output through the main m stream. The signal processing of the 仃 疋 ; ; ; ; ; ; ; 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 多个 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号... 介面魏,經由與上述主隨排不同的職控制匯流 排而與上❹m裝置連接,接收自上制概 控制信號,並基於上述㈣信賴上述多個 ^控制]並且由上述控龍賴指定的上制試結果信 ' 可經由上述測試控制匯流排而由上述測試裝置讀出. 上述測試裝置包括: β ’ y測試單元,經由上述主匯流排而與上述半導體元件進The interface Wei is connected to the upper device via a different control bus that is different from the above-mentioned main slave, receives the control signal from the top, and is based on the above (4) trusting the plurality of controls] and is designated by the above-mentioned controller The test result letter ' can be read by the above test device via the above test control bus bar. The above test device includes: a beta 'y test unit via which the semiconductor component is fed through the main bus bar 行信號的收發,使至少-個上述功能區塊執行上述規定 信號處理;以及 控制單元,生成第1控制信號與第2控制信號,並麵 由上述測試控制匯流排而將上述第丨控制信號與第2控^ 信號供給至上述半導體元件中,上述第〗控制信號用^對 上述半導體元件内的上述多個BIST電路進行個別地控 制,而上述第2控制信號用以將藉由上述BIST電路所^ 成的上述測試結果信號自上述半導體元件内的介面電 讀出。 甲 38 201009369 31916pif 藉由上述控制,其特徵為 對是否伸上、十、1 4第1控制信號’至少包含 路進行設定電路中的任一邮τ電路為主動電 多個L: 圍f2項所述之測試裝置,其中上述Transmitting and receiving a line signal, causing at least one of the functional blocks to perform the predetermined signal processing; and the control unit generating a first control signal and a second control signal, and the first control signal is coupled to the test control bus The second control signal is supplied to the semiconductor element, wherein the first control signal is individually controlled by the plurality of BIST circuits in the semiconductor element, and the second control signal is used by the BIST circuit The above test result signal is electrically read from the interface in the above semiconductor element. A 38 201009369 31916pif By the above control, it is characterized in that whether or not the first control signal is included in the tenth or fourteenth first control signal, at least one of the τ circuits in the setting circuit is active, and a plurality of L: Test device, wherein the above 上述成為多個模式能夠進行切換, 上迷選擇域包含設定模式的模式資料。 電路之職料各肅 流排而將該第3控制信號::L;=:控制匯 試裝5置如專利範圍第1項至第3項中任-項所述之測 測試門述控制單疋更生成指示上述BIST電路的 開始、停止的第4控制信號,並經由上述測試控制匯 机排而將糾4控制錢供給至上述半導體元件中。The above-described plurality of modes can be switched, and the selection field includes the mode data of the setting mode. The third control signal of the circuit is exhausted and the third control signal is: L; =: the control test piece 5 is set to the test test list as described in any of the first to third aspects of the patent scope. Further, a fourth control signal indicating the start and stop of the BIST circuit is generated, and the correction control is supplied to the semiconductor element via the test control. 試裝6署如盆申f專利範圍第1項至第3項中任一項所述之測 述控制單元生成選項信號,該選項信號用 '對上述多個BIST電路中的至少一個進行固有的控制, 上述測試控制匯流排,包括用以傳輸上述選項信號且 與上述第1、第2控制信號不同的其它信號線。 7.如申請專利範圍第2項所述之測試震置,其特徵 為,於上述測試單元與上述半導體元件進行信號的收發, 且上述至少一個功能區塊執行上述規定的信號處理的狀熊 下,上述控制單元使與上述至少一個功能區塊對應的上^ 39 201009369 31916pif 電路為主動電路’而對上述至少—個功能區塊進行測 繼i番如宙申請專利範圍第7項所述之測試裝置,其中上述 上述㈣同步鋪衫’ _步㈣單元接收藉由 23170所生成的上述控制錢,並與上述測試單元 的測试速率同步輸出該控制信號。 試裝i H請專利範㈣1項至第3項中任—項所述之測 電路於多個功能區塊之間共用化。叩力犯的㈣ 測試Γ置如ΙΓ利範圍第1項至第3項中任—項所述之 流排而輸入校2^個上述迅訂電路可經由校正用匯 正信ί述測狀置的上述測試單元構成為可生成上述校 制單元,取得上述BIST電路進行對上述校正 職生社制試結果錢,且根據上述 ==來生成用以對™電路進行校正的 11. -種轉體元件,其特徵在於具備: 出,’經由主匯流排而進行信號的輸入輸 、’執灯規疋的信號處理執行; 能區Ϊ路,針對上述多個功能區塊中的每一功 試結果對:的數位測試,並生成與測 201009369 · 31916pif ' 介面電路,經由與上述主匯流排不同的測試控制匯产 排’而接收自測試裝置中輪出的控制信號,並基於上述^ 制信號對上述多個BIST電路進行控制,並且藉由上述^ 制信號所指定的上述測試結果信號,可經由上述測試控制 匯流排而由上述測試震置讀出。 12. 如申請專利範圍f u項所述之半導體元件, 上述控制信號至少包括: 〃 ❹ 選擇㈣,對是否使上述多個BIST電路中的任一 BIST電路成為主動電路進行設定;以及 測試資料輸入信號,包含應供給至設定為主動電路的 上述BIST電路的測試圖案;且 藉由上述選擇信號而設定為主動電路的上述BIST電 路’接收上述測試資料輸入信號,對相應的上述功能區塊 進行測試。 13. 如申請專利範圍第12項所述之半導體元件,其中 上述多個BIST電路的至少—個構成為多個模式可進行切 髎換’上述介面電路根據上述聊信號巾所包含的模式資 料,來設定上述BIST電路的模式。 14. 如申請專利範圍第12項所述之半導體元件,其中 藉由上述選擇信號而設定為主動電路的BIST電路,根據 上述控制信號中所包含的啟動停止信號,來使測試開 停止。 15·如申凊專利範圍第11項所述之半導體元件,其特 徵為,於至少一個功能區塊執行上述規定的信號處理的狀 41 201009369 31916pif 態下,與上述至少一個功能區塊對應的上述BIST電路, 對上述至少一個功能區塊進行測試。 16. 如申請專利範圍第11項所述之半導體元件,其中 上述多個BIST電路中具有同一功能的BIST電路,於多個 功能區塊之間共用化。 17. 如申請專利範圍第11項所述之半導體元件,其中 至少一個上述BIST電路,可經由校正用匯流排而輸入有 校正信號,該BIST電路將對上述校正信號處理的結果作 為上述測試結果信號而輸出。The test control unit generates an option signal according to any one of the items 1 to 3 of the patent application, which is inherent to at least one of the plurality of BIST circuits. Control, the test control bus bar includes another signal line for transmitting the option signal and different from the first and second control signals. 7. The test apparatus according to claim 2, wherein the test unit transmits and receives a signal to the semiconductor element, and the at least one functional block performs the predetermined signal processing. The control unit is configured to make the above-mentioned at least one functional block corresponding to the at least one functional block as the active circuit and perform the test on the at least one functional block as described in item 7 of the patent application scope. And a device, wherein the above-mentioned (4) synchronous lay-up 'four-step (four) unit receives the above-mentioned control money generated by 23170, and outputs the control signal in synchronization with the test rate of the test unit. The test circuit described in paragraphs 1 to 3 of the patent specification (4) is shared between multiple functional blocks. (4) The test device is input into the school according to the flow chart described in item 1 to item 3 of the profit range. The above-mentioned shortcut circuit can be determined by using the calibration method. The test unit is configured to generate the calibration unit, obtain the BIST circuit to perform the test result of the calibration, and generate a 11.-type swivel element for correcting the TM circuit according to the above== The method is characterized in that: ", input and output of signals via the main bus, "signal processing execution of the lamp", and energy path, for each of the plurality of functional blocks : the digital test, and generate and test the 201009369 · 31916pif 'interface circuit, receive the control signal that is rotated from the test device via the test control production line different from the above main bus, and based on the above control signal A plurality of BIST circuits are controlled, and the test result signal specified by the control signal can be read by the test shake via the test control bus. 12. The semiconductor device of claim 5, wherein the control signal comprises at least: 〃 ❹ selecting (4), setting whether to enable any one of the plurality of BIST circuits to be an active circuit; and testing a data input signal And including the test pattern to be supplied to the BIST circuit set as the active circuit; and the BIST circuit set to be the active circuit by the selection signal receives the test data input signal, and tests the corresponding functional block. 13. The semiconductor device according to claim 12, wherein at least one of the plurality of BIST circuits is configured to be switched in a plurality of modes, wherein the interface circuit is based on mode data included in the chat towel. To set the mode of the above BIST circuit. 14. The semiconductor device according to claim 12, wherein the BIST circuit set as the active circuit by the selection signal causes the test to be stopped based on the start-stop signal included in the control signal. The semiconductor device according to claim 11, wherein the at least one functional block performs the above-described predetermined signal processing in a state of 41 201009369 31916pif, corresponding to the at least one functional block The BIST circuit tests at least one of the above functional blocks. 16. The semiconductor device according to claim 11, wherein the BIST circuit having the same function among the plurality of BIST circuits is shared between the plurality of functional blocks. 17. The semiconductor device according to claim 11, wherein at least one of the BIST circuits is input with a correction signal via a calibration bus, and the BIST circuit uses the result of the correction signal processing as the test result signal. And the output. 4242
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