201008470 九、發明說明： . 【發明所屬之技術領域】 ， 本發明係涉及一種散熱裝置，尤係一種用於對發熱電 子元件進行散熱之散熱裝置。 【先前技術】 隨者電子資訊產業之快速發展，中央處理器等發熱電 子元件尚速、咼頻及集成化使其發熱量劇增，如不及時排 β除該等熱量，將引起發熱電子元件自身溫度之升高，進而 導致發熱電子元件之損壞或其性能之降低。故，需要對發 熱電子元件進行散熱。目前，業者常用之散熱方式係在發 熱電子元件表面裝設一散熱裝置。 該散熱裝置一般包括一散熱器、設於散熱器上之一風 扇及穿βχ於散熱器上之複數熱管。該散熱器包括複數散熱 鰭片，该等散熱鰭片為平整結構，相鄰兩散熱鰭片之間形 ❹成一直型氣流通道，每一散熱鰭片上設有通孔。該熱管包 括一蒸發部及一冷凝部，該蒸發部與一發熱電子元件熱接 觸^該冷凝部穿插於散熱鰭片上之通孔中。散熱器工作時， 熱管之蒸發部將發熱電子元件產生之熱量傳至冷凝部，然 後再傳至散熱鰭片，由於散熱韓片存在一定之熱阻，故， …、e周圍之政熱鰭片之溫度較高，而由風扇產生之氣流在 經熱管時，由於受熱管之阻擋，而在熱管之後方形成一 空氣熱旋窩，不利於熱管之散熱’影響散熱裝置之散熱效 201008470 .果。同時’風扇產生之氣流在流經散熱鰭片間形成之氣流 •通道時，由於散熱鰭片之表面對氣流之,钻滞力，使流經氣 .流通道之氣流在散熱鰭片之表面形成層流層，該層流層中 之氣流流速低，並且沿著散熱鱗片之表面流動，從而阻礙 了層流層以外之氣流與散熱鰭片進行對流，進一步影響散 熱聚·置之散熱效果。 【發明内容】 ❹ 有雲於此’有必要提供—種散熱效果較佳之散熱襄置。 -種散熱裝置，包括散熱器及熱管，所述散熱器包括 間隔設置之複數散熱鰭片，每相鄰之兩散熱韓片之間形成 供氣流通過之氣流通道，每一散熱鰭片上設有供熱管穿設 之通孔，每-散熱鰭片於靠近通孔之位置設有導引部，所 述導引部於氣流行進方向上排布形成漸縮狀之導流通道， 所述導料道耗料向熱管處，所料”上設有切 〇 口，所述切口連通兩相鄰之氣流通道。 _-種散熱裝置’包括散熱器及熱管，所述散熱器包括 間隔叹置之夕個散熱鰭片’相鄰之散熱鰭片之間形成供氣 流通過之氣流通道，所述散熱鰭片之本體上設有供熱管穿 設之通孔，所述散熱鰭片之本體上於靠近通孔之位置向外 凸出設有兩個凸起，沿氣流行進之方向上所述兩個凸起之 間排布形成由迎風端向背風端呈漸縮狀之導流通道，所述 導流通道將氣流匯集並導引至熱管處，所述每一凸起於面 201008470 .向氣流之-側形成切口，所述切口將相鄰之氣流通道連通。 .、=習知技術相比，本發明散熱裝置，在散熱鰭 ，近熱官之位置處設置導引部，且導引部於氣流行進方向上 排布形成漸縮狀之導流通道，該漸縮狀之導流通道可以將 氣流導向熱管處，增強了熱管處之熱交換，減弱了熱管後 方=熱旋窩對散熱之影響，同時在導引部上設置切口可以 破壞散熱鰭片表面之層流層，增強了氣流在散熱續片之間 ©之I流效果，從而從兩個方面增強了散熱器之散熱效果。 【實施方式】 下麵參照附圖結合實施例對本發明作進一步說明。 π請參照圖！，本發明第一實施例之散熱裝置包括一散熱 器10及與5亥政熱器10結合之一熱管12。該熱管具有一 蒸發段121及一冷凝段122’該蒸發段121與一發熱電子元 件（圖未示）熱連接，該冷凝段122穿插於該散熱器ι〇上， ©以將發熱電子元件產生之熱量傳遞至該散熱器1()。該散熱 器10及熱管12可與一風扇（圖未示）配合使用，該風扇 可以為系統風扇，亦可以為裝在散熱器1〇上之風扇，該風 扇產生之氣流沿圖1中箭頭F所示之方向流向該散熱器 1〇，以將散熱器ίο上之熱量散發到周圍之空氣中。 s亥散熱器ίο由複數相互平行之散熱鰭片^堆疊排列 而成’每相鄰之兩散熱鰭片u之間形成一氣流通道13。如 圖2及圖3所示，每一散熱鰭片u包括一平板狀之矩形本 7 201008470 體110 ’該本體110之中部設有一通孔111，以用於收容該 熱官12之冷凝段122。該本體110自通孔lu之周緣垂直 ，向外延伸形成-環形凸緣112。該本體11〇於靠近該通孔 111之位置設有一導引部113,該導引部113包括兩個條形 之凸起114 ’這兩個凸起114從該本體110上衝壓形成，從 而使這兩個凸起114凸出於該本體110之-側，並使該本 體110之另一側對應每一凸起114之位置各形成一凹陷 ❹（请參照圖3)。該兩凸起114對稱分佈於該通孔U1之上 下兩侧，且沿氣流前進方向上排布在通孔111之前端，該 兩凸起114自遠離通孔m之位置指向通孔⑴，其靠近= 孔111之一端相互靠a，遠離通孔111之-端相互遠離， 使該兩凸起114與通孔m之間排布形成“V”形，即上述 兩個凸起m之間之距離自#近通孔⑴之位置向遠離通 孔in之位置逐漸增加’使該兩凸起114間形成一定指向 ❹該通孔hi之夾角，從而使導引部113在氣流前進方向上 由迎風端向背風端呈一漸縮狀結構，並於導引部m之兩 凸起114之間形成由迎風端向背風端呈漸縮狀之導流通道 ⑽。該兩凸起114凸出於本體⑽之高度小於凸緣⑴ 之高度’以於散熱鰭片u組裝在一起時，該兩凸起ιΐ4之 頂端與相鄰之另—散熱鰭月11間隔-定㈣而；Μ目碰觸。 本實施例中，兩凸起114凸出於本體11〇之高度剛好能使 兩凸起m之頂部位於氣流通道13之令間，使流經氣流通 8 201008470 道13之氣流一部分被導流部113導流，一部分沿著原來之 •方向繼續流動。每一凸起114於靠近導流通道1131之侧邊 .呈直線狀’該直線狀之側邊面向導流通道1131，每一凸起 114遠離導流通道1131之側邊大致呈“c”形並與本體n〇 平滑相連。該直線狀之側邊上設有一切口丨i 6，該切口 116 亦自遠離通孔111之位置指向通孔m，該切口 n6朝向導 流通道1131設置且與凸起114之凹陷115連通，以將散熱 ❹器中相鄰之兩氣流通道13藉由切口 116連通，每一凸 起114之切口 116正對另一凸起U4之切口 n6。 該散熱裝置工作時，風扇產生之氣流沿圖中箭頭F所 不方向進入氣流通道13’由於該散熱鰭片u上設有導引部 113 ’且該導引部113之兩凸起114在氣流行進方向上於通 孔ill之前方排布形成漸縮狀之導流通道ιΐ3ΐ，使進入氣 流通道13之氣流在導引部113之導引下沿該導流通道ιΐ3ι ❹流向熱管12處，即熱量密集區，使熱量密集區内之熱量快 速地被氣流帶走’有利於提高散熱裝置之散熱效率。同時， 由於該導引部U3之凸起114上設有切口 116，進入氣流通 道13之部分氣流’尤係形成於散熱鰭片11表面之層流層 之氣流，藉由切口 116進入另一相鄰之氣流通道13’而^ -氣流通道13中兩層流層之間之較冷之氣流則被兩凸起 114導向熱管12處，從而既破壞了散熱鰭片U表面之層流 層’增強了氣流在散熱鰭片u之狀I流效果，又減弱了 9 201008470 熱管背後之熱旋窩對散熱之影響，提高了散熱裝置之散 熱效率。 .另外’當散熱器工作時，熱管12快速地將發熱電 子疋件產生之熱量傳遞至散熱鰭片11，此時熱管12相當於 係散熱W11上之—個熱源，熱管12上之熱量將自通孔 ⑴之外緣向本體110上遠離通孔⑴之位置傳遞，而切口 114自遠離通孔111之位置指向通孔⑴設置，不會影響通 ©孔111周圍之熱量之傳遞。 ❹ 當然’上述散熱裳置中之散熱鰭片u還可為其他結 構。圖4和圖5所示為本發明第二實施例之散熱裝置中之 散熱鰭#lla。本實施例中，該導引部U3a之兩個凸起⑽ 均大致呈孤形，該本體11〇a之另一側對應每一凸起⑽ 之位置各形成一弧形之凹陷115a。該兩凸起⑽對稱分佈 於通孔111之兩側，並圍繞在通孔111之周圍，其中一個 凸起1143沿氣流行進之方向上從通孔111之上方f曲延伸 至通孔111之後方，另一凸起加沿氣流行進之方向上從 通孔m之下方f曲延伸至通孔m之後方，所述兩個凸 起114a排布$ C”开）。每一凸起1143均具有與通孔⑴ 相對之弧形内側邊及與内側邊相對之弧形外側邊。每一凸 起114a之内側邊與外側邊間之距離沿氣流行進方向上逐漸 減小’即每—凸起1Ua之寬度自迎風端向背風端逐漸減 小’即較寬之-端形成於迎風一端，較窄之—端形成於背 201008470 几端豸兩凸起l14a之間之距離由迎風端向背風端逐新 減I #兩凸起114a於迎風端相互遠離，而於背風端相互 *靠近’從而使該導引部113a形成一漸縮狀結構，而於兩凸 起⑴a之間形成一導流通道出^。每一凸起ii4a凸出於 ，體之高度自靠近通孔U1之内侧向外側，且由迎風端向 背風端均逐漸減小，直至與本體11〇3平滑連接。每一凸起 114a之迎風端之側邊為直線形，且於該直線形側邊上設有 © 一切口 116a’該切口 116a正對氣流方向設置且自遠離通孔 in之位置指向通孔ln，該切σ 116a之高度自靠近通孔 111向遠離通孔ηι之方向逐漸減小。每一凸起Ii4a及其 切口 116a沿不同方向上高度之漸變，有利於氣流之過渡， 以減小氣流脅音。 圖6和圖7所示為本發明第三實施例之散熱裝置中之 散熱鰭片lib，該散熱鰭片llb與本發明第二實施例中之散 ❿熱鰭片11a類似，其不同之處在於：本實施例中該導引部 113b為一C形之凸起，該本體11〇b之另一側對應該導 引部113b之位置形成一 “c”形之凹陷115b，該導引部 113b之内側形成一漸縮狀之導流通道U31b，相當於將第 二實施例中之兩凸起l14a之兩較窄之末端即背風端連接為 一體。該導引部113b迎風端之兩側邊呈直線形，且於該兩 側邊上各設一切口 116b。該切口 i16b自遠離通孔lu之位 置指向通孔111。 11 201008470 肖上所述，本發明符合發明㈣之要件，爰依法提出 ‘專利冑請。㈣上所述者僅為本發明之龍實施例，舉凡 •熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一實施例之散熱裝置之立體組裝圖。 圖2係圖1所示散熱裝置中之散熱鰭片之立體圖。 G 圖3係圖2所示散熱鰭片之另一角度之立體圖。 圖4係本發明第二實施例之散熱裝置中之散熱鰭片之 立體圖。 圖5係圖4所示散熱鰭片之另一角度之立體圖。 圖ό係本發明第三實施例之散熱裝置中之散熱鰭片之 立體圖。 圖7係圖6所示散熱鰭片之另一角度之立體圖。 【本發明主要元件符號說明】 散熱器 10 散熱鰭片 11,11a,lib 本體 110,110a,110b 通孔 111 凸緣 112 導流部 113,113a,H3b 導流通道 1131,1131a,1131b 凸起 114,114a,114b 凹陷 115，115a，115b 切口 116,116a, 116b 熱管 12 蒸發段 121 冷凝段 122 氣流通道 13 12201008470 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art] With the rapid development of the electronic information industry, the heat-emitting electronic components such as the central processing unit are still speeding up, frequency and integration, so that the heat generation is greatly increased. If the heat is not released in time, the heat-generating electronic components will be caused. The increase in self temperature causes damage to the heat-generating electronic components or a decrease in their performance. Therefore, heat dissipation of the heating electronic components is required. At present, the heat dissipation method commonly used by the industry is to install a heat sink on the surface of the heating electronic component. The heat sink generally includes a heat sink, a fan disposed on the heat sink, and a plurality of heat pipes that are placed on the heat sink. The heat sink includes a plurality of heat dissipating fins, and the heat dissipating fins have a flat structure, and the adjacent two heat dissipating fins are formed into a continuous air flow passage, and each of the heat dissipating fins is provided with a through hole. The heat pipe includes an evaporation portion and a condensation portion, and the evaporation portion is in thermal contact with a heat-generating electronic component, and the condensation portion is inserted into the through hole in the heat dissipation fin. When the heat sink is working, the evaporation portion of the heat pipe transmits the heat generated by the heat-generating electronic components to the condensing portion, and then to the heat-dissipating fins. Since the heat-dissipating Korean film has a certain thermal resistance, the heat-foil fins around ... The temperature is higher, and the airflow generated by the fan is blocked by the heat pipe, and an air heat swirling hole is formed behind the heat pipe, which is disadvantageous to the heat dissipation of the heat pipe, which affects the heat dissipation effect of the heat sink device 201008470. At the same time, when the airflow generated by the fan flows through the airflow channel formed between the heat radiating fins, the airflow flowing through the gas channel forms on the surface of the heat radiating fin due to the airflow of the fin surface. The laminar flow layer has a low flow velocity in the laminar flow and flows along the surface of the heat dissipating scale, thereby hindering the convection of the airflow outside the laminar flow layer and the heat dissipation fin, further affecting the heat dissipation effect of the heat dissipation. SUMMARY OF THE INVENTION ❹ There is a cloud here. It is necessary to provide a heat dissipation device with better heat dissipation effect. a heat dissipating device comprising a heat sink and a heat pipe, wherein the heat sink comprises a plurality of heat dissipating fins arranged at intervals, and an air flow passage for airflow is formed between each adjacent two heat dissipating fins, and each fin is provided on the fin a through hole through which the heat pipe is disposed, and each of the heat dissipation fins is provided with a guiding portion at a position close to the through hole, and the guiding portion is arranged in a flow direction of the airflow to form a tapered guiding channel, the guiding channel The heat is supplied to the heat pipe, and the material is provided with a cutting opening, and the slit communicates with two adjacent air flow passages. The heat sink device includes a heat sink and a heat pipe, and the heat sink includes a slap An air flow passage is formed between the adjacent fins of the heat dissipating fins for the airflow to pass through, and the through hole of the heat dissipating fin is disposed on the body of the heat dissipating fin, and the body of the heat dissipating fin is adjacent to the through hole The position is outwardly convexly provided with two protrusions, and the two protrusions are arranged in a direction along the airflow to form a flow guiding channel which is tapered from the windward end to the leeward end, and the flow guiding channel Collecting and directing airflow to the heat pipe, each convex No. 201008470. A slit is formed on the side of the airflow, and the slit connects the adjacent airflow passages. . . = Compared with the prior art, the heat sink of the present invention provides a guide at the position of the heat sink fin and the near heat officer. And the guiding portion is arranged in a direction of airflow to form a tapered flow guiding channel, the tapered guiding channel can guide the airflow to the heat pipe, enhance heat exchange at the heat pipe, and weaken the heat pipe behind = The effect of the hot whirl on the heat dissipation, and the provision of the slit on the guiding portion can destroy the laminar layer on the surface of the heat dissipating fin, thereby enhancing the I flow effect of the airflow between the heat sinking slabs, thereby enhancing the heat dissipation from two aspects. [Embodiment] The present invention will be further described below with reference to the accompanying drawings. π Please refer to the figure! The heat dissipating device of the first embodiment of the present invention includes a heat sink 10 and a 5 heat exchanger 10 A heat pipe 12 is coupled to the heat pipe 12. The heat pipe has an evaporation section 121 and a condensation section 122'. The evaporation section 121 is thermally connected to a heat-generating electronic component (not shown), and the condensation section 122 is interspersed with the heat sink ι, Take The heat generated by the heat-generating electronic component is transferred to the heat sink 1 (). The heat sink 10 and the heat pipe 12 can be used in conjunction with a fan (not shown), which can be a system fan or a heat sink. The upper fan, the airflow generated by the fan flows to the heat sink 1〇 in the direction indicated by the arrow F in FIG. 1 to dissipate the heat on the heat sink ίο to the surrounding air. The heat dissipation fins are stacked and arranged to form an air flow channel 13 between each adjacent two heat dissipation fins u. As shown in FIG. 2 and FIG. 3, each heat dissipation fin u includes a flat rectangular shape. 201008470 The body 110' is provided with a through hole 111 in the middle of the body 110 for receiving the condensation section 122 of the heat register 12. The body 110 is perpendicular to the periphery of the through hole lu and extends outward to form an annular flange 112. The body 11 is disposed adjacent to the through hole 111, and is provided with a guiding portion 113. The guiding portion 113 includes two strip-shaped protrusions 114'. The two protrusions 114 are stamped from the body 110, thereby The two protrusions 114 protrude from the side of the body 110, and the other side of the body 110 forms a recessed ridge corresponding to each of the protrusions 114 (please refer to FIG. 3). The two protrusions 114 are symmetrically distributed on the upper and lower sides of the through hole U1, and are arranged at the front end of the through hole 111 in the advancing direction of the air flow, and the two protrusions 114 are directed to the through hole (1) from a position away from the through hole m, One end of the hole 111 is a to each other, and the end of the hole 111 is away from each other, so that the two protrusions 114 and the through hole m are arranged to form a "V" shape, that is, between the two protrusions m. The distance from the position of the near hole (1) to the position away from the through hole in is increased by 'the angle between the two protrusions 114 is directed to the through hole hi, so that the guiding portion 113 is winded in the direction of the airflow. The end has a tapered structure toward the leeward end, and a flow guiding passage (10) which is tapered from the windward end to the leeward end is formed between the two protrusions 114 of the guiding portion m. The two protrusions 114 protrude from the height of the body (10) to be smaller than the height of the flange (1). When the heat dissipation fins u are assembled together, the top ends of the two protrusions ΐ4 are spaced apart from the adjacent ones of the heat dissipation fins 11 (4) And; In this embodiment, the two protrusions 114 protrude from the height of the body 11〇 so that the tops of the two protrusions m are located between the airflow passages 13, so that a part of the airflow flowing through the airflow passage 8 201008470 is 13 113 diversion, part of which continues to flow in the original direction. Each of the protrusions 114 is adjacent to the side of the flow guiding channel 1131. The linear side faces are directed to the flow channel 1131, and each of the protrusions 114 is substantially "c" shaped away from the side of the flow guiding channel 1131. And connected smoothly with the body n〇. The linear side is provided with a hole i6, and the slit 116 is also directed from the position away from the through hole 111 to the through hole m. The slit n6 is disposed toward the flow guiding channel 1131 and communicates with the recess 115 of the protrusion 114. The two adjacent air flow channels 13 in the heat sink are connected by a slit 116, and the slit 116 of each protrusion 114 faces the slit n6 of the other protrusion U4. When the heat sink is in operation, the airflow generated by the fan enters the airflow passage 13' in the direction of the arrow F in the figure. Since the heat dissipation fin u is provided with the guiding portion 113' and the two protrusions 114 of the guiding portion 113 are in the airflow In the direction of travel, a tapered flow guiding channel ιΐ3ΐ is arranged in front of the through hole ill, so that the airflow entering the air flow passage 13 flows along the guiding channel 113 to the heat pipe 12 under the guidance of the guiding portion 113, that is, The heat-intensive area makes the heat in the heat-intensive area quickly taken away by the airflow', which is beneficial to improve the heat dissipation efficiency of the heat sink. At the same time, since the protrusion 114 of the guiding portion U3 is provided with the slit 116, part of the airflow entering the airflow passage 13 is particularly formed in the laminar flow of the surface of the heat dissipating fin 11, and enters the other phase through the slit 116. The adjacent air flow passage 13' and the colder air flow between the two flow layers in the air flow passage 13 are guided by the two projections 114 to the heat pipe 12, thereby destroying the laminar layer of the surface of the heat dissipation fin U. The effect of the airflow on the fins of the heat sink fins is reduced, and the effect of the hot swirls behind the heat pipes of 201004070 on the heat dissipation is reduced, and the heat dissipation efficiency of the heat sink is improved. In addition, when the heat sink is working, the heat pipe 12 quickly transfers the heat generated by the heat generating electronic component to the heat radiating fins 11. At this time, the heat pipe 12 is equivalent to a heat source on the heat sink W11, and the heat on the heat pipe 12 will be self-heated. The outer edge of the through hole (1) is transmitted to the position of the body 110 away from the through hole (1), and the slit 114 is disposed from the position away from the through hole 111 to the through hole (1), and does not affect the heat transfer around the hole 111. ❹ Of course, the heat sink fin u in the above heat sinking skirt may be other structures. 4 and 5 show a heat sink fin #11a in the heat sink of the second embodiment of the present invention. In this embodiment, the two protrusions (10) of the guiding portion U3a are substantially orphaned, and the other side of the body 11〇a forms an arcuate recess 115a corresponding to each of the protrusions (10). The two protrusions (10) are symmetrically distributed on both sides of the through hole 111 and surround the through hole 111. One of the protrusions 1143 extends from the upper side of the through hole 111 to the back of the through hole 111 in the direction in which the airflow travels. The other protrusions are extended from the lower side of the through hole m to the rear of the through hole m in the direction in which the airflow travels, and the two protrusions 114a are arranged to be "C" open. Each of the protrusions 1143 has An arcuate inner side opposite to the through hole (1) and an outer outer side opposite to the inner side. The distance between the inner side and the outer side of each of the protrusions 114a gradually decreases along the direction of the airflow. The width of each protrusion 1Ua gradually decreases from the windward end to the leeward end, that is, the wider end is formed at the windward end, and the narrower end is formed at the back 201008470. The distance between the two ends l14a is increased by the wind. The end leeward end is newly reduced by I # two protrusions 114a away from each other at the windward end, and close to each other at the leeward end so that the guiding portion 113a forms a tapered structure and forms between the two protrusions (1)a. A flow guiding channel exits each of the protrusions ii4a, and the height of the body is from the inner side to the outer side of the through hole U1 And the windward end is gradually reduced to the leeward end until it is smoothly connected with the body 11〇3. The side of the windward end of each of the protrusions 114a is linear, and a slit 116a is provided on the side of the straight line. The slit 116a is disposed in the direction of the airflow direction and is directed from the position away from the through hole in to the through hole ln, and the height of the tangent σ 116a gradually decreases from the approaching through hole 111 to the direction away from the through hole ηι. Each of the projections Ii4a and The gradation of the height of the slit 116a in different directions facilitates the transition of the airflow to reduce the airflow dam. Fig. 6 and Fig. 7 show the heat sink fin lib in the heat sink of the third embodiment of the present invention, the heat sink fin The sheet 11b is similar to the heat sinking fin 11a of the second embodiment of the present invention, and the difference is that the guiding portion 113b is a C-shaped protrusion in the embodiment, and the other body 11b The side opposite to the guiding portion 113b forms a "c" shaped recess 115b, and the inside of the guiding portion 113b forms a tapered guiding channel U31b, which is equivalent to the two protrusions l14a in the second embodiment. The narrow end, that is, the leeward end is integrally connected. The guiding portion 113b The sides of the windward end are linear, and each of the sides is provided with a hole 116b. The slit i16b points from the position away from the through hole lu to the through hole 111. 11 201008470 The present invention conforms to the invention (4) The requirements are as follows: 'The patent is requested. (4) The above is only the embodiment of the dragon of the present invention. Anyone who is familiar with the skill of the present invention should cover the equivalent modifications or changes in the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a heat dissipating device according to a first embodiment of the present invention. FIG. 2 is a perspective view of a heat dissipating fin in the heat dissipating device of FIG. G Figure 3 is a perspective view of another angle of the heat sink fin shown in Figure 2. Fig. 4 is a perspective view showing a heat dissipating fin in the heat dissipating device of the second embodiment of the present invention. FIG. 5 is a perspective view of another angle of the heat dissipation fin shown in FIG. 4. Figure 3 is a perspective view of a heat sink fin in a heat sink of a third embodiment of the present invention. Figure 7 is a perspective view of another angle of the heat sink fin shown in Figure 6. [Description of main components of the present invention] heat sink 10 heat sink fins 11, 11a, lib body 110, 110a, 110b through hole 111 flange 112 flow guiding portion 113, 113a, H3b flow guiding channel 1131, 1131a, 1131b convex 114, 114a, 114b depression 115, 115a, 115b slit 116, 116a, 116b heat pipe 12 evaporation section 121 condensation section 122 gas flow passage 13 12