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TWI274540B - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
TWI274540B
TWI274540B TW95105449A TW95105449A TWI274540B TW I274540 B TWI274540 B TW I274540B TW 95105449 A TW95105449 A TW 95105449A TW 95105449 A TW95105449 A TW 95105449A TW I274540 B TWI274540 B TW I274540B
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TW
Taiwan
Prior art keywords
heat
heat sink
flow guiding
guiding portion
fins
Prior art date
Application number
TW95105449A
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Chinese (zh)
Other versions
TW200733852A (en
Inventor
Ching-Bai Hwang
Jing-Gong Meng
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Foxconn Tech Co Ltd
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Priority to TW95105449A priority Critical patent/TWI274540B/en
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Publication of TWI274540B publication Critical patent/TWI274540B/en
Publication of TW200733852A publication Critical patent/TW200733852A/en

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink includes a plurality of fins parallel to each other, and at least a heat pipe extending through these fins. A through hole is defined in each of the fins for extension of the heat pipe. A flow channel is formed between each of two neighboring fins for flowing through of the fluid. A guiding member having a curved shape is arranged around the through hole for guiding the fluid flowing to the heat pipe. A space defined in the guiding member decreases gradually along the direction of the fluid.

Description

1274540 九、發明說明: 【發明所屬之技術領域】 本發明涉及-種散熱ϋ,尤指-種具較高散熱效率的散熱器。 【先前技術】 隨著大型積體電路技術的不斷進步及廣泛應用,電腦廣泛應用於 各行^業,爲適應資料處理量不斷增加及及時性要求提高的發展趨 勢,高頻高速處理器不斷推出,使得處理器單位時間産生大量埶量, 如不及時排除這些熱量將引起處理器自身溫度的升高,對系統的安全 及性能造成很大影響。通常業界射央處理器等 助其散熱,同時,在散熱器上安裝風扇,以提供強制氣流 的熱量快速散發,從而能夠對中央處理器等發熱電子元件進行更爲有 效的散熱。 如第五圖所示,現有的散熱器i 一般包括複數相互平行設置的雜 片2 ’穿設於散熱鰭片2上的熱管4,及設於則2側關於産生強制 氣流,風扇(圖未示),其中藉片2呈平板狀結構,相鄰兩縛片2之間形 成供氣流流通的風道3,熱管4包括-與熱源觸的蒸發部及穿設於鱗 片2上的冷凝部,相應地於鰭片2上設有供熱管冷凝部穿設的通孔。 該散熱器1工作時,熱管4將自熱源産生的熱量快速的傳遞至藉片2 上風扇所産生的氣流流經風道3並與鑛片2進行熱交換最終帶走敎 源所産生的熱量。 …' 然而,上述散熱器1雖然可通過增加鰭片2的數量或增大每一鰭 片2的面積的方式提升散熱器1的整體散熱面積,以提升散熱效果,曰 但此與電子元件高密度及小型化的發展方向相違背,況且鰭片、2所能 ,加的數量及尺寸有限,其對散熱效果的改善亦同樣有限,另一提昇 =熱,1散熱效果的方式係減小鰭片2之間的間距以增加鰭片2的數 S ’提升鰭片2的散熱面積,該種方式雖可避免散熱器j體積的增加, 然而鰭片2間距的減小往往會增加氣流的流阻,不僅影響埶 音。另-方面,由_片2為平板結構,當風扇氣; =月f時,由於粘性力的影響,鰭片2表面與氣流的接觸部分有形 成一層流底層,在該層流底勒氣流的流速幾乎爲零,氣流與散熱^ 片2之間的主要熱交換方式為熱傳導,熱交換效果大大降低。、因如 6 1274540 何提升鰭片與風扇氣流的換熱效果,是提升散熱器散熱效果的關鍵所 在。 【發明内容】 有蓉於此’實有必要提供一種具有高效換熱效果的散熱器。 該種散熱器包括複數平行設置的散熱鰭片及至少一穿設於該散熱 籍片上的熱管’每一散熱鰭片上設有供熱管穿設的穿孔,相鄰兩散熱 鰭片之間形成一供流體通過的流道,每一散熱鰭片於其穿孔的外緣形 成一用以將流體導向熱管的導流部,該導流部呈漸縮狀曲線結構。 該散熱器的散熱鰭片上形成導流部,可導引氣流的分佈及流動, 同時還可增強散熱鰭片表面的紊流效果,有效提升散熱效率。 【實施方式】 下面參照附圖,結合實施例作進一步說明。 缺如第一圖所示,該散熱器包括一散熱鰭片組1〇,一穿設於該散熱 ,片組10上的熱管30,及一置於散熱鰭片組10侧端用於提供強制氣 流的散熱風扇50。風扇5G所產生的氣流可沿圖帽獅示方向流入散 熱鰭^組10内,從而與散熱鰭片組1〇進行熱交換帶走熱量。 凊同時參考第二至四圖,該散熱鰭片組1〇包括複數相互平行設置 二片f,每一•片2〇包括-本體21及分別形成於本體21兩端的折 j 23,各鰭片20的折邊23相互抵靠,從而於相鄰兩鰭片2〇之間形成 一^折邊23方向延伸的流道25。每一鰭片2〇的相應位置上 ίΓ圓27的驗大小與齡30的橫麵職大小相應, ίίΓϋΙ以便於熱管3G的穿設,該實施例中穿孔27大致 姓:缺:邊成圓弧倒角’該穿孔27相對於軸線x—x呈軸對稱 Γ/ί 穿孔27的周緣向外延伸形成—環形凸緣29,該凸緣 的間距大致相等,從而該等散熱鰭片組 f 齡3g的柱狀容置空間,可有效辦加埶瞢 t===使熱管30的熱量更好的傳_&、g 部包括 該導流 24、26的位置分別形成有凹陷244、264。其中設於内側的=== 7 1274540 穿孔27,該片兩孔27大::::的第二凸條26相對遠離鰭片2〇 外緣,即該兩凸條24、26 ====對稱的設置於穿孔27的 分別包括-中間部位24〇 6 、/為對她,兩凸條24、26 外延伸的兩外端242、262,^自,分別傾斜向 大於第一凸條24的兩外端24=;^\26的兩外端262之間的夹角 χ-χ之間的距離沿其^ 242 角’從而凸條24、26與軸線 沿風扇氣流的方向(如第—圖中=中間部位240、260逐漸減小, 軸線X—X之間分別开Μ 頭所不方向),兩外端242、262與 内側的第一凸t 的空間’位於外側的第二凸條26與 可導引驗朝向軸線成—^㈣郎,鱗麵狀的結構 30 2:^26 ; 間部位、細的寬度,利於氣流的262的見度均略大於中 的αΪΪ 3〇2t二用於與熱源接觸的蒸發部及穿設於所觸片2〇上 勻^至鰭片快速的導熱性能可將熱源所産生的熱量快速均 内的,3〇的蒸發部吸收熱源產生的熱量,熱管3〇 自埶、諸乂並向熱管30的冷凝部流動,然後於冷凝部釋放 並冷凝回流至蒸發部進入下-次循環,從二 貝的相變化吸收/釋放大量潛熱,將熱源所產生的埶量 僂ίΓί遞至則2G,由於則2G存在—定的熱阻,熱管3g將熱量 域2G時,鰭片2G靠近熱管3G的區域,即穿孔27的周緣區 ^的熱讀為集中,形成一熱量密集區,相對於韓片20的其它位置 =熱量密集_溫度更高,當顯5G所產生的強纖流沿第_圖中箭 =不方向進人H片20之間所形成的流道25内,由於則2Q上設有 V机部22,氣流在進入縛片20之間所形成的流道25後,第一凸條% 的兩外端242導引氣流流向鰭片2〇穿孔π及其周緣區域,即流向鰭 =20的熱1雄集區’可使該熱量密集區内的熱量快速的被風扇5〇所 生的氣流帶走,同轉二凸條26亦財針氣流的侧,其設置於 第-凸條24的外側’可進-步導引氣流向軸線χ—χ集中,而該兩凸 條24、26在集巾氣流的同時,由於其均呈漸驗結構,射增加氣流 的流速,加強換熱效果。另一方面,氣流在流經鰭片2〇表面時,由於 81274540 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat sink having a high heat dissipation efficiency. [Prior Art] With the continuous advancement and wide application of large-scale integrated circuit technology, computers are widely used in various industries. In order to adapt to the increasing trend of data processing and timeliness requirements, high-frequency high-speed processors are continuously introduced. This causes the processor to generate a large amount of data per unit time. If the heat is not removed in time, the temperature of the processor itself will rise, which has a great impact on the safety and performance of the system. Usually, the industry's central processor assists in heat dissipation. At the same time, a fan is installed on the heat sink to provide a rapid release of heat from the forced airflow, thereby enabling more efficient heat dissipation of the heat-generating electronic components such as the central processing unit. As shown in the fifth figure, the conventional heat sink i generally includes a plurality of pieces 2 which are disposed in parallel with each other, and a heat pipe 4 which is disposed on the heat radiating fins 2, and is disposed on the side 2 to generate a forced air flow, and the fan (not shown) The borrowing sheet 2 has a flat structure, and an air duct 3 for airflow is formed between the adjacent two fastening sheets 2, and the heat pipe 4 includes an evaporation portion that contacts the heat source and a condensation portion that is disposed on the scale 2, Correspondingly, the fin 2 is provided with a through hole through which the heat pipe condensation portion is bored. When the heat sink 1 is in operation, the heat pipe 4 quickly transfers the heat generated by the heat source to the airflow generated by the fan on the borrower 2, flows through the air duct 3, and exchanges heat with the rocker 2, thereby finally taking away the heat generated by the heat source. . However, although the above-mentioned heat sink 1 can increase the overall heat dissipation area of the heat sink 1 by increasing the number of fins 2 or increasing the area of each fin 2, the heat dissipation effect can be improved, but this is high with electronic components. The development direction of density and miniaturization is contrary to the situation. In addition, the number of fins and 2 can be increased, and the number and size of the fins are limited. The improvement of the heat dissipation effect is also limited. Another boost = heat, and the way of heat dissipation is to reduce the fins. The spacing between the sheets 2 increases the number of fins 2' to increase the heat dissipation area of the fins 2. This way, although the volume of the heat sink j is increased, the reduction of the fins 2 tends to increase the flow of the airflow. Resistance, not only affects the voice. On the other hand, the _ sheet 2 is a flat plate structure, when the fan is gas; = month f, due to the viscous force, the surface of the fin 2 and the airflow contact portion forms a flow bottom layer, in which the flow of the bottom flow The flow rate is almost zero, and the main heat exchange between the gas stream and the heat sink 2 is heat conduction, and the heat exchange effect is greatly reduced. For example, 6 1274540 How to improve the heat transfer effect between the fin and the fan airflow is the key to improving the heat dissipation effect of the radiator. SUMMARY OF THE INVENTION It is necessary to provide a heat sink having an efficient heat exchange effect. The heat sink includes a plurality of heat dissipating fins disposed in parallel and at least one heat pipe disposed on the heat dissipating chip. Each of the heat dissipating fins is provided with a through hole for the heat pipe to be pierced, and a heat dissipation fin is formed between the two heat dissipating fins. The flow passage through which the fluid passes, each of the heat dissipation fins forming a flow guiding portion for guiding the fluid to the heat pipe at the outer edge of the perforation, the flow guiding portion having a tapered curve structure. A heat guiding fin is formed on the heat dissipating fin of the heat sink to guide the distribution and flow of the airflow, and at the same time, the turbulence effect on the surface of the heat radiating fin can be enhanced, and the heat dissipation efficiency is effectively improved. [Embodiment] Hereinafter, the embodiments will be further described with reference to the accompanying drawings. As shown in the first figure, the heat sink includes a heat sink fin set 1 , a heat pipe 30 disposed on the heat sink, the chip set 10 , and a side disposed on the heat sink fin set 10 for providing a force A cooling fan 50 for airflow. The airflow generated by the fan 5G can flow into the heat radiating fin group 10 in the direction of the cap lion, thereby performing heat exchange with the heat radiating fin group 1 to remove heat. Referring to the second to fourth figures, the heat dissipating fin set 1 includes a plurality of f pieces arranged in parallel with each other, and each of the pieces 2 includes a body 21 and a fold j 23 formed at each end of the body 21, each fin The flanges 23 of the two are abutted against each other, so that a flow path 25 extending in the direction of the folded edge 23 is formed between the adjacent two fins 2A. The corresponding size of each fin 2〇 corresponds to the size of the horizontal 30, ίίΓϋΙ to facilitate the wearing of the heat pipe 3G. In this embodiment, the perforation 27 is roughly surnamed: missing: edge into an arc The chamfers 'the perforations 27 are axisymmetric with respect to the axis x-x. The outer periphery of the perforations 27 extends outwardly to form an annular flange 29 having a substantially equal spacing so that the fins are aged 3g. The columnar accommodating space can be effectively added with t=== to make the heat of the heat pipe 30 better. The g portion including the guides 24 and 26 is formed with recesses 244 and 264, respectively. Wherein the inner side of the === 7 1274540 perforation 27, the two holes 27 of the piece: the :::: second rib 26 is relatively far from the outer edge of the fin 2, that is, the two ribs 24, 26 ==== Symmetrically disposed on the perforations 27 respectively include an intermediate portion 24〇6, or a pair of outer ends 242, 262 extending outwardly of the two ribs 24, 26, respectively, inclined to be larger than the first ridge 24 The angle between the two outer ends 24=;^26 of the two outer ends 262 is the angle between the χ-χ along its angle 242' so that the ribs 24, 26 and the axis are along the direction of the fan airflow (as shown in the figure) The middle portion 240, 260 is gradually reduced, and the axis X-X is opened between the heads, and the second outer ends 242, 262 and the inner first convex t space are located on the outer second ribs 26. And the guide can be oriented toward the axis - ^ (four) Lang, scaly structure 30 2: ^ 26; between the part, the width of the width, the visibility of the 262 for the airflow is slightly larger than the middle α ΪΪ 3 〇 2t two for The evaporation portion in contact with the heat source and the rapid thermal conductivity of the fins disposed on the contact pads 2 can quickly dissipate the heat generated by the heat source, and the evaporation portion of the 3 吸收 absorbs the heat generated by the heat source. The heat pipe 3 flows from the crucible and the crucible to the condensation portion of the heat pipe 30, and then is released in the condensation portion and condensed and refluxed to the evaporation portion to enter the next-cycle, and absorbs/releases a large amount of latent heat from the phase change of the two shells, and the heat source The generated amount 偻ίΓί is passed to 2G, because 2G has a certain thermal resistance, when the heat pipe 3g is in the heat domain 2G, the fin 2G is close to the heat pipe 3G, that is, the heat reading of the peripheral region of the through hole 27 Concentration, forming a heat-intensive area, relative to the other positions of the Korean film 20 = heat-intensive _ temperature is higher, when the strong fiber flow generated by the 5G is along the arrow in the figure = no direction into the H piece 20 In the formed flow channel 25, since the V portion 22 is provided on the 2Q, after the airflow enters the flow channel 25 formed between the tabs 20, the two outer ends 242 of the first ridges % guide the airflow to the fins. 2〇Perforation π and its peripheral area, that is, the hot 1 male area that flows to the fin=20, the heat in the heat-intensive area can be quickly taken away by the airflow generated by the fan 5〇, and the same two ridges 26 The side of the cash flow, which is disposed on the outer side of the first ridge 24, can guide the airflow toward the axis χ-χ, and the Ridge sets 24, 26 while the towel stream, because of its structure showed gradually inspection, the exit air flow rate increases, strengthening the effect of heat transfer. On the other hand, when the airflow flows through the surface of the fin 2, due to 8

第五圖為習 知散熱器示意圖。 【主要元件符號說明】 散熱鰭片組 10 縫片 20 本體 21 導流部 22 折邊 23 凸條 24、26 中間部位 240、260 外端 242、262 凹陷 244、264 流道 25 1274540 片20表面形成-層底層,而氣流在流動 置m目、===、’/在障礙物附近形成渴流,而導流部22的設 設置—障礙物,從而可有效破壞形成於鰭片 表面的層&底層,增強氣流在鯖片2〇表面處^ ^ 2〇 , 片20另’對應凸條24、26的位置分別形成凹陷施、264,該凹陷 、^64 ,設置使鰭片2〇下側呈非平面狀,同樣可增強氣流的蒼流效 化制^ 施、264可藉由衝壓等方式一體成型於則20上,以簡The fifth picture is a schematic diagram of a conventional heat sink. [Description of main component symbols] Heat sink fin set 10 Slit piece 20 Body 21 Guide part 22 Folding edge 23 Brace 24, 26 Intermediate part 240, 260 Outer end 242, 262 Depression 244, 264 Flow path 25 1274540 Surface of sheet 20 - the bottom layer of the layer, and the air flow is placed in the mesh, ===, '/, forming a thirst flow near the obstacle, and the flow guiding portion 22 is provided with an obstacle, thereby effectively destroying the layer &amp formed on the surface of the fin The bottom layer, the enhanced airflow at the surface of the cymbal 2〇 ^ ^ 2 〇, the sheet 20 and the other corresponding positions of the ribs 24, 26 respectively form a depression, 264, the depression, ^ 64, the lower side of the fin 2 It is non-planar, and can also enhance the flow of the airflow system, 264 can be integrally formed on the 20 by stamping, etc.

該^施例中,導流部22包括兩凸條24、26,實際上,凸條24、 ,的數量、、形狀大小等均可根據鰭片2〇以及熱管3〇的狀況而設定, ^為了,或^個,其形狀不限於拋物線狀,只要其沿氣流方向呈漸縮 、即可V引氧流集中流向熱量密集區,一般彎曲的曲線、流線型漭 阻較小,效果更好。 '丨L 、綜上所述’本發明符合發明專利要件,爰依法提出專利申請。惟, f上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在 ^依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利 範圍内。 【圖式簡單說明】 第一圖爲散熱器立體示意圖。 第二圖爲散熱鰭片組分解示意圖。 第三圖爲第二圖的另一角度視圖。 第四圖爲其中一散熱鰭片俯視圖。 9 1274540 穿孔 27 凸緣 29 熱管 30 風扇 50In the embodiment, the flow guiding portion 22 includes two convex strips 24 and 26. In fact, the number, shape and the like of the protruding strips 24, can be set according to the condition of the fins 2〇 and the heat pipes 3〇, ^ In order to make it or not, the shape is not limited to a parabola shape, as long as it is tapered in the direction of the airflow, the V-introduced oxygen flow concentrates to the heat-intensive area, and generally the curved curve and the streamline type have less resistance and the effect is better. '丨L, summed up' The invention complies with the patent requirements of the invention and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims. [Simple description of the diagram] The first figure is a three-dimensional schematic diagram of the radiator. The second figure is an exploded view of the heat sink fin group. The third figure is another angle view of the second figure. The fourth figure is a top view of one of the heat sink fins. 9 1274540 perforated 27 flange 29 heat pipe 30 fan 50

Claims (1)

1274540 十、申請專利範圍: 1·種政熱器,包括複數平行設置的散熱鰭片及至少一穿設於該散熱 鰭片上的熱管,每一散熱鰭片上設有供熱管穿設的穿孔,相鄰兩散 熱鰭片之間形成一供流體通過的流道,其特徵在於:每一散熱鰭片 於其穿孔的外緣形成一用以將流體導向熱管的導流部,該導^部呈 漸縮狀曲線結構。 2·如申請專利範圍第i項所述之散熱器,其中該散熱器還包括一設於 散熱鰭片侧端用以產生流體的風扇。 3·如申凊專利範圍第1項所述之散熱器,其中該導流部呈軸對稱結 灸構,對稱設置於穿孔外側。 4·如申凊專利範圍第3項所述之散熱器,其中該導流部呈拋物線狀或 流線型。 5·如申請專利範圍第3項所述之散熱器,其中每一散熱鰭片上間隔設 有複數導流部,相鄰兩導流部之間形成漸縮狀的空間。 6· ^申請專利範圍第1至5項中任意一項所述之散熱器,其中導流部 靠近流體入口端的寬度大於遠離流體入口端的寬度。 7.如申請專利範圍第1至5項中任意一項所述之散熱器,其中對應導 流部位置每一散熱鰭片相對於設有導流部的侧面的另一側形成相應 的凹陷。 > 8. —種散熱器,包括複數相互平行設置的散熱鰭片,相鄰兩散熱鰭片 之間形成一流道’其特徵在於:每一散熱籍片的一側面上形成至少 一導流部,該導流部呈彎曲狀延伸。 9·如申請專利範圍第8項所述之散熱器,其中該導流部呈軸對稱結構。 10.如申請專利範圍第9項所述之散熱器,其中該散熱鰭片上設有至少 一穿孔,該導流部對稱設置於穿孔外側。 11·如申請專利範圍第1〇項所述之散熱器,其中每一穿孔内穿設有一埶 管。 12·如申請專利範圍第1〇項所述之散熱器,其中該導流部呈拋物線狀或 流線型。 13·如申請專利範圍第1〇項所述之散熱器,其中導流部靠近流體入口端 11 1274540 的寬度大於遠離流體入口端的寬度。 14卞1:5利範圍第9至13項中任意一項所述之散熱器,其中導流部 /、/、軸線的距離自導流部外端向中間部位逐漸減小。 14項所述之散熱器,其中每—散熱韓片上設有複 數間又置的導流部。 16·如申請專利範圍第15項所述之散熱器,其中所述複數導流部包括兩 導流部。 17·如申請專利範圍第15項所述之散熱器,其中相鄰兩導流部之 一漸縮狀的空間。1274540 X. Patent application scope: 1. The heat exchanger includes a plurality of heat-dissipating fins arranged in parallel and at least one heat pipe disposed on the heat-dissipating fins, and each of the heat-dissipating fins is provided with a perforation for the heat pipe to be inserted. A flow passage for the passage of a fluid is formed between the two adjacent fins, wherein each of the fins forms a flow guiding portion for guiding the fluid to the heat pipe at the outer edge of the perforation, and the guide portion is gradually formed. Shrink curve structure. 2. The heat sink of claim i, wherein the heat sink further comprises a fan disposed at a side end of the heat sink fin for generating a fluid. 3. The heat sink according to claim 1, wherein the flow guiding portion is axially symmetric and is symmetrically disposed outside the perforation. 4. The heat sink of claim 3, wherein the flow guiding portion is parabolic or streamlined. 5. The heat sink of claim 3, wherein each of the heat dissipation fins is provided with a plurality of flow guiding portions spaced apart from each other, and a tapered space is formed between the adjacent two flow guiding portions. The heat sink of any one of claims 1 to 5, wherein the width of the flow guiding portion near the fluid inlet end is greater than the width away from the fluid inlet end. The heat sink according to any one of claims 1 to 5, wherein each of the heat dissipating fins has a corresponding recess with respect to the other side of the side on which the flow guiding portion is provided. > 8. A heat sink comprising a plurality of heat dissipating fins arranged in parallel with each other, and a first-class track formed between two adjacent fins is characterized in that at least one flow guiding portion is formed on one side of each heat radiating film The flow guiding portion extends in a curved shape. 9. The heat sink of claim 8, wherein the flow guiding portion has an axisymmetric structure. 10. The heat sink of claim 9, wherein the heat dissipating fin is provided with at least one perforation, and the flow guiding portion is symmetrically disposed outside the perforation. 11. The heat sink of claim 1, wherein each of the perforations is provided with a manifold. 12. The heat sink of claim 1, wherein the flow guiding portion is parabolic or streamlined. 13. The heat sink of claim 1, wherein the width of the flow guiding portion adjacent the fluid inlet end 11 1274540 is greater than the width away from the fluid inlet end. The heat sink according to any one of the items 9 to 13, wherein the distance of the flow guiding portion /, /, the axis gradually decreases from the outer end of the flow guiding portion toward the intermediate portion. The heat sink of the item 14 is characterized in that each of the heat-dissipating pieces is provided with a plurality of mutually-conducting flow guiding portions. The heat sink of claim 15, wherein the plurality of flow guiding portions comprise two flow guiding portions. 17. The heat sink of claim 15 wherein the one of the adjacent two flow guiding portions is tapered. 18·如申請專利範圍第9項所述之散熱器,其中對應導流部位置每_散 熱鰭片相對於設有導流部的侧面的另一側形成相應的凹陷。18. The heat sink of claim 9, wherein the corresponding deflector position forms a corresponding recess per _ heat sink fin relative to the other side of the side on which the flow guide is provided. 1212
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