201007868 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種半導體設備，特別是關於一種整合 點測及分選的設備。 ' 【先前技術】 在習知的半導體後段（back-end)製程中，點測設備 (Prober)以及分選設備（Sorter)乃是各自獨立的。晶圓加工 ^ 完成後，被貼附在藍膜(blue tape)上並切割成多個晶粒。 該藍膜被固定於一晶圓環(wafer ring)並端開，使其上的各 晶粒彼此分離。接著，該晶圓環經由手動或自動的上片程 序送入點測設備。點測設備針對該晶圓環上的晶粒做電性 測試，然後，測試完畢的晶圓環再以人工方式移置到分選 設備。分選設備依照測試結果將晶圓環上的晶粒分選到各 等級的分選盒(bin)中。為配合整體製程，晶圓環從離開點 〇 測設備到送入分選設備之間往往要等上數日。在這段期 間，被撐開的藍膜會逐漸收縮，使得晶粒的分佈位置改 變，因此在分選時容易發生錯位。此外，在以人工的方式 將晶圓環從點測設備移置到分選設備的這個步驟也容易 發生人為疏失，對製程的可靠度造成危害。 一直以來，製程整合都是半導體製程中一個重要的發 展方向。當相關製程整合於同一個系統内時，晶圓將得以 迅速地被處理，因此處理速度提升；而且晶圓維持在真空 環境下自動傳送，避免曝露於空氣中，可使產品的良率提 5 201007868 高；設備的整合更可使設備的佔地面積減少。製程整合除 了對於提昇處理過程的質、量以及降低成本有利以外，整 合後的流程使得晶圓在該段製程中不須以人工傳送，消除 人為疏失的發生。 為解決前述問題，有人提出一種整合點測及分選的裝 置，圖1係其示意圖。在使用此點測及分選的裝置10時， 晶圓環載入晶圓環置放區14後，移置裝置102自該晶圓 環取下晶粒，送至傳遞區16，點測裝置12對傳遞區16中 的晶粒做電性測試，測試完的晶粒再由移置裝置104依該 晶粒的電性測試結果自傳遞區16直接分選到分選盒置放 區18中的分選盒，最後從分選盒置放區18出料。這種裝 置整合了習知的點測及分選製程，但實際應用時卻因處理 速度過慢而不具經濟效益，因此目前的半導體廠仍然採用 各自獨立的點測設備及分選設備。 【發明内容】 本發明的目的之一，在於提出一種整合半導體後段製 程中點測及分選流程的裝置。 根據本發明，一種點測及分選裝置包括一測試區，該 測試區設有一點測裝置，對一晶圓環上的晶粒進行測試， 測試後的晶圓環藉由一傳送裝置，將該晶圓環自該測試區 傳送到一分選區，該分選區具有一分選裝置，將該晶圓環 上的晶粒依測試結果分選到多個分選盒中。 根據本發明，一種點測及分選裝置包括一裝填區，供 201007868 載入一待測晶圓環，一測試區具有一點測裝置，用來對該 待測晶圓環進行測試，一晶圓環置放區，供放置測試後的 晶圓環，一傳送裝置將該待測晶圓環自該裝填區傳送到該 測試區接受測試，再將測試後的晶圓環傳送到該晶圓環置 ^ 放區，一分選裝置根據測試結果自該晶圓環置放區將晶粒 • 從測試後的晶圓環上分選到分選盒置放區的分選盒中。 較佳者，於本發明之點測及分選裝置中設置一視覺檢 測系統，以檢查受測晶粒的外觀。 ® 較佳者，更包括一進料裝置，以自動控制方式進料。 本發明提出一種整合點測及分選的裝置，整合點測及 分選製程，減低人為疏失的發生機會，提昇產品良率，同 時維持晶圓處理速度。 【實施方式】 圖1之整合裝置因為將晶粒一一取起進行測試，使得 Φ 處理速度過低。本發明中點測晶粒的步驟改為一次處理整 個晶圓以提昇處理速度。 圖2係本發明第一實施例的方塊圖，待測的晶圓環進 料給點測及分選裝置20後，先於測試區26接受測試，測 試完畢後傳送裝置22將晶圓環移置到分選區24做分選， 最後出料。本實施例係對晶圓環進行點測，換言之，測試 區26 —次對整個晶圓的晶粒做電性測試，因此測試的速 度提昇。測試完的晶圓環直接送入分選區24進行分選， 因此藍膜的收縮程度對分選造成的影響降到最低。在本實 7 201007868 施例中，傳送裝置22以機械臂或滑軌實現。 圖3是一個實體設備的示意圖，晶圓環進料給點測及 分選裝置20後，在點測平台264上接受點測裝置262測 試，然後經由傳送裝置22傳送到晶圓環置放平台244接 受分選裝置246揀取，晶圓環上的晶粒依其等級被分選裝 - 置246移置到分選平台242的分選盒中。在其他實施例 中，也可以在點測平台、晶圓環置放平台或分選平台上設 置視覺檢測系統(AOI)，以便於檢查晶粒外觀是否完整。 ® 圖4係本發明第二實施例的方塊圖，晶圓環進料給點 測及分選裝置30後，先放置於裝填區32，傳送裝置304 將裝填區32上的晶圓環移置到測試區34,測試區34中設 有點測裝置，晶圓環上的晶粒在測試區34接受點測裝置 測試，測試完畢後，傳送裝置304再將晶圓環移置到晶圓 環置放區36，分選裝置302自晶圓環置放區36中的晶圓 環取下晶粒，依照測試結果分選到分選盒置放區38的分 q 選盒中，完成分選之步驟，最後由分選盒置放區38出料。 在本實施例中，裝填區32同時提供緩衝的作用。較佳者， 在測試區、晶圓環置放區或分選裝置設置視覺檢測系統， 以便於檢查晶粒外觀是否完整。進出料方式可以有各種變 -化，例如將晶圓環及分選盒的進、出料都設計於裝填區， - 分選完畢之晶圓環及分選盒都由傳送裝置304移置到裝填 區而出料。在其他實施例中，於裝填區進行晶圓環的進、 出料，分選盒的進、出料則經由分選盒置放區。 圖5是一個實體設備的示意圖，俗稱卡匣的自動進料 201007868 裝置308設置在點測及分選裝置30的右側，晶圓環306 由進料裝置308進料到裝填區32後，被傳送裝置304取 起並移置到測試區34接受點測，測試完的晶圓環再由傳 送裝置304移置到晶圓環置放區36,分選裝置302為可提 供真空吸力的擺臂，將晶粒自晶圓環置放區36中的晶圓 環取下後，依該晶粒的等級擺放到分選盒置放區38中的 分選盒内。在本實施例中，傳送裝置304為一機械臂，在 其他實施例中，傳送裝置304可以滑轨或其他機構實現。 以上對於本發明之較佳實施例所作的敘述係為闡明 之目的，無意限定本發明精確地為所揭露的形式，基於以 上的教導或從本發明的實施例學習而作修改或變化是可 能的，實施例係為解說本發明的原理以及讓熟習該項技術 者以各種實施例利用本發明在實際應用上而選擇及敘 述，本發明的技術思想企圖由以下的申請專利範圍及其均 等來決定。 【圖式簡單說明】 圖1係習知整合點測及分選流程的裝置； 圖2係本發明第一實施例的方塊圖； 圖3係圖2之實施例的示意圖； 圖4係本發明第二實施例的方塊圖；以及 圖5係圖4之實施例的示意圖。 【主要元件符號說明】 9 201007868201007868 IX. Description of the Invention: [Technical Field] The present invention relates to a semiconductor device, and more particularly to an apparatus for integrating point measurement and sorting. [Prior Art] In the conventional semiconductor back-end process, the spotting device (Prober) and the sorting device (Sorter) are independent. After wafer processing ^ is completed, it is attached to a blue tape and cut into a plurality of crystal grains. The blue film is fixed to a wafer ring and opened to separate the respective crystal grains on each other. The wafer ring is then fed into the spotting device via a manual or automated wafer loading procedure. The spot test device performs electrical testing on the die on the wafer ring, and then the tested wafer ring is manually moved to the sorting device. The sorting device sorts the grains on the wafer ring into bins of each grade according to the test results. In order to match the overall process, it takes a few days for the wafer ring to pass from the point of detection to the sorting device. During this period, the expanded blue film gradually shrinks, causing the distribution position of the crystal grains to change, so that misalignment is likely to occur at the time of sorting. In addition, this step of manually removing the wafer ring from the spotting device to the sorting device is also prone to human error, which is detrimental to the reliability of the process. Process integration has always been an important development direction in semiconductor manufacturing. When the related processes are integrated into the same system, the wafers can be processed quickly, so the processing speed is improved; and the wafers are automatically transferred in a vacuum environment to avoid exposure to the air, which can increase the yield of the product. 201007868 high; the integration of equipment can reduce the footprint of the equipment. Process integration In addition to improving the quality, quantity, and cost reduction of the process, the integrated process eliminates the need for manual transfer of wafers during the process, eliminating human error. In order to solve the aforementioned problems, a device for integrating point measurement and sorting has been proposed, and Fig. 1 is a schematic view thereof. When the device 10 for measuring and sorting is used, after the wafer ring is loaded into the wafer ring placement area 14, the displacement device 102 removes the die from the wafer ring and sends it to the transfer area 16, and the spotting device 12, the die in the transfer zone 16 is electrically tested, and the tested die is directly sorted from the transfer zone 16 by the displacement device 104 to the sorting box placement area 18 according to the electrical test result of the die. The sorting box is finally discharged from the sorting box placement area 18. This device integrates the traditional spot measurement and sorting process, but the actual application is too slow to be economical, so the current semiconductor factory still uses its own independent point measurement equipment and sorting equipment. SUMMARY OF THE INVENTION One object of the present invention is to provide an apparatus for integrating the point measurement and sorting processes in a semiconductor back-end process. According to the present invention, a spotting and sorting apparatus includes a test area having a point measuring device for testing a die on a wafer ring, and the tested wafer ring is transported by a transfer device The wafer ring is transferred from the test zone to a sorting zone, and the sorting zone has a sorting device, and the die on the wafer ring is sorted into a plurality of sorting boxes according to the test result. According to the present invention, a spotting and sorting apparatus includes a loading area for 201007868 to load a wafer ring to be tested, and a test area having a point measuring device for testing the wafer ring to be tested, a wafer a ring placement area for placing the tested wafer ring, a transfer device transferring the wafer ring to be tested from the loading area to the test area for testing, and transmitting the tested wafer ring to the wafer ring In the discharge zone, a sorting device sorts the die from the wafer ring placement area from the tested wafer ring to the sorting box of the sorting box placement area according to the test result. Preferably, a visual inspection system is provided in the spotting and sorting apparatus of the present invention to check the appearance of the measured crystal grains. ® is better, and includes a feeding device that feeds in an automatic control mode. The invention proposes a device for integrating point measurement and sorting, integrating the spot measurement and sorting process, reducing the chance of human error, improving the product yield and maintaining the wafer processing speed. [Embodiment] The integrated device of Fig. 1 is tested because the crystal grains are taken one by one, so that the processing speed of Φ is too low. In the present invention, the step of spotting the die is changed to process the entire wafer at a time to increase the processing speed. 2 is a block diagram of a first embodiment of the present invention. After the wafer ring to be tested is fed to the spotting and sorting device 20, the test is performed before the test zone 26. After the test is completed, the transfer device 22 moves the wafer ring. Set to the sorting area 24 for sorting, and finally discharge. In this embodiment, the wafer ring is spot-measured, in other words, the test area 26 is electrically tested on the entire wafer, so that the speed of the test is improved. The tested wafer ring is sent directly to the sorting zone 24 for sorting, so that the degree of shrinkage of the blue film minimizes the effect of sorting. In the embodiment of the present invention 7 201007868, the conveyor 22 is realized with a robot arm or a slide rail. 3 is a schematic diagram of a physical device. After the wafer ring is fed to the spotting and sorting device 20, it is tested by the spotting device 262 on the spotting platform 264 and then transferred to the wafer ring placement platform via the transfer device 22. The 244 is picked up by the sorting device 246, and the dies on the wafer ring are sorted by the grading device 246 to the sorting box of the sorting platform 242. In other embodiments, an optical inspection system (AOI) can also be placed on the spotting platform, the wafer ring placement platform, or the sorting platform to facilitate inspection of the integrity of the grain appearance. FIG. 4 is a block diagram of a second embodiment of the present invention. After the wafer ring is fed to the spotting and sorting device 30, it is first placed in the loading area 32, and the transfer device 304 displaces the wafer ring on the loading area 32. To the test area 34, a test device is provided in the test area 34, and the die on the wafer ring is tested by the spot test device in the test area 34. After the test is completed, the transfer device 304 then shifts the wafer ring to the wafer ring. In the discharge area 36, the sorting device 302 takes the die from the wafer ring in the wafer ring placement area 36, and sorts it into the sub-q box of the sorting box placement area 38 according to the test result to complete the sorting. The step is finally discharged from the sorting box placement area 38. In the present embodiment, the loading area 32 simultaneously provides a buffering effect. Preferably, a visual inspection system is provided in the test area, the wafer ring placement area or the sorting device to facilitate inspection of the integrity of the grain appearance. The input and output modes can be variously changed, for example, the inlet and the discharge of the wafer ring and the sorting box are designed in the loading area, and the sorted wafer ring and the sorting box are all transferred to the transfer device 304. Discharged from the filling area. In other embodiments, the inlet and outlet of the wafer ring are carried out in the loading area, and the inlet and outlet of the sorting box are passed through the sorting box placement area. 5 is a schematic diagram of a physical device, commonly referred to as a cassette automatic feed 201007868. The device 308 is disposed on the right side of the spotting and sorting device 30. The wafer ring 306 is fed by the feeding device 308 to the loading area 32 and then transferred. The device 304 is picked up and displaced to the test area 34 for spot testing. The tested wafer ring is then transferred by the transfer device 304 to the wafer ring placement area 36. The sorting device 302 is a swing arm that provides vacuum suction. After the dies are removed from the wafer ring in the wafer ring placement area 36, they are placed in the sorting box in the sorting box placement area 38 according to the level of the die. In the present embodiment, the transfer device 304 is a robotic arm. In other embodiments, the transfer device 304 can be implemented by a slide rail or other mechanism. The above description of the preferred embodiments of the present invention is intended to be illustrative, and is not intended to limit the scope of the present invention. It is possible to make modifications or variations based on the above teachings or learning from embodiments of the present invention. The embodiments are described and illustrated in the practical application by the skilled person in the various embodiments using the present invention. The technical idea of the present invention is determined by the following claims and their equals. . BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram of a conventional integrated point measurement and sorting process; FIG. 2 is a block diagram of a first embodiment of the present invention; FIG. 3 is a schematic view of an embodiment of FIG. A block diagram of a second embodiment; and FIG. 5 is a schematic diagram of an embodiment of FIG. [Main component symbol description] 9 201007868
10 點測及分選裝置 102 移置裝置 104 移置裝置 12 點測裝置 14 晶圓壞置放區 16 傳遞區 18 分選盒置放區 20 點測及分選裝置 22 傳送裝置 24 分選區 242 分選平台 244 晶圓環置放平台 246 分選裝置 26 測試區 262 點測裝置 264 點測平台 30 點測及分選裝置 302 分選裝置 304 傳送裝置 306 晶圓環 308 進料裝置 32 裝填區 34 測試區 36 晶圓環置放區 201007868 38 分選盒置放區10 Spot and sorting device 102 Displacement device 104 Displacement device 12 Dot device 14 Wafer placement zone 16 Transfer zone 18 Sorting box placement area 20 Spotting and sorting device 22 Transfer device 24 Sorting area 242 Sorting platform 244 Wafer ring placement platform 246 Sorting device 26 Test area 262 Spot measuring device 264 Spot measuring platform 30 Spotting and sorting device 302 Sorting device 304 Transfer device 306 Wafer ring 308 Feed device 32 Filling area 34 Test Area 36 Wafer Ring Placement Area 201007868 38 Sorting Box Placement Area
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