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TWI368966B - - Google Patents

Info

Publication number
TWI368966B
TWI368966B TW097131281A TW97131281A TWI368966B TW I368966 B TWI368966 B TW I368966B TW 097131281 A TW097131281 A TW 097131281A TW 97131281 A TW97131281 A TW 97131281A TW I368966 B TWI368966 B TW I368966B
Authority
TW
Taiwan
Application number
TW097131281A
Other languages
Chinese (zh)
Other versions
TW201007868A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW097131281A priority Critical patent/TW201007868A/en
Priority to KR1020090069433A priority patent/KR101117655B1/en
Priority to JP2009179530A priority patent/JP5008700B2/en
Publication of TW201007868A publication Critical patent/TW201007868A/en
Application granted granted Critical
Publication of TWI368966B publication Critical patent/TWI368966B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H10P72/0606—
    • H10P72/0611—
    • H10P72/3302—
    • H10P72/7606—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW097131281A 2008-08-15 2008-08-15 Probing and sorting device TW201007868A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW097131281A TW201007868A (en) 2008-08-15 2008-08-15 Probing and sorting device
KR1020090069433A KR101117655B1 (en) 2008-08-15 2009-07-29 Probe and sorting apparatus
JP2009179530A JP5008700B2 (en) 2008-08-15 2009-07-31 Probe testing and sorting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097131281A TW201007868A (en) 2008-08-15 2008-08-15 Probing and sorting device

Publications (2)

Publication Number Publication Date
TW201007868A TW201007868A (en) 2010-02-16
TWI368966B true TWI368966B (en) 2012-07-21

Family

ID=42016448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097131281A TW201007868A (en) 2008-08-15 2008-08-15 Probing and sorting device

Country Status (3)

Country Link
JP (1) JP5008700B2 (en)
KR (1) KR101117655B1 (en)
TW (1) TW201007868A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101707805B1 (en) * 2015-09-15 2017-02-17 (주) 윈팩 Reconstruction method of wafer
CN119920736B (en) * 2025-04-01 2025-07-22 江西省兆驰光电有限公司 LED chip sorting machine and LED chip sorting method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01202832A (en) * 1988-02-08 1989-08-15 Nec Kyushu Ltd Prober for manufacture of semiconductor
KR100274595B1 (en) * 1997-10-06 2000-12-15 윤종용 Semiconductor device probe station, its cooling apparatus, its cooling method, and eds method thereof
JP2000162275A (en) * 1998-12-01 2000-06-16 Fujitsu Ltd Semiconductor test method and semiconductor test apparatus
JP2001021617A (en) * 1999-07-07 2001-01-26 Tesetsuku:Kk Method for carrying electronic part and its device
US6781363B2 (en) * 2001-06-21 2004-08-24 Han-Ping Chen Memory sorting method and apparatus
JP2008172203A (en) * 2007-11-19 2008-07-24 Hitachi High-Technologies Corp Semiconductor chip sorting device

Also Published As

Publication number Publication date
KR101117655B1 (en) 2012-03-20
KR20100021359A (en) 2010-02-24
JP5008700B2 (en) 2012-08-22
TW201007868A (en) 2010-02-16
JP2010045349A (en) 2010-02-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees