201005211 九、發明說明： •【發明所屬之技術領域】 • 本發明涉及一種照明裝置，尤指一種光源模組 及應用該光源模組之發光二極體燈具。 【先前技術】 發光二極體作為一種新型光源，具有工作壽命 長、節能以及環保等優點，市場前景看好。惟，發 光二極體在運行中產生大量之熱量，且容易因溫度 ®之升高而導致發光效率明顯下降，甚至造成元件之 損壞，在照明領域中發光二極體之散熱問題則更加 突出。是故，如何將發光二極體之工作溫度保持在 一定範圍内以避免上述現象之發生，是發光二極體 燈具應用必需解決之問題。 傳統發光二極體燈具包括一板狀之散熱器及 複數安裝於散熱器一側之光源模組。該等光源模組 @均勻地排列於散熱器之背面。當發光二極體處於工 作狀態時，其產生熱量傳導至位於其背面之散熱 器，最後通過散熱器以向周圍輻射熱量之方式散發 至周圍空氣當中。為提高其散熱效率，一般採用增 大散熱器之尺寸。惟，這樣使得發光二極體散熱器 及整個照明裝置之體積增大。尤其在室内照明領 域，對燈具不僅要求工作狀態穩定，同樣要求結構 緊湊。傳統發光二極體燈具由於散熱結構笨重而複 雜，顯然不滿足現實所需。 6 201005211 【發明内容】 • 一種光源模組，包括一固定架及貼設於該固定 •架上之一發光二極體模組’該固定架包括一底板、 與該底板間隔設置之一安裝板及連接該底板與安 裝板之一連接部’該發光二極體模組貼設於該安裝 板上，還包括設置於該固定架上之一熱管，該熱管 連接該底板與安裝板。 一種發光二極體燈具’包括一散熱器，安裝於 ®該散熱器上之複數光源模組，該光源模組包括一固 定架及貼設於該固定架上之一發光二極體模組，該 固定架包括一底板、與該底板間隔設置之一安裝板 及連接該底板與安裝板之一連接部，該發光二極體 模組貼設於該安裝板上，該光源模組還包括設置於 該固定架上之一熱管’該熱管連接該底板與安裝 板。 ❹ 與習知技術相比，本發明之光源模組將發光二 極體模組貼設於該固定架之安裝板上，該埶管導埶 連接該固定架之安裝板、底板，從而實現較好散熱 效果’確保發光二極體模組穩定工作 【實施方式】 請參閲圖1至圖2,本發明之發光二極體燈具 包括複數光源模組1及供該丼、、择 疋源模組1貼設之一散 熱器50，該光源模組1包括— 挤 固定架10，貼設於 該固定架1 0上之一發光二極體 體模組20，裝設於該 201005211 固定架10之上並與該固定架10及散熱器50導熱 連接之一第―、第二熱管30、40。 請同時參閱圖3 ’上述固定架1〇由導熱性能 良好之材料如銅、鋁等—體製成，其包括固定於散 熱器50上之一底板12、一與該發光二極體模組2〇 才目貼合之安襞板14及連接該底板12及安裝板14 之·一連接部16。該底板12為一大致呈矩形之水平 ❹板體’其四角均形成一方形缺口（未標示），便於 將該第一、第二熱管30、40裝設於該固定架10之 上。該底板1 2之底面上間隔開設有一第一溝槽12〇 及 第二溝槽122，該第一、第二溝槽120、122 才目 ★ 且沿該底板1 2之縱長方向延伸。該第一、 第=溝槽12〇、122之橫截面均呈弧形，以分別對 應各置該第—、第二熱管30、40之一部分。該底 12 、 λ近二相對邊緣處分別開設有複數通孔 〇 4供複數固定件（圖未示）穿過將該固定架10 固 疋。該連接部16由該底板12之頂面中部垂 ^向上延伸並對應連接該安裝板14底面之中部。 '•亥安裴板14為一矩形板體，其形成於該連接部 頂面上。該發光二極體模組2 〇貼設於該安裝板14 之頂面。該安裝板14相對於該連接部1 6形成一銳 角（未標示）’使得貼設於該安裴板14頂面之發 光一極體模組20與安裝於散熱器上之該底板 1 2成一定角度傾斜設置，以增加發光二極體模·组 201005211 在其他實施例中201005211 IX. Description of the invention: • [Technical field to which the invention pertains] The present invention relates to a lighting device, and more particularly to a light source module and a light-emitting diode lamp using the same. [Prior Art] As a new type of light source, the light-emitting diode has the advantages of long working life, energy saving and environmental protection, and the market prospect is promising. However, the light-emitting diode generates a large amount of heat during operation, and it is easy to cause a significant decrease in luminous efficiency due to an increase in temperature ® and even cause damage to components. In the field of illumination, the heat dissipation problem of the light-emitting diode is more prominent. Therefore, how to keep the operating temperature of the light-emitting diode within a certain range to avoid the above phenomenon is a problem that must be solved in the application of the light-emitting diode lamp. A conventional light-emitting diode lamp includes a plate-shaped heat sink and a plurality of light source modules mounted on one side of the heat sink. The light source modules @ are evenly arranged on the back of the heat sink. When the light-emitting diode is in operation, it generates heat to the heat sink located at the back thereof, and finally radiates heat to the surrounding air through the heat sink to the surrounding air. In order to improve the heat dissipation efficiency, the size of the heat sink is generally increased. However, this increases the volume of the light-emitting diode heat sink and the entire lighting device. Especially in the field of indoor lighting, the luminaire not only requires a stable working condition, but also requires a compact structure. Conventional light-emitting diode lamps are complicated by the cumbersome heat-dissipating structure, and obviously do not meet the needs of reality. 6 201005211 [Invention] A light source module includes a fixing frame and a light emitting diode module attached to the fixing frame. The mounting frame includes a bottom plate and a mounting plate spaced apart from the bottom plate. And the connecting portion of the bottom plate and the mounting plate, the light emitting diode module is attached to the mounting plate, and further comprises a heat pipe disposed on the fixing frame, the heat pipe connecting the bottom plate and the mounting plate. A light-emitting diode lamp includes a heat sink and a plurality of light source modules mounted on the heat sink. The light source module includes a fixing frame and a light-emitting diode module attached to the fixing frame. The mounting bracket includes a bottom plate, a mounting plate spaced apart from the bottom plate, and a connecting portion connecting the bottom plate and the mounting plate. The light emitting diode module is attached to the mounting plate, and the light source module further includes a setting. A heat pipe on the fixing frame connects the bottom plate to the mounting plate.光源 Compared with the prior art, the light source module of the present invention attaches the light emitting diode module to the mounting plate of the fixing frame, and the connecting tube guide is connected to the mounting plate and the bottom plate of the fixing frame, thereby realizing Good heat dissipation effect to ensure stable operation of the LED module [Embodiment] Referring to FIG. 1 to FIG. 2, the LED lamp of the present invention includes a plurality of light source modules 1 and the source and the source mode. The light source module 1 includes a heat sink module 50, and the light source module 1 includes a light-emitting diode module 20 attached to the mounting frame 10, and is mounted on the 201005211 fixing frame 10. The first and second heat pipes 30 and 40 are thermally connected to the fixing frame 10 and the heat sink 50. Please refer to FIG. 3 'the above-mentioned fixing frame 1 〇 is made of a material with good thermal conductivity such as copper, aluminum, etc., and includes a bottom plate 12 fixed on the heat sink 50, and a light emitting diode module 2 The mounting plate 14 and the connecting portion 16 connecting the bottom plate 12 and the mounting plate 14 are attached. The bottom plate 12 is a substantially rectangular horizontal slab body. The four corners thereof form a square notch (not shown) for mounting the first and second heat pipes 30, 40 on the fixing frame 10. A first trench 12 〇 and a second trench 122 are defined in the bottom surface of the bottom plate 12 , and the first and second trenches 120 and 122 extend along the longitudinal direction of the bottom plate 12 . The cross sections of the first and second grooves 12, 122 are curved to respectively correspond to a portion of the first and second heat pipes 30, 40. A plurality of through holes 〇 4 are respectively opened at the opposite edges of the bottom 12 and λ for a plurality of fixing members (not shown) to pass through the fixing frame 10. The connecting portion 16 extends vertically from the top surface of the bottom plate 12 and is correspondingly connected to the middle portion of the bottom surface of the mounting plate 14. The 'Hai'an slab 14 is a rectangular plate body formed on the top surface of the connecting portion. The LED module 2 is attached to the top surface of the mounting board 14 . The mounting plate 14 forms an acute angle (not shown) with respect to the connecting portion 16 such that the light-emitting diode module 20 attached to the top surface of the ampoule plate 14 and the bottom plate 12 mounted on the heat sink are formed. A certain angle tilt setting to increase the light-emitting diode mode group 201005211 in other embodiments
之連線和第二溝 20之照射範圍。4 二極體燈具不同照 槽、凹槽1 2 2、14 2之連線均與該連接部丄6相平行 並垂直於該底板12。該第一、第二凹槽14〇、142 之横截面呈弧形，分別對應卡置該第一、第二熱管 3〇、40之另一部分。 上述發光二極體模組20包括一矩形電路板22 及安裝於該電路板22頂面上之複數發光二極體 24。該電路板22之底面與該固定架1〇之安裝板 14之頂面相緊密貼合。該等發光二極體24沿該電 路板22之縱長方向墓直線均勻排列’以將發光時 產生熱量均勻地傳遞至§亥固疋架1〇上’進而傳導 至與該固定架10相連之散熱器5〇上。 請同時參閱圖4，上述第一熱管30呈u形， 其包括平行設置之一第一傳熱段32與一第二傳熱 段34及連接該第一、第二傳熱段32、34之一第一 連接段36。該第一熱管30穿置於該固定架10之 201005211 上並位於該固定架10之一側，其中第一傳熱段3 2 •對應卡置於該固定架10之底板12之第一溝槽120 ‘内，第二傳熱段34對應卡置於該固定架10之安裝 板14之第一凹槽140内，該第一連接段36橫跨於 該底板12與安裝板14之間。該第一熱管30之第 一、第二傳熱段32、34所在平面（未標示）垂直 於該固定架10之底板12，且該平面平行於該連接 部16。 ® 上述第二熱管40呈U形，其包括平行設置之 一第三傳熱段42與一第四傳熱段44及連接該第 三、第四傳熱段42、44之一第二連接段46。該第 二熱管40之第三、第四傳熱段42、44之間之垂直 距離大於該第一熱管30之第一、第二傳熱段32、 34之間之垂直距離，以使該第二熱管40對應穿置 於該固定架10之另一侧，其中第三傳熱段42對應 _卡置於該固定架10之底板12之第二溝槽122内， 第二傳熱段44對應卡置於該固定架10之安裝板 14之第二凹槽142内，該第二連接段46橫跨於該 底板12與安裝板14之間。該第二熱管40之第三、 第四傳熱段42、44所在平面（未標示）垂直於該 固定架 10之底板 12，且該平面平行於該連接部 16。該第二熱管40之開口方向與該第一熱管30之 開口方向相反，以達到均勻傳熱效果。 請一併參閱圖5，上述散熱器50由導熱性能 10 201005211 良好之材料一體製成。該散熱器5〇包括一矩形 .板52及自該基板52上延伸而出之複數散熱鰭 ‘ 54。該光源模組1安裝於該基板52之頂面中部 且沿該基板5 2之縱長方向設置。光源模組1之 量在不同實施例中相應不同，在本實施例中，該 源模組1之數量為四，兩兩一組相對設置，並關 s亥基板5 2之縱向中垂線野稱排佈。該基板5 2之 ❹面中部平行間隔開設有八定位槽56，該八定位 5 6兩兩相鄰為一組，每—組二定位槽5 6分別與 光源模組1之固定架1〇之底板12之第一、第二 槽122、124在形狀上相對應，配合圍設出二容 部（未標示）’剛好分別容置該第一熱管30之 —傳熱段32、第二熱管40之第三傳熱段42，以 固定架10之底板12底面與該基板52之頂面對 貼合。該散熱鰭片54包括由該基板52整個底面 〇直向下延伸而出之複數第一散熱鰭片542及由 基板5 2頂面兩相對邊緣處分別垂直向上延伸而 之複數第二散熱鰭片5 44。該等第一、第二散熱 片542、544沿該基板52之縱向延伸，其間形^ 數氣流通道（未標示）。 使用本發明之光源模組i時，根據照明環境 需要，將複數光源模組i按照一定排佈方式如 向、縱向、周向等安裝於發光二極體燈具之散熱 50之基板52之上，其中該固定架1〇及第一、 基 片 5 數 光 於 頂 槽 溝 置 第 使 應 垂 該 出 鰭 複 之 橫 器 第 11 201005211 • 二熱管30、40與散熱器50之基板52同時貼合。 • 該發光二極體模組20發光時產生熱量經固定架10 ' 及穿置於固定架10上之第一、第二熱管30、40傳 導至散熱器50之基板52上，再經散熱鰭片54散 發至周圍空氣中去，從而有效地降低發光二極體模 組20工作溫度，保證發光二極體燈具穩定工作。 又，貼設發光二極體模組20之安裝板14與貼合該 底板12之基板5 2成一定角度傾斜設置，增加發光 ®二極體模組20照射範圍，適應多種照明環境需要。 綜上所述，本發明符合發明專利要件，爰依法 提出專利申請。惟，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 Φ 圖 1係本發明之發光二極體燈具之立體組合 圖。 圖2係圖1中光源模組之立體分解圖。 圖3係圖2之倒置圖。 圖4係圖1中光源模組之正視圖。 圖5係圖1中發光二極體燈具之立體分解圖。 【主要元件符號說明】 12 201005211The line of illumination and the range of illumination of the second trench 20. 4 The diodes and the grooves 1 2 2 and 14 2 are connected in parallel with the connecting portion 丄6 and perpendicular to the bottom plate 12. The first and second recesses 14A and 142 have an arc shape in cross section, and respectively correspond to the other portion of the first and second heat pipes 3, 40. The LED module 20 includes a rectangular circuit board 22 and a plurality of LEDs 24 mounted on the top surface of the circuit board 22. The bottom surface of the circuit board 22 is in close contact with the top surface of the mounting plate 14 of the mounting frame 1 . The light-emitting diodes 24 are evenly arranged along the longitudinal direction of the circuit board 22 to uniformly transfer heat generated during light emission to the 亥 疋 疋 ' 进而 ” ” ” ” ” The radiator 5 is on the raft. Referring to FIG. 4 simultaneously, the first heat pipe 30 has a U shape, and includes a first heat transfer section 32 and a second heat transfer section 34 disposed in parallel and connecting the first and second heat transfer sections 32 and 34. A first connecting section 36. The first heat pipe 30 is disposed on the 201005211 of the fixing frame 10 and located on one side of the fixing frame 10, wherein the first heat transfer portion 32 2 is correspondingly disposed in the first groove of the bottom plate 12 of the fixing frame 10. The first heat transfer section 34 is disposed in the first recess 140 of the mounting plate 14 of the mounting bracket 10 , and the first connecting section 36 spans between the bottom plate 12 and the mounting plate 14 . The plane (not shown) of the first and second heat transfer sections 32, 34 of the first heat pipe 30 is perpendicular to the bottom plate 12 of the mount 10, and the plane is parallel to the joint portion 16. The second heat pipe 40 has a U shape, and includes a third heat transfer section 42 and a fourth heat transfer section 44 and a second connection section connecting the third and fourth heat transfer sections 42 and 44 in parallel. 46. The vertical distance between the third and fourth heat transfer sections 42 and 44 of the second heat pipe 40 is greater than the vertical distance between the first and second heat transfer sections 32, 34 of the first heat pipe 30, so that the first The second heat pipe 40 is correspondingly disposed on the other side of the fixing frame 10, wherein the third heat transfer portion 42 is correspondingly disposed in the second groove 122 of the bottom plate 12 of the fixing frame 10, and the second heat transfer portion 44 corresponds to The card is placed in the second recess 142 of the mounting plate 14 of the mounting bracket 10, and the second connecting portion 46 spans between the bottom plate 12 and the mounting plate 14. The plane (not shown) of the third and fourth heat transfer sections 42, 44 of the second heat pipe 40 is perpendicular to the bottom plate 12 of the mounting frame 10, and the plane is parallel to the connecting portion 16. The opening direction of the second heat pipe 40 is opposite to the opening direction of the first heat pipe 30 to achieve a uniform heat transfer effect. Referring to FIG. 5 together, the heat sink 50 is integrally formed of a material having good thermal conductivity 10 201005211. The heat sink 5 includes a rectangular plate 52 and a plurality of heat radiating fins ‘54 extending from the substrate 52. The light source module 1 is mounted on the middle of the top surface of the substrate 52 and disposed along the longitudinal direction of the substrate 52. The quantity of the light source module 1 is different in different embodiments. In this embodiment, the number of the source modules 1 is four, two sets are oppositely disposed, and the longitudinal vertical line of the substrate is closed. Arrange. The bottom surface of the bottom surface of the substrate 52 is parallelly disposed with eight positioning grooves 56. The eight positioning positions are adjacent to each other, and each of the two positioning grooves 56 is respectively fixed to the fixing frame of the light source module 1. The first and second slots 122 and 124 of the bottom plate 12 are corresponding in shape, and the two heat-receiving portions (not shown) are disposed to receive the heat-transfer section 32 and the second heat pipe 40 respectively. The third heat transfer section 42 is surface-fitted to the top surface of the substrate 52 by the bottom surface of the bottom plate 12 of the mounting frame 10. The heat dissipation fins 54 include a plurality of first heat dissipation fins 542 extending straight from the entire bottom surface of the substrate 52 and a plurality of second heat dissipation fins extending vertically upward from opposite edges of the top surface of the substrate 52 5 44. The first and second heat sinks 542, 544 extend in the longitudinal direction of the substrate 52 with a gas flow path (not labeled) therebetween. When the light source module i of the present invention is used, the plurality of light source modules i are mounted on the substrate 52 of the heat dissipation 50 of the light emitting diode lamp according to a certain arrangement manner, such as the direction, the longitudinal direction, the circumferential direction, etc. according to the lighting environment. Wherein the fixing frame 1〇 and the first substrate 5 are lighted in the top groove, so that the fins are folded. The transverse device is 11 201005211. • The two heat pipes 30 and 40 are bonded to the substrate 52 of the heat sink 50 at the same time. . The heat generated by the LED module 20 is transmitted to the substrate 52 of the heat sink 50 through the fixing frame 10' and the first and second heat pipes 30 and 40 which are placed on the mounting frame 10, and then radiated through the heat sink fins. The sheet 54 is radiated to the surrounding air, thereby effectively reducing the operating temperature of the LED module 20 and ensuring stable operation of the LED lamp. Moreover, the mounting plate 14 on which the LED module 20 is attached and the substrate 52 that is attached to the bottom plate 12 are inclined at an angle to increase the illumination range of the LED module 20 to meet various lighting environments. In summary, the present invention complies with the requirements of the invention patent, and proposes a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a three-dimensional combination diagram of a light-emitting diode lamp of the present invention. 2 is an exploded perspective view of the light source module of FIG. 1. Figure 3 is an inverted view of Figure 2. 4 is a front elevational view of the light source module of FIG. 1. FIG. 5 is an exploded perspective view of the light-emitting diode lamp of FIG. 1. FIG. [Main component symbol description] 12 201005211
光源模組 1 固定架 10 底板 12 第一溝槽 120 第二溝槽 122 通孔 124 安裝板 14 第一凹槽 140 第二凹槽 142 連接部 16 發光二極體模組 20 電路板 22 發光二極體 24 第一熱管 30 第一傳熱段 32 第二傳熱段 34 第一連接段 36 第二熱管 40 第三傳熱段 42 第四傳熱段 44 第二連接段 46 散熱器 50 基板 52 散熱鰭片 54 第一散熱鰭片 542 第二散熱鰭片 544 定位槽 56Light source module 1 Fixing frame 10 Base plate 12 First groove 120 Second groove 122 Through hole 124 Mounting plate 14 First groove 140 Second groove 142 Connection portion 16 Light-emitting diode module 20 Circuit board 22 Light-emitting two Polar body 24 first heat pipe 30 first heat transfer section 32 second heat transfer section 34 first connecting section 36 second heat pipe 40 third heat transfer section 42 fourth heat transfer section 44 second connecting section 46 heat sink 50 substrate 52 Heat sink fin 54 first heat sink fin 542 second heat sink fin 544 positioning groove 56
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