200918817 九、發明說明： •【發明所屬之技術領域】 . 本發明涉及一種發光二極體燈具，尤係一種帶有散熱 裝置之發光二極體燈具。 【先前技術】 發光二極體光源作為一種新興之第三代光源，雖然現 在還不能大規模取代傳統之白熾燈，惟，其具有工作壽命 (長、節能、環保等優點’而普遍被市場所看好。而且，目 前由發光二極體組成之模組能產生大功率、高亮度之光 源，完全可以取代習知之白熾燈實現室内外照明，亦將廣 泛地、革命性地取代傳統之白熾燈等習知之光源，進而成 為符合節能環保主題之主要光源。 在用於一 些專業用途如作為戶外照明設備時 ，作為 LED照明設備光源之LED通常會被嚴密地封裝在一殼體内 以能在諸如沙塵很大或者空氣很潮濕等之惡劣自然環境下200918817 IX. Description of the invention: • Technical field to which the invention pertains. The present invention relates to a light-emitting diode lamp, and more particularly to a light-emitting diode lamp with a heat sink. [Prior Art] As a new generation of light source, the light-emitting diode light source can not replace the traditional incandescent lamp on a large scale. However, it has the advantages of long working life (long, energy saving, environmental protection, etc.) and is widely used in the market. Optimistic. Moreover, the module consisting of LEDs can produce high-power, high-brightness light sources, which can replace the traditional incandescent lamps for indoor and outdoor lighting. It will also replace the traditional incandescent lamps widely and revolutionarily. The light source of the conventional light becomes the main light source in line with the theme of energy saving and environmental protection. When used for some professional purposes such as outdoor lighting equipment, the LED as the light source of the LED lighting device is usually tightly packaged in a casing to be able to In a harsh natural environment such as heavy dust or very humid air
释射產生之熱 作都長期處在高 200918817 溫環境下’而影響其壽命及穩定性。 【發明内容】 有鑒於此，有必要提供一種受環境溫度影響較小且散 熱良好之發光二極體燈具。 一種帶有散熱裝置之發光二極體燈具，包括一散熱器 及複數發光一極體’該散熱器包括一底板及由該底板頂面 延伸而出之複數散熱鰭片，還包括與該散熱器導熱連接之 導熱板，該等發光二極體位於該等導熱板背向該散熱器之 表面’該等導熱板為具有單向傳熱功能之相變熱傳導元 件，其可加快該等發光二極體向該散熱器傳熱並阻止反向 傳熱。 上述發光二極體燈具中之相變導熱元件具有單向傳熱 之特性，該發光二極體燈具工作時，熱量可以快速地傳導 到該散熱器進而被散發出去，該發光二極體燈具在非工作 狀態時，即使該散熱器受環境溫度加熱而溫度升高，由於The heat generated by the release of radiation has long been in the high temperature of 200918817, which affects its life and stability. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a light-emitting diode lamp that is less affected by ambient temperature and has good heat dissipation. A light-emitting diode lamp with a heat sink, comprising a heat sink and a plurality of light-emitting ones, the heat sink comprising a bottom plate and a plurality of heat-dissipating fins extending from a top surface of the bottom plate, further comprising the heat sink a thermally conductively connected thermally conductive plate, the light emitting diodes being located on a surface of the heat conducting plate facing away from the heat sink. The heat conducting plates are phase change heat conducting elements having a unidirectional heat transfer function, which can accelerate the light emitting diodes The body transfers heat to the heat sink and prevents reverse heat transfer. The phase change heat conduction element in the above-mentioned light-emitting diode lamp has the characteristic of one-way heat transfer, and when the light-emitting diode lamp works, heat can be quickly transmitted to the heat sink and then emitted, and the light-emitting diode lamp is In the non-working state, even if the radiator is heated by the ambient temperature, the temperature rises due to
:導熱板早向傳熱之特性’該散熱器無法將來自外界之熱 里傳遞到垓LED上，而達到保護LED之效果。 【實施方式】 參閱圖1至圖3’本發明一優選實施例中之發光二極體 燈具中之散熱装置 用於對安裝在該發光二極體燈具内之 複數LED (發光二極體）⑽進行散熱，該發光二極體燈 二為用於戶外明之專業燈具，—般工作在比較惡劣之 衣兄下故/、有岔封殼體以保護其内之及相關 兀件該散熱衣置包括一散熱器1〇和貼設在該散熱器 200918817 底面上之複數導熱板20。該等LED100以矩陣排列方式安 ；裝於該等導熱板20上。 . 上述散熱器由導熱性能良好之金屬材料如鋁、銅等 體成型，其包括一矩形底板12和從該底板12垂直向上 延伸之複數散熱鰭片14。該底板12具有面向該導熱板2〇 之一底面120和與該底面12〇平行並相對之一頂面122。該 等散熱鰭片14從該底板12之頂面122向外延伸同時暴露 厂在邊發光二極體燈具之殼體外以將來自LED1〇〇之熱量散 發到周圍環境中，該散熱鰭片14可以設計成不同之形狀， 以使該散熱器10之熱交換面積最大化，在本實施例中，該 等散熱鰭片14相互等距間隔且與該底板12相對兩側邊平 行。 上述ir熱板20均由導熱性能優良之材料如銅製成，每 導熱板20均為一矩形扁平板體狀之相變傳導元件如板型 熱官，其具有傳統熱管之殼體（未標號）及該殼體内腔中 (之工作流體，該殼體包括一第一外壁22以及朝向該散熱器 10底面120並平行該第一外壁22之第二外壁24。該等 LED 100分別安裝在該等導熱板2〇之第一外壁22上。該第 二外壁24與該散熱器1〇底板12之底面120可通過焊接等 方式緊密接觸。導熱板20之數量在本實施列中優選為四 個，並且以矩陣排列方式等間距地貼設在該散熱器1〇之底 面120上。該等導熱板20均為具有單向傳熱功能之特殊熱 管’即熱量從該導熱板20之第一外壁22向第二外壁24傳 輪時，該導熱板20之熱阻很小而表現其高導熱特性，但當 8 200918817 熱量反過來從該導熱板20之第二外壁24向第一外壁22傳 輸時，該導熱板20熱阻很大而表現其絕熱特性。該導熱板 20之单向導熱性能係通過該導熱板20殼體内設置之毛細 結構之特定構造來實現，該殼體内毛細結構組織可以為孔 徑較大之螺旋溝槽、銅網或者只在該第一外壁22對應之内 壁上設置之燒結層。當該導熱板20水平放置且其第一外壁 22朝向地面時，該工作流體剛好能足夠浸沒該第一外壁22 内表面上之毛細結構組織，該工作流體作為熱載體將熱量 從第一外壁22傳至第二外壁24。 上述散熱裝置處於工作狀態時，該等導熱板20之第二 外壁24與該散熱器10底板12之底面120緊密接觸。 LED100產生之熱量直接被導熱板20吸收，導熱板20再將 熱量傳導到該散熱器10上，最後由該散熱器10上之散熱 鰭片14將熱量散發到周圍空氣中，從而達到冷卻LED100 之效果。 此外，使用者須被告知，當本發明之發光二極體燈具 被置於戶外並曝露在陽光下時，應當保證該散熱器10之底 板12之底面120面向地面。如此，該導熱板20第一外壁 22上之毛細結構組織將浸沒在工作流體中，而該導熱板20 之第二外壁24則與工作流體相離。因此因日照輻射在該散 熱器上聚集之熱量就不能通過導熱板20傳至其上之 LED100，從而起到保護該等LED100之作用。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 9 200918817 之等效修飾 熟悉本案技藝之人士，在爰依本發明精神所作 或變化’皆應涵❹以下之申請專利範圍内。 【圖式簡單說明】 圖1係發明帶有散熱裝置之發光二極體燈具中之散熱 裝置一優選實施例之立體組合圖。 ’”、 圖2係圖1中散熱裝置之立體分解圖。 圖3係圖2中散熱裝置之倒置視圖。 主要元件符號說明】 1 散熱器 10 底板 12 底面 120 頂面 122 散熱鰭片 14 導熱板 20 第一外壁 22 第二外壁 24 LED 100: The characteristics of early heat transfer of the heat conducting plate' The heat sink cannot transfer the heat from the outside to the 垓LED to achieve the effect of protecting the LED. [Embodiment] Referring to FIG. 1 to FIG. 3, a heat dissipating device in a light emitting diode lamp according to a preferred embodiment of the present invention is used for a plurality of LEDs (light emitting diodes) installed in the light emitting diode lamp (10) For heat dissipation, the light-emitting diode lamp 2 is used for professional lighting of outdoor lighting, and the work is performed under the relatively bad clothes, and the casing is sealed to protect the inside and the related components. A heat sink 1 〇 and a plurality of heat conducting plates 20 attached to the bottom surface of the heat sink 200918817. The LEDs 100 are mounted in a matrix arrangement and mounted on the heat conducting plates 20. The heat sink is formed of a metal material such as aluminum or copper having good thermal conductivity, and includes a rectangular bottom plate 12 and a plurality of heat radiating fins 14 extending vertically upward from the bottom plate 12. The bottom plate 12 has a bottom surface 120 facing the heat conducting plate 2 and a top surface 122 parallel to the bottom surface 12A. The heat dissipation fins 14 extend outward from the top surface 122 of the bottom plate 12 while exposing the outside of the housing of the edge light emitting diode lamp to dissipate heat from the LED 1 to the surrounding environment. The heat dissipation fins 14 can The heat sinking fins 14 are designed to have different shapes to maximize the heat exchange area of the heat sink 10. In the present embodiment, the heat sink fins 14 are equally spaced from each other and parallel to opposite side edges of the bottom plate 12. Each of the above ir hot plates 20 is made of a material having excellent thermal conductivity such as copper, and each of the heat conducting plates 20 is a rectangular flat plate-like phase change conducting member such as a plate type heat official having a conventional heat pipe casing (not labeled). And a working fluid in the inner cavity of the housing, the housing includes a first outer wall 22 and a second outer wall 24 facing the bottom surface 120 of the heat sink 10 and parallel to the first outer wall 22. The LEDs 100 are respectively mounted on the The second outer wall 24 and the bottom surface 120 of the heat sink 1 and the bottom plate 12 can be in close contact by welding or the like. The number of the heat conducting plates 20 is preferably four in the present embodiment. And are equally spaced on the bottom surface 120 of the heat sink 1 in a matrix arrangement. The heat conducting plates 20 are all special heat pipes having a one-way heat transfer function, that is, heat from the first outer wall of the heat conducting plate 20. When the second outer wall 24 passes the wheel, the thermal resistance of the heat conducting plate 20 is small to exhibit its high thermal conductivity, but when 8 200918817 heat is reversely transmitted from the second outer wall 24 of the heat conducting plate 20 to the first outer wall 22 The heat conducting plate 20 has a large thermal resistance and exhibits its thermal insulation. The unidirectional thermal conductivity of the heat conducting plate 20 is achieved by a specific configuration of the capillary structure disposed in the casing of the heat conducting plate 20, and the capillary structure in the casing may be a spiral groove with a large aperture, a copper mesh or a sintered layer disposed only on the corresponding inner wall of the first outer wall 22. When the heat conducting plate 20 is horizontally placed and the first outer wall 22 faces the ground, the working fluid is just enough to submerge the capillary on the inner surface of the first outer wall 22. Structurally, the working fluid acts as a heat carrier to transfer heat from the first outer wall 22 to the second outer wall 24. When the heat sink is in operation, the second outer wall 24 of the heat conducting plate 20 and the bottom surface of the bottom plate 12 of the heat sink 10 120 is in close contact. The heat generated by the LED 100 is directly absorbed by the heat conducting plate 20, and the heat conducting plate 20 conducts heat to the heat sink 10, and finally the heat radiating fins 14 on the heat sink 10 radiate heat to the surrounding air, thereby The effect of cooling the LED 100 is achieved. In addition, the user must be informed that when the light-emitting diode lamp of the present invention is placed outdoors and exposed to sunlight, the heat sink 10 should be secured. The bottom surface 120 of the plate 12 faces the ground. Thus, the capillary structure on the first outer wall 22 of the heat conducting plate 20 will be immersed in the working fluid, and the second outer wall 24 of the heat conducting plate 20 will be separated from the working fluid. The heat radiated on the heat sink cannot be transmitted to the LED 100 thereon through the heat conducting plate 20, thereby protecting the LEDs 100. In summary, the present invention complies with the invention patent requirements, and patents are filed according to law. However, the above description is only a preferred embodiment of the present invention, and those skilled in the art of the present invention are equivalent to the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a preferred embodiment of a heat dissipating device in a light emitting diode lamp with a heat sink. Fig. 2 is an exploded view of the heat sink in Fig. 1. Fig. 3 is an inverted view of the heat sink in Fig. 2. Main component symbol description 1 Heat sink 10 Base plate 12 Base surface 120 Top surface 122 Heat sink fins 14 Heat conducting plate 20 first outer wall 22 second outer wall 24 LED 100