200933871 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種可承载多個發光晶片的導線架，且特 別是有關於一種可阻止外界水氣滲入其内與發光晶片接觸之 導線架。 【先前技術】 近年來’由於發光一極體(Light Emitting Diode，LED)具 Ό 有體積短小以及單一熱量低的優勢，LED的相關應用越來越 多。目前LED的主流應甩在於電子產品的背光照明，例如： 手，、筆記型電腦以及電視。這些電子產品一般所需要的背 光是白光，白光LED的製作方式為目前LED產業的重要議 ，之一。目前而言，白光LED的製作方式大致可分為激發螢 光粉出光或是利用三原色LED(紅、藍、綠)混光。激發螢光 粉出光的方式大致可分為藍光LED搭配黃色螢光粉、藍光 LED搭配紅色及綠色螢光粉或是紫外光LED搭配三原色螢光 粉而言二RGB三色LED混光有著色彩飽和度較高以 ❹ 及發光紐較高的伽，目此普遍顧於碰電子產品中。 a 另外，，前在照明市場上，LED有逐漸取代傳統照明燈 具^勢’諸如車用頭燈、探照燈、以及室内照明等。由於 照明市場必須要有足夠的光強度，才能夠遠距離的辨識 詈。如目前市面上已逐漸開發有高亮度照明之發光裝 壯m圖一所示’即為為目前市面上既有之高亮度照明之發 鉻絡有高亮度發光能力的發光裝置1 ’不管是利 光方式或是聰三色LED混光方式，都需要 夕x、一極體12於導線架10上，在實際應用上可能 200933871 至Γΐ個或更多的發光二極體12，本處僅以設置複 發光一極體12加以說明之。因此，基座1〇2必須形成較 ^面積’讓多個發光二極體12得以同時排列於該基座· 使乡贿光二鋪12所紅之醜得以透過基座 進行雖傳遞’進祕其向外翻。*為了解決散熱問 故需於基座！〇2之底部貼合有一散熱構件14，以使熱量 传以透過基座102傳遞至散熱構件μ上。進而，透過散熱構 件14與空氣產生熱交換而達到快速散熱的效果。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame that can carry a plurality of light-emitting wafers, and more particularly to a lead frame that prevents external moisture from penetrating into contact with the light-emitting wafer. [Prior Art] In recent years, due to the advantages of short size and low heat of a Light Emitting Diode (LED), LED related applications are increasing. At present, the mainstream of LEDs lies in the backlighting of electronic products, such as: hands, notebook computers and televisions. The backlights that these electronic products generally require are white light, and the production method of white LEDs is one of the important discussions in the LED industry. At present, the production method of white LEDs can be roughly divided into excitation of phosphor powder or the use of three primary color LEDs (red, blue, green). The way to stimulate the fluorescent powder to light out can be roughly divided into blue LED with yellow fluorescent powder, blue LED with red and green fluorescent powder or ultraviolet LED with three primary color fluorescent powder. Two RGB three-color LED mixed with color saturation The higher the degree, the higher the gamma and the higher the luminescence, which is generally used in electronic products. a In addition, in the lighting market, LEDs have gradually replaced traditional lighting fixtures such as automotive headlights, searchlights, and indoor lighting. Since the lighting market must have sufficient light intensity, it can be identified from a distance. For example, the light-emitting device with high-brightness illumination has been gradually developed on the market. It is a light-emitting device that has high-brightness illumination capability for the high-intensity illumination that is currently available on the market. The method or the Chong three-color LED light mixing method requires an eve x and a polar body 12 on the lead frame 10. In practical applications, it may be 200933871 to one or more light-emitting diodes 12, which is only set by the place. The complex light-emitting body 12 will be described. Therefore, the pedestal 1 〇 2 must form a relatively large area 'to allow multiple illuminating diodes 12 to be simultaneously arranged on the pedestal. · The ugliness of the banquet of the banquet is carried out through the pedestal. Turn outwards. * In order to solve the heat dissipation problem, it needs to be on the pedestal! A heat dissipating member 14 is attached to the bottom of the crucible 2 so that heat is transmitted to the heat dissipating member 51 through the base 102. Further, heat is exchanged with the air through the heat radiating member 14 to achieve rapid heat dissipation.
❹ 但疋，承載多個發光二極體丨2的導線架1〇，為了提供 具有較大散熱面積之基座102，需將基座1〇2製成平板狀， 再於基座102上方成型有絕緣本體1〇〇，且基座1〇2之面積 大於絕緣本體100。而絕緣本體100於基座1〇2上成型時， 為了不致產生脫落，因此在基座102上設有複數個通孔 1024，使絕緣本體1〇〇能透過通孔1〇 接^基座脱為了與散熱構件14結合， 須叹置有鎖固孔1026，以使基座1〇2得以透過該鎖固元件 16(如圖—所示之螺絲)被鎖固於散熱構件14上。 如述結構’絕緣本體1〇〇僅透過通孔丨024與基座1〇2結 合。但絕緣本體100係以射出成型方式結合於基座1〇2上了 故其絕緣本體100與該基座102間形成有一水平之貼合面， 但由於絕緣本體100利用射出成型技術於基座102上成形 時，由於絕緣本體100與基座102係為兩種不同材質之材料 所構成’因此’絕緣本體1〇〇無法有效緊密的貼合於該基座 102上’故需透過通孔1024達到絕緣本體1〇〇與基座1〇2之 結合。 惟’由於該絕緣本體100以射出成形方式結合於該基座 102上時，因射出成形必須經過冷卻收縮的過程，因此容易 200933871 造成絕緣本體100的變形，造成絕緣本體1〇〇與基座1〇2間 之貼合面無法密合地相接觸，而於絕緣本體100與該基座 10^間之貼合面產生縫隙，致使水氣夾帶於空氣中，經由該 未岔合之貼合面所產生之缝隙進入絕緣本體100與基座102 =產生之1§晶區域中，而產生水氣渗人的問題，造成固晶區 域内部之發光二極體12的損壞。再者，基座1〇2係透過鎖固 元件16與散熱構件14結合，因此，在鎖固的過程中，亦容 Ο ❹ 上，，鎖固力道不平均造成基座脱的輕曲變形使絕緣本 ，100與基座102間產生缝隙，或是增大其縫隙，造成水氣 =的，形加劇’嚴重影響發光裝置i之效能，更容易造成 發光一極體12的失效，而縮短其使用壽命。 J是，如何提供一種具有絕佳散熱效果，且能有效防止 進而延長翻壽命之高亮度發光裝置專用之導線 条，即為本發明中所欲解決之問題。 【發明内容】 有1姿㈣在於提供—種具有絕佳雜效果，且能 用之導線^紅，進崎長朗壽命之高亮度發光裝置專 之導Ιίΐίίί亦根據本發明之第-具體實施例，本發明 ίίϊί 絕緣本體以及支架。基座包含上端面 有-义 7 200933871 以、過該第Γ表面與該第二表面所形成之高低落差， 達ij有效阻止水氣渗入發光裝置之效果。 一 *包本;=具面進-間皆有-高度差。第三表面設於第—表面及第二表H兩之 含第；本具;2::ίί;= ❹ ❹ 第三表面與第四表面相鄰地設於第 :以’根據上$多個具體實施例，本發明之導線架之基 ίϊϋ之ΐ形成有局度落差的多個表面，以使絕緣本體與該 成有更為獅之接觸_，令其水氣從絕緣本體鱼 ίί^ΐ隙滲人後’除可延長水氣滲人路徑之長度亦ΐ ;„向’以增加水氣滲入之困難度，進而ί: 峨嶋™發光二極 精射靖^㈣詳述及所 【實施方式】 本發蚊導線社要細於具有高亮度照明的發光裝置 上’因=需承載多數個發光晶片，其可承·十個或一百個 =導晶㈣総碰、極體或其 相較於先前技術之導線架10(如圖一所示），本發明之 線架之基座包含翅之間具有高度差的表面以阻止水氣渗入 8 200933871 發光裝置内。如圖二B中的導線架2〇所示，基座2〇2之上 端面2020包含第一表面20200以及低於第一表面2〇2⑻之第 二表面20202 ’致使該第-表面2〇2〇〇與該第二表面簾2 形成有-高低落差。另外’需截說_是，為了讓所 施例都能具有明確的高度及正負方向定義，因此將基座之第 -表面定A為-高度參考面，且將基座之下端面定義低於第 一表面0 當夾帶於空氣中的水氣經由絕緣本體2〇〇盥基座2〇2之 __滲人到第二表面聊2後，水氣之权路徑會遇到 由具有T%度差的相近表面所形成的轉折處，轉折處可阻擔水 氣的滲入甚至讓水氣反向流動。並且’水氣需克服該高度差 才能滲入到第一表面20200，相對地延長了水氣欲盥發光二 極體4接觸所需滲入的路徑長度。再者，由第'一 _與該第二表面2_間形成有一高度落差 ^本體200成型於該基座202上時，其絕緣本體2〇〇會將該 咼低落差處填滿，並包覆於第一表面2〇2〇〇之周圍，而八詨 絕緣本體200與該第一表面20200之周緣形成較佳的緊密 合效果，進而避免水氣渗人第-表面2_巾。進 ❹ 0把導線架2G達到阻擋外界水氣滲人S1晶區域2G2G4鱼發光 二極體4接觸的目的。 "^ 再者，基座之上端面可包含更多之間具有高度差的表 面，如圖三A中的導線架21及圖四中的導線架22所示。相 較於圖二B中的基座202,圖三A及圖三的基座212之 上端面2120進一步包含第三表面212〇4，第三表面212〇4皆 高於第一表面21200及第二表面21202。相較於圖三A中的 基座212，圖四中的基座222之上端面2220進一步包含第四 表面22206，第四表面皆低於第一表面222〇〇及第二表面 22202。藉此，絕緣本體及基座之間的接觸面具有更多能阻擔 200933871 水氣滲入的轉折處，且相對地延長了水氣從外界到固晶區域 的參入路經。另外，絕緣本體藉由填滿多個轉折處(亦即，高 低落差處)更能緊密地貼合於基座，以阻止外界水氣滲入導線 架内。 、/ ''' ❹ 〇 另外，如圖一 D所示的導線架20之基板202與絕緣本 體202之尺寸大致相同，因此絕緣本體2〇〇及基座2〇2(如圖 一 C所示）皆需開一鎖固孔，讓螺絲可鎖入該鎖固孔，將導 架20鎖固於散熱構件5上(如圖二D所示）。但是，本發明之 導線架不限於此，如圖五所示之導線架23之基座232之尺 小於絕緣本體230，因此只需在絕緣本體23〇上開一鎖 孔，螺絲可不穿過基板232而鎖入散熱構件。由於絕緣本 能吸收部份鎖固力道，且基板232並未直接受力(未被螺 絲牙過），所以導線架23被鎖固於散熱構件5上時，基板2幻 J不容易趣屈變形’進而不會產生或加大絕緣本體23。 232之間的縫隙，更能阻止水氣渗入導線架a内。 、音於射出成型的絕緣本體會冷卻收縮或是基座受鎖固力 ίίΪΪΐ形，而在基座與絕緣本體之間產生_。若絕、ί 將絕緣本體與基座緊統相接合，除了間接地 =者t °可以在基座上設置多個通孔，如圓二Β及圖力 設ίΞί ίί俩孔2024的基座2G2，還可以在基座四; 240山如圖六A及圖六B所示之基座242。絕緣本許 基座242之ΐΐ時填滿凹槽期，進*增加絕緣本體240鱼 42之間的縱向接合力(如圖六Α所示之箭頭方向）。- 材粗水氣渗人的目的之外，本發明的導線架於妹槿月 材枓方面运可有其他的變化以更㈣散發或導引發光; 200933871 所ΐ生的熱里。當然，下述之導線架之基座仍然包含之間具 有高度差的多個表面以達到阻止水氣滲入的主要目的。/ 為了快速地散去尚亮度照明發光裝置所產生的熱量，導 線架之基座可使用導熱係數較高的材料製成。一般而言，基 座之材料為鋁或銅，導線架的基座理論上全部用導熱係數較 ，的銅製成即可，但是銅的成本較鋁昂貴。因此，實際作法 是把兩個不同材料製成的部份組合為基座，如圖五Α及圖五 上之基座252所示’基座252包含第一子基座Μ2。及第二子 ❹ 。第—子基座252G之材料為銅，第二子基座2522 ，材料為!S。尺寸較小且_之第—子基座252G用以承載多 =發光二鋪’以快速導去熱量。尺寸較大且雜之第二子 二，2522可容納第-子基座252〇，除了幫助散去第一子基 座2520傳導來的熱量之外，面積較大的第二子基座助 與賴構件的熱絲量峨雜去熱量。進而，基座 252兼顧了散熱速率及製造成本的要求。 除了上述_高導熱係數材料的方法之外，還可以 一曰大散熱®躺方法增加雜辭，如^ Α至目八 〇 ^ 的導線架％之基座262包含散熱板2似，散 ^ 2624軸地向外突出於絕緣本體26〇。舉例而言 熱板2624⑽突出於絕緣本體260兩側，圖六^中 =熱板2624向外突出於絕緣本體26()四周、突出工 =0 ^^2624除了可增加散熱面積之外，多個導= 曰可以互相連接各自的散熱板】24以乎均分散埶 量，避免熱量過於集中。J刀散熱 加散熱速率的方法還可如圖九所示之基座272 犬出於絕緣本體270之下綾。卑舳梂丛 < 扣人^ 112 272突出部分的内凹空間，、士，、、，件6包3相配於基座 進而增加基座272與散熱構件6 200933871 接觸面積以增加^^熱 基座也可轉—_匈皱_；^突Hi限於此， 途上另2如本有其他變化以適用於不同用 以及外觀呈現:、ίϊ 3方ϊ、與發光二極體的連接方式 有高戶罢的然，述之導線架之基座仍然包含之間且 有间度差的多個表面以達到阻止水氣滲人的主要目的間/、 〇 ❹ :導線架與電路的連接方式上，圖二Β令 之支架204埋入於絕緣本體2〇 、·查垃 ==二極體4電性連接之外内只§出了:= 透過接線紐連接讀料電路， = =。當然，支架找置方料限於此，社f可mm 、兄’ Ϊ tA至針C所示。視電路域支細實際焊接情 ，，犬出於絕緣本體且與電路板相連接之第二連部 曲以利於雜。舉例來說，若_架28 i入於電 ϋ線所f )之__ ’蝴十A及針B所示，支ί 連接部2842可保持平直以貼近電路板。若導線Ϊ =直接置放於電路板(虛線所示)上，如圖十、；^ =842需折彎以貼近魏板。藉此，過錫爐時，電^ 的錫膏可輕易地黏附於第二連接部2842。 於導線架之支架與發光二極體的連接方式上，二A 巧成陣列的其中-列發光二極體4為例，如圖二示的 之第—連接部_只電性連接至該列發光二極體4 中最罪近第一連接部2040的發光二極體4 /其他發光二極體 4之間只以接線互相電性連接。若該列發光二極體*其中之 一發光二極體4損壞失效，該列發光二極體4皆無法發光。 因此，如圖十一所示之支架294包含多個第一連接部294〇， 每個第一連接部2940皆與第二連接部2942相連接。每一個 12 200933871 第一連接部2940係一長條狀’可電性連接一列發光二極體7 中每一個發光二極體7，因此該列其中一個發光二極體7損 壞失效，不會影響到其他發光二極體7運作。 、 Ο❹ However, the lead frame 1 carrying the plurality of LEDs 2, in order to provide the susceptor 102 having a large heat dissipation area, the pedestal 1 〇 2 is formed into a flat shape, and then formed over the pedestal 102 There is an insulating body 1 〇〇, and the area of the pedestal 1 〇 2 is larger than the insulating body 100. When the insulative housing 100 is formed on the base 1〇2, a plurality of through holes 1024 are formed in the base 102 so that the insulative housing 1 can pass through the through hole 1 and be removed from the base. In order to be combined with the heat dissipating member 14, a locking hole 1026 is required to be slid so that the pedestal 1 〇 2 can be locked to the heat dissipating member 14 through the locking member 16 (screw as shown). The structure 'insulating body 1' is joined to the susceptor 1 〇 2 only through the through hole 丨 024. However, the insulative housing 100 is bonded to the base 1 2 by injection molding, so that a horizontal bonding surface is formed between the insulative housing 100 and the base 102. However, the insulative housing 100 is formed on the base 102 by injection molding. In the case of the upper forming, the insulating body 100 and the pedestal 102 are made of two different materials. Therefore, the insulating body 1 〇〇 cannot be effectively and closely attached to the pedestal 102. The insulating body 1〇〇 is combined with the base 1〇2. However, since the insulating body 100 is bonded to the susceptor 102 by injection molding, the injection molding must undergo a process of cooling and shrinking, so that the deformation of the insulating body 100 is easily caused by 200933871, resulting in the insulating body 1 and the pedestal 1 The bonding surfaces of the two sides are in intimate contact with each other, and a gap is formed between the insulative body 100 and the bonding surface of the base 10, so that moisture is entrained in the air, and the unbonded bonding surface is passed through the unbonded bonding surface. The resulting gap enters the insulating body 100 and the pedestal 102 = generated § crystal region, causing water and gas infiltration problems, causing damage to the light-emitting diode 12 inside the solid crystal region. Furthermore, the pedestal 1 〇 2 is coupled to the heat dissipating member 14 through the locking member 16 , so that during the locking process, the locking force also causes uneven deformation of the pedestal. Insulation, a gap is formed between 100 and the susceptor 102, or the gap is increased, causing the water vapor=, the shape is intensified, which seriously affects the performance of the illuminating device i, and is more likely to cause the failure of the illuminating body 12, and shortens its Service life. J is how to provide a wire strip for a high-intensity light-emitting device which has an excellent heat-dissipating effect and can effectively prevent the life of the turn-on, which is a problem to be solved in the present invention. SUMMARY OF THE INVENTION There is a posture (4) in which a high-intensity light-emitting device having excellent miscellaneous effects and capable of using a wire, which can be used for a long life, is also provided. 第 ΐ ί ί 亦 亦 亦 亦 亦 亦 亦 亦 亦 亦 亦 亦, the invention ίίϊί insulation body and bracket. The pedestal includes an upper end surface having a height difference formed by the surface of the second cymbal and the second surface, and the ij effectively prevents the moisture from penetrating into the illuminating device. A * package; = face-in-between - height difference. The third surface is disposed on the first surface and the second surface H; the present device; 2:: ίί;= ❹ ❹ the third surface is adjacent to the fourth surface and is disposed at the first: In a specific embodiment, the base of the lead frame of the present invention forms a plurality of surfaces having a partial drop so that the insulating body is in contact with the lion, so that the water vapor is from the insulating body. After the gap is infiltrated, the length of the water infiltration can be extended. „To 'to increase the difficulty of infiltration of water and gas, and then :: 峨嶋TM illuminating two-pole fine Jing Jing ^ (4) details and implementation Mode] The Mosquito wire company should be finer on the illuminating device with high-brightness illumination. 'Because it needs to carry a large number of illuminating wafers, it can bear ten or one hundred = guiding crystal (four) bump, polar body or its phase Compared with the lead frame 10 of the prior art (as shown in FIG. 1), the base of the wire frame of the present invention includes a surface having a height difference between the wings to prevent moisture from penetrating into the light-emitting device of the 200933871. The lead frame 2020 of the pedestal 2 〇 2 includes a first surface 20200 and a second lower than the first surface 2 〇 2 (8). The face 20202' causes the first surface 2〇2〇〇 to form a height difference with the second surface curtain 2. In addition, it is necessary to say that in order to allow the embodiment to have a clear height and a positive and negative direction definition, Therefore, the first surface of the pedestal is defined as a-height reference surface, and the lower end surface of the pedestal is defined to be lower than the first surface 0. When water entrained in the air passes through the insulating body 2, the pedestal 2 〇 2 After __ infiltrating the second surface, the water-gas path will encounter a turning point formed by a similar surface with a difference in T%. The turning point can prevent the infiltration of moisture and even the water vapor. To flow, and 'the water gas needs to overcome the height difference to penetrate into the first surface 20200, relatively prolonging the length of the path required for the contact of the water-emitting diode 4 to contact. Further, by the first one and When the second surface 2_ is formed with a height difference, when the body 200 is formed on the base 202, the insulating body 2〇〇 fills the low drop and covers the first surface 2〇2〇. Around the crucible, the gossip insulator body 200 and the periphery of the first surface 20200 form a better compact effect In order to avoid the infiltration of water and gas into the first surface 2_ towel. Into the 0 lead wire frame 2G to block the outside water and gas infiltration of the S1 crystal region 2G2G4 fish light emitting diode 4 contact. The upper end face may include more surfaces having a height difference therebetween, as shown in the lead frame 21 in FIG. 3A and the lead frame 22 in FIG. 4. Compared to the pedestal 202 in FIG. 2B, FIG. The upper end surface 2120 of the pedestal 212 of FIG. 3 further includes a third surface 212〇4, and the third surface 212〇4 is higher than the first surface 21200 and the second surface 21202. Compared to the pedestal 212 in FIG. The upper end surface 2220 of the base 222 in FIG. 4 further includes a fourth surface 22206, and the fourth surface is lower than the first surface 222 and the second surface 22202. Thereby, the contact surface between the insulating body and the pedestal has more turning points which can resist the penetration of water and gas into the 200933871, and relatively extend the incorporation of water and gas from the outside to the solid crystal region. In addition, the insulating body can be more closely attached to the pedestal by filling a plurality of turning points (i.e., at a high and low drop) to prevent outside moisture from penetrating into the lead frame. In addition, the substrate 202 of the lead frame 20 shown in FIG. 1D is substantially the same size as the insulative housing 202, and thus the insulative housing 2 and the base 2〇2 are shown in FIG. ) A locking hole is required to allow the screw to lock into the locking hole, and the guide frame 20 is locked on the heat dissipating member 5 (as shown in FIG. 2D). However, the lead frame of the present invention is not limited thereto, and the base 232 of the lead frame 23 shown in FIG. 5 is smaller than the insulating body 230, so that only a locking hole is required in the insulating body 23〇, and the screw can not pass through the substrate. 232 and locked into the heat dissipating member. Since the insulating instinct absorbs part of the locking force, and the substrate 232 is not directly stressed (not screwed), when the lead frame 23 is locked on the heat dissipating member 5, the substrate 2 is not easily deformed. The insulating body 23 is not produced or enlarged. The gap between the 232 is more able to prevent moisture from seeping into the lead frame a. The insulating body that is formed by the injection will cool or shrink or the base is locked, and a _ is generated between the base and the insulating body. If the IGBT is tightly coupled to the pedestal, in addition to indirectly = t °, a plurality of through holes may be provided on the pedestal, such as a circle 2 Β and a base 2G2 of the hole 2024. It can also be used on the base 4; 240 is the base 242 shown in Figure 6A and Figure 6B. Insulation is required. When the base 242 is filled, the groove period is filled, and the longitudinal joint force between the insulating body 240 and the fish 42 is increased (in the direction of the arrow shown in Fig. 6). - In addition to the purpose of infiltrating the material, the lead frame of the present invention may have other changes in the aspect of the moon 枓 以 以 散 散 散 散 散 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 Of course, the base of the lead frame described below still contains a plurality of surfaces having a height difference therebetween to achieve the primary purpose of preventing moisture from penetrating. / In order to quickly dissipate the heat generated by the illuminating device, the base of the wire frame can be made of a material with a high thermal conductivity. In general, the material of the base is aluminum or copper, and the base of the lead frame is theoretically all made of copper having a higher thermal conductivity, but the cost of copper is more expensive than aluminum. Therefore, the actual practice is to combine the two parts made of different materials into a pedestal, as shown in Figure 5 and the pedestal 252 on Figure 5. The pedestal 252 includes a first sub-base Μ2. And the second child. The material of the first sub-base 252G is copper, and the second sub-base 2522 is made of !S. The smaller-sized sub-base 252G is used to carry multiple = light-emitting two-slides to quickly conduct heat. The second sub-two, 2522 can accommodate the second sub-base 252, in addition to helping to dissipate the heat transferred from the first sub-base 2520, the second sub-base with a larger area assists The amount of hot wire of the Lai component is noisy and de-heating. Further, the susceptor 252 takes into consideration the requirements of the heat dissipation rate and the manufacturing cost. In addition to the above method of high thermal conductivity material, it is also possible to increase the vocabulary by a large heat dissipation method. For example, the pedestal 262 of the lead frame of the 导线 Α 目 包含 包含 包含 包含 包含 包含 包含 26 26 The shaft protrudes outward from the insulating body 26〇. For example, the hot plate 2624 (10) protrudes from the two sides of the insulating body 260, and the heat plate 2624 protrudes outward from the insulating body 26 (), and the protrusion is 0^^2624, in addition to increasing the heat dissipation area, Guide = 曰 can be connected to each other's heat sinks] 24 to disperse the amount of heat, to avoid excessive concentration of heat. The method of heat dissipation of the J knife and the method of dissipating the heat dissipation rate may also be as shown in FIG. Despicable plexus < buttoning ^ 112 272 protruding part of the concave space,,,,,,, 6, 6 pieces of 3 mated to the base to increase the contact area of the base 272 and the heat dissipating member 6 200933871 to increase the ^ ^ thermal base Block can also be transferred - _ Hungary wrinkle _; ^ sudden Hi is limited to this, on the way another 2 as there are other changes to apply to different uses and appearance:, ϊ ϊ 3 square ϊ, and the connection with the light-emitting diode has a high However, the base of the lead frame still contains a plurality of surfaces between and with a degree of difference to prevent the main purpose of water and gas infiltration, 〇❹: the way the lead frame is connected to the circuit, The bracket 204 of the second command is buried in the insulating body 2〇··查拉== diode 4 is electrically connected only § out:= Connect the reading circuit through the wiring button, ==. Of course, the bracket to find the material is limited to this, the social f can mm, the brother ' Ϊ tA to the needle C. Depending on the actual soldering condition of the circuit domain, the dog is connected to the circuit board and connected to the circuit board to facilitate the miscellaneous. For example, if the frame 28i is inserted into the __' butterfly 10A and the needle B of the electric wire, the support portion 2842 can be kept straight to be close to the circuit board. If the wire Ϊ = directly placed on the circuit board (shown in dashed lines), as shown in Figure 10, ^ = 842 need to bend to close to the Wei board. Thereby, when the tin furnace is passed, the solder paste of the electric material can be easily adhered to the second connecting portion 2842. In the connection mode of the lead frame of the lead frame and the light emitting diode, the two-in-one array of the middle-row light-emitting diode 4 is taken as an example, and the first connection portion shown in FIG. 2 is electrically connected to the column. The light-emitting diodes 4 / the other light-emitting diodes 4 of the light-emitting diode 4 which are closest to the first connecting portion 2040 are electrically connected to each other only by wires. If one of the light-emitting diodes 4 of the column of light-emitting diodes 4 fails, the column of light-emitting diodes 4 cannot emit light. Therefore, the bracket 294 shown in FIG. 11 includes a plurality of first connecting portions 294, and each of the first connecting portions 2940 is connected to the second connecting portion 2942. Each of the 12 200933871 first connecting portions 2940 is a strip-shaped electrically connected to each of the light-emitting diodes 7 of the column of light-emitting diodes 7, so that one of the light-emitting diodes 7 in the column is damaged and does not affect. It works to other light-emitting diodes 7. Ο
於外觀呈現上，由於發光二極體的尺寸相較於一般燈管 或燈泡所需的發光元件小很多，因此承载發光二極體的導線 架可輕易地依實際應用或製造需求而改變外觀呈現，如圖+ 二及圖十三所示。圖十二中的基座3〇2呈:見圖^ 的基座312呈一橢圓形，且絕緣本體31〇呈一圓形。當然， 基座302、基座312以及絕緣本體310之外觀不限於此，還 可為三角形或其他多邊形。 需補充說明的是，上述多個實施例所描繪之基座盥支架 皆為分離，亦即，熱電分離式導線架。但是，本發明^導& 架不限於此’基座也可與其中一側的支架一體成形，即， 熱電共體式導線架。 古相，於先前技術，本發明之導線架之基座利用之間形成 有南度落差的多個表面，以使絕緣本體與該基座間形成有更 為複雜之接觸面積，令其水氣從絕緣本體與基座之間的縫隙 滲入後、’除可延長水氣滲入路徑之長度亦可改變水氣之流動 方向’以增加水氣滲人之困難度，進*有效避免水氣渗入到 與發光晶片接觸’以防止發光二極體失效或縮短其 使用哥〒。再者’本發明之導線架之基座除了設置通孔或凹 ϋΪ，射彻鎖固元件，以增加基座與絕緣本體之間的 接δ力’進而減小絕緣本體與基座之間的縫隙，因此可 ’本發明之導線架可具錢岐絕緣本體 ί ’本發明之導線架具有絕佳散熱效果，且能有 效防止水•人，轴延長高亮度發光裝置的使用壽命。 13 200933871 藉由以上較佳具體實_之詳述’係希望能更加清楚猫 述本發明之特徵與精神，而並非以上述所揭露的較佳具艘實 施例來對本發明之範疇加以限制。相反地，其目的是g望能 涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範 圍的範疇内。因此，本發明所申請之專利範圍的範疇應該根 據上述的說明作最寬廣的解釋，以致使其涵蓋所有可能的改 變以及具相等性的安排。 ❹ ΟIn appearance, since the size of the light-emitting diode is much smaller than that of a general lamp or a light bulb, the lead frame carrying the light-emitting diode can be easily changed according to actual application or manufacturing requirements. , as shown in Figure + 2 and Figure 13. The base 3 〇 2 in Fig. 12 is: the base 312 of Fig. 2 has an elliptical shape, and the insulating body 31 has a circular shape. Of course, the appearance of the base 302, the base 312, and the insulative housing 310 is not limited thereto, and may be a triangle or other polygon. It should be noted that the susceptor raft brackets depicted in the above various embodiments are all separated, that is, the thermoelectric separation type lead frame. However, the present invention is not limited to this. The pedestal can also be integrally formed with one of the brackets, i.e., the thermoelectric type lead frame. In the prior art, in the prior art, a plurality of surfaces having a south degree difference are formed between the bases of the lead frame of the present invention, so that a more complicated contact area is formed between the insulating body and the base, so that the water vapor is from After the gap between the insulating body and the pedestal penetrates, 'except for extending the length of the water gas infiltration path can also change the flow direction of the water gas' to increase the difficulty of water and gas infiltration, and effectively prevent moisture from seeping into and The illuminating wafer contacts 'to prevent the illuminating diode from failing or shortening its use. Furthermore, the pedestal of the lead frame of the present invention is provided with a through hole or a recess, and the locking element is struck to increase the connection force between the pedestal and the insulating body to further reduce the relationship between the insulating body and the pedestal. The slit can be used as the lead frame of the present invention. The lead frame of the present invention has excellent heat dissipation effect and can effectively prevent the water and the human body from extending the service life of the high-intensity light-emitting device. The present invention is not limited by the above-described preferred embodiments, and is not intended to limit the scope of the invention. On the contrary, it is intended to cover various modifications and equivalents within the scope of the invention as claimed. Therefore, the scope of the patented scope of the invention should be construed as broadly construed in the light of the above description, so that it covers all possible modifications and equivalent arrangements. ❹ Ο
14 ^33871 【圖式簡單說明】 圖係繪不先前技術之導線架之示意圖。 意圖。係'、會不根據本發明第一具體實施例之導線架之示 田IB鱗示圓二A中的導線架沿A_A線之剖面圖。 圖-C鱗示圖二八中的基座與支架之示意圖。 圖- £) v 圖。 係、會不圖二A中的導線架與散熱片貼合之示意14 ^33871 [Simple description of the diagram] The diagram shows a schematic diagram of the lead frame of the prior art. intention. A section of the lead frame which is not in accordance with the first embodiment of the present invention. The field IB scale shows a cross-sectional view of the lead frame in the circle AA along the line A_A. Figure-C is a schematic view of the base and the bracket in Figure 28. Figure - £) v diagram. The schematic diagram of the lead frame and the heat sink in Fig. 2A
I 意圖IA鱗示根據本發明第二具體實施例之導線架之示 圖B係繪不圖三八中的基座之示意圖。 圖。珍不根據本發明第三具體實施例之導線架之示意 圖。係'綠不根據本發明第四具體實施例之導線架之示意 意圖。 人、示根據本發明第五具體實施例之導線架之示 、B係纷示圖六A中的基座之示意圖。 圖七A彳> 意圖。 、、、示根據本發明第六具體實施例之導線架之示I intends that the IA scale shows the lead frame according to the second embodiment of the present invention. Fig. B is a schematic view of the susceptor in Fig. 38. Figure. A schematic diagram of a lead frame according to a third embodiment of the present invention is shown. The outline of the green lead is not according to the fourth embodiment of the present invention. A diagram showing a lead frame according to a fifth embodiment of the present invention, and a B diagram showing a susceptor in FIG. Figure 7A彳> Intent. And showing the lead frame according to the sixth embodiment of the present invention
圖七Β係繪干圍L /、圖七A中的第一子基座與第二子基座之示 15 200933871 意圖。 意圖圖八Α鱗示根據本發明第七具體實施例之導線架之示 圖八B係繪示對顧中的導線架之立體圖。 圖八CM縫示對應圖中的導線架之另—立體圖。 圖九錯示根據本發明第八具體實施例之導線架之示意 Ο 圖十A 意圖。 係繪示根據本發明第九具體實施例之導線架之示 圖十B係緣示圖十A中的導線架沿A_A線之剖面圖。 圖十C係赫圖+B之導線架包含折彎支架之示意圖。 ^圖十一係繪示根據本發明第十具體實施例之導線架之示 意圖。 ❹ 圖十二係繪示根據本發明第十一具體實施例之基座之示 意圖。 一圖十三係繪示根據本發明第十二具體實施例之導線架之 示意圖。 *·’ ' 【主要元件符號說明】 1:發光裝置 10、20、21、22、23、26、28 :導線架 100、200、230、240、260、270、280、310 :絕緣本體 200933871 20204 :固晶區域 2042、2842、2942 :第二連接部 20200、21200、22200 :第一表面 © 20202、21202、22202 :第二表面 102、202、212、222、 312 :基座 12、4、7 :發光二極體 16 :鎖固構件 2022 :下端面 1026:鎖固孔 ❹ 2424 :凹槽 2520 :第一子基座 21204 :第三表面 232 ' 242'252'262'272 ' 302、 14、5、6 :散熱構件 204、284、294 :支架 2020、2120、2220 :上端面 1024、2024 :通孔 2624 :散熱板 2522 :第二子基座 22206 :第四表面 2040、2940 :第一連接部 17Figure 7 is a diagram showing the first sub-base and the second sub-base in the dry circle L /, Figure 7A. 15 200933871 Intent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 8B is a perspective view of a lead frame according to a seventh embodiment of the present invention. Figure 8 CM shows another perspective view of the lead frame in the corresponding figure. Figure 9 is a schematic illustration of a lead frame according to an eighth embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 10B is a cross-sectional view of the lead frame taken along line A_A of FIG. Figure 10C is a schematic view of the lead frame of Herto + B including a bent bracket. Figure 11 is a schematic illustration of a lead frame in accordance with a tenth embodiment of the present invention.十二 Figure 12 is a schematic illustration of a pedestal in accordance with an eleventh embodiment of the present invention. Figure 13 is a schematic view showing a lead frame according to a twelfth embodiment of the present invention. *·' ' [Description of main component symbols] 1: Light-emitting device 10, 20, 21, 22, 23, 26, 28: lead frame 100, 200, 230, 240, 260, 270, 280, 310: Insulated body 200933871 20204 : solid crystal regions 2042, 2842, 2942: second connecting portions 20200, 21200, 22200: first surface © 20202, 21202, 22202: second surface 102, 202, 212, 222, 312: pedestals 12, 4, 7 Light-emitting diode 16 : locking member 2022 : lower end surface 1026 : locking hole ❹ 2424 : groove 2520 : first sub-base 21204 : third surface 232 ' 242 ' 252 ' 262 ' 272 ' 302, 14, 5, 6: heat dissipating members 204, 284, 294: brackets 2020, 2120, 2220: upper end faces 1024, 2024: through holes 2624: heat sink 2522: second sub base 22206: fourth surface 2040, 2940: first connection Department 17