JP2014112495A - Lighting device - Google Patents

Abstract

An illumination device capable of being thinned is provided.
A lighting device includes a rectangular plate-shaped fixing plate, a frame portion provided on a periphery of the fixing plate, a transmission plate that faces the fixing plate and is fitted to the frame portion. 30 and an LED chip 40 as a semiconductor light emitting device mounted directly on the fixed plate 10. A wiring pattern is formed on one surface of the fixed plate 10. A plurality of LED chips 40 are mounted on one surface of the fixing plate 10 on which the wiring pattern is formed. A heat radiating portion 11 is provided on the other surface of the fixing plate 10.
[Selection] Figure 2

Description

  The present invention relates to a lighting device including a fixed plate to which a semiconductor light emitting element is fixed.

  Compared to fluorescent lamps or incandescent lamps that have been used as light sources in the past, they are superior in terms of power saving and long life, and light emitting diodes are used as light sources in various fields as brightness increases.

  Such a light emitting diode includes a main body substrate on which a pair of terminal electrodes are formed, a light emitting element mounted at a substantially central portion of the main body board, a bonding wire for connecting the light emitting element and the terminal electrode portion, and a light emitting element sealed. A translucent resin body is provided. The light emitting diode can be conductively connected in a state where the terminal electrode is directly placed on a mounting substrate such as a mother board (see Patent Document 1).

JP 2011-82285 A

  However, when the light-emitting diode of Patent Document 1 is used in a lighting device, the light-emitting diode is mounted on a mounting board such as a mother board or a printed board, and the mounting board on which the light-emitting diode is mounted is attached to the lighting device using screws or the like. It was necessary to fix to a mounting plate or a fixing plate. Moreover, the connector for connecting an electric wire to a mounting board was required. Compared with the dimensions of the light emitting diodes (for example, height dimensions), the thickness of the mounting substrate, the dimensions of the fixing members such as screws, and the dimensions of the connectors are not negligible. It was not possible to plan.

  This invention is made | formed in view of such a situation, and it aims at providing the illuminating device which can achieve thickness reduction.

  A lighting device according to a first aspect of the present invention is a lighting device including a fixing plate to which a semiconductor light emitting element is fixed. The fixing plate has a wiring pattern formed on one surface and a heat radiation portion having a groove on the other surface. The semiconductor light emitting element is provided on the one surface, and the semiconductor light emitting element is formed on a substrate, a semiconductor light emitting layer formed on one surface of the substrate, and the semiconductor light emitting layer. And an electrode connected to the wiring pattern, wherein light is extracted from the other surface of the substrate.

  A lighting device according to a second invention is characterized in that, in the first invention, a sealing portion that is translucent and seals the semiconductor light emitting element is provided on the one surface of the fixing plate.

  A lighting device according to a third invention is characterized in that, in the first invention or the second invention, the fixing plate is made of a synthetic resin having high thermal conductivity.

  A lighting device according to a fourth invention is the lighting device according to any one of the first invention to the third invention, wherein the lighting device is fitted to the frame portion provided on the periphery of the fixing plate, and is fitted to the frame portion. And a transmission plate that transmits light.

  In the first invention, the fixing plate has a wiring pattern formed on one surface and a heat radiation portion having a groove on the other surface. A semiconductor light emitting element is provided on one surface of the fixing plate. The semiconductor light emitting element includes a substrate, a semiconductor light emitting layer formed on one surface of the substrate, and an electrode formed on one surface of the substrate and connected to the semiconductor light emitting layer. Prepare. Electrodes are connected to the wiring pattern, and light is extracted from the other surface of the substrate. That is, the semiconductor light emitting element is directly mounted on the one surface of the fixing plate having the wiring pattern formed on one surface and the heat radiation portion on the other surface. This eliminates the need for a mounting substrate for mounting the semiconductor light-emitting element, and also eliminates the need for parts such as screws for fixing the mounting substrate to the lighting device and connectors provided on the mounting substrate. The occupied dimension (height dimension) can be reduced, and the lighting device can be thinned. Further, the mounting process of the mounting board is not necessary, and the component cost and the manufacturing cost can be reduced.

  In the second invention, a sealing portion that is translucent and seals the semiconductor light emitting element is provided on one surface of the fixing plate. Since the sealing portion is formed on one surface of the fixing plate, the dimension (height dimension) of the light emitting portion including the semiconductor light emitting element and the sealing portion can be reduced, and the lighting device can be thinned. it can.

  In the third invention, the fixing plate is made of a highly heat conductive synthetic resin. Since the fixing plate has high thermal conductivity, the heat of the semiconductor light emitting element mounted on one surface of the fixing plate can be efficiently radiated to the outside through the heat radiating portion on the other surface of the fixing plate.

  According to the fourth aspect of the invention, a frame portion provided at the periphery of the fixed plate and a transmission plate that fits into the frame portion and transmits light from the semiconductor light emitting element are provided. Thereby, a thin illuminating device can be realized in which the fixed plate and the transmissive plate are opposed to each other and the periphery is surrounded by the frame portion.

  According to the present invention, a mounting substrate is not necessary, and a reduction in thickness can be achieved.

It is an external appearance perspective view which shows an example of a structure of the illuminating device of this Embodiment. It is principal part sectional drawing which shows an example of a structure of the illuminating device of this Embodiment. It is a principal part top view which shows an example of a fixed plate. It is sectional drawing which shows an example of a structure of the LED chip mounted in the fixed board.

  Hereinafter, the present invention will be described with reference to the drawings illustrating embodiments thereof. FIG. 1 is an external perspective view showing an example of the configuration of the lighting device 100 according to the present embodiment, FIG. 2 is a cross-sectional view of the main part showing an example of the configuration of the lighting device 100 according to the present embodiment, and FIG. 2 is a plan view of a principal part showing an example of a fixed plate 10. FIG. As shown in FIGS. 1 to 3, the lighting device 100 is a rectangular plate-shaped fixing plate 10, a frame portion 20 provided at the periphery of the fixing plate 10, and the fixing plate 10. And the LED chip 40 as a semiconductor light emitting device mounted directly on the fixed plate 10.

  Light from the LED chip 40 passes through the transmission plate 30 and is emitted to the outside. The transmission plate 30 may be transparent or translucent, and may have diffusibility for diffusing light. The transmission plate 30 serves as a light emitting surface of the lighting device 100. Moreover, the thickness of the illuminating device 100 can be made into the thickness (height dimension) of the frame part 20. FIG.

  The fixing plate 10 is made of a highly heat conductive synthetic resin. The fixed plate 10 has, for example, a thermal conductivity of about 2 W / m · K or more and 10 W / m · K or less as a high thermal conductivity, and has an insulating property. As the high thermal conductive synthetic resin, for example, a thermoplastic resin such as polyphenylene sulfide resin can be used. The thickness of the fixing plate 10 can be, for example, about 2 to 3 mm, but the thickness dimension is not limited to this, and is set to about 5 mm or 10 mm depending on the shape or size of the fixing plate 10. You can also.

  As shown in FIG. 3, a wiring pattern 15 is formed on one surface of the fixed plate 10. The wiring pattern 15 can be formed on the fixed plate 10 using, for example, a method such as screen printing. An appropriate method can be used as a method of forming the wiring pattern 15.

  A plurality of LED chips 40 are mounted on one surface of the fixing plate 10 on which the wiring pattern 15 is formed. A heat radiating portion 11 is provided on the other surface of the fixing plate 10. In addition, according to the mounting area | region of the LED chip 40, the thermal radiation part 11 may be provided in the whole surface of the fixing plate 10, or may be provided in a part of other surface of the fixing plate 10, for example.

  The heat dissipating part 11 includes a protruding heat dissipating fin 111 and a groove 112 formed between the heat dissipating fins 111. The shape of the groove 112 is, for example, an elongated rectangular shape in a plan view of the fixed plate 10, and is provided in a plurality of rows, and has, for example, a substantially U shape in a cross-sectional view of the fixed plate 10. The shape of the groove 112 is not limited to this, and for example, it may be formed in a lattice shape, and the cross-sectional shape may be a semicircular shape, a triangular shape, or the like.

  The frame portion 20 is provided around the fixed plate 10. The frame portion 20 may be integrally formed with the fixed plate 10 or may be a separate member from the fixed plate 10. The frame portion 20 includes a side portion 22 having an inclined surface inclined with respect to one surface of the fixed plate 10, a fitting portion 21 that fits the periphery of the transmission plate 30, and the like.

  On one surface of the fixing plate 10 (the mounting surface of the LED chip 40) and the inclined surface of the side portion 22, for example, a highly reflective member such as a highly reflective white resist is applied or pasted. Thereby, the light from the LED chip 40 can be efficiently reflected toward the transmission plate 30. Moreover, it is not necessary to fix the conventional reflector with screws or the like.

  FIG. 4 is a cross-sectional view showing an example of the configuration of the LED chip 40 mounted on the fixed plate 10. As shown in FIG. 4, the LED chip 40 includes a substrate 41, an n-type semiconductor layer 42, a p-type semiconductor layer 43, an electrode 44, an insulating layer 45, and the like. In FIG. 4, the heat radiating part 11 is omitted for the sake of simplicity. Further, in FIG. 4, the wiring connecting the n-type semiconductor layer 42 and the p-type semiconductor layer 43 and the electrode 44 is omitted for the sake of simplicity.

  The LED chip 40 includes, for example, a semiconductor light emitting layer (LED structure) in which an n-type semiconductor layer 42, an active layer (not shown), and a p-type semiconductor layer 43 are stacked on one surface 411 of a substrate 41 having a rectangular shape in plan view. It is. Further, on one surface 411 of the substrate 41, a pair of electrodes 44 are formed on both sides of the substrate 41 to be electrically connected to the wiring pattern 15 formed on the fixing plate 10 by soldering or the like. The one surface 411 side of the LED chip 40 is covered with an insulating layer 45 except for the surface of the electrode 44. The light emitted from the semiconductor light emitting layer is emitted mainly from the other surface 412 side of the substrate 41 to the outside.

  On one surface of the fixed plate 10, a sealing portion 60 that is translucent and seals the LED chip 40 is provided. The sealing part 60 may contain the fluorescent substance and does not need to contain it. When the phosphor is contained, for example, a yellow phosphor can be used. For example, the yellow phosphor absorbs light having a wavelength in the range of 450 nm to 480 nm and emits yellow light having a peak in the range of 540 nm to 600 nm (including yellow-green and orange close to yellow). Thereby, the white light source excellent in color rendering can be realized. The phosphor is not limited to the yellow phosphor, and may be other phosphors, and different phosphors can be used as appropriate in order to realize a required emission color. A desired emission color can be obtained by changing the material of the phosphor. Moreover, it is good also as a sealing part by providing the sheet | seat containing a fluorescent substance on the other surface 412 of the board | substrate 41 instead of providing the sealing part 60 containing a fluorescent substance. Moreover, the sheet | seat containing fluorescent substance can be provided in the surface of the sealing part 60, and it can also be set as the sealing part 60 including the said sheet | seat.

  In the LED chip 40, the electrode 44 and the wiring pattern 15 are electrically connected by solder 70. The thickness (height) of the LED chip 40 is, for example, about 200 μm, and the height of the sealing portion 60 is, for example, about 1 mm.

  As described above, in the lighting device 100 of the present embodiment, the fixing plate 10 has the wiring pattern 15 formed on one surface and the heat radiating portion 11 having the concave groove 112 formed on the other surface. The LED chip 40 is provided on one surface of the fixing plate 10. The LED chip 40 is formed on the substrate 41, the semiconductor light emitting layer (42, 43) formed on the one surface 411 of the substrate 41, and the one surface 411 of the substrate 41. And an electrode 44 connected to the semiconductor light emitting layer. The electrode 44 is connected to the wiring pattern 15, and light is extracted from the other surface 412 of the substrate 41. That is, the LED chip 40 is directly mounted on the one surface of the fixing plate 10 having the wiring pattern 15 formed on one surface and the heat radiating portion 11 on the other surface. This eliminates the need for a mounting board for mounting the LED chip 40, and also eliminates the need for parts such as screws for fixing the mounting board to the lighting device and connectors provided on the mounting board. The occupied dimension (for example, about 5 mm to 10 mm) can be reduced, and the lighting device can be reduced in thickness. Moreover, the mounting process of a mounting board becomes unnecessary, and component costs, such as a mounting board and a connector, and manufacturing cost can be reduced.

  Further, in the lighting device 100 of the present embodiment, the electrode 44 of the LED chip 40 is directly connected to the wiring pattern 15 with the solder 70 and does not use a bonding wire like a conventional LED chip. When the ambient temperature changes due to the difference in thermal expansion coefficient between the sealing resin and the sealing resin, no abnormality such as disconnection of the wire or peeling of the contact point of the wire occurs.

  Further, in the lighting device 100 of the present embodiment, since the LED chip 40 is directly mounted on one surface of the fixed plate 10, the mounting substrate on which the LED chip 40 is mounted is attached to the lighting device, the wiring is connected to the mounting substrate, In the case where a plurality of mounting boards are provided, there are no check items for quality assurance and places that cause failure, which are necessary in conventional lighting devices such as connection between mounting boards, and quality can be improved.

  Moreover, since the mounting board is unnecessary in the lighting device 100 of the present embodiment, there is no problem that the position of the LED chip 40 is conventionally restricted by restrictions such as the shape of the mounting board. It is possible to form a wiring pattern at any arbitrary position and set the position of the LED chip 40 relatively freely.

  Further, by using a high thermal conductive resin (high heat dissipation resin) as the material of the fixing plate 10, the lighting device body can be made insulative, and insulation performance can be ensured relatively easily. The fixing plate 10 may be made of a metal such as aluminum. In this case, what is necessary is just to apply | coat an insulating film to the surface which mounts LED chip 40 as needed.

  Moreover, in the illuminating device 100 of this Embodiment, the sealing part 60 which is translucent and seals the LED chip 40 is provided in one surface of the fixing plate 10. FIG. Since the sealing part 60 is formed on one surface of the fixed plate 10, the dimension (height dimension) of the light emitting part including the LED chip 40 and the sealing part 60 can be reduced, and the lighting device is ultra-thin. Can be achieved.

  Further, since the fixing plate 10 has high thermal conductivity, the heat of the LED chip 40 mounted on one surface of the fixing plate 10 can be efficiently radiated to the outside through the heat radiating portion 11 on the other surface of the fixing plate 10. it can.

  In addition, the illumination device 100 according to the present embodiment includes a frame portion 20 provided on the periphery of the fixed plate 10 and a transmission plate 30 that fits into the frame portion 20 and transmits light from the LED chip 40. As a result, it is possible to realize a thin illuminating device in which the fixed plate 10 and the transmission plate 30 are provided in a pair and the periphery is surrounded by the frame portion 20.

  The shape of the lighting device is not limited to that illustrated in FIG. The present embodiment can be applied to various types of illumination devices such as an embedded illumination device attached to an attachment hole such as a ceiling or a wall, a downlight, a device attached to a wall surface, and the like.

DESCRIPTION OF SYMBOLS 10 Fixing plate 11 Heat radiation part 15 Wiring pattern 20 Frame part 30 Transmission board 40 LED chip 41 Substrate 42 N-type semiconductor layer 43 P-type semiconductor layer 44 Electrode 60 Sealing part

Claims (4)

A lighting device comprising a fixed plate to which a semiconductor light emitting element is fixed,
The fixing plate is
A wiring pattern is formed on one side,
A heat dissipation part having a groove on the other surface is formed,
The semiconductor light emitting element is provided on the one surface,
The semiconductor light emitting device is
A substrate,
A semiconductor light emitting layer formed on one surface of the substrate;
An electrode formed on one surface of the substrate and connected to the semiconductor light emitting layer,
The electrode is connected to the wiring pattern;
An illumination device, wherein light is extracted from the other surface of the substrate.   The lighting device according to claim 1, wherein a sealing portion that is translucent and seals the semiconductor light emitting element is provided on the one surface of the fixing plate. The fixing plate is
The lighting device according to claim 1 or 2, wherein the lighting device is made of a highly heat-conductive synthetic resin. A frame provided on the periphery of the fixed plate;
The lighting device according to claim 1, further comprising: a transmission plate that fits into the frame portion and transmits light from the semiconductor light emitting element.

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