CN203300702U - Light-emitting module and lighting equipment - Google Patents

Abstract

The utility model relates to a light-emitting module and lighting equipment. The light-emitting module according to an embodiment is formed by layering a metal reflective layer on a substrate containing a polyimide layer, and mounting a light-emitting element to the reflective layer through a eutectic solder. The utility model provides the light-emitting module which can maintain light-emission strength and the lighting equipment provided with the light-emitting module.

Description

Light emitting module and lighting equipment

technical field

Embodiments of the present invention relate to a light emitting module (module) in which a plurality of light emitting elements are arranged and installed on a substrate, and a lighting device in which the light emitting module is incorporated. the

Background technique

In recent years, a light-emitting module in which a plurality of light-emitting elements (such as light-emitting diodes (Light Emitting Diode, LED)) are arranged and mounted on a substrate has been developed, and lighting equipment incorporating such a light-emitting module has gradually become popular. the

A light-emitting module includes, for example: a substrate with an insulating layer on the surface; a metal reflective layer partially laminated on the surface of the substrate (that is, the surface of the insulating layer); a plurality of LED chips mounted on the reflective layer; and a sealing member , the reflective layers and the plurality of LED chips are sealed on the surface of the substrate and have light transmission. the

For example, the insulating layer on the surface of the substrate is formed by reacting an epoxy (epoxy) resin with a curing agent. A plurality of reflective layers are individually provided for each LED chip, or one is provided for the entire mounting area of a plurality of LED chips, and a silver-plated layer is provided on the surface. The plurality of LEDs are blue LEDs emitting blue light. The sealing member is formed by mixing a phosphor into a gas-permeable silicone resin, and the phosphor is excited by blue light to emit yellow light having a complementary color relationship. the

Prior art literature

Patent Documents

Patent Document 1: Japanese Patent Laid-Open No. 2008-277561

Utility model content

The problem solved by the invention

In the above-mentioned conventional light-emitting module, part of the blue light emitted from the LED chip is incident on the surface of the insulating layer on which no reflective layer is provided. In addition, the curing agent of the epoxy resin is decomposed and vaporized by the blue light. Furthermore, the organic gas passes through the sealing member and reacts with the silver on the surface of the reflective layer. the

As a result, the surface of the reflective layer becomes black over time, and the reflectance of light decreases over time. This phenomenon will continue until the gas is no longer evolved from the insulating layer. the

Therefore, it is desired to develop a light-emitting module capable of maintaining luminous intensity for a long period of time and a lighting device incorporating such a light-emitting module. the

means of solving problems

The light-emitting module according to the embodiment is formed by laminating a metal reflective layer on a substrate including a polyimide layer, and mounting a light-emitting element on the reflective layer via eutectic solder. the

A light-emitting module according to an embodiment includes: a substrate including a polyimide layer; a metallic reflective layer laminated on the substrate; and a light-emitting element mounted on the reflective layer via eutectic solder. the

In some embodiments, the reflective layer is made of silver. the

In some implementations, the light-emitting element is flip-chip mounted on the reflective layer via the eutectic solder. the

The lighting device of the embodiment includes the light emitting module of the above embodiment. the

The effect of utility models

According to the present invention, it is possible to provide a light-emitting module capable of maintaining luminous intensity for a long period of time and a lighting device incorporating such a light-emitting module. the

Description of drawings

Fig. 1 is an external perspective view showing an LED lamp according to an embodiment. the

Fig. 2 is a cross-sectional view of the LED lamp of Fig. 1 cut along the axis. the

Fig. 3 is a plan view of a light emitting module incorporated in the LED lamp of Fig. 1 viewed from a light derivation side. the

Fig. 4 is a plan view showing a module substrate of the light emitting module of Fig. 3 . the

Fig. 5 is a cross-sectional view of the light-emitting module in Fig. 3 cut along the line F5-F5. the

Fig. 6 is a partially enlarged cross-sectional view of a main part of a light emitting module according to another embodiment. the

Reference signs:

1: Lighting module

5: Module substrate

5a: Incision part

6: base plate

7: Insulation layer

11: reflective layer

11': wiring layer

12, 13: power supply conductor

14, 15: power supply terminal

21: Light emitting element

21a, 34: Component electrodes

22: eutectic solder

23: Bonding wire

24: End bonding wire

25: frame components

25a: Hole for sealing

26: Photoresist layer

28: sealing member

30: Lighting module

32: LED chip

36: Semiconductor light-emitting layer

100: LED lights

102: Ontology

103: Module fixed table

103a: Surface

104: Cover installation convex part

105: concave part

106: threading hole

106a: Ditch

107: cooling fins

111: insulating member

111a: bottom wall

112: Insulation convex part

114: through hole

115: lamp holder

116: base

117: Lamp body

118: eyelet terminal

121: lighting device

122: circuit substrate

123: circuit parts

124: Connecting components

161: Lighting cover

162: cover ring

A: Basal layer

B: middle layer

C: surface layer

F5: line

Detailed ways

Hereinafter, the embodiment will be described in detail with reference to the drawings. the

In FIG. 1 , an external view of an LED lamp 100 is shown as an example of a lighting device incorporating a light emitting module according to an embodiment. Moreover, in FIG. 2, the cross-sectional view which cut|disconnected the LED lamp 100 of FIG. 1 along the axis|shaft is shown. the

The LED lamp 100 includes a main body 102 , an insulating member 111 , a base 115 , a lighting device 121 , a light emitting module 1 , and a lighting cover (cover) 161 . the

The LED lamp 100 is attached, for example, by screwing the base 115 to a socket (not shown) attached to the ceiling with the lighting cover 161 facing downward. That is, in FIG. 1 and FIG. 2, the LED lamp 100 is illustrated in a state upside down from the mounted state. the

The body 102 is formed of aluminum with relatively high thermal conductivity. As shown in FIG. 2 , a module fixing platform 103 for installing the light emitting module 1 is provided on the upper end of the main body 102 as shown in the figure. Furthermore, around the module fixing table 103, an annular cover mounting protrusion 104 is integrally protruded from the upper end of the main body. the

Furthermore, a recessed portion 105 is provided on the lower end side of the main body 102 in the drawing, which is dented toward the upper side in the drawing. Furthermore, a threading hole 106 extending along the axial direction is formed inside the main body 102 . The upper end of the threading hole 106 in the drawing opens on the upper surface of the body 102 , and the lower end of the threading hole 106 in the drawing opens on the bottom surface of the recess 105 . Further, a groove portion 106a formed in a laterally curved manner is provided continuously to the upper end of the threading hole 6 and along the back surface of the module fixing table 103 . the

Furthermore, a plurality of heat dissipation fins (fins) 107 are integrally formed on the outer periphery of the main body 102 . As shown in FIG. 1 , the plurality of cooling fins 107 are curved and extended toward the upper end of the body 102 and spread outward. The plurality of cooling fins 107 are provided to dissipate the heat generated from the light emitting module 1 to the outside of the LED lamp 100 . the

The insulating member 111 is formed in a bottomed cylindrical shape as shown in cross section in FIG. 2 . Further, the insulating member 111 integrally has an annular insulating convex portion 112 protruding from the outer peripheral surface at the middle portion in the height direction thereof. The insulating member 111 is accommodated in the recess 105 such that the bottom wall 111 a contacts the bottom of the recess 105 and the insulating protrusion 112 is engaged with the edge of the opening of the recess 105 . That is, the outer surface of the insulating member 111 is in close contact with the inner surface of the concave portion 105 . the

A portion of the insulating member 111 that is closer to the lower side in the drawing than the insulating protrusion 112 protrudes to the lower side in the drawing than the lower end of the main body 102 in the drawing. In other words, only a portion of the insulating member 111 that is higher than the insulating convex portion 112 in the figure is inserted into the concave portion 105 of the body 102 . Moreover, a through hole 114 is provided on the bottom wall 111 a of the insulating member 111 , and the through hole 114 is used to communicate the lower end of the wiring hole 6 in the drawing with the interior of the insulating member 111 . the

The base 115 has a structure in which a base body 117 and an eyelet terminal 118 are attached to a substantially disk-shaped base 116 formed of an insulating material, as shown in FIG. 2 . The base 115 of this embodiment is an E26 type base. The base 115 is attached to cover the lower portion of the insulating member 111 so that the base 116 closes the opening of the insulating member 111 . A spiral groove is formed on the lamp base body 117, and the spiral groove is screwed into a lamp socket on the power supply side not shown. the

The lighting device 121 is accommodated inside the insulating member 111 as shown in FIG. 2 . The lighting device 121 is formed by mounting circuit components 123 such as a transformer (transformer), a capacitor (condenser), and a transistor (transistor) on a circuit board 122 . The lighting device 121 is electrically connected to the lamp head 115 . The connection member 124 for the electrical connection is illustrated in FIG. 2 . The connecting member 124 electrically connects the eye terminal 118 and the circuit board 122 . the

Furthermore, the lighting device 121 is electrically connected to the light-emitting module 1 described later via an insulated-coated wire (not shown) passed through the wire hole 6 (groove portion 106 a ). Furthermore, the lighting device 121 supplies DC power to the light emitting module 1 via the base 115 . the

The lighting cover 161 is formed in a substantially hemispherical shape as shown in FIG. 1 . The lighting cover 161 is formed of translucent synthetic resin. As shown in FIG. 2 , the lighting cover 161 is fitted and attached to a cover mounting protrusion 104 protruding from the upper end of the main body 102 in the drawing so as to cover the light emitting side of the light emitting module 1 . That is, the light emitted from the light emitting module 1 is used as illumination light via the illumination cover 161 . the

The cover attachment protrusion 104 on the main body 102 side has L-shaped attachment grooves (not shown) at a plurality of locations along the circumferential direction thereof. On the other hand, on the outer periphery of the fitting portion of the lighting cover 161 , a plurality of locking protrusions (not shown) are respectively provided at positions corresponding to the plurality of attachment grooves of the cover attachment protrusion 104 . the

That is, the lighting cover 161 is mounted on the main body 102 by hooking its locking protrusions on the mounting grooves of the cover mounting protrusions 104 . Furthermore, on the edge of the lighting cover 161, as shown in FIGS. 1 and 2, a cover ring 162 for covering the mounting groove and the locking protrusion is provided. the

Hereinafter, the light emitting module 1 of the first embodiment will be described in detail with reference to FIGS. 3 to 5 . the

Shown in FIG. 3 is a plan view of the light-emitting module 1 viewed from the light-extracting side (hereinafter referred to as the surface side), a plan view of the module substrate 5 of the light-emitting module 1 is shown in FIG. The cross-sectional view of the light-emitting module 1 cut by the line F5-F5. The light emitting module 1 has a chip on board (COB) structure. the

The light emitting module 1 of this embodiment includes a module substrate 5 ( FIG. 4 ), a light emitting element 21 , a bonding wire 23 , an end bonding wire 24 , a frame member 25 , and a sealing member 28 . On the surface of the module substrate 5, there are a metal reflective layer 11, a power supply conductor 12 on the positive side, and a power supply conductor 13 on the negative side; Surface; bonding wires 23 are used to connect the plurality of light emitting elements 21 in series in each row; end bonding wires 24 are used to supply power to the plurality of light emitting elements 21 in each row; frame member 25 surrounds the sealing area; sealing member 28 The sealing hole 25 a of the frame member 25 is filled. the

The module substrate 5 is formed in a substantially quadrangular shape, for example, as shown in FIG. 4 . For example, the module substrate 5 preferably has a metal base substrate to improve the heat dissipation of each light emitting element 21 . As shown in FIG. 5 , the module substrate 5 of the present embodiment has a structure in which an insulating layer 7 thinner than the base plate 6 is laminated on the surface of the base plate 6 made of metal. the

The base plate 6 is formed of, for example, aluminum or an aluminum alloy. The insulating layer 7 is formed of electrically insulating polyimide. As the insulating layer 7 made of polyimide, for example, UPILEX-S (trade name), Kapton (trade name), Apical (trade name), or the like can be used. the

The insulating layer 7 made of polyimide does not contain phenol-based resin or amine-based resin as contained in the curing agent of epoxy resin, so even if there is incident light from the light-emitting element 21, almost There are no decomposed components gasified by photolysis. Moreover, the insulating layer 7 made of polyimide is also excellent in heat resistance (500 degreeC or more). Furthermore, this insulating layer 7 constitutes a mounting surface of the module substrate 5 . the

As the module substrate 5 , for example, a single-layer polyimide substrate made of polyimide, a metal base substrate in which a polyimide layer is laminated on a metal plate other than aluminum, or the like can be used. In any case, it is sufficient that the surface layer of the module substrate 5 constituting the mounting surface of the light emitting element 21 is formed of polyimide. the

As shown in FIG. 5 , the module substrate 5 is fixed in close contact with the surface 103 a of the module fixing table 103 . Therefore, the module substrate 5 has four cutouts 5 a for mounting on the module fixing table 103 . That is, the module substrate 5 is mounted in close contact with the main body 102 by passing four unillustrated screws through the four notches 5 a and screwing them into unillustrated screw holes of the module fixing table 103 . the

The module fixing table 103 is made of metal, and is fixed in close contact with the upper surface of the main body 102 as described above. Therefore, when the plurality of light emitting elements 21 of the light emitting module 1 are turned on and the light emitting module 1 generates heat, the heat is transferred to the main body 102 via the module fixing table 103 . the

The reflective layer 11 , the power supply conductor 12 , and the power supply conductor 13 are all patterned on the surface of the insulating layer 7 of the module substrate 5 . As shown in FIG. 4 , the reflective layer 11 occupies the central portion of the insulating layer 7 and is arranged in a quadrangular shape, and the power supply conductor 12 and the power supply conductor 13 are respectively arranged in the vicinity of the reflective layer 11, for example, sandwiching the reflective layer 11. Both sides of the reflective layer 11 in the length direction. In other words, between the reflective layer 11 and the power supply conductors 12 and 13 on both sides thereof, elongated gaps (gap) exposing the surface of the insulating layer 7 are respectively formed. the

Thus, when the reflective layer 11 is single, the power supply conductor 12 and the power supply conductor 13 are provided on both sides so as to sandwich the reflective layer 11 . Moreover, when there are multiple reflective layers 11, the power supply conductor 12 and the power supply conductor 13 are provided on both sides so as to sandwich these reflective layer groups. That is, the reflective layer 11 may be provided separately corresponding to each light emitting element 21 . The reflective layers 11 , the power supply conductors 12 , and the power supply conductors 13 preferably have a metal surface portion, and the metal surface portion has a higher reflectance than the insulating layer 7 . the

Thereby, the power supply conductor 12 and the power supply conductor 13 can be formed at the same time as the reflective layer 11, and the power supply conductor 12 and the power supply conductor 13 can also reflect light similarly to the reflective layer 11, so that the sealing area relative to the sealing member 28 can be ensured. The occupied area of the reflective portion made of metal (ie, the reflective layer 11 , the power supply conductor 12 , and the power supply conductor 13 ) is larger, so that the beam maintenance ratio can be further improved. the

Moreover, two power supply terminals 14 and 15 are also patterned on the surface of the insulating layer 7 . One power supply terminal 14 is connected to the power supply conductor 12 on the positive electrode side via a conductive member (not shown), and the other power supply terminal 15 is connected to the power supply conductor 13 on the negative electrode side via a conductive member (not shown). Furthermore, the power supply terminal 14 and the power supply terminal 15 are connected to the circuit board 122 of the lighting device 121 via an insulated-coated electric wire not shown. the

That is, the unillustrated insulated and coated wires connecting the light-emitting module 1 and the lighting device 121 extend from the power supply terminal 14 and the power supply terminal 15 of the light-emitting module 1, pass through the threading hole 106 through the groove portion 106a, and are connected to the lighting device. The circuit substrate 122 of the device 121 . Furthermore, the reflective layer 11 , the power supply conductor 12 , the power supply conductor 13 , and the power supply terminal 14 and the power supply terminal 15 are formed simultaneously. the

The reflective layer 11 , the power supply conductor 12 , the power supply conductor 13 , the power supply terminal 14 , and the power supply terminal 15 provided on the surface of the insulating layer 7 are all formed into a three-layer structure of a base layer A, an intermediate layer B, and a surface layer C. The base layer A is formed by bonding and bonding Cu (copper) to the entire surface of the insulating layer 7 of the module substrate 5 , and then removing excess portions by etching. Also, the intermediate layer B is provided by plating Ni (nickel) on the surface of the base layer A. As shown in FIG. Furthermore, the surface layer C is provided by electrolessly plating Ag (silver) on the surface of the intermediate layer B. As shown in FIG. the

In this way, the surface layer C is formed by electroless plating, thereby simplifying the manufacturing steps of the light emitting module 1 and reducing the manufacturing cost (cost). In contrast, when the surface C is formed by electroplating, plating leads must be provided on the surface C of the reflective layer 11, the surface C of the power supply conductor 12, the surface C of the power supply conductor 13, and the surface C of the power supply terminal 14 and the power supply terminal 15, respectively. Therefore, the plating pattern will become complicated, and a step of removing the leads after plating is required, so that the steps become complicated. In the case of electroless plating, such plating leads are not required. the

In this way, since the surface layer C is formed by Ag, the light reflectance of the reflective layer 11 , the power supply conductor 12 , and the power supply conductor 13 will be higher than that of the insulating layer 7 . The total light reflectance of the surface layer C formed of silver is, for example, 90.0%. As the material of the surface layer C having a higher light reflectance than the insulating layer 7, there are gold, nickel, aluminum, etc. other than Ag. Furthermore, the reflective layer 11 is not limited to the above-mentioned three-layer structure, and can also be formed by a single layer of metal having a higher light reflectance than the insulating layer 7 . the

Furthermore, it is preferable that the line roughness Ra of at least the surface of the reflective layer 11 among the reflective layer 11 , the power supply conductor 12 , the power supply conductor 13 , and the power supply terminal 14 and the power supply terminal 15 is 0.2 or less. In this way, by making the line roughness Ra of the surface of the reflective layer 11 small, the unevenness of the surface can be reduced, and the surface area of the reflective layer 11 exposed to the organic gas described later can be reduced. Thereby, the phenomenon that the surface of the reflective layer 11 becomes black can be suppressed, and the fall of reflectance can be suppressed. the

A plurality of light emitting elements 21 are arranged on the surface of the reflective layer 11 . The light emitting element 21 of the present embodiment is a bare chip of an LED (Light Emitting Diode). The bare chip is, for example, a chip formed into a substantially rectangular parallelepiped by dicing a semiconductor wafer (wafer) on which a nitride is formed on a semiconductor substrate such as sapphire (sapphire). Compound semiconductors (such as gallium nitride compound semiconductors). the

Furthermore, this bare chip is a single-sided electrode type chip having two element electrodes 21 a on the upper surface thereof as shown in FIG. 3 . The size of each element electrode 21a of the light emitting element 21 thus formed is 0.5 mm in length and 0.25 mm in width. For each light emitting element 21, for example, a light emitting element 21 including an LED emitting blue light is used so that the light emitting part emits white light. the

The light emitting element 21 emits light by passing a forward current through the p-n junction portion of the semiconductor. That is, the light emitting element 21 directly converts electrical energy into light. Therefore, compared with an incandescent light bulb in which a filament (filament) is incandescent at a high temperature by energization and radiates visible light using its thermal radiation, the light emitting element 21 has an energy-saving effect. the

As shown in FIG. 5, each light-emitting element 21 uses eutectic solder 22 to bond and fix the back surface of its semiconductor substrate on the surface layer C of the reflective layer 11. The eutectic solder 22 is typically an Au-based solder, and for example, an Au (gold)—Sn (tin)-based eutectic solder may also be used. The eutectic temperature of this Au—Sn-based eutectic solder 22 is about 320° C. the

These light emitting elements 21 are mounted on the module substrate 5 in a vertical and horizontal array as shown in FIG. 3 . That is, the first to third light emitting element rows are formed by a plurality of light emitting elements 21 arranged to extend in the longitudinal direction of the reflective layer 11 . the

In each light emitting element row, the element electrodes of two light emitting elements 21 adjacent to each other in the direction in which the row extends are of different polarities, that is, the element electrode 21a on the positive side of one light emitting element 21 and the other light emitting element 21 The element electrode 21a on the negative electrode side is connected by a bonding wire 23 made of Au thin wire. Thereby, a plurality (four) of light emitting elements 21 included in each light emitting element row are electrically connected in series. Therefore, the light-emitting elements 21 in one row emit light together in the energized state. the

Since the end bonding wires 24 for connecting the light-emitting elements 21 at both ends of each column to the power supply conductors 12 and 13 are also fine metal wires made of Au, heat transfer is difficult. Therefore, the heat of the light emitting elements 21 at both ends of each column is less likely to move (escape) to the power supply conductor 12 and the power supply conductor 13 along the end bonding wire 24 . Thereby, the temperature distribution of each part of the reflective layer 11 can be made uniform, and the temperature difference of the some light emitting element 21 mounted on the reflective layer 11 can be suppressed. the

Furthermore, as described above, the light emitting elements 21 of each column are connected in parallel to the power supply conductor 12 and the power supply conductor 13 via the end bonding wires 24 . Therefore, even if the light-emitting elements 21 in any one of the first to third light-emitting element rows sometimes fail to emit light due to reasons such as poor bonding, the light-emitting module 1 as a whole does not fail to emit light. the

The frame member 25 is, for example, a member formed of synthetic resin into a rectangular frame shape, and is bonded and fixed to the surface of the module substrate 5 . The frame member 25 has a rectangular sealing hole 25 a of a size surrounding all the light emitting elements 21 . This sealing hole 25 a surrounds the entire reflective layer 11 and a part of the power supply conductor 12 and the power supply conductor 13 . That is, the sealing hole 25 a defines the size of a sealing region filled with a sealing member 28 described later. the

More specifically, as shown in FIG. 3, the sealing hole 25a has a size that surrounds all the light emitting elements 21, all the bonding wires 23, and all the end bonding wires 24, and as shown in FIG. 5, the thickness of the frame member 25, that is, The depth of the sealing hole 25 a is set to a value at which all the constituent elements (light emitting element 21 , bonding wire 23 , and end bonding wire 24 ) can be buried by the sealing member 28 . In addition, the size of the sealing area of the filling sealing member 28 corresponds to the opening area of the sealing hole 25a (hereinafter, this area is referred to as the sealing area). the

As shown in FIG. 3 , a photoresist layer 26 covering the surface of the module substrate 5 and a photoresist layer 26 are provided at positions sandwiching the reflective layer 11 up and down in the figure. The photoresist layers 26 each have holes for exposing the power supply terminals 14, 15, and the like to the outside, for example. the

The sealing member 28 is filled in the sealing hole 25 a to bury the reflective layer 11 , the power supply conductor 12 , the power supply conductor 13 , the plurality of light emitting elements 21 , the plurality of bonding wires 23 , and the plurality of end bonding wires 24 . The sealing member 28 is made of an air-permeable light-transmitting synthetic resin, for example, a transparent silicone resin. In addition, the sealing member 28 is inject|poured predetermined amount into the hole 25a for sealing in the uncured state, and is heat-cured after that. the

A suitable amount of phosphor (not shown) is mixed in the sealing member 28 . The phosphor is excited by light emitted from the light emitting element 21 to emit light of a color different from that of the light emitted from the light emitting element 21 . In this embodiment, the light-emitting element 21 is an LED chip that emits blue light. Therefore, a yellow phosphor is used as the phosphor to emit white light as the light-emitting module 1. The yellow phosphor emits a complementary color to the blue light. yellow line of light. Since the phosphor of the sealing member 28 mixed with the phosphor emits light in this way, the entire sealing member 28 filling the sealing hole 25 a functions as a light emitting part of the light emitting module 1 . the

When the light-emitting module 1 with the above-mentioned structure is installed in the LED lamp 100 and energized through the lighting device 121, the plurality of light-emitting elements 21 covered by the sealing member 28 emit blue light at the same time, and the yellow phosphor mixed in the sealing member 28 is excited. And emit yellow light. That is, the sealing member 28 functions as a planar light source that emits white light that is a mixture of blue light and yellow light. the

At this time, the reflective layer 11 functions as a heat spreader that diffuses the heat emitted by the plurality of light emitting elements 21, and also reflects light toward the module substrate 5 among the lights emitted by the light emitting elements 21. reflector to function. Moreover, the power supply conductor 12 and the power supply conductor 13 located in the sealing area also function as a heat sink similarly to the reflection layer 11, and also function as a reflection mirror. the

That is, the heat from each light-emitting element 21 is dissipated to the outside of the LED lamp 100 through the reflective layer 11, the module substrate 5, the module fixing table 103, the upper surface of the body 102, and the heat dissipation fins 107. In addition, the light reflected by the reflective layer 11 and the light reflected by the power supply conductor 12 and the power supply conductor 13 after being diffused by the sealing member 28 are used as illumination via the lighting cover 161 together with the main light emitted directly from the sealing member 28. Light. the

As shown in FIG. 3 , the reflective layer 11 , the power supply conductor 12 , and the power supply conductor 13 are provided so as to cover substantially the entire surface area of the sealing region 25 a (sealing area). In this way, by increasing the proportion of the metal layer that reflects light (the reflective layer 11 , the power supply conductor 12 , and the power supply conductor 13 ), the reflectance of light can be increased, thereby improving the luminous efficiency of the light emitting module 1 . the

On the contrary, compared with these metal layers (reflective layer 11, power supply conductor 12, power supply conductor 13), the position exposed on the surface of the insulating layer 7 without reflective layer 11 and power supply conductor 12, power supply conductor 13 Reflectivity is low. In other words, part of the light emitted from the light emitting element 21 enters the exposed portion of the insulating layer 7 . The light-emitting element 21 of this embodiment is an LED chip that emits blue light, so the blue light mainly enters the exposed portion of the insulating layer 7 . the

When the insulating layer 7 of the module substrate 5 is formed of epoxy resin as before, the phenolic resin contained in the curing agent is decomposed and vaporized by blue light. However, since the insulating layer 7 of the present embodiment is formed of polyimide, there is almost no organic gas generated by photolysis even when blue light is incident. the

Therefore, according to this embodiment, there is almost no case where the organic gas generated from the insulating layer 7 permeates the sealing member 28 and reacts with the silver on the surface layer C of the reflective layer 11, the power supply conductor 12, and the power supply conductor 13, and there is no need to worry about this. The surface of these metal layers (reflective layer 11, supply conductor 12, supply conductor 13) turns black over time. Therefore, according to the present embodiment, it is possible to provide the light emitting module 1 capable of maintaining sufficient light emission intensity for a long period of time. the

Furthermore, since the insulating layer 7 made of polyimide is an organic material excellent in heat resistance, the plurality of light emitting elements 21 can be connected to the reflective layer 11 using the eutectic solder 22 . As described above, the insulating layer 7 made of polyimide has a heat resistance temperature exceeding 500°C. Furthermore, the eutectic temperature of the eutectic solder 22 is about 320°C. Therefore, even if the light emitting element 21 is mounted on the module substrate 5 using the eutectic solder 22 , the properties of the insulating layer 7 do not change. the

In this way, when a plurality of light emitting elements 21 are mounted using eutectic solder 22 , heat generated from light emitting elements 21 can be well transferred to module substrate 5 , and heat dissipation of light emitting elements 21 can be improved. Thereby, the light output of the light emitting module 1 can be increased, so that a high output light emitting module 1 can be provided. the

FIG. 6 shows a partially enlarged cross-sectional view showing the structure of a main part of a light emitting module 30 according to the second embodiment. The light emitting module 30 is formed by mounting an element electrode 34 of an LED chip 32 (light emitting element) on the wiring layer 11' in a flip chip manner. the

The wiring layer 11 ′ is formed by patterning the reflective layer 11 , and functions as wiring for feeding power to the LED chip 32 . In addition, in this case, the semiconductor light-emitting layer 36 of the LED chip 32 is located on the side of the module substrate 5 (insulation layer 7 ), and the light emitted by the semiconductor light-emitting layer 36 is not only from the top (here, refers to the element electrode 34 formed thereon). The side is the opposite side), and it will also be released from the side. the

Except for this, the light emitting module 30 of the second embodiment has substantially the same structure as the light emitting module 1 of the first embodiment described above. Therefore, here, the same reference numerals are assigned to the constituent elements that function in the same way as those of the light emitting module 1 of the first embodiment, and detailed description thereof will be omitted. the

In the manufacturing process of the light emitting module 30 , a plurality of LED chips 32 are mounted on the module substrate 5 using the eutectic solder 22 . At this time, the module substrate 5 on which the eutectic solder 22 is applied and on which the chip is mounted is placed in a furnace (not shown), and heated to the eutectic temperature. Thereby, the eutectic solder 22 is melted, and the element electrode 34 is bonded to the wiring layer 11'. the

As described above, according to the present embodiment, in addition to achieving the same effects as those of the first embodiment described above, by using the module substrate 5 having the polyimide layer 7 on the surface, it can be realized by the eutectic solder 22 The flip-chip mounting of the LED chip 32 can further improve the thermal conductivity of the LED chip 32 relative to the module substrate 5, thereby improving the reliability of mounting. the

The above-mentioned embodiments are merely examples, and are not intended to limit the scope of the invention. This embodiment can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. This embodiment or its modifications are included in the scope or spirit of the invention, and are also included in the invention disclosed in the claims and its equivalent scope. the

Claims (4)

1. a light emitting module, is characterized in that, comprising:

Substrate, it comprises polyimide layer;

Metal reflector, lamination is on described substrate; And

Light-emitting component, be installed on via eutectic solder on described reflector.

2. light emitting module according to claim 1, is characterized in that,

Described reflector is the reflector of silvery.

3. light emitting module according to claim 1 and 2, is characterized in that, described light-emitting component is installed on described reflector with flip chip via described eutectic solder.

4. a lighting apparatus, is characterized in that, comprises arbitrary described light emitting module in claims 1 to 3.

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