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TW200937123A - Resist material and laminate - Google Patents

Resist material and laminate Download PDF

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Publication number
TW200937123A
TW200937123A TW098101387A TW98101387A TW200937123A TW 200937123 A TW200937123 A TW 200937123A TW 098101387 A TW098101387 A TW 098101387A TW 98101387 A TW98101387 A TW 98101387A TW 200937123 A TW200937123 A TW 200937123A
Authority
TW
Taiwan
Prior art keywords
group
polymer
resist material
organic group
double bond
Prior art date
Application number
TW098101387A
Other languages
English (en)
Chinese (zh)
Other versions
TWI337690B (ja
Inventor
Shigeru Nakamura
Takashi Nishimura
Shuuji Kage
Yoshitaka Kunihiro
Takashi Watanabe
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200937123A publication Critical patent/TW200937123A/zh
Application granted granted Critical
Publication of TWI337690B publication Critical patent/TWI337690B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Silicon Polymers (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW098101387A 2008-01-15 2009-01-15 Resist material and laminate TW200937123A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008005662 2008-01-15
JP2008265272 2008-10-14
JP2008265271 2008-10-14

Publications (2)

Publication Number Publication Date
TW200937123A true TW200937123A (en) 2009-09-01
TWI337690B TWI337690B (ja) 2011-02-21

Family

ID=40885259

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098101387A TW200937123A (en) 2008-01-15 2009-01-15 Resist material and laminate

Country Status (3)

Country Link
JP (1) JP4392464B2 (ja)
TW (1) TW200937123A (ja)
WO (1) WO2009090867A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8722755B2 (en) 2012-03-16 2014-05-13 Chi Mei Corporation Photosensitive resin composition and uses thereof
CN110333647A (zh) * 2019-07-03 2019-10-15 北京波米科技有限公司 一种正型感光性树脂组合物
TWI876017B (zh) * 2020-03-31 2025-03-11 日商日鐵化學材料股份有限公司 感光性樹脂組成物、其硬化物及包含所述硬化物的顯示裝置

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5581614B2 (ja) * 2008-07-31 2014-09-03 Ｊｓｒ株式会社 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子
WO2011013709A1 (ja) * 2009-07-31 2011-02-03 Jsr株式会社 発光素子、発光素子の製造方法及び発光素子保護層形成用組成物
WO2011018907A1 (ja) * 2009-08-10 2011-02-17 積水化学工業株式会社 感光性組成物及びソルダーレジスト組成物
JP2011100974A (ja) * 2009-10-09 2011-05-19 Jsr Corp 発光素子及び発光素子保護層形成用組成物
JP2011100975A (ja) * 2009-10-09 2011-05-19 Jsr Corp 発光素子、発光素子の製造方法、及び発光素子保護層形成用組成物
WO2011062053A1 (ja) * 2009-11-17 2011-05-26 株式会社タムラ製作所 難燃性ソルダーレジスト組成物及びそれを用いて得られるフレキシブル配線板
JP5673562B2 (ja) * 2010-01-28 2015-02-18 Jsr株式会社 半導体発光素子の製造方法、半導体発光素子及び半導体発光素子の製造方法に用いられる感光性組成物
US8616732B2 (en) 2010-02-12 2013-12-31 Toshiba Lighting & Technology Corporation Light-emitting device and illumination device
JP6061440B2 (ja) * 2010-02-25 2017-01-18 太陽ホールディングス株式会社 ポリエステル基材用樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5820568B2 (ja) * 2010-03-31 2015-11-24 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
KR101807641B1 (ko) * 2010-04-14 2017-12-11 도레이 카부시키가이샤 네거티브형 감광성 수지 조성물, 그것을 사용한 보호막 및 터치 패널 부재
JP5719613B2 (ja) * 2011-01-27 2015-05-20 セイコーインスツル株式会社 光デバイス、発光デバイス、及び傾斜機能材の製造方法
JP5729329B2 (ja) * 2011-03-31 2015-06-03 Jsr株式会社 感放射線性組成物、並びに硬化膜及びその形成方法
TWI553409B (zh) * 2011-08-31 2016-10-11 旭化成電子材料股份有限公司 Hardened
JP5828292B2 (ja) * 2011-11-25 2015-12-02 信越化学工業株式会社 酸無水物基含有オルガノシロキサン及びその製造方法
JP2013033282A (ja) * 2012-10-26 2013-02-14 Taiyo Holdings Co Ltd 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5450763B2 (ja) * 2012-10-26 2014-03-26 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
US9651865B2 (en) 2013-02-14 2017-05-16 Toray Industries, Inc. Negative-type photosensitive coloring composition, cured film, light-shielding pattern for touch panel, and touch panel manufacturing method
JP6456632B2 (ja) * 2013-09-05 2019-01-23 三洋化成工業株式会社 感光性樹脂組成物
JP5876862B2 (ja) * 2013-12-03 2016-03-02 太陽ホールディングス株式会社 ポリエステル基材用樹脂組成物、それを用いたドライフィルム及びプリント配線板
KR101845081B1 (ko) * 2014-11-28 2018-04-04 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
KR101758438B1 (ko) * 2014-12-02 2017-07-17 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
KR101908163B1 (ko) 2014-12-03 2018-10-16 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
JP6002203B2 (ja) * 2014-12-10 2016-10-05 互応化学工業株式会社 ソルダーレジスト用樹脂組成物及びプリント配線板
KR101835866B1 (ko) 2014-12-17 2018-03-08 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
KR101835867B1 (ko) 2014-12-23 2018-03-08 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
JP6438298B2 (ja) * 2014-12-25 2018-12-12 株式会社カネカ 新規感光性樹脂組成物とその応用
WO2017057543A1 (ja) * 2015-09-30 2017-04-06 東レ株式会社 感光性樹脂組成物、硬化膜、タッチパネル及びタッチパネルの製造方法
JP6688875B2 (ja) * 2016-03-14 2020-04-28 富士フイルム株式会社 組成物、膜、硬化膜、光学センサおよび膜の製造方法
JP2018151628A (ja) * 2017-03-10 2018-09-27 日本化薬株式会社 感光性樹脂組成物、その硬化物及び物品
JP7147197B2 (ja) * 2018-03-16 2022-10-05 大日本印刷株式会社 配線基板および配線基板の製造方法
US11294284B2 (en) * 2018-07-17 2022-04-05 Shin-Etsu Chemical Co., Ltd. Photosensitive resin composition and pattern forming process
JP2021071661A (ja) * 2019-10-31 2021-05-06 株式会社カネカ 感光性組成物、ならびに着色パターンおよびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56136816A (en) * 1980-03-31 1981-10-26 Shin Etsu Chem Co Ltd Epoxy resin composition
JP4110401B2 (ja) * 2003-06-13 2008-07-02 信越化学工業株式会社 感光性シリコーン樹脂組成物及びその硬化物並びにネガ型微細パターンの形成方法
JP4630032B2 (ja) * 2004-10-04 2011-02-09 東レ・ダウコーニング株式会社 ポリオルガノシロキサン及びそれを含む硬化性シリコーン組成物並びにその用途
JP2006213763A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用の樹脂組成物、発光部品及び該発光部品を用いた表示機器
JP4711208B2 (ja) * 2006-03-17 2011-06-29 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。
KR20090014176A (ko) * 2006-04-26 2009-02-06 세키스이가가쿠 고교가부시키가이샤 광 반도체용 열경화성 조성물, 광 반도체 소자용 다이본드재, 광 반도체 소자용 언더필재, 광 반도체 소자용밀봉제 및 광 반도체 소자

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8722755B2 (en) 2012-03-16 2014-05-13 Chi Mei Corporation Photosensitive resin composition and uses thereof
CN110333647A (zh) * 2019-07-03 2019-10-15 北京波米科技有限公司 一种正型感光性树脂组合物
CN110333647B (zh) * 2019-07-03 2023-04-14 波米科技有限公司 一种正型感光性树脂组合物
TWI876017B (zh) * 2020-03-31 2025-03-11 日商日鐵化學材料股份有限公司 感光性樹脂組成物、其硬化物及包含所述硬化物的顯示裝置

Also Published As

Publication number Publication date
TWI337690B (ja) 2011-02-21
JPWO2009090867A1 (ja) 2011-05-26
JP4392464B2 (ja) 2010-01-06
WO2009090867A1 (ja) 2009-07-23

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