200936001 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種晶片式表面黏著型元件絕緣製 .程及其結構，尤指一種製作具有良好絕緣與保護功能之絕 緣製程結構之製程。 【先前技術】 表面黏著型元件已經極為普遍地應用於各種電子線 ® 路設計，所採用的材料更具有多樣性並依據製程條件的不 同而加以調整。表面黏著型元件之使用場合在於線路機板 組裝後，必須藉由銲接製程完成此一組裝要求，而易於銲 接使用的端電極特性自然是要求重點之一。一般來說，在 表面黏著型元件之端電極製程後通常利用電鍍製程成型 一銲接介面層於端電極的外側，並利用該鋒接介面層與外 部線路機板進行焊接組裝之步驟。 ^ 對於本體材料絕緣性較差之表面黏著型元件，於製造 銲接介面層的電鍍製程時，因為本體材料絕緣性較差的狀 ' 況下會使電鍍製成變得複雜、困難。部份元件材料可藉由 * 特殊的電鍍條件設定加以完成；但部份元件材料即使調整 電鍍條件亦無法以電鍍製程完成電極銲接介面結構，而必 須使用昂貴且特殊的端電極材料使端電極本身直接具有 銲接特性；即使如此，此種端電極之銲接性與可靠性仍很 難達成電鍍銲接介面結構相同要求的品質與水準。 而習知技術中，可利用特殊的材料與製程來提高本體 200936001 材料之絕緣性，例如本體上完整被覆一層以玻璃成分為主 的保護絕緣層，然後利用製作端電極結構之高溫燒結製 程，藉由端電極導體的燒入完成與功能主結構内電極之連 . 接；但由於玻璃材料經由被覆、燒結等製程後，除了耐鹼 - 性能力較差之外，該玻璃之絕緣效果會因成型的結構厚度 與玻璃密度不均勻而導致絕緣性不佳的問題。 又例如，可採用保護絕緣材料如環氧樹脂將元件被覆 之後，再製作端電極；此一製程的問題在於，保護絕緣材 ❹ 料的披覆作業溫度低，因此後製程的端電極材料必須使用 低溫型，但低溫製程之端電極卻造成元件特性上的不利影 響；再者，由於表面黏著型元件外觀一般為長方體結構， 為解決邊角被覆問題，此製程方式必須將元件以一個接一 個的方式進行，使整體產能無法進一步提昇。 另外，對於繞線式電感元件，其結構係為線圈導體直 接外露於本體基材之上，加上元件整體結構的特殊，使得 保護絕緣層之製作非常困難；此外，一些功能應用較為特 殊的元件如積層表面黏著型壓敏變阻器以及積層表面黏 • 著型高壓電容元件，兩者在線路機板實際使用時必須額外 • 考慮元件本體表面對於雜質、溼度的吸附問題，否則將會 產生過南的漏電流而致使元件失效。 緣是，本發明人有感上述缺失之可改善，提出一種設 計合理且有效改善上述缺失之本發明。 【發明内容】 200936001 本發明之主要目的，在於提供一種晶片式表面黏著型 元件絕緣製程及其結構，該絕緣製程係利用一單端浸入製 程以批次的方式製作保護絕緣結構，進而提高製程效率與 . 產能。 本發明之再一目的，在於提供一種晶片式表面黏著型 元件絕緣製程及其結構，使該晶片式表面黏著型元件上披 覆一抗酸鹼且耐濕性佳的絕緣結構。 為了達成上述之目的，本發明係提供一種晶片式表面 ❹ 黏著型元件絕緣製程，步驟如下：步驟一：提供至少一個 晶片式表面黏著型元件，其中該至少一晶片式表面黏著型 元件具有一本體部、一位於該本體部一端之第一侧部以及 一位於該本體部另一端之第二侧部，且該第一侧部與該第 二側部上分別蓋設有一第一導電端電極與一第二導電端 電極；步驟二：提供一未固化之絕緣材料；步驟三：提供 一單端浸泡步驟，以將該至少一晶片式表面黏著型元件浸 入該未固化之絕緣材料一預定時間；以及步驟四：去除批 覆於該第二導電端電極上之絕緣材料。 • 本發明亦提供一種依上述絕緣製程所製得之絕緣結 ' 構，包括：一本體部，其中該本體部一端設有一第一側部 以及該本體部另一端設有一第二側部；一蓋設於該第一側 部之第一導電端電極；一蓋設於該第二侧部之第二導電端 電極；以及一包覆該本體部之絕緣層，其中該絕緣層成型 於該第一導電端電極與該第二導電端電極之間且具有一 預定厚度。 200936001 程，下有益的效果：本發明提出之絕緣f 構，且該絕緣結構具有厚度與密 乍、邑、·彖結 所製:之絕緣結構能使元件更具二r::之r明 特徵及技術内容，請參 供參考與==與圖’然而所附圏式僅提 "n 亚非用來對本發明加以限制者。 【實施方式】 元件圖，本發明係提供—種晶片式表面黏著划 絕緣絕緣製程可製作—高絕緣性、抗酸驗: 型ΐ二::;面:f?元叙表面，例如表面黏著 Ο :::、=)，但本發明不以上述為限= 例===發明所提出之絕緣製程之第一實施 ” U)··提供至少一個晶片式表面黏著型元件，盆 型電著型電容元件1 ’其中該至少一表面黏著 有—本體部11、—位於該本體部11 一 二側ίίΤ12以及一位於該本體部11另-端之第 :：一1 ’且該第一側部1 2與該第二側部1 3上分別 ;'!;弟一導電端電極2 〇與一第二導電端電極2 广表面黏著型電容元件i内部設有内電極丄丄。，而 該第-導電端電極2 〇與該第二導電端電極2丄係盥該 200936001 内電極1 1 Q達成電性連接。 端電^ 先將該第—導電端電極2 Q與該第二導電 ==㈣表面黏著型電容元件1上，再利= 電端ΐ*· Ο.象製製作一絕緣層結構；藉此’該第一導 電端電極20以及兮坌—道币 ♦ 1 〇的連接可廊、用：一 一導電端電極2 1與該内電極1 上、;+、由兩 心、用#乂间溫的製程，以提高元件之特性。而 e ❹ 電：電Si 1 〇與該第—導電端電極2 0及該第二導 二電之連接技術以及該第一導電端電極2〇與 之技術，故不在此詳加說^技⑭為本領域者所熟知 ::提供一未固化之絕緣材料3(請參閱 態光阻，但不以上述2 ==::態::或液 緣材料3係置放於一槽體6中:=二』化之絕 目士 且該未固化之絕緣材料3 ;有—預定黏度以及-預定組成濃度，以利下—步驟之進 以將：：提供一單端浸泡步驟(請參考第四A圖)， ㈣μ 表面黏著型電容元件1浸人該未固化之π 2料3 1定時間。本發明細批线覆財式進行本 ，哺供具有高®程效率的單端披覆餘。 =示，係將該至少-表面黏著型電容元件^ Α = 定裝置5 ’且以直立的方式將每 $、《者3^ $谷το件1浸人該未固化之絕緣材料3 /又入的冰度可隨著晶片式表面黏著型元件種類之不同而 200936001 加以調整；以本實施例來 件1之該第二導雷，山φ 將母—表面黏著型電容元 導電铋電極2 1與該本體部2 固化之絕緣材料3 0 +月立口丨i 1次入該彳 而由於在本步驟中，僅 電極2 1 )浸入該未固化之 ^ (W二導電端 覆（或單端浸入）步驟。而在之為單端被 本體部11浸入H門2 —電端電極21與該 件1取出該未固化之絕緣材料3， 未疋 β材料具有一預定黏度3.，該 k絕緣 於該第二導雷邑騎科3即可附著 T 电極2 1與該本體部1 未固化之絕緣層3 〇 .哕茸日 、而形成 U，。亥寸日日片式表面黏著型元侔、、考入致 木固化之絕緣材料3之預定時 Ρ μ 求而加以調整。 I冓之厚度需 步驟（c):去除批覆於該第二導電端電極 固化之絕緣層3 〇。在此步歟中， 之禾 第-導雷#9 Ί 用，谷詡將批覆於該 ❿弟一¥病電極2工上之未固化之絕緣層3 q去除。 劑的使用需與步驟（b)中之絕緣材料相配合，例如若牛 驟⑴中使用光阻劑進行披覆，則本步驟中則可以使^ 相對應的光阻清洗劑將批覆於該第二導電端電極 絕緣材料（光阻劑）加以去除。而藉 m 此步驟，該絕緣 材枓僅披覆於該等表面黏著型電容元件丄之本體部工 i二裸=出位於該本體部11兩側之第-導電端i極2 ◦與罘二導電端電極21。 而在去除批覆於該第二導電端電極2丄上之未固化 11 200936001 之絕緣層3 0之後，更提供一固化步驟，y將批覆於該本 體部1 1上之未固化之絕緣層3 〇加以固化且成型為— 具有預疋厚度W之絕緣層3 0，。該預定厚度W可隨著不 同類型的晶片式表面黏著型元件加以變化，例如一般元件 的絕緣厚度在3-5/zm ;而高壓元件之厚度需求約在2〇一5〇200936001 IX. Description of the Invention: [Technical Field] The present invention relates to a wafer-type surface-adhesive component insulation process and its structure, and more particularly to a process for fabricating an insulation process structure having good insulation and protection functions. [Prior Art] Surface-adhesive components have been widely used in various electronic wire ® road designs, and the materials used are more diverse and adjusted according to process conditions. The surface-adhesive component is used in the assembly process of the circuit board. This assembly requirement must be completed by the soldering process, and the characteristics of the terminal electrode for easy soldering are naturally one of the key points. Generally, after the end electrode process of the surface-adhesive element, a soldering interface is usually formed on the outer side of the terminal electrode by an electroplating process, and the step of soldering and assembling the interface layer with the external circuit board is performed. ^ For the surface-adhesive component with poor insulation of the bulk material, the electroplating process is complicated and difficult due to the poor insulation of the bulk material during the electroplating process of manufacturing the solder interface layer. Some of the component materials can be completed by *special plating conditions; however, some component materials cannot complete the electrode soldering interface structure by electroplating even if the plating conditions are adjusted, and expensive and special terminal electrode materials must be used to make the terminal electrodes themselves. It has direct soldering properties; even so, the solderability and reliability of such terminal electrodes are still difficult to achieve the same quality and level required for electroplated solder interface structures. In the prior art, special materials and processes can be used to improve the insulation of the body 200936001 material, for example, a protective layer of a glass component is completely covered on the body, and then a high-temperature sintering process for fabricating the terminal electrode structure is utilized. The burning of the terminal electrode conductor is completed and connected to the internal electrode of the functional main structure; however, since the glass material is processed through coating, sintering, etc., in addition to the alkali resistance-resistance, the insulating effect of the glass is formed by the molding. The problem that the thickness of the structure and the density of the glass are not uniform causes poor insulation. For another example, after the component is coated with a protective insulating material such as epoxy resin, the terminal electrode is fabricated; the problem of this process is that the temperature of the protective insulating material is low, so the terminal electrode material of the post process must be used. Low-temperature type, but the end electrode of the low-temperature process causes adverse effects on the characteristics of the component; in addition, since the surface-adhesive component generally has a rectangular parallelepiped structure, in order to solve the problem of corner coating, the process must be one after another. The way it is carried out, the overall production capacity cannot be further improved. In addition, for the wound inductor element, the structure is that the coil conductor is directly exposed on the body substrate, and the special structure of the component makes the protection of the insulating layer very difficult; in addition, some functions are more special components. For example, a laminated surface-adhesive pressure-sensitive varistor and a laminated surface-adhesive high-voltage capacitive component must be additionally used when the circuit board is actually used. Considering the adsorption of impurities and humidity on the surface of the component body, otherwise it will be over-subscribed. Leakage current causes component failure. The reason is that the inventors have felt that the above-mentioned deficiency can be improved, and proposes a present invention which is rational in design and effective in improving the above-mentioned deficiency. SUMMARY OF THE INVENTION 200936001 The main object of the present invention is to provide a wafer-type surface-adhesive component insulation process and a structure thereof, which utilizes a single-end immersion process to form a protective insulation structure in a batch manner, thereby improving process efficiency. With . Still another object of the present invention is to provide a wafer type surface mount type component insulating process and structure thereof, which is coated with an acid-base resistant and moisture-resistant insulating structure. In order to achieve the above object, the present invention provides a wafer-type surface-adhesive component insulating process, the steps are as follows: Step 1: providing at least one wafer-type surface-adhesive component, wherein the at least one wafer-type surface-adhesive component has a body a first side portion at one end of the body portion and a second side portion at the other end of the body portion, and the first side portion and the second side portion are respectively covered with a first conductive end electrode and a second conductive terminal electrode; step two: providing an uncured insulating material; step three: providing a single-end soaking step to immerse the at least one wafer-type surface-adhesive component into the uncured insulating material for a predetermined time; And step 4: removing the insulating material coated on the second conductive terminal electrode. The present invention also provides an insulating structure formed by the above-mentioned insulating process, comprising: a body portion, wherein the body portion has a first side portion at one end and a second side portion at the other end of the body portion; a first conductive terminal electrode disposed on the first side portion; a second conductive terminal electrode disposed on the second side portion; and an insulating layer covering the body portion, wherein the insulating layer is formed on the first portion A conductive terminal electrode and the second conductive terminal electrode have a predetermined thickness. 200936001, the beneficial effect: the insulating structure of the invention is proposed, and the insulating structure has the thickness and the density, the 邑, the 彖 彖: the insulating structure can make the component more r:: And the technical content, please refer to the reference == and the diagram 'but the attached formula only mentions"n Asia and Africa is used to limit the invention. [Embodiment] The component diagram, the invention provides a wafer type surface adhesion scratch insulation process can be made - high insulation, acid resistance test: type ΐ 2::; surface: f? element surface, such as surface adhesion Ο :::, =), but the invention is not limited to the above = Example === The first implementation of the proposed insulation process" U)·· Providing at least one wafer-type surface-adhesive component, basin-type electric type The capacitive element 1' wherein the at least one surface is adhered to the body portion 11, is located on the two sides of the body portion 11 and a portion at the other end of the body portion 11: a 1 ' and the first side portion 1 2 and the second side portion 13 respectively; '!; the first conductive terminal electrode 2 〇 and the second conductive terminal electrode 2 the wide surface-adhesive capacitive element i is internally provided with an internal electrode 丄丄. The conductive terminal electrode 2 is electrically connected to the second conductive terminal electrode 2, and the inner electrode 1 1 Q of the 200936001 is electrically connected. The first conductive terminal 2 Q and the second conductive == (four) surface are first Adhesive-type capacitive element 1, on the other end, the electric terminal ΐ*· Ο. The terminal electrode 20 and the connection of the 兮坌-dollar ♦ 1 〇 can be used for: one-to-one conductive terminal electrode 2 1 and the inner electrode 1; +, by the two cores, using the #乂 temperature process to improve The characteristics of the component, and e ❹ electricity: the connection between the electric Si 1 〇 and the first conductive terminal electrode 20 and the second conductive diode and the first conductive terminal electrode 2 〇 technology, so it is not detailed here It is well known to those skilled in the art that: an uncured insulating material 3 is provided (please refer to the state photoresist, but not in the above 2 ==:: state: or the liquid edge material 3 is placed in a slot) In the body 6: = 2 化 之 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定Referring to FIG. 4A), (4) μ surface-adhesive capacitive element 1 is immersed in the uncured π 2 material 3 1 for a predetermined time. The present invention is a fine-batch line-funded type, and is supplied with a single-end draping with high ≤ efficiency. Overlay. = indicates that the at least-surface-adhesive capacitive element ^ Α = fixed device 5 ' and immersed each $, "3^ $谷το1" in an upright manner The cured insulating material 3 / re-entry ice can be adjusted according to the type of wafer-type surface-adhesive component 200936001; in this embodiment, the second guiding mine of the component 1 , the mountain φ will be the mother-surface bonding type The capacitor element conductive electrode 2 1 and the insulating material 3 0 + month 丨i 1 which is solidified by the body portion 2 are inserted into the crucible, and in this step, only the electrode 2 1 ) is immersed in the uncured ^ (W 2 a conductive end-covering (or single-end immersion) step, wherein the single-ended portion is immersed in the H-gate 2 - the electric-end electrode 21 by the body portion 11 and the uncured insulating material 3 is taken out from the member 1, the un-β material has a predetermined Viscosity 3. The k is insulated from the second guide Thundering Branch 3 to adhere the T electrode 2 1 and the uncured insulating layer 3 of the body portion 1 to form a U. The size of the surface-adhesive type of the enamel, and the predetermined time 考 μ of the insulating material 3 which is cured by the wood are adjusted. The thickness of the I 需 needs to be step (c): removing the insulating layer 3 批 which is cured by the second conductive terminal electrode. In this step, the Zhihe-Leader #9 Ί is used, and the gluten is removed from the uncured insulation layer 3 q of the ❿弟一病病2. The use of the agent needs to be matched with the insulating material in the step (b). For example, if a photoresist is used for coating in the bolus (1), in this step, the corresponding photoresist cleaning agent can be approved in the first step. The two conductive end electrode insulating materials (photoresist) are removed. By the step of m, the insulating material 枓 is only coated on the surface of the surface-adhesive capacitive element i i bare = the first-conducting end of the main body portion 11 is pole 2 ◦ and 罘Conductive terminal electrode 21. After removing the insulating layer 30 of the uncured 11 200936001 coated on the second conductive terminal electrode 2, a curing step is further provided, and y will be applied to the uncured insulating layer 3 on the body portion 11 It is cured and formed into an insulating layer 30 having a pre-twisted thickness W. The predetermined thickness W can be varied with different types of wafer surface-mounting components, for example, the insulation thickness of a general component is 3-5/zm; and the thickness requirement of a high-voltage component is about 2〇5〇.
❹ #m。另外，本步驟並不限定固化該絕緣材料之方法，例 如了使用加熱或疋紫外光照射的方式以使上述絕緣材料 固化。而該固化後所形成的絕緣層3 〇，.即為本發明中具 有耐酸鹼度、高絕緣性以及耐濕性優良之絕緣結構，而^ 解，因元件本體表面對於雜質、溼度的吸附問題而產生的 過尚漏電流問題。再者，本發明所提出之絕緣製程所製作 緣層3 Q ’具有表面光滑的優點，且其4膜的厚度' '丄度均勻’尤其可滿足高壓電容在使用上的要求。 另外，在步驟（c)之後更進一步包括一成型步驟， :如電鍍製程以分別成型一第一銲接介面層4 〇與一 第接介面層4 1於該第一導電端電極2 〇與該第二 2电端電極2 1上。本發明即是利料端浸泡的製程形成 1有優良耐酸驗度、高絕緣性以及耐濕性之絕緣結構於 =曰片式表面黏著型元件之本體部丄1，使該具有絕緣層 f作二ίΐ式表面黏著型元件可利用後續之成型步驟 作麵接所需要的銲接介面層。 h參考第三圖至第 D 圖 ， 一 ‘叫口矛㈡固汉弟记 I明之第二實施例則將該絕緣製程應一 著塑薄膜繞綠式電感元件;L，。與第_實_不同^ 12 200936001 Π該式電感元件1，具有-本體部 寬之第-側部i 2以及一第= = 1為 2與該第二側部丄3 J ，且遠第-側部1 〇與-第二導電端電極= 包覆有-線圈導體14圈二，！本體部❹ #m. Further, this step does not limit the method of curing the insulating material, for example, by heating or krypton ultraviolet light to cure the above insulating material. The insulating layer 3, which is formed after the curing, is an insulating structure having excellent acid and alkali resistance, high insulating property and moisture resistance, and is solved by the surface of the element body for adsorption of impurities and humidity. The resulting leakage current problem. Furthermore, the edge layer 3 Q 'made by the insulating process of the present invention has the advantage of a smooth surface, and the thickness of the film of the 4 film is uniform, which particularly satisfies the requirements for use of the high voltage capacitor. In addition, after the step (c), a molding step is further included, such as an electroplating process to separately form a first soldering interface layer 4 and a first interface layer 4 1 on the first conductive terminal electrode 2 and the first Two 2 electric terminal electrodes 2 1 . The invention is a process for immersing the end of the material to form an insulating structure having excellent acid resistance, high insulation and moisture resistance, and a body portion 曰1 of the surface-bonding type component of the 曰-type surface, so that the insulating layer f is used The two-dimensional surface-adhesive component can utilize the subsequent molding step for the soldering interface layer required for face bonding. h Referring to Fig. 3 to Fig. D, a second embodiment of ‘Choukou Spear (2) Gu Handi Ji I Ming will apply a plastic film to the green inductor element; L,. Different from the first _ real _ 12 200936001 Π the inductance element 1 has a first side portion i 2 of the body width and a == 1 is 2 and the second side portion 丄3 J , and the farthest - Side 1 〇 and - 2nd conductive end electrode = covered with - coil conductor 14 turns 2,! Body part
翔著：！二成型有螺旋狀紋路，以形成-表面 部占者型溥胺繞線式電感元件丄，。 同t地’將複數個表面黏著型薄膜繞線式電感元件 著刑泡的方式製作絕緣結構；亦即將該等表面黏 感树Γ之—端（例如第—導電端電 固定於一固定裝置5，且以直立的方式將每-表 ::者型薄膜繞線式電感元件1’浸入該未固化之絕緣 厂3 ’再將批覆於該第二導電端電極2 1上之未固化之 絕緣層3 G純去除。之後再雜覆於財丄上之 未固化之絕緣層3 Q固化形成—絕緣層3 0，。而在此實 施例中’由於該線圈導體14具有-第-厚度^，故在固 化步驟之後，該絕緣層3 ◦，的第二厚度W2必須大於該 第—厚度W1以提供良好的絕緣功能。 、本發明亦提供一種依上述絕緣製程形成一絕緣結構 於一晶片式表面黏著型元件，其包括：一本體部i丄，其 中該本體部1 1 —端設有-第-側部1 2以及該本體部 1 1另一端設有一第二侧部i 3 ; 一蓋設於該第一侧部丄 2之第一導電端電極20 ; —蓋設於該第二側部1 3之第 13 200936001 二導電端電極2 1 ;以及一包覆該本體部1 1之絕緣層3 0’ ，其中該絕緣層3 0’成型於該第一導電端電極2 0 與該第二導電端電極21之間且具有一預定厚度W。 . 綜上所述，本發明具有下列諸優點： 1、 由於本發明係在端電極之製作完成之後才進行絕 緣結構之製程，故後端的低溫絕緣結構製程並不會限制前 端電極製作溫度的範圍；亦即可利用較高溫的製程製作端 電極或連接端電極與内電極，使應用本發明製程之晶片式 ® 表面黏著型元件在功能上更具有耐突波電流之特性。 2、 另一方面，本製程可利用批次的方式進行單端坡 覆的步驟，可大幅提昇絕緣結構製作的整體效率，進而提 高晶片式表面黏著型元件的產能。 3、 本發明利用絕緣效果佳及用途廣之絕緣材料製作 上述之絕緣結構，以提供高絕緣性、耐酸鹼性以及耐濕性 佳的保護絕緣結構。 φ 惟以上所述僅為本發明之較佳實施例，非意欲侷限本 發明之專利保護範圍，故舉凡運用本發明說明書及圖式内 容所為之等效變化，均同理皆包含於本發明之權利保護範 圍内，合予陳明。 【圖式簡單說明】 第一圖係本發明之晶片式表面黏著型元件絕緣製程之流 程方塊圖。 第二圖係本發明之表面黏著型電容元件之示意圖。 14 200936001 第一 A圖係本發明之晶月式表面黏著型元件絕緣製 第一實施例之流程示意圖。 衣王之 弟二B圖係第二A圖之A部分之放大圖。 不 第二圖係本發明之表面黏著型薄膜繞線式電感元 意圖。 - ，三A圖係本發明之晶片式表面黏著型元件^ 弟二實施例之流程示意圖。 裏各之 鲁 第二β圖係第三A圖之B部分之放大圖。 ㈣之晶片式表面黏著型元件抵次進行絕緣 第四A圖係本發明之單端浸泡步驟之示意圖。 【主要元件符號說明】 1 表面黏著型電容元件Xiang Xiang:! The second molding has a spiral pattern to form a surface-occupied quinone-wound-type inductor element 丄. In the same way, a plurality of surface-adhesive film-wound-type inductor elements are formed into an insulating structure; that is, the surface of the surface-adhesive tree is terminated (for example, the first conductive end is electrically fixed to a fixing device 5) And immersing each of the:-type film wound-type inductor elements 1' in the uncured insulation factory 3' and unclamping the uncured insulation layer on the second conductive-end electrode 2 1 in an upright manner 3 G is purely removed. Then, the uncured insulating layer 3 Q which is mixed with the financial layer is cured to form an insulating layer 30. In this embodiment, 'because the coil conductor 14 has a -th thickness ^, After the curing step, the second thickness W2 of the insulating layer 3 must be greater than the first thickness W1 to provide a good insulating function. The present invention also provides an insulating structure for forming a wafer surface adhesion according to the above insulating process. The component comprises: a body portion i, wherein the body portion 1 1 - end is provided with a - side portion 12 and the other end of the body portion 1 1 is provided with a second side portion i 3 ; The first conductive terminal electrode 20 of the first side portion ;2; a 13th 200936001 second conductive terminal electrode 2 1 of the second side portion 13; and an insulating layer 30' covering the body portion 1 1 , wherein the insulating layer 30 0 is formed on the first conductive terminal electrode 2 0 and the second conductive terminal electrode 21 have a predetermined thickness W. In summary, the present invention has the following advantages: 1. Since the present invention performs the process of insulating the structure after the fabrication of the terminal electrode is completed. Therefore, the low-temperature insulating structure process at the back end does not limit the range of the front electrode fabrication temperature; the terminal electrode or the terminal electrode and the inner electrode can be fabricated by a higher temperature process, so that the wafer type surface adhesion type using the process of the present invention can be used. The component is functionally more resistant to surge current. 2. On the other hand, the process can be used in a single-end slope step by batch method, which can greatly improve the overall efficiency of the insulation structure and thus improve the wafer surface. The production capacity of the adhesive component 3. The invention utilizes the insulating material with good insulating effect and wide application to fabricate the above insulating structure to provide high insulation, acid and alkali resistance and moisture resistance. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS In the scope of the present invention, the following is a schematic flow chart of the wafer-type surface-adhesive element insulating process of the present invention. The second figure is the surface-adhesive type of the present invention. A schematic diagram of a capacitor element. 14 200936001 The first A diagram is a schematic flow chart of the first embodiment of the crystal moon type surface-adhesive element insulation of the present invention. The second diagram of the second section of the second section of the clothing of the king of the king of clothing is enlarged. The second figure is intended to be a surface-adhesive film wound inductor element of the present invention. - The three-A diagram is a schematic flow chart of the wafer-type surface-adhesive element of the present invention. The second beta image is a magnified view of part B of the third A map. (d) The wafer type surface-adhesive element is insulatively infiltrated. FIG. 4A is a schematic view of the single-end soaking step of the present invention. [Main component symbol description] 1 Surface-adhesive capacitive component
14 2 0 3 本體部 第一侧部 線圈導體 狀况深武電感元件 11〇 内電極 13 第二惻部 3 04 056 第一導電端電極 2ι 未固化之絕緣材料 未固化之絕緣層 30 第一銲接介面層 4i 固定裝置 槽體 第二導電端電極 絕緣層 第二銲接介面層 15 200936001 w Wl W2 預定厚度 第一厚度 第二厚度14 2 0 3 body part first side coil conductor condition deep wu inductance element 11 〇 inner electrode 13 second 3 part 3 04 056 first conductive end electrode 2 ι uncured insulating material uncured insulating layer 30 first soldering interface layer 4i Fixing device tank second conductive end electrode insulating layer second soldering interface layer 15 200936001 w Wl W2 predetermined thickness first thickness second thickness