TW201036006A - The manufacture and use of planar embedded magnetics as discrete components and in integrated connectors - Google Patents

Abstract

The current invention provides an integrated planar transformer and electronic component that includes at least one wideband planar transformer disposed in a planar substrate, where each wideband planar transformer includes a planar substrate in a fully-cured and rigid state, a ferrite material embedded in the planar substrate, where the ferrite material is enveloped in an elastic and non-conductive material, inter-wound conductors disposed around the embedded ferrite material, where top and bottom conductors are bonded by an insulating adhesive. The top and bottom conductors are connected in an inter-connected pattern by conductive vias disposed on each side of the ferrite material and span through the layers to the conductors. The planar transformer further includes at least one center tap connected to at least one inter-wound conductor. The integrated planar transformer and electronic component further includes at least one electronic component connected to at least one terminal of the wide-band planar transformer.

Description

201036006 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to communication technology. More particularly, the present invention relates to the creation of embedded planar magnetic components and the integration of planar magnetic components into communication connectors. [Prior Art] 0 Since the connector was originally developed for voice transmission, it has been used in the communication industry. The connector has evolved several times to support the current 10G/1G/100/10 Mbps Ethernet network. Together with other communication protocols and electronic devices that require electromagnetic components, this technology will continue to evolve to support the emerging high-speed 40G and I00G. As communication systems have begun to gather more and more individual devices in a single box (that is, a 48-inch Ethernet switch or a multi-drop router), the space on the printed circuit board has become very valuable. value. In addition to adding printed Q-switches with passive components to match parasitic phenomena from integrated circuits (1C) and connectors, connector manufacturers take the next step in the development of connectors by attempting to externally Magnetic components are integrated into the connector to reduce system space. Magnetic components are required to isolate the user from internal voltage surges or to isolate the electronic components from external high voltage shorts and surges. They also limit the EM I electromagnetic interference emissions seen from the system, which is necessary to comply with the regulations and regulations related to electronic equipment. In the current solution, the hand-wound magnetic elements are soldered down to the posts or pads provided in the back of the RJ-45, and the hands are wound around the magnetic components in the connector housing. In a single jack housing, eight individually wound magnetic units need to be attached to the appropriate connections and then squeezed into the back of the housing. The prior art assembly 100 is shown in Figures 1 (a) - (b), wherein Figure 1 (a) shows the hand winding 102 wound around the annular or annular tube magnet 1 〇4 to form a magnetic unit 1 06, and, Figure 1 (b) shows the conventional connector 1 〇 8 and the difficulty of accomplishing this integration. Once all of the magnetic units 106 are inserted, they are covered with a colloidal material to keep them in place. Since these magnetic units 106 are fairly close and their spacing is difficult to control, this is time consuming and provides poor repeatability and performance. Efforts have been made to use the guide posts or slots in the housing to characterize the location of these units, but these have been discarded due to cost and number of manufacturing cycles. With these hand-wound components, it is virtually impossible to control the leakage and balance the primary and secondary coils across the central tap. In addition, for higher frequency applications, the impedance cannot be controlled and broadband performance is achieved. Finally, these components cannot be used to create sub-systems and modules due to the inherent variations from hand-wrapped. Among other components, a horizontal donor PCB board can be inserted into the housing, which allows the manufacturer to place the passive component and the magnetic component on the PCB, and in the PCB, it will be held again by the mounting material. . While this provides an improvement over other attempts 'but' because the magnetic element is still hand-wound and then placed 'and thus limits performance and increases manufacturing costs', it still provides only limited performance. These boards also provide an additional function, i.e., providing a base for the connector. OEMs (original equipment manufacturers) are now looking for ways to move to the next level of integration in their 201036006 devices. They will progress to a 96-inch panel on the box' which means that the connector and the P C B space must be made smaller. As the current design provides, the connector (not the RJ45 connector) must be narrower and not deeper. Current hand-wound magnetic solutions cannot meet this demand due to mechanical limitations and manual assembly. Current transformer magnetic components are wound by hand and then encapsulated with epoxy resin and packaged. They are typically quad flat no-lead (QFN), gull-wing or ball grid array (B G A ) package components. These hand-wound components are used in non-Ethernet applications such as set-top boxes, RF routers, RF mobile devices, the Internet, and consumer electronics. When these hand-wound transformers are integrated into the connector, they can enter the PCB substrate and be installed in a horizontal or vertical configuration. These are hand-wound and hand-welded, attached to a thin board and then attached to the inside of the connector. It is impossible to control critical parasitic parameters such as leakage inductance and capacitance coupling, which can cause poor performance. Therefore, there is a need to develop low cost, embedded planar magnetic components that can be integrated into shallow and narrow communication connectors. There is also a need for efficient and low cost manufacturing methods to fabricate such devices that avoid damage to the ferromagnetic material and reduce EMI, maximize winding turns, and control winding parasitic inductance. [Invention] The present invention provides an integrated planar transformer. And an electronic component comprising at least one broadband planar transformer disposed in the planar substrate. [Each of each of the wide 201036006 frequency plane transformers comprises a fully solidified and rigid planar substrate, and a ferromagnetic material, the ferromagnetic material being embedded in the fully cured and In a rigid planar substrate, the embedded ferromagnetic material is encapsulated in an elastic and non-conductive material. The planar transformer further includes inter-winding conductors disposed about the embedded ferromagnetic material, wherein the inter-winding conductor has a top conductor and a bottom conductor 'the top conductor is bonded to the fully cured and rigid substrate by the first bonding layer The surface, the bottom conductor is bonded to the bottom surface of the fully cured and rigid substrate by a second bonding layer, wherein the bonding layer comprises an insulating adhesive. The top conductor and the bottom conductor are connected in an interconnect pattern by conductive vias disposed on each side of the ferromagnetic material, the conductive vias spanning the bonding layer and the fully cured and rigid planar substrate to form an inter-winding conductor . The planar transformer in turn includes at least one central tap connected to at least one inter-winding conductor. The integrated planar transformer and electronic component in turn includes at least one electronic component coupled to at least one end of the broadband planar transformer. According to one aspect of the invention, the planar substrate comprises FR4, a thermoset material or a thermoplastic material. In another aspect of the invention, adjacent top guide systems are configured to conform to parallel and predetermined spacing therebetween, and adjacent top conductors and bottom guides are configured to wrap around the embedded ferromagnetic material The number of windings is maximized to reduce winding parasitic inductance and leakage inductance. Here, the interval between the top conductor and the bottom conductor may be in the range of 10 μm to 5 〇 0 / / m. In another aspect of the invention 'using a laminate material to laminate a conductive layer to a planar substrate' the laminate may comprise a flexible epoxy resin, a high temperature -8 - 201036006 thermoplastic material, or a high flow ceramic 塡 hydrocarbon Compound. According to another aspect, the 'central tap is impedance matched to the differential 50%' where any non-differential current flows through the central tap to remain open, terminating in the electrical network to optimize the impedance filtering of the common mode signal Chemical. In still another aspect of the invention, the ferromagnetic material has the shape of a wheel, an annular tube, a U-shape, an E-shape or a strip shape. Here, the center of the ring body or the ring-tube ferromagnet contains a compound which is disposed in a size disposed therein. Further, the 'ring ferromagnetic or toroidal ferromagnetic body contains the thermoplastic member disposed therein, and the thermoplastic member has material properties conforming to the material properties of the sheet, and has a shape conforming to the shape of the center of the ring or the annular tube. According to another aspect, the 'crash material system is configured to span at least two terminals of the wide frequency plane', wherein when exposed to a potential in the range of 500V rms to V rms, the collapsed material acts (actuate) in another state In the example, all of the integrated planar transformers are coated with an insulating layer, wherein the terminals of the integrated planar transformer are exposed.

According to one aspect of the invention, the connection between the broadband planar transformer and the electrical power includes at least one pin disposed through at least one of the holes in the substrate, wherein the at least one conductive pin is linear or angled I. In the sample, the top conductor comprises a teardrop shape in which the narrow end of the shape is connected to a conductive element disposed in the center of the ring or ring of the ferromagnetic material and the wide end of the teardrop shape is connected to the impedance ground or Matching or containing a ring-shaped ferromagnetically stable center-packed planar base-wheel center transformer with 10,000 Q outer surface with one sub-component and one conductive beta. , Teardrop-shaped tubular connection to the -9 - 201036006 placed around the outer or outer tubular conductive elements of the ferromagnetic material. Here the 'transformer inductors are commensurate with the coupling coefficient between 〇1', where the affinity is based on i) the spacing between the conductive elements, or u) the spacing between the annular tubular conductors, or in) Or the opening span ' or iv in the ring-tube ferromagnet according to the ratio between the primary and secondary windings; or i) ' ii ), iii) and W), wherein the opening span comprises an air gap, wherein The gap includes at least one ground via. In another aspect of the invention, the electronic component can be any connector that requires isolation or electromagnetic functionality. Here, the connector includes at least one electrical contact connected to at least one terminal of the planar transformer. In one aspect of the invention, at least one broadband planar transformer comprises a wide frequency planar transformer array. In still another aspect of the invention, at least one of the electronic components includes an array of connectors. In another aspect of the invention, at least one of the electronic components comprises a PCB array. According to another aspect, the integrated planar transformer and the bottom surface of the electronic component include solder pads. In still another aspect, the heat pipe is configured to remove heat generated at the conductor between the windings. Here, the heat pipe may include a thermally conductive metal plated through hole, at least one thermally conductive metal layer, an additional thermally conductive metal disposed on the at least one signal track, at least one thermally conductive sheet disposed at an edge of the integrated planar transformer device, or surrounding Thermally conductive material for the edge of integrated planar transformers and electronic components. -10- 201036006 In yet another aspect, at least one of the central taps is disposed on top of the broadband planar transformer. According to another aspect, the electronic components are disposed on top of the planar substrate to minimize the distance between them to provide the desired matching of the central tap current. In another aspect of the invention, the wideband planar transformer further comprises i) at least one common mode current transformer, wherein each common mode current transformer provides signal shaping and adjustment, or U)M circuitry, or i) And ii), wherein the germanium circuit is an electrical circuit that supports the functionality of an embedded broadband planar transformer for a particular function and application. Here, the functions supported by the Μ circuit include filtering function, crosstalk cancellation function, high voltage suppression, ΕΜΙ suppression, digital control, LED control, balance-unbalance (Baiun) control, and power management function. In another aspect, the integration comprises a stack, wherein the stack includes at least a first wide Q-frequency planar transformer and a first current transformer on top of the second broadband planar transformer and the second current transformer, and A current transformer and a filter and impedance matching component on top of the first broadband planar transformer, wherein the number of wideband planar transformers in the stack is dependent upon the desired application. According to still another aspect of the present invention, the integration includes a stack, wherein the stack includes a current choke on top of the filter, wherein the filter is disposed on top of the impedance matching element, and the impedance matching component is configured On the broadband plane transformer. In another aspect of the invention, the elastic and non-conductive material comprises at least -11 - 201036006 a enthalpy, wherein the elastic expansion coefficient of the elastic and non-conductive material having the smear reaches the thermal expansion coefficient of the planar substrate. In another aspect of the invention, a bore is provided in the substrate, wherein the thermal expansion of the integrated planar transformer and electronic components is controlled by drilling. The present invention is to be understood as being limited to the details of the details of the invention. Thus, the following preferred embodiments of the invention are disclosed, without loss of generality, and without limitation. The present invention comprises a planar magnetic component in which a ferromagnetic or magnet is embedded as an element in a base dielectric material having a pre-formed opening, wherein the magnetic unit is molded, routed, mechanically drilled, or perforated A pre-formed opening is formed. These are then packaged in a low stress adhesive such as a low stress epoxy that is configured to provide a suitable electrical environment. The copper layer cooperates with the through holes to cause the magnetic structure previously produced by the hand winding unit to be in a small component similar to 1C. These units can be created for individual channels or as channel groups. Figures 2(a)-(e) show a planar transformer 200 arranged in an array, wherein Figure 2a shows a planar substrate 202 in a fully cured and rigid state. As shown, the planar substrate 02 is shown with pockets 204, where the recesses 204 are shown as round holes, and the pockets 204 have a precise tolerance to accommodate the ferromagnetic material 206, as in the case of -12-201036006 The ferromagnetic material 206 is shown here as a ring wheel. These holes can be drilled to the desired thickness or drilled to the desired thickness at a controlled depth. Figure 2(b) shows an array of planar transformers 200 having a teardrop-shaped top electrode 208, wherein the conductive and internal edges of the ring-shaped ferromagnets shown in Figure 2(a) are also shown. Through hole 210. As shown in FIG. 2(b), the top conductor 210 is bonded to the planar substrate 206 using an insulating adhesive 212, wherein the insulating adhesive 2 disposed on the bottom surface of the planar base 0 plate 202 is again shown. i 2 is used to bond the bottom conductor 214 as shown in Figure 2 (c). Here, Fig. 2(c) shows an array of elliptical planar transformers 200 provided with top conductors 208, as shown, the top conductors 208 having a non-uniform teardrop shape as conductors wound around the embedded ferromagnetics 06. . As shown, a plurality of teardrop-shaped top conductors 208 are configured to conform to parallel and predetermined spacing therebetween, and adjacent top conductors 28 8 are configured to surround windings around the embedded ferromagnetic 260 The maximum number is used to reduce the parasitic inductance and leakage inductance of the winding. Q Figures 2(d)-(e) show an array of planar transformers 200 configured for multi-channel applications (see Figure 2(e)), where Figure 2(d) shows the use of a circular ring/annular tube The ferromagnetic body 206, and the top conductor 208 has a relatively uniform teardrop shape, as described above, with parallel and predetermined spacing between the top conductors 208. 3(a) - (b) show the configuration of the stacked planar transformer 300. For example, the planar transformer 200 can be vertically stacked to the back of the connector 3〇2 (see FIG. 3(b)) to enable integration. The space required for the connector unit 304 is minimized. Since many integrated connectors require eight-13-201036006 individual wound ferromagnetic or magnetic materials to be used to cover, for example, four signal channels in connector 302, 'a tight array of connectors from manufacturer 404 is obtained. (i.e., 1X 4 cells or 2 X 6 cells) will expand component selection due to the compact and durable nature of the planar transformer 202 in accordance with the present invention (see Figure 17 for stacking details). Another embodiment of the invention adds a pad to the bottom of the channel magnetic unit. These pads are similar to QFN packages or LGA (Leadless Grid Arrays) which allow the integrated magnetic unit 200 to be reflowed onto the pads of the connector or to another PCB substrate. Given the use of high temperature consumables, the connector can still be reflowed during the OEM reflow process without any impact on the connector 302. One other aspect includes a BGA pad that is added to the bottom of the magnetic unit 200. This also allows the channels to be stacked into the connector when needed. Industrial connectors not only provide a signal path for the device, but also provide power to the external device. The difficulty in using hand-wound ferromagnetics in these applications is that the windings used are surrounded by air and low stress entanglement materials with poor thermal conductivity, so it is very difficult to remove heat therefrom. The present invention provides an additional copper layer, additional copper plated vias, or thick signal traces for use as a heat transfer tube for removing heat generated in the windings. In addition, copper or other conductive material may be placed or coated around the edges of the planar device. By adding a via or pad to the edge of the board, the connector manufacturer can attach the metal sheet to the substrate, which is smashed into a portion of the connector housing to provide a heat sink to the substrate for enhanced thermal efficiency. use. Another topic related to these connectors includes the additional passive components required for filtering and EMI control. In accordance with the present invention, in order to effectively carry the Ε Μ I -14 - 201036006, the common mode current central tap is integrated into the wideband planar transformer. These central taps are impedance matched to 50% of the differential impedance so that any non-differential current will return from this path to the appropriate ground. The better the impedance matching of the 50% differential impedance seen by the signal, the more current will be removed. Prior to the present invention, the common mode trajectory typically traveled a long distance from the magnet to the proper ground. In addition, a slight change in the copper trace will result in inductance for optimal common mode rejection and electromagnetic interference (EMI) performance. Moreover, the present invention provides a mechanism for reducing 0 common mode noise, including the use of discrete components. In accordance with the present invention, Figures 4(a)-4(e) show a combined termination resistor and magnetic structure 400 in which termination resistor 402 is shown directly on top of magnetic structure 200. As shown, since the ferromagnet is hand-wound, this cannot be on the current magnet used in the integrated connector. It will be appreciated that other components can be placed directly on the surface of the ferromagnetic body embedded in the planar substrate such that this distance is minimized and provides a perfect match of the central tap current. This also results in a tighter design. Q Figure 4 (c) shows the central tap terminal circuit 404, which is 0. twenty two. A 5pF capacitor termination instead of a resistor termination can be terminated using an open stub (non-physical component) or a forked finger or a physically surface mount capacitor as item 1 1. This novel change allows for a well-controlled inductor (L) that is typically controlled and in the range of 1 -1 5 v , to converge resonantly with the capacitor (C) to produce the desired frequency Transmission. More specifically, this frequency is typically the first or second harmonic of the clock of the system. It is noted that capacitor C is implemented in the form of a high dielectric breakdown voltage. This can be implemented with short tubes, -15- 201036006 where 'grounding or shielding is a reasonable spacing in the presence of dielectric or air for isolation. The resonant frequency is determined and the resonant frequency is inversely proportional to the square root of the product of L and C. Figure 4(d) schematically shows that the enhanced filter series LC traps 406' provide enhanced rejection in the transmission path of the selected frequency to the element in Figure 4(c) without causing a pass band ( The function in the pass band) deteriorates. This can be achieved as shown by the 'insertion of the LC trap 408 at the input and output or between the choke and the transformer, allowing the first order to the nth order elliptical low pass filtering'. Figure 4(e) shows the response 410 of the two LC traps added to the top of the transformer and choke combo circuit. 'The 'band' is still flat until 600 MHz, and in the mobile phone device and action The device application tends to suddenly sag at the required frequency of 700 MHz-800 MHz to transmit and lose energy. Today's high-speed connectors provide a signal path to signals running at hundreds of MHz. They must typically be externally filtered to minimize interference from external sources of noise, such as the Global System for Mobile Communications (G S Μ). In the planar implementation, on the true signal path on the embedded planar transformer, it can include an RJ-45 connector, which can achieve external filter and impedance matching for both the device and the connector, providing user-consistent Accurate and high performance solution. This also solves the problem of PCB board design such as the ability to add vias or test points. These are impossible in the way of hand-wound solutions. Crosstalk between ferromagnetics in these connectors is an important issue because the hand-wound members do not have good control of the spacing. According to one aspect of the invention -16-201036006, the spacing is defined by plate lithography, which allows for very precise control of the spacing. In a multi-layer stack for a multi-channel connector, the spacing is defined by interlayer spacers or BGA ball thicknesses or solder pasts used in the layers, wherein the ground plane in the multi-layer stack configuration can be used to provide Electrical crosstalk between transformer and choke, or between transformer and choke to transformer and choke. Since crosstalk is attenuated by the square of the distance between the tracks, this is easily maintained in the present invention. An improvement was made to isolate each column of through-holes between the 0 current transformer and the transformer with 1 0-; [5 db. This is advantageous in each channel for higher rejection of the difference to common mode energy and lower conversion (and vice versa). However, since the present invention provides tight coupling and minimized controlled leakage, this via fence is hardly required for implementation. In addition, when stacking components, an infinite distance cannot be added between the top and bottom channels because of the height limitations of the connectors of adjacent components. The teardrop-like and tight space between the windings between the primary and secondary turns minimizes leakage above and below the device and minimizes impact on channel performance in the presence of components or shields. The integrated connector consists of a socket similar to the RJ-45 shown in Figure 1 (b). The socket has a housing made of metal, plastic or PCB substrate and an integrated magnetic component. In today's integrated connectors, these magnetic components are only ferromagnetics wound by transformer copper wires. These wires are then soldered into the connector substrate to keep the magnetic elements from moving, and after placement, the charge material is injected into the ferromagnetic body. This material must be low stress, such as 变异 variation. -17- 201036006 Figure 5(a) - (e) is a performance inductor implemented with connector 500. According to one aspect of the invention, the socket 502 is back mounted to the planar magnetic element 2000. The interconnect in this embodiment is a conductor that slides conductor 504 into aperture 506 on planar magnetic substrate 202. When more than one layer of magnetic element is required to create multiple channels, additional magnetic layers are added and these additional magnetic layers are interconnected via vias or BGA balls. In order to connect to the PCB, as shown at the bottom of Figure 5(e), an additional headstock 5 0 8 can be added. By using the copper trace, this connection to the board becomes a very efficient hot aisle in the thermal connector. This is critical in connector applications such as P〇E (Ethernet powered). Figures 5(c) - (d) are side and perspective views respectively seen in the implementation. In this case, the terminating resistors in these connectors will be mounted as shown in Figure 5(e). In order to create this unit, the base frame of the plastic or metal substrate will be slid vertically to the placement, and the pre-group 5 ( a ) - ( e ) can be used to terminate/filter any passive components or maintain the crosstalk distance. The connector conductor assembly shown in Fig. is inserted 'in front' to slide the conductor into a suitable opening on the planar magnetic substrate. Solder or conductive epoxy to attach the socket conductor to the substrate and then 'return this assembly' to complete the final attachment. With regard to an alternate embodiment of the invention, planar magnetic properties can be used as a horizontal substrate. The conductors can be made longer and 9 degrees to allow them to contact the horizontal plate, rather than as shown in Figure 5 (a) - (e plane magnetic part amp 504, if this can, the pad device Thicker, so that the display of the power supply is usually mounted in the same way. A required installation. The figure is to the rear to use the through hole. The component is bent in the middle of the -18-201036006 The component and the connector conductor are slid into the through hole. Then, as in the past, a plurality of planar substrates are stacked. But 'this will increase the total connector length. In yet another embodiment, the conductor pins can be made only slightly longer and then bent at the ends. Then, as shown in Figure 7, the ends can be soldered to be flush with the horizontal plate, and at the same time they are held by the plastic insert. Furthermore, an embedded edge magnetic module can be used as the electrical and mechanical substrate. To create an integrated connector. As shown in Figure 7-9, the embedded edge magnetic device is directly connected to the host at any angle between 1 or 1 to 79 degrees, either directly or via a socket or through-hole pin. Board PCB. Figure 7 shows the 單埠 double height stack configuration. Figure 8 shows a double-height stack configuration with EMI ground shield and P〇E + power connections, and Figure 9(a) shows a double-turn stacked embedded edge magnet with P〇E + power connections. The embedded planar magnetic portion can have many different form factors relative to the main embedded edge mode Q/substrate. The embedded edge magnetic module/substrate is used in many configurations such as 1x1, 1x2, 2x1, 1x4, 2x4, 2x6, and the like. In addition, the embedded edge magnetic module/substrate reduces connector width and height to create higher density switches in industry standard 19” rack mountable systems. Moreover, embedded edge magnetic components enable high power The application (P〇E+) can have an open back side 'allowing the heat generated by the magnetic elements to be transferred to the blade heat sink or other heat transfer mechanism through which the system airflow can allow heat to be integrated from high density. The embedded magnetic planar connector is properly dissipated. -19- 201036006 The embedded edge magnetic module allows additional embedded planar magnetic components to be stacked on it, with additional functionality and a small form factor configuration. Stacked embedded planar magnetic components can be used to inject common-mode chokes and Μ circuits for signal shaping and conditioning. Μ circuits are power circuits that support embedded planar magnetic component functions for specific functions and applications. Examples of Μ circuits include, but are not limited to, filtering functions, crosstalk cancellation functions, high voltage rejection and ΕΜΙ suppression, digital control, LED control, balance-free (Baiun) control and power management functions, etc., such as the examples described in Figures 4c-4d. Discrete components that generate power network functions, 矽 die attach (flip or wire) can be used Bonding technology) and other structures to implement this 电路 circuit. Figure 8 shows an embedded edge module/substrate configuration that provides optimal ΕΜΙ shielding and unique cascading via electrical isolation with thermal conductivity Allows heat dissipation to support high power applications such as Ρ〇Ε +. In addition, thermal epoxy and other thermally conductive packaging materials can be used to help dissipate heat from the ferromagnetic body. The central tap allows power not to be supported in the motherboard PCB The best power distribution in a flat system can be achieved by the cable-to-center tap connection on the top of the embedded edge module/substrate. The stacking combination can be as follows: transformer and choke The top of the transformer and the choke, the filter and impedance are matched to the top of the transformer and the choke, or the choke is in the filter, impedance matching and transformer In Fig. 9(b), an example of a ferromagnetic based transformer 200 incorporating a ferromagnetic choke 902 is shown, wherein the top and bottom windings 904/906 of the choke 9〇2 provide a high order total The mode gives the common mode attenuation. Figure 9 (c) shows some representative ferromagnetic shapes, including ring wheel, ring tube, -20- 201036006 ring tube with dog bone center wall, U shape, E shape, or strip shape. When using the terminal design in Figures 4(c) and 4(d), a ferroelectric choke may not be needed. This embodiment is shown in Figure 9(e) where a non-ferroelectric choke is provided A common mode attenuation other than 25MHz. The above description covers transformers, which have a coupling coefficient higher than 0. 9 and less than 1. 0 tightly coupled inductor. This is required for a 1: 1 transformer without impedance or voltage conversion. Another embodiment is the primary coil 0 of the turns and the secondary coil of the turns to obtain a Μ··Ν transformer. However, the coupling coefficient is modified by spacing the inductors or creating an air gap in the core of the ferroelectric body so that the coupling is controlled at 0 and 0. Between 9. Another factor that decouples the inductor is the use of a respective ferroelectric for each inductor. This allows the conductors and transformers to be built as a basic unit for many structures as described, but can be combined to form, for example, but not limited to, a ΕΜΙ filter, a common mode choke, a directional coupler, balanced-unbalanced (Baiun) ) Many component devices such as devices. These functionalities can be combined with embedded planar magnetic components to produce system level functionality for multiple applications, for example, Ethernet that requires module or subsystem functionality, Set-top boxes, RF routers, mobile networks, mobile phones, and other electronic devices. Figures 9c (i)-C(iii) are examples of different shapes of ferromagnetic bodies that can be inserted into a substrate to make these devices and components. The air range between the different feet of the ferromagnetic body can be inserted into the grounding through hole to change the coupling between the different sub-conductors' ° Since the ring or ring tube ferromagnet is most useful for Ethernet applications 'so' The previous main description discusses ring or ring tube ferromagnets. An embodiment of a balance-unbalance device (Balun) is shown in Fig. 9(d), which is a three-terminal device in which one side of the main stage is grounded. The energy from the opposite end is perfectly separated and opposite in phase. The Balance-Unbalanced Device (Baiun) provides single-ended inputs to differential outputs or differential outputs to single-ended inputs to match impedance and is used in many RF applications. The embedded edge magnetic substrate/module has a row of devices that are inserted into the memory receptacle, the device array being configured to be tilted vertically or at 45 degrees, or at any position therebetween. The embedded edge magnetic devices have their own through-hole pins that are attached directly to the "board" PCB. However, a similar configuration using a socket connector configuration similar to a memory chip is also possible, or other attachment configurations that meet the vertical attachment reliability requirements. In addition to this basic configuration, it is within the scope of the invention to have sockets and other connections disposed on the top edge for connection to a central tap or other circuit connection. The device can also be integrated into the connector to provide mechanical strength as the entire connector is mounted to the motherboard PCB. An aspect of the present invention can result in, for example, a 96 埠 high density gigabit Ethernet switch that is not achievable by conventional methods, as well as cost effective P〇E+ Ethernet switches. The application thus minimizes the proper power isolation of the motherboard PCB with the top edge connection. Prior art techniques for fabricating electromagnetic components by manually winding copper wires around magnetic components have severe limitations on performance, repeatability, cost, and quality. In the prior art, performance was based on personal use of tweezers under a microscope to place copper wires. It is determined by the consistency of the surrounding magnetic components. For transformers manufactured for the Ethernet network, this limits capacity to less than 20 per hour per worker. Automated machines that perform this work have not proven to be cost effective for the small form factor components used in the communications industry -22-201036006. In the past, attempts have been made to solve the problem of how ferromagnetic material sheets are inserted into a plurality of FR-4 layers (having a recessed glass substrate to provide a rigid low dielectric constant epoxy type), but because of the expensive type of ferromagnetic material used, Fragile, and highly sensitive to stress', so it was not successful. They also do not provide any methods that can be used to align the magnetic material in the embedded material required to ensure performance, repeatability and reliability. In order to obtain the required degree of inductance, the ferromagnetic material must be suitably thick. Thinly deposited ferroelectric materials provide too low inductance. In order to create a component with the required degree of inductance in this way, a large number of individual components need to be brought together, thus making the component too large for general applications and not suitable for small connectors. The ferromagnet used in a general transformer is formed into a thicker unit by mechanical pressure. However, they are quite fragile. Among them, this material is inherently highly sensitive to stress. A problem with embedding these materials is that the epoxy for the PIC material is designed to be rigid' to provide a substrate for additional copper layer patterning and attachment. The present invention provides, in a planar substrate of a rigid, fully cured material, thermoset or thermoplastic material such as FR4, via pull/drill, punch or pre-formed holes to provide openings for the fabrication of magnetic components ( Ferromagnetics) also have large openings for magnetic components (ferromagnetic) so that they can take into account general manufacturing latitude. The thermoplastic material may be a ceramic particle-filled hydrocarbon that provides a high glass transition temperature (Tg), low mobility, and a coefficient of thermal expansion (CTE) consistent with copper, and an epoxy resin is used to encapsulate the ferromagnetic body. Once the magnetic members (ferromagnetics) are placed in the opening -23- 201036006, they are surrounded and encapsulated with epoxy resin and accurately positioned. The central hole of the magnetic member is filled with epoxy resin, plastic or other material that acts as a plug for the filling hole. According to one aspect of the invention, an intermediate layer of a low stress epoxy resin having an chelating agent is used as an interface layer between the FR-4 substrate and the ferromagnetic body. Then, a low stress epoxy resin is placed to lock the ferromagnetic body where appropriate during the process or during the temperature range visible during operation, but no pressure is applied thereto. According to one aspect, the intermediate layer is sufficiently solid to allow drilling and through holes to be plated through it. This requires a double ruthenium, a resin substrate' and the addition of sand to add hardness to the mixture. Butadiene is added to provide a low stress environment to the ferromagnetic body. The key element in the manufacture of epoxy resins is the addition of each component while not allowing the formation of bubbles. This will require the material to mix slowly and then placed in a vacuum to eliminate any bubbles before using it. It will be apparent that other adhesive materials that achieve the process steps described in this specification can be used. The present invention also provides a low stress method to further add a simple copper layer above and below the base substrate, thereby avoiding the adverse effects of additional Fr-4 stacking on the magnetic component. After the substrate is completed, this material is spread over the uneven surface before the application of copper. A low stress epoxy resin, a high temperature thermoplastic material or a high flow ceramic crucible is used on the top and bottom to laminate the carbon nanotube material, and the planar substrate is laminated with a conductive material. In order to create parts with consistent performance, the magnetic elements (ferromagnetics) must be placed accurately so that they do not interfere with or touch the ferromagnetics when the through holes of the completed windings are created. Figure 10 (a) shows a top view of the relationship between the hole and the ferromagnetic 1 000. As shown, the ideally disposed aperture 1 002 is reasonably spaced from the ferromagnetic walls 1 〇〇 4 • 24 - 201036006. A distance greater than 50 /z m is required. In the illustrated embodiment, the aperture 1002 is 150/zm or 6 mils from the inner wall 1004. When the through hole is too close to the ferromagnetic body, the ferromagnetic body will break and cause inductance and performance to deteriorate. Figure 10 (b) shows a ferromagnetic body with this fracture of an improper borehole that is too close to the ferromagnet. Any movement of the component after the hole configuration can result in a ferromagnetic body that breaks or morphs during the drilling of the through hole; ferromagnetic cracks or through-hole "edges" created by drilling the ferromagnetic material can degrade component performance. 0 Using a low-stress epoxy resin, a high-temperature thermoplastic material (L C P ) or a high-horizontal flow ceramic 塡-filled hydrocarbon material, the planar substrate is laminated on the top and bottom by laminating the conductive material. Figure 10 (c) shows a top view of the layout of the top conductor 1 006 as a representative configuration, connected to the conductive vias located inside and outside the ferromagnetic component 1 004! 002. Figure 1 1 (a) -1 1 (i) shows a process step 1100 of an ia planar transformer 200 in accordance with an aspect of the present invention. As shown in Fig. 11 (a), the perforation 1 1 0 2 is placed in the fully cured and rigid substrate n 〇 4 . Fig. 1 1 〇 (b) shows that the ferromagnetic material 1 1 〇 6 is arranged in the bore 1 1 02. Then, as shown in Fig. 11(c), the ferromagnetic material is encapsulated in the elastic and non-conductive material 1108. Figure 11 (d) shows the use of an insulating adhesive H14 to bond the top conductor 1110 and the bottom conductor 1112 to the planar substrate 1104. Figure 11 (e) shows a perforation 1116 drilled through the top conductor U1, the top bonding layer 1114 'elastic and non-conductive material 1 108, the planar substrate 1 1 〇 4, the bottom bonding layer H14, and the bottom conductor 1112, and then The perforations 1116 are cleaned. Figure 11 (f) shows that the perforations 1112 are coated with metal to create conductive vias 111 8 . Then, as shown in Fig. 1 1 (g), the conductive via 1 1 18 is flush with the top and bottom surfaces of the -25-201036006 conductive layer (1110/1112). The top conductor 1120 and the bottom conductor H22 are formed in the conductor 1110/1112 by etching by a lithographic mask or other compatible method. (i) shows a cross-sectional view of the completed wide-band planar transformer Π 00, all of which have been coated with insulating layer H24. Using microvias, additional layers can be layered on top and bottom of the conductors 1 1 1 0/1 1 1 2 ) connected to each other to add additional layers. Example of a highly symmetrical ceramic-filled hydrocarbon-filled composite material from Rogers' name 4450F, which is also ideal for the addition of excess insulation and higher density drilling. It is also possible to prepare a planar substrate by using a 4450F sheet or other such laminate with a copper layer on one side to produce a suitable groove for the ferromagnet and the low oxy-resin. The composition described after the low-stress epoxy resin helps to slow down the lamination pressure so as not to damage the ferromagnet. The alternative method of the present invention allows the user to use an organic polymer substrate such as liquid crystal polymerized LCP, wherein the pores have been pre-formed and the pores contain A ferromagnetic body is placed thereon. The ferromagnetic body is mechanically vibrated into position by using a tapered insert or by pick and place. In this case, the LCP substrate and column provide a structural support skeleton. Then, since the pass is set to pass through the LCP, ultra-low stress such as polyfluorene is used to surround the ferromagnetic body. The thick FR-4 layer can be laminated on the ferromagnetic body. Then, when the entire process is performed as in the standard PCB process described above, this layer can be used higher than the planar substrate, so that when the material is underneath When flowing, the flow is limited. 1 (h Electrical layer I 11 of the layers (the flow is the upper one, the slightly higher in the force ring (the column is above the hole material in the machine condition. When ^ Tg -26- 201036006 Figure 12a-12b shows the use of LCP as The planar substrate and the stacked structure 1200. Here, the planar substrate 1202 is controlled to a depth as shown and the ferromagnetic body is inserted, wherein for low temperature liquids (LCP) 1202, the hole depth can be as low as From the bottom, it is possible to use, for example, LPC-based materials in a molded form or a circuit-laminated form. When a low-temperature LCP is used as the planar substrate 1 202, other materials described earlier are used and a heterogeneous interface is prevented; at a pressure of 0 or non-existent The LCP can withstand high temperatures and can be made around ferromagnetic. At the center of the ring or ring tube 1204, the posts can be inserted into the dimensions of the finished bore (see Figure 14b and Figure 16). When the modulus temperature (~180 degrees) starts to flow, it is typically reached at a glass transition temperature (Tg) of 280 to 350 degrees. When copper 1 206 is stacked on the top and bottom, Use a more LCP 1 2 08 or higher The temperature of the thermoplastic material is laminated and dimensioned. Then, we can use the process steps shown earlier to complete the via and trace formation on the Q board. Add additional copper to the top and bottom copper by using additional bonding material. Layer 1 2 0 6. In addition, using the same process, the germanium circuit 1 208 in the form of a dispersive SMT, the die and the package die are embedded in the ferromagnetic 1 204. Figure 12 (b) shows the path next to the ferromagnetic body Figure 12(a) shows the connections made using microvias Μ circuits 1 208 drilled at a controlled depth. These vias can be formed using mechanical drilling or lasers. The co2 laser can specifically pass through, for example, a ring. Soft material, and another hole in the hard material such as copper and pad to the hole to the crystal polymerization 0. 1 mm of thermoplastic can not exist in the body and the mold is made of LCP material. After the high flow rate and high temperature, the rigid LCP base can be used to separate and connect the electricity to the hole. The oxygen resin will penetrate -27- 201036006 In addition, once the through hole is drilled and the ferromagnetic body is placed, the additional copper layer covered by the FR-4 or the pre-filled body can be laminated on top of the layer for supporting the ferromagnetic body, wherein the lamination process requires Both pressure and heat can be completed. In this lamination process, the resin coated ferromagnet was destroyed. If there is no additional flattening, the general FR-4 does not provide enough liquid glue to cover the unevenness in the planar substrate. The additional laminate leaves an open-air gap that will stratify when tested for general reliability. It does not stick to the ferromagnetic material, causing reliability problems. The above technique prevents flatness problems. Once copper is attached to a thick conformal solder mask, typically 2 layers of solder mask or special material is required for voltage protection to improve the breakdown voltage and can be fully electro-mine Through hole. In the absence of new and novel methods, as noted in the prior art, the PCB process cannot easily conform to the desired magnetic material. A key requirement as a component of transformer operation is that they provide electrical isolation. The Ethernet component must be able to support 1 500 Vrms AC for one minute. This can be achieved by using a solder mask layer or other material that produces conductive insulation. Typically, a two layer solder mask is required. In addition, it is important to fill the through holes with a non-conductive material. Creating an electromagnetic component requires a large number of through holes to be placed around the irregular ferromagnetic body. This can result in uneven surfaces. The number of these ridges and significant through holes creates an air gap that collapses under high voltage stress. In addition, it is important to ensure that the bubbles present in the epoxy or encapsulant are removed prior to the curing process. Without new technology, these components will not pass the standards required for the components of these types -28- 201036006. Figure 13 shows an implementation technique 1300 for creating very high voltage capabilities for planar magnetic components. A thin layer of crash material 1302 can be used simultaneously to create a coupled parallel plate capacitor to relieve DC blocking or filtering/matching applications' and to generate a high voltage collapse before the circuit would collapse at 1500V rms. This configuration provides a breakdown voltage from 500V rms to 10,000V rms depending on the materials used between the circuits. The setting of the crash material is important. The FR4 or substrate material is drilled or perforated and the collapsed material is shaken and cured prior to the lamination process. Another embodiment of this is to open the pad in the PCB solder mask and to deposit the collapsed material over the surface, the size of the ferromagnetic body, the number of turns required to achieve the open circuit inductance, and the closed loop magnetic path. There is an exchange condition between the actual number of turns taken by a shape. According to yet another aspect, focusing on the perimeter, creating a novel shape that still has a closed loop path, and the novel shape has enough Q through holes to maximize inductance - they can be made narrow to facilitate multi-channel components (multiple ferromagnets and multiple channels per channel).

Fr-4 is a general epoxy resin, and a glass composite used for a PCB substrate material has a coefficient of thermal expansion which is generally six times higher than that of a ferromagnetic material. This means that 'providing that a precise opening is made in the Fr_4 base member for the magnetic element as shown in Fig. 14 (a), then the ferromagnetic body will encounter a high degree during thermal expansion visible in, for example, a PCB infrared reflow operation. Stress. Since the ferromagnetic body is quite fragile, this causes the core to break and damage the performance of the electromagnetic component. Figure 1 4 (b) shows a good alignment of the ferromagnetic body relative to the hole size -29- 201036006 Example. Figure 1 4 (c) shows an example of the irregularity of the hole size relative to the size of the ferromagnetic body. Alternatively, large openings can be made to provide latitude and stress issues that accommodate the fabrication of ferromagnets, but this can result in delamination due to air gaps in the structure or improper junctions with the desired vias. The problem of degree, thus eliminating one of the main advantages of the components of the method according to the invention. The commercially available epoxy resin used to fill this gap can be unstressed due to the formation of high stress chains in the polymer. Low-stress formulations such as polyoxynitride do not provide sufficient solidity for drilling and through-hole formation. According to another aspect of the invention, a low stress epoxy is provided between a higher CTE and a sensitive, fragile ferromagnet. This layer is made of a first stress adhesive such as a low stress epoxy resin to which a rubber derivative is added, and is considerably different from the substrate FR-4. It adds a low modulus of expansion so that as the temperature on the board increases, it becomes rubber and absorbs most of the swell from FR-4 and is applied to it as shown in Figure 15(a)-15. (b), in turn, provides a stable base material for the required drilling of the through holes, and is still sufficiently rigid to protect the through bars and tracks on the material. This is important for the ability to use a PCB to support magnetic ferromagnets. Without this, this kind of i is impossible.

For example, an adhesive for epoxy resin may be first dispensed in ferromagnetic i, or after a configuration in which a low stress material is first disposed and then g is allowed to be placed in a given opening, the tendency to distribute the adhesive is preferred. Align yourself so that the epoxy is on the sides of all the edges, the resulting structure is FR-4 interface is low for more image, the substrate is made to support the opening The magnet is flattened -30- 201036006. The component is placed 'and then semi-cured, thus eliminating the alignment problem described above. Further processing can be performed once the ferromagnetic body is locked in place, i.e., by using the alignment marks on the edge of the board produced prior to opening the drilled ferromagnet. This allows a standard PCB process to be important to complete the active electromagnetic components. In some cases the 'stress relief holes or slots can be drilled into the center of the ferromagnetic opening' to allow the material to expand or contract with only a slight problem. Plastic or similar materials can also be used as a plug for the center hole in the ferromagnetic magnet. Further, a low stress epoxy resin layer of a rubber derivative may be used to attach the copper layer to the top and bottom of the substrate Fr-4 holding the ferromagnetic body. This material is applied by some simple process such as screen printing or simple coating. It is important to remove any bubbles. This material acts to bond the copper to the FR-4' and provides a conformal surface on the embedded ferromagnet without causing the temperatures and stresses typically seen with FR-4 stacking. This is important for the solder mask that is required to provide a flat surface to the voltage collapse requirement later in the 〇 process. Figure 16 shows a cross-sectional view of a planar transformer 1600 in which embedded ferromagnetic 1 602 is encapsulated in a bonding stack 1 604, such as a low stress epoxy bonding laminate. Conductive vias 1 606 are shown on each side of ferromagnetic 1 602. A portion of the fully cured and rigid substrate 1 608, such as FR4 or other rigid sheet material, is shown, and the insulating laminate 1610 is shown bonded to the conductive layer 1612. Other methods according to the invention - 31 - 201036006, which contribute to the flattening of the board and the elimination of the breakdown voltage, are the complete plating of the vias with copper or other materials. This makes it possible to eliminate the problem of a high-intensity field that is not covered in the via tube and cause a collapse ionization point, and is very different from those described in the prior art. One novel method disclosed is the creation of a spherical grid area (BGA) pad at the top and bottom of the component. On the bottom, design the part with a BGA pad layout. These can be reflowed normally to attach to a custom printed circuit board. Since precision pitch balls provide much lower inductance and resistance than conventional wire-wound transformers, this can solve most of the higher frequency issues. In many applications, the required end products are used. An element similar to the size of an integrated circuit of a plastic package. Manufacturers generally do not want to use complex PCB processes for components that make up only 1% of the PCB. One aspect of the present invention is a 1C format device that allows manufacturers to continue to use high capacity processes for large boards and the advantages of the processing unit of the present invention in PCB format when needed. By slicing the board into individual small cells with BGA balls or pads similar to a quad flat no-pin (QFN) or a gateless gate array (Lga), it offers significant improvements in all-round solutions. In one aspect of the invention, the process begins with a base material made of a dielectric material 'typically FR-4, but for higher frequency components, this can be other materials. This material is manufactured in standard size and thickness and is dispensed in pieces. Manufacturers of embedded magnetic components have begun drilling holes in this material that are larger than the neodymium magnets to be used. These openings must be made large enough to maintain the gap between the ferromagnet and FR-4 to account for any expansion encountered during thermal cycling. -32- 201036006 Once this opening is made, the plate is placed tightly on the surface of the bottom forming the ferromagnetic opening. A low stress epoxy resin with an adhesion promoter, vermiculite to enhance the strength of the material, and butadiene are added to each opening. The ferromagnet is placed by a standard pick-and-place machine or a mechanical vibrator with a tapered via cover. When allowed to be installed in an epoxy resin, the ferromagnetic bodies tend to align themselves so that the epoxy material is evenly distributed around the ferromagnet. This is important for ensuring that there are no air gaps in the structure that can cause reliability failures, and that this is properly configured to ensure performance. Low temperature curing is used to lock the ferromagnetic body in place and to allow low stress polymer chain structures. Once the plate with the ferromagnet in the epoxy is cured, a thin layer of low stress epoxy is applied to the substrate. This material group is the same as the one used to fill the neodymium magnet except to remove the softening material. This material is evenly spread or applied to the board by a mechanical brush or screen printing process. A copper layer is then applied to the top surface. The plate is placed in a vacuum box to remove any air bubbles that can be under the copper. This operation is repeated for the underlayer of copper, which is then laminated and then cured at a higher temperature to lock the low stress structure in the polymer. The through holes can be drilled mechanically or by laser. Care must be taken to avoid overheating the epoxy in mechanically drilled through holes. This can cause the epoxy to mess up and damage the drill bit. A multi-step drill collar is required to penetrate the material all the way without breaking the drill bit or leaving a large amount of debris in the hole. The reformed epoxy resin debris causes improper plated through holes and reliability issues. UV laser drilling can also be used to create through hole openings. -33- 201036006 In some cases, the quality of the ferromagnetic magnet makes it sensitive to the expansion of the epoxy resin in its center. If an extended temperature range is required, a stress relief must be provided to allow the inner epoxy to expand without breaking the ferromagnetic or causing delamination of the PCB trace. Drilling additional imitation holes during the drilling process can prevent this. These are not blocked and will not be plated; however, this provides room for epoxy expansion when the device is exposed to temperature extremes. Standard PCB processing can be used for electroless plating, electroplating, and board patterning. However, in order to protect the thin vias from the breakdown voltages caused by very high potential fields, these vias are fully charged. This can also be achieved by a conductive polymer. This capillary action on the weld material mask leaves a solid top surface that does not have a "valley". This spreads the field over a wider material width and provides a flat surface to the solder mask to be coated without an air gap. Once this is achieved, a double layer solder mask must be applied to the board. This is used to protect against high pressure crash tests (high voltage insulation test) and must be consistent with the board so that no air gaps may occur during testing. Screen-printed parts allow manufacturers to identify their parts to their customers. Additional real-time product information can be added to easily identify device information on the top of the part. Once these boards are completed, a complete performance test (online nail bed test) is performed on the entire board immediately, providing good cost savings. Parts can be attached with solder. In the case of a QFN package, additional large vias are added to the drilling and plating process that is a semi-circular hole in the case of a castellation. The plates can be drilled to provide individual units. Since these units can be stacked, horizontally or vertically, inserted into different mechanical enclosures or cables -34- 201036006 components, a number of possible solutions can be achieved. In addition, a simple pressure-pressure mounting "snap in" configuration can be implemented. Figures 17(a)-17(c) show stacking option 1700 in which solder balls 1702 are disposed on the bottom and top sides of the integrated planar transformer and electronic component 107. Figure 17 (b) shows the bottom pad 17 〇 6 and the top pad 1 708 on the integrated component 1704 configured for stacking, and Figure 17 (c) shows the bottom pad 1 706 on the integrated component 1 704 for stacking and An integrated component that does not have a pad as the top of the Q and the insulation layer 1 7 0 4 . The invention has been described in terms of a plurality of representative embodiments, which are intended to illustrate different aspects and not to limit. Thus, the present invention is capable of many modifications and modifications and For example, other laminate materials having a higher dielectric constant ranging from 2 to 〇〇〇, from 3 μ, DuPont, and R0gers, are used as a substrate or a laminate. Variations in the conductor material can be used. Copper can be replaced by aluminum, silver or gold to increase conductivity and reduce losses. Die attach techniques such as die attach, bump attachment, wiring, etc. are not illustrated herein. Other embodiments are that the ferromagnetic holes are large enough to embed the germanium circuit in the interior of the ferromagnetic or ferromagnetic material. Applications such as antennas and other εΜι aggregation techniques can be implemented for energy harvesting and ultra-wideband. All such variations are considered to be within the scope and spirit of the invention as defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The objects and advantages of the present invention can be understood by reading the above detailed description in conjunction with the accompanying drawings in which: Figure 1(a) - (b) shows a prior art connection using a hand-wound magnet The hand-wound magnets are integrated into the connector housing using conventional soldering methods. Figures 2(a)-(e) show planar transformers arranged in a tight array in accordance with the present invention. Figures 3(a)-(b) show connectors made into compact array units in accordance with the present invention to enable connector manufacturers to use different channel portions. Figures 4(a)-(e) show the termination resistor placed directly on top of the magnet structure and central tap configuration in accordance with the present invention. Figures 5(a)-(e) show the back of a socket mounted to a planar magnet in accordance with the present invention, wherein the conductor slides into a hole in the planar magnetic substrate. Figure 6 shows a connector mounted to a pCB in accordance with the present invention for attaching a planar magnet to a PCB'where' as shown at the bottom of the device, adding additional headers. Figures 7-10 show different embodiments and aspects of the apparatus and process of the present invention. 1 (a) - (i) show the steps of an embodiment of fabricating a planar magnet structure in accordance with the present invention. 12(a)-(b) show a liquid crystal polymer (LCP) LCP and a laminate layer as a planar substrate according to the present invention. Figure 13 shows the high voltage capability of a planar magnetic device in accordance with the present invention. -36- 201036006 Figure 1 4 (a) - (c) shows that, in accordance with the present invention, a ferromagnetic body will be seen to a high degree during thermal expansion in the case of manufacturing a penetration hole in a base member of Fr-4 for a magnetic element. The stress is as seen in the p CB infrared reflow operation. Figure 5(a) - (b) shows that the layer made of the first stress adhesive and the added rubber derivative according to the present invention is very different from the substrate FR-4, which absorbs a lot of causes due to reflow, lamination and Other pressure and temperature processes come from the stress of FR-4 thermal expansion, which in turn provides the stable base material needed for through hole drilling. Figure 16 shows a low stress epoxy layer without a rubber derivative added to adhere the copper layer to the top and bottom of the substrate Fr-4 holding the ferromagnetic body in accordance with the present invention. Figure 1 7 (a) - (d) shows an integrated magnetic circuit provided with stacked layers and attached solder balls in accordance with the present invention. Q [Description of main component symbols] 200: Planar transformer 2 0 2 : Planar substrate 204: Pocket 206: Ferromagnetic material 2 0 8 : Top electrode 2 1 0 : Top conductor 2 1 2 : Insulating adhesive 214 : Bottom conductor -37- 201036006 3 00: Stacked planar transformer 3 02 : Connector 3 04: Integrated connector unit 4 00 : Combined terminating resistor and magnetic structure 402 : Terminating resistor 4〇4 : Central tap terminal circuit 406 : Enhanced Filter Series LC Notch 4 0 8 : LC Notch 5 0 0 : Connector 5 02 : Socket 504 : Conductor 5 06 : Hole 508 : Headstock 9 0 0 : Current Reactor 9 04 : Bottom Winding 9 〇6: Bottom winding 1 0 0 0 : Ferromagnetic

1002 : 孑 L 1 004: inner wall 1 006 : top conductor 1 102 : perforation 1 104 : substrate 1 106 : ferromagnetic material 1 1 〇 8 : elastic and non-conductive material - 38 - 201036006 1 1 1 1 1 1 1 1 ❹ 1 1 1 1 1 1 1 1 Ο ! 1 1 1 1 1 1 1 1 _• Top conductor: bottom conductor: bottom joint layer: perforation: overnight L = top conductor: bottom conductor: insulation: structure: plane Substrate: Ferromagnetic: Copper layer: Μ - Circuit: Crash material: Planar transformer: Ferromagnetic: Bonded laminate: Conductive via: Substrate: Insulation laminate: Bonded conductive layer: Solder ball: Electronic component: Bottom pad: Top pad

Claims (1)

201036006 VII. Patent application scope: 1. An integrated planar transformer and electronic components, including: a. at least one broadband planar transformer, which is arranged in a planar substrate, wherein 'each of the broadband planar transformers comprises: i_planar substrate 'wherein the planar substrate is fully cured and rigid; 11 · ferromagnetic material' wherein the ferromagnetic material is embedded in the fully cured and rigid planar substrate, wherein the embedding comprises the ferromagnetic material encapsulation In the elastic and non-conductive materials iii - the inter-winding conductor ' is disposed around the embedded ferromagnetic body 'wherein the inter-winding conductor comprises a top conductor and a bottom conductor' which is bonded to the first bonding layer to a top surface of the fully cured and rigid substrate, the bottom conductor being bonded to the bottom surface of the fully cured and rigid substrate by a second bonding layer, wherein the bonding layer comprises an insulating adhesive, wherein the top layer The conductor and the bottom conductor are connected in an interconnected manner by conductive vias disposed on each side of the ferromagnetic body, Wherein the conductive via forms the inter-winding conductor through the bonding layer and the fully cured and rigid planar substrate; iv. at least one central tap is connected to at least one of the inter-winding conductors; and b. at least one An electronic component 'where the electronic component is connected to at least one terminal of the broadband planar transformer. The integrated planar transformer and electronic component of claim 1, wherein the planar substrate is selected from the group consisting of FR4, a thermosetting material, and a thermoplastic material. 3. The integrated planar transformer and electronic component of claim 1, wherein the adjacent top conductors and the bottom conductors are configured to conform to parallel and predetermined intervals therebetween, and the phases The adjacent top conductors and the bottom conductors are configured to maximize the number of windings surrounding the embedded ferromagnetic material to reduce winding parasitic inductance and leakage inductance. 4. The integrated planar transformer and electronic component of claim 3, wherein the spacing between the top conductors is in the range of 10 /z m to 500 #m. 5. The integrated planar transformer and electronic component of the scope of claim 1 wherein 'using' is a stack selected from the group consisting of flexible epoxy resins, high temperature thermoplastic materials, and high flow ceramic cerium-filled argon compounds. The material Q is laminated to the planar substrate. 6. For example, the integrated planar transformer and electronic component of the scope of claim 1 wherein the central tap is impedance matched to 50% of the differential impedance. ·7. Integrated planar transformer and electronics as claimed in claim 1 An assembly wherein the ferromagnetic material has a shape selected from the group consisting of a ring wheel, an annular tube, a U shape, an E shape, and a strip shape. 8. The integrated planar transformer and electronic component of claim 7, wherein the ring-shaped ferromagnetic material or the -41 - 201036006 center of the annular tube ferromagnetic material comprises a dimensionally stable charge disposed therein Compound. 9. The integrated planar transformer and electronic component of claim 7, wherein the center of the ring ferromagnetic material or the annular tube ferromagnetic material comprises a thermoplastic element disposed therein, wherein the thermoplastic element comprises The material properties of the planar substrate conform to the material properties and the shape conforming to the center of the ring or the shape of the center of the annular tube. I 0. The integrated planar transformer and electronic component of claim 1, wherein the crash material is disposed over at least two terminals of the broadband planar transformer, wherein when exposed to 50 0 rms to 10, 〇 The potential of the collapse material in the 〇〇V rms range. II. The integrated planar transformer and electronic component of claim 1 wherein all outer surfaces of the integrated planar transformer are coated with an insulating layer wherein at least one terminal of the integrated planar transformer is exposed. I2. The integrated planar transformer and electronic component of claim 1, wherein the connection between the broadband planar transformer and the electronic component comprises at least one conductive pin configured to pass through at least one hole in the substrate. Wherein the at least one conductive pin is linear or angled. The integrated planar transformer and electronic component of claim 1, wherein the top conductor comprises a teardrop shape, wherein the teardrop-shaped narrow end is connected to a ring disposed on the ferromagnetic material Or a conductive element within the center of the annular tube, and the teardrop-shaped wide end is connected to the outer conductive element of the ring or annular tubular surrounding the ferromagnetic material. 14_ For example, the integrated planar transformer of the scope of claim 13 and the electric component - 42- 201036006 sub-assembly, wherein a plurality of transformer inductors are related by a coupling coefficient between 0 and 1, wherein the dependence is based on i) the spacing between the conductive elements 'or ii) the spacing between the teardrop conductors, or iii) the opening span of the ring wheel or the annular tube ferromagnet, or iv) according to the primary and secondary a ratio of the windings of the stage; or i), Π), iii) and iv), wherein the opening span comprises an air gap, wherein the air gap comprises at least one ground via 〇〇 15. As claimed in the patent scope An integrated planar transformer and electronic component of the item 1 wherein the electronic component includes any connector that requires isolation or electromagnetic functionality. 1 6 . The integrated planar transformer and electronic component of claim 15 wherein the connector comprises at least one electrical contact connected to at least one terminal of the planar transformer. 17. The integrated planar transformer and electronic component of claim 1 wherein the at least one broadband planar transformer comprises an array of the broadband planar 〇 transformer. 18. The integrated planar transformer and electronic component of claim 1, wherein the at least one electronic component comprises an array of the connector. The integrated planar transformer and electronic component of claim 1, wherein the at least one electronic component comprises an array of the PCB. 20. The integrated planar transformer and electronic component of claim 1 wherein the integrated planar transformer and the bottom surface of the electronic component comprise a splicing interface. 21. The integrated planar transformer of claim 1 and the sub-assembly of -43-201036006, wherein the heat pipe is configured to extract heat generated at a conductor of the sub-winding. 22. The integrated planar transformer and electronic component of claim 21, wherein the heat pipe is selected from the group consisting of a thermally conductive plated metal via, at least one thermally conductive metal layer, and an additional thermally conductive metal disposed on at least one of the signal tracks And a group of at least one thermal pad disposed on an edge of the integrated planar transformer device and a heat conductive material surrounding the integrated planar transformer and the electronic component. 23. The integrated planar transformer and electronic component of claim 1, wherein the at least one central tap is disposed on top of the broadband planar transformer. 24. The integrated planar transformer and electronic component of claim 1, wherein the electronic component is disposed on top of the planar substrate to minimize a distance therebetween to provide a central tap current The match you want. 25. The integrated planar transformer and electronic component of claim 1, wherein the broadband planar transformer further comprises i) at least one common mode current transformer, each of the common mode current transformers providing signal shaping and adjustment 'or 11) Μ circuit, or i) and ii) 'where the circuit is an electrical circuit' supports the functionality of the embedded broadband planar transformer for specific functions and applications 〇 26. The integrated plane of claim 25 Transformers and electronic components, where 'the functions supported by the circuit are selected from the filtering function, crosstalk cancellation function, high voltage suppression, electromagnetic interference (ΕΜΙ) -44 - 201036006 suppression, digital control, LED control, balance - A group of unbalanced (Baiun) control and power management functions. 27. The integrated planar transformer and electronic component of claim 1, wherein the integration comprises a stack, wherein the stack comprises at least a second of the second broadband planar transformer and the second of the current stabilizer a first first broadband planar transformer and a first current transformer, and a filter and impedance matching element on top of the first broadband planar transformer and the first current transformer, wherein the broadband in the stack The number of planar transformers is based on the desired application. 28. The integrated planar transformer and electronic component of claim 1, wherein the integration comprises a stack, wherein the stack comprises a choke on top of the filter, wherein the filter is configured for impedance On top of the matching component, and the impedance matching component is disposed on the broadband planar transformer. 29. The integrated planar transformer and electronic component of claim 1, wherein the elastic and non-conductive material comprises at least one squeezing agent, wherein a thermal expansion coefficient of the elastic and non-conductive material having the chelating agent The thermal expansion factor of the planar substrate is reached. 30. The integrated planar transformer and electronic component of claim 1, wherein a hole is provided in the substrate, wherein the integrated planar transformer and the thermal expansion of the electronic component are by the holes Controlled -45 -