200921234 九、發明說明： 【發明所屬之技術領域】 本發明涉及光學成像領域，尤其涉及一種微型相機模 組及其製作方法。 【先前技術】 近年來，具有攝像功能之電子產品，例如手機（Mobile Phone)越來越受到廣大消費者之青睞。然而，隨著手機越來 越向輕薄短小方向發展，傳統之相機模組因體積較大而難 以整合到手機中以使手機兼具攝像功能。 參見 Gautham Viswanadam 等人於會議 2005 Electronics Packaging Technology Conference 上發表之 “Novel Wafer Level Package Technology Studies for Image Sensor Devices” 一文，其揭示了一種採用晶圓級封裝之微型相機 模組，包括一個半導體影像感測晶片（Semic〇nduct〇r Imaging Chip)及一個與半導體影像感測晶片組裝在一起而 構成單一模組（Single Module)之鏡頭模組。該種微型相機模 組因具小尺寸及低成本等優勢而有望應用於下一代輕薄短 小化之手機中。 由於該種微型相機模組相對於傳統之相機模組而言具 有更小之尺寸，為滿足其尺寸要求及量產要求，其整個製 程將會不同於傳統之相機模組；並且其對鏡頭模組之光學 性能要求亦將會趨於嚴格以獲取較佳之成像品質。 【發明内容】 有雲於此，提供一種具較佳成像品質之微型相機模組 200921234 及其製造方法實為必要。 一種微型相機模組，其包括： 一影像感測單元，其包括一感光區域；以及 一透鏡單元，其接合於該影像感測單元之鄰近該 區域之-側，該透鏡單元包括一玻璃概底 '一位於該玻璃 概底上之透明成核層以及一位於該透明成核層上之透鏡， 該透鏡具有-主光軸，該感光區域設置於該透鏡之主光轴 上且與該透鏡單元間隔設置。 =及，:種微型相機模組之製作方法，其包括步驟： ，供-半導體晶圓（Wafer)’其形成有複數個感光區域； _提供-玻璃晶圓，其上沈積有一透明成核層及複數個 經由壓印製程形成於該透明成核層上之透鏡，該複數個透 鏡分別具有一主光軸； 將該玻璃晶圓接合於該半導體晶圓之形成有該複數個 =一品域之侧"亥複數個感光區域與該玻璃晶圓間隔設 置且該複數個感光區域位於與其對應之透鏡的主光轴上， 從而形成一晶圓級微型相機模組陣列；以及 时切割該微型相機模組陣列’以獲取複數個相互分離之 早個微型相機模組。 該微型相機模組及其製作方法，其經由設置一透明成 :層來控制透鏡單元之透鏡於形成過程中之表面張力以及 二強透鏡與玻璃襯底之間的黏附力。一方面，表面張力之 :制可抑制透鏡於其形成過程因表面張力過大而過度收 縮’以免其光學性能下降；另一方面，黏附力之增強可使 200921234 透鏡與玻璃襯底緊密結合而不致於脫落。 【實施方式】 下面結合附圖對本發明實施例作進一步詳細說明。 第一實施例 請參閱圖1，本發明第一實施例提供之微型相機模組 10 ’其包括一影像感測單元12、一間隔層13、一透明蓋板 14、一紅外截止濾光（jnfra_red cut Filter)層15、一間隔單 元16以及一透鏡單元I?。 該影像感測單元12為一固態影像感測器件，例如電荷 耦合感測器件（CCD)或互補式金氧半導體（CM〇s)器件。該 影像感測單元可包括一半導體襯底121及一經由半導體製 程形成於半導體襯底121 —側之感光區域123;該半導體襯 底121可為矽襯底。 ’ 〇該間隔層13接合於該影像感測單元12之形成有感光 區域|23之一側，其為一環狀結構，例如方形環狀結構。 該方形裱狀結構可具有一方形輪廓及一圓形通孔。該間隔 層13可經由—黏合劑（圖中未示出），如紫外光可固化樹脂 或熱硬化樹脂與該影像感測單元12接合在一起。 該透明蓋板14接合於該間隔層13之遠離 =元12之-側，並經由該間隔層13與該感光區域 隔一預設距離。該透明蓋板14可經由一黏合劑（圖中未开 出）如i外光可固化樹脂或熱硬化樹脂與該間隔層u接名 在—起，以封蓋住該感光區域123。該透明蓋板14可由每 璃等透明材料製成。 200921234 該紅外截止濾光層15設置於該透明蓋板14之遠離該 .感光區域123之一側’用以遽除紅外光。可理解的是，根 -據微型相機模組10之應用場合不同，例如應用於紅外攝 像，该紅外截止濾光層15則需相應地變更為紅外導通 (Infra-red Pass Filter)遽光層。 該間隔單元16接合於紅外戴止濾光層15與透鏡單元 17之間，用以在該紅外截止濾光層15與透鏡單元17之間 形成一預定間隔。該間隔單元16為一環形結構，其材料優 選為黑色擋光材料。 該透鏡單元17接合於該間隔單元16之遠離該紅外截 止濾光層15之一側，用以對被拍攝物體進行光學成像；該 光學成像可由該影像感測單元12之感光區域123感測以產 生相應之電子影像訊號。該透鏡單元17包括一玻璃襯底 171、一位於該玻璃襯底171上之透明成核層173以及一位 於該透明成核層173上之透鏡175,該透鏡175具有一主光 軸00’。該透明成核層173用以控制透鏡175在其形成過程 \ . 中之表面張力以及透鏡175與玻璃襯底171之間之黏附 力；從而一方面可抑制透鏡175於其形成過程因表面張力 過大而過度收縮，以免其光學性能下降；另一方面可使透 鏡175與玻璃襯底171緊密結合而不致於脫落。該透明成 核層173之材料不同於玻璃襯底171與透鏡175,其可選用 石夕氧化物（SiOx，X之取值為1〜2)，二氧化鈦（Ti02)等無機 透明材料。該透鏡175可為塑膠透鏡，如球面、非球面或 折繞混合塑膠透鏡。該透鏡175可由壓印製程形成’例如 9 200921234 •紫外光壓印（uv Embossing)、熱壓印（Hot Embossing)或氮靜 . 壓壓印（Nitrogen Embossing)等屋印工藝。 • 需要指明之是，本發明第一實施例之微型相機模組1〇 亦可不設置該透明蓋板14、紅外截止濾光（Infra_red Filter)層15及間隔單元16，而係將該透鏡單元17經由該 間隔層13及黏合劑（圖中未示出）直接接合於該影像感測單 το 12之鄰近該感光區域123之一側，並經由該間隔層 與該感光區域123間隔一預設距離。另外，可理解的是， 該預設距離之大小可經由設定間隔層13之厚度來調整。進 步的，5亥透鏡單元17並不限於僅在玻璃襯底171之一側 設置透明成核層及透鏡，其可於玻璃襯底171之雙面均設 置透明成核層及透鏡。 參見圖2及圖3’下面將具體描述一種製作微型相機模 組10之方法，其大致可包括以下步驟： ，步驟（a):提供一半導體晶圓（Wafer)221，其上經由半導 I體製程形成有複數個感光區域123;本實施射， 晶圓221為矽晶圓。 步驟（b):提供—間隔層晶圓23 ’利用㈣、或雷射鑽 孔、或超聲鑽孔等方法於間隔層晶圓23上形成複數個通孔 231 ’例如圓形通孔。 ㈣⑷：提供—透明蓋板晶圓24 ’於該透明蓋板晶圓 —表面上利用濺鑛或蒸錢等沈積方式形成—紅外截止 〜層25;本實施例中，該透明蓋板晶® 24 4-玻璃晶圓。 夕驟⑷.提供-黑色間隔單元晶圓26，利用蝕刻、或 200921234 • 雷射鑽孔、或超聲鑽孔算方法私叫 σ _ ^ Μ札寺万法於間隔早兀晶圓26上形成複 1數個通孔261，例如圓形通孔。 步驟⑷：提供-玻璃晶圓271，於玻璃晶圓Μ上沈 ^透明成核層加該透明成核層273可經由蒸鑛或減鑛 方式沈積於該玻璃晶圓271 i，用以於後續透鏡Μ之形 成過程中控制其表面張力及透鏡175與玻璃晶圓Μ之黏 附力。該透明成核層273之材料不同於玻璃晶圓Μ，豆可 為石夕氧化物、二氧化鈦等無機透明材料。然後，於透明成 核層273上經由壓印製程形成複數個透鏡175。 具體的，該壓印製程可為⑴紫外光壓印：利用一壓模 之成里面疋印开》成於透明成核層273上之紫外光可固化 樹脂層以形成複數個透鏡預成型體，並利用紫外光照射固 化肩透鏡預成型體來獲取複數個該透鏡175 ; (H)熱壓印： 利用一壓杈之成型面壓印一形成於透明成核層273上之熱 塑性樹脂層，於壓印過程中控制壓印溫度及施加於塵模相 對於其成型面之背面的壓力，例如1〇〇〜2〇〇〇牛頓 (Newton)，來獲取複數個透鏡預成型體，冷卻後即可獲得複 數個該透鏡175 ;或（Ui)氮靜壓壓印：利用氮氣向壓模之相 對於其成型面之背面施加壓力來壓印出複數個該透鏡 175，由於氮氣為流體，其作用於壓模背面之壓力的分佈較 均勻，進而有利於提升最終形成之透鏡175的品質。需要 指明的是，該透鏡175之表面形狀設計可取決於壓模之成 型面形狀。 步驟（f):將該半導體晶圓221、間隔層晶圓23、透明 11 200921234 蓋板晶圓24、間隔單元晶圓26、以及其上依次形成有透明 t成核層273及複數個透鏡175之玻璃晶圓271，依次疊設在 一起，相鄰兩者之間可經由紫外光固化樹脂或熱硬化樹脂 (圖未示出）接合在一起，以使該玻璃晶圓271接合於該半導 體晶圓221之形成有該複數個感光區域123之一側；該複 數個感光區域123和該玻璃晶圓271間隔設置且該複數個 感光區域123分別位於與其對應之透鏡175之主光軸00’ 上，從而形成一個晶圓級微型相機模組陣列100(如圖3所 示）。 步驟（g):切割該微型相機模組陣列100，則可獲取複 數個相互分離之單個微型相機模組10。 需要指明的是，本實施例中之步驟（a)〜步驟（g)的順序 僅為舉例，並非限制本發明；本領域技術人員可適當變更 各步驟（a)〜(g)之先後順序，只有其不偏離本發明之技術效 果均可。 第二實施例 請參閱圖4,本發明第二實施例提供之微型相機模組 30，其與第一實施例提供之微型相機模組10基本相同，包 括一影像感測單元12、一間隔層13、一透明蓋板14、一紅 外截止渡光（Infra-red Cut Filter)層15、一間隔單元16及一 透鏡單元17 ;該影像感測單元12包括一半導體襯底121 及一形成於該半導體襯底121 —侧之感光區域123。不同之 處在於：該微型相機模組30還包括一透鏡單元37、以及位 於透鏡單元37與透鏡單元17之間的另一間隔單元36。該 12 200921234 透鏡單元37包括一玻璃襯底371、一位於該玻璃襯底371 上之透明成核層373、以及一位於該透明成核層373上之透 鏡375。該透鏡單元37之透鏡375設置於透鏡單元17之透 鏡175的主光軸上，且該透鏡單元37與該透鏡單元17 接合在一起並經由該間隔單元36與透鏡單元17間隔一預 設距離。該透明成核層373與第一實施例之透明成核層173 基本相同，故不再贅述。該透鏡375與透鏡175可為球面、 非球面或折繞混合塑膠透鏡。該種雙透鏡單元17之設置， 有利於光學像差之校正，進而可提升整個微型相機模組30 之成像品質。 另外’本領域技術人員可理解的是，本實施例中微型 相機模組30並不限於僅包括兩個透鏡單元，其還可包括更 多個透鏡單元，具體數量則可根據實際應用之需求而定。 參見圖5 ’該微型相機模組3〇之製作方法與該微型相 機杈組10之製作方法基本相同，不同之處在於：為使微型 相機杈組30具雙透鏡單元之結構，於微型相機模組3〇之 装=過程中，還需提供一其上依次形成有透明成核層473 及複數個透鏡375之玻璃晶圓471、以及另一間隔單元晶圓 牝該透明成核層473與間隔單元晶圓牝分別與微型相機 核組10之製作方法中之透明成核層仍及間隔單元晶圓％ 基本相同，於此不再贅述。 θ ‘上所述，本發明確已符合發明專利之要件，遂依法 提出專利巾請。惟’以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 13 200921234 - 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 , 應涵蓋於以下申請專利範圍内。 _【圖式簡單說明】 圖1係本發明第一實施例提供之一種微型相機模組之 截面示意圖。 圖2係本發明實施例提供之一種製作圖1所示微型相 機模組之方法之一過程狀態局部示意圖。 圖3係本發明實施例制得之一個晶圓級微型相機模組 / * 陣列之俯視示意圖。 圖4係本發明第二實施例提供之另一種微型相機模組 之截面示意圖。 圖5係本發明實施例提供之一種製作圖4所示微型相 機模組之方法之一過程狀態局部示意圖。 【主要元件符號說明】 微型相機模組 10 ' 30 影像感測單元 12 半導體概底 121 感光區域 123 間隔層 13 透明蓋板 14 紅外截止濾光層 15 間隔單元 16 透鏡單元 17 玻璃襯底 171 透明成核層 173 透鏡 175 半導體晶圓 221 間隔層晶圓 23 通孑L 231 透明盖板晶圓 24 紅外截止濾光層 25 間隔早元晶圓 26 通孔 261 玻璃晶圓 271 14 200921234 透明成核層 透鏡單元 透明成核層 間隔單元晶圓 透明成核層 273 間隔單元 36 37 玻璃襯底 371 373 透鏡 375 46 玻璃晶圓 471 473 15200921234 IX. Description of the Invention: [Technical Field] The present invention relates to the field of optical imaging, and more particularly to a miniature camera module and a method of fabricating the same. [Prior Art] In recent years, electronic products with camera functions, such as mobile phones, have become more and more popular among consumers. However, as mobile phones are becoming more and more thin and light, the conventional camera modules are difficult to integrate into mobile phones due to their large size, so that the mobile phones have both camera functions. See "Novel Wafer Level Package Technology Studies for Image Sensor Devices" by Gautham Viswanadam et al., at the 2005 Electronics Packaging Technology Conference, which discloses a micro camera module in a wafer level package that includes a semiconductor image sensing A chip (Semic〇nduct〇r Imaging Chip) and a lens module assembled with a semiconductor image sensing chip to form a single module. This miniature camera module is expected to be used in the next generation of thin and light mobile phones due to its small size and low cost. Since the miniature camera module has a smaller size than the conventional camera module, the entire process will be different from the conventional camera module in order to meet the size requirements and mass production requirements; and the lens module The optical performance requirements of the group will also tend to be strict to achieve better image quality. SUMMARY OF THE INVENTION In view of this, it is necessary to provide a miniature camera module with a better imaging quality 200921234 and its manufacturing method. A miniature camera module includes: an image sensing unit including a photosensitive area; and a lens unit coupled to a side of the image sensing unit adjacent to the area, the lens unit including a glass bottom a transparent nucleation layer on the glass substrate and a lens on the transparent nucleation layer, the lens having a main optical axis disposed on a main optical axis of the lens and associated with the lens unit Interval setting. = and, the method for fabricating a miniature camera module, comprising the steps of: a semiconductor wafer (wafer) formed with a plurality of photosensitive regions; a _ supply-glass wafer having a transparent nucleation layer deposited thereon And a plurality of lenses formed on the transparent nucleation layer by an embossing process, wherein the plurality of lenses respectively have a main optical axis; and bonding the glass wafer to the semiconductor wafer to form the plurality of = one product domain a plurality of photosensitive regions are spaced from the glass wafer and the plurality of photosensitive regions are located on a main optical axis of the lens corresponding thereto, thereby forming a wafer level micro camera module array; and cutting the micro camera at the same time The module array 'to obtain a plurality of early miniature camera modules separated from each other. The miniature camera module and the manufacturing method thereof control the surface tension of the lens of the lens unit during formation and the adhesion between the two strong lenses and the glass substrate by providing a transparent layer. On the one hand, the surface tension: the system can inhibit the lens from being excessively contracted due to excessive surface tension during its formation to prevent its optical performance from deteriorating; on the other hand, the adhesion enhancement can make the 200921234 lens and the glass substrate tightly coupled without causing Fall off. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. The first embodiment of the present invention provides a miniature camera module 10' including an image sensing unit 12, a spacer layer 13, a transparent cover 14, and an infrared cut filter (jnfra_red). The cut filter layer 15, a spacer unit 16, and a lens unit I?. The image sensing unit 12 is a solid-state image sensing device such as a charge coupled sensing device (CCD) or a complementary metal oxide semiconductor (CM) device. The image sensing unit may include a semiconductor substrate 121 and a photosensitive region 123 formed on the side of the semiconductor substrate 121 via a semiconductor process; the semiconductor substrate 121 may be a germanium substrate. The spacer layer 13 is bonded to one side of the image sensing unit 12 on which the photosensitive region|23 is formed, which is an annular structure such as a square ring structure. The square dome structure can have a square outline and a circular through hole. The spacer layer 13 may be bonded to the image sensing unit 12 via a bonding agent (not shown) such as an ultraviolet curable resin or a thermosetting resin. The transparent cover 14 is joined to the side of the spacer layer 13 away from the = element 12, and is separated from the photosensitive area by a predetermined distance via the spacer layer 13. The transparent cover 14 can be attached to the photosensitive region 123 via an adhesive (not shown) such as an external photocurable resin or a thermosetting resin. The transparent cover 14 can be made of a transparent material such as glass. 200921234 The infrared cut filter layer 15 is disposed on a side of the transparent cover 14 away from the photosensitive region 123 for removing infrared light. It can be understood that, depending on the application of the miniature camera module 10, for example, for infrared imaging, the infrared cut filter layer 15 needs to be changed to an infrared-infrared filter (Infra-red Pass Filter). The spacer unit 16 is bonded between the infrared wear filter layer 15 and the lens unit 17 for forming a predetermined interval between the infrared cut filter layer 15 and the lens unit 17. The spacer unit 16 is an annular structure, and the material thereof is preferably a black light blocking material. The lens unit 17 is coupled to one side of the spacing unit 16 away from the infrared cut filter layer 15 for optical imaging of the object; the optical imaging can be sensed by the photosensitive area 123 of the image sensing unit 12 Generate corresponding electronic image signals. The lens unit 17 includes a glass substrate 171, a transparent nucleation layer 173 on the glass substrate 171, and a lens 175 on the transparent nucleation layer 173. The lens 175 has a main optical axis 00'. The transparent nucleation layer 173 is used to control the surface tension of the lens 175 in the forming process thereof and the adhesion between the lens 175 and the glass substrate 171; thereby, on the one hand, the lens 175 is inhibited from being excessively deformed due to surface tension during its formation. However, excessive shrinkage prevents the optical performance from deteriorating; on the other hand, the lens 175 can be tightly bonded to the glass substrate 171 without falling off. The material of the transparent nucleation layer 173 is different from that of the glass substrate 171 and the lens 175, and an inorganic transparent material such as SiOx (Xx value: 1 to 2) or titanium dioxide (Ti02) may be used. The lens 175 can be a plastic lens such as a spherical, aspherical or folded plastic lens. The lens 175 can be formed by an imprint process, such as 9 200921234 • UV Embossing, Hot Embossing, or Nitrogen Embossing. It should be noted that the micro camera module 1 of the first embodiment of the present invention may not be provided with the transparent cover 14, the infrared cut filter (Infra_red Filter) layer 15 and the spacer unit 16, but the lens unit 17 is The spacer layer 13 and the adhesive (not shown) are directly bonded to one side of the image sensing sheet τ 12 adjacent to the photosensitive region 123, and are spaced apart from the photosensitive region 123 by a predetermined distance via the spacer layer. . In addition, it can be understood that the size of the preset distance can be adjusted by setting the thickness of the spacer layer 13. Further, the 5 liter lens unit 17 is not limited to providing a transparent nucleation layer and a lens on only one side of the glass substrate 171, and a transparent nucleation layer and a lens may be provided on both surfaces of the glass substrate 171. Referring to FIG. 2 and FIG. 3 ′, a method for fabricating the miniature camera module 10 will be specifically described below, which may substantially include the following steps: Step (a): providing a semiconductor wafer (Wafer) 221 via a semiconductor I The process is formed with a plurality of photosensitive regions 123; in this embodiment, the wafer 221 is a germanium wafer. Step (b): providing a spacer wafer 23' to form a plurality of vias 231' such as circular vias on the spacer wafer 23 by means of (d), or laser drilling, or ultrasonic drilling. (4) (4): Providing - the transparent cover wafer 24' is formed on the surface of the transparent cover wafer by deposition such as splashing or steaming - infrared cut-off layer 25; in this embodiment, the transparent cover crystal® 24 4-glass wafer. (4). Provided - black spacer cell wafer 26, using etching, or 200921234 • laser drilling, or ultrasonic drilling calculation method privately called σ _ ^ Μ 寺 万 万 于 于 于 于 于 于 于 于A plurality of through holes 261, such as circular through holes. Step (4): providing a glass wafer 271, depositing on the glass wafer, transparent nucleation layer, and the transparent nucleation layer 273 may be deposited on the glass wafer 271 i by steaming or demining for subsequent use The surface tension and the adhesion of the lens 175 to the glass wafer are controlled during the formation of the lens. The material of the transparent nucleation layer 273 is different from that of the glass wafer, and the beans may be inorganic transparent materials such as Shixia oxide and titanium dioxide. Then, a plurality of lenses 175 are formed on the transparent nucleation layer 273 via an imprint process. Specifically, the embossing process may be: (1) ultraviolet embossing: using a stamper to smear the ultraviolet curable resin layer formed on the transparent nucleation layer 273 to form a plurality of lens preforms, and A plurality of the lenses 175 are obtained by curing the shoulder lens preform by ultraviolet light irradiation; (H) hot stamping: a thermoplastic resin layer formed on the transparent nucleation layer 273 is stamped by a pressed molding surface, and pressed During the printing process, the imprinting temperature is controlled and the pressure applied to the back surface of the dust mold relative to the molding surface thereof, for example, 1 〇〇 2 New Newton, to obtain a plurality of lens preforms, which are obtained after cooling. a plurality of the lenses 175; or (Ui) nitrogen hydrostatic imprint: a plurality of the lenses 175 are imprinted by applying pressure to the back surface of the stamper relative to the molding surface thereof by nitrogen gas, and the nitrogen acts as a fluid, which acts on the pressure The pressure distribution on the back side of the mold is relatively uniform, which in turn helps to improve the quality of the lens 175 that is ultimately formed. It is to be noted that the surface shape design of the lens 175 may depend on the shape of the molding surface of the stamper. Step (f): forming the semiconductor wafer 221, the spacer wafer 23, the transparent 11 200921234 cover wafer 24, the spacer cell wafer 26, and the transparent t nucleation layer 273 and the plurality of lenses 175 thereon The glass wafers 271 are stacked one on another, and the adjacent two of them may be bonded together via an ultraviolet curing resin or a thermosetting resin (not shown) to bond the glass wafer 271 to the semiconductor crystal. The circle 221 is formed with one side of the plurality of photosensitive regions 123; the plurality of photosensitive regions 123 are spaced apart from the glass wafer 271 and the plurality of photosensitive regions 123 are respectively located on the main optical axis 00' of the lens 175 corresponding thereto. Thus, a wafer level micro camera module array 100 is formed (as shown in FIG. 3). Step (g): cutting the micro camera module array 100, a plurality of individual micro camera modules 10 separated from each other are obtained. It should be noted that the order of steps (a) to (g) in this embodiment is merely an example, and is not intended to limit the present invention; those skilled in the art may appropriately change the order of steps (a) to (g). Only it does not deviate from the technical effects of the present invention. The second embodiment of the present invention is the same as the miniature camera module 10 of the first embodiment, and includes an image sensing unit 12 and a spacer layer. 13. A transparent cover 14 , an infrared cut filter layer 15 , a spacer unit 16 and a lens unit 17 ; the image sensing unit 12 includes a semiconductor substrate 121 and a The semiconductor substrate 121 is a photosensitive region 123 on the side. The difference is that the miniature camera module 30 further includes a lens unit 37 and another spacing unit 36 between the lens unit 37 and the lens unit 17. The 12 200921234 lens unit 37 includes a glass substrate 371, a transparent nucleation layer 373 on the glass substrate 371, and a lens 375 on the transparent nucleation layer 373. The lens 375 of the lens unit 37 is disposed on the main optical axis of the lens 175 of the lens unit 17, and the lens unit 37 is engaged with the lens unit 17 and spaced apart from the lens unit 17 by a predetermined distance via the spacer unit 36. The transparent nucleation layer 373 is substantially the same as the transparent nucleation layer 173 of the first embodiment, and therefore will not be described again. The lens 375 and lens 175 can be spherical, aspherical or folded hybrid plastic lenses. The arrangement of the double lens unit 17 facilitates the correction of optical aberrations, thereby improving the imaging quality of the entire miniature camera module 30. In addition, it can be understood by those skilled in the art that the micro camera module 30 in this embodiment is not limited to only including two lens units, and may further include more lens units, and the specific number may be according to actual application requirements. set. Referring to FIG. 5, the manufacturing method of the micro camera module 3 is basically the same as the manufacturing method of the micro camera unit 10. The difference is that in order to make the micro camera unit 30 have a structure of a double lens unit, the micro camera module In the process of group 3, a glass wafer 471 on which a transparent nucleation layer 473 and a plurality of lenses 375 are sequentially formed, and another spacer cell wafer 473 the transparent nucleation layer 473 and the spacer are further provided. The unit wafer defect is substantially the same as the transparent nucleation layer and the spacer unit wafer % in the manufacturing method of the micro camera core group 10, and will not be described herein. θ ‘The above description, the invention has indeed met the requirements of the invention patent, and the patent towel is requested according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in accordance with the spirit of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a miniature camera module according to a first embodiment of the present invention. FIG. 2 is a partial schematic view showing a process state of a method for manufacturing the micro-camera module shown in FIG. 1 according to an embodiment of the present invention. 3 is a top plan view of a wafer level micro camera module /* array made in accordance with an embodiment of the present invention. 4 is a schematic cross-sectional view showing another miniature camera module according to a second embodiment of the present invention. FIG. 5 is a partial schematic view showing a process state of a method for manufacturing the micro-camera module shown in FIG. 4 according to an embodiment of the present invention. [Description of main component symbols] Micro camera module 10' 30 Image sensing unit 12 Semiconductor base 121 Photosensitive area 123 Spacer 13 Transparent cover 14 Infrared cut filter layer 15 Spacer unit 16 Lens unit 17 Glass substrate 171 Transparent Core layer 173 lens 175 semiconductor wafer 221 spacer wafer 23 pass L 231 transparent cover wafer 24 infrared cut filter layer 25 interval early wafer 26 through hole 261 glass wafer 271 14 200921234 transparent nucleation layer lens Cell transparent nucleation layer spacer unit wafer transparent nucleation layer 273 spacer unit 36 37 glass substrate 371 373 lens 375 46 glass wafer 471 473 15