200929461 九、發明說明： '【發明所屬之技術領域】 ' 本發明涉及一種發光二極體模組，特別係指一 種具有散熱結構之發光二極體模組。 【先前技術】 發光二極體作為一種高效之發光源，具有環 保、亮度高、省電、壽命長等諸多特點已經被廣泛 ◎之運用於各種領域。惟，發光二極體工作時會產生 大量之熱量，特別係一些用於照明之大功率之發光 二極體，熱量如若得不到及時之散發，易產生過熱 現象，進而導致其發光效率下降。 為使發光二極體產生之熱量及時散發以保持 其正常工作溫度，通常將複數發光二極體貼置於一 散熱體上從而形成一具有散熱結構之發光二極體 模組，該發光二極體模組根據實際需要應用於不同 ❹照明燈具中。傳統之發光二極體模組包括一平板狀 之散熱體及複數安裝於該散熱體一側面之複數發 光二極體。當發光二極體被點亮時，其產生之熱量 經由散熱體散發至周圍空氣中。這些發光二極體呈 線性均勻地排列，且由於發光二極體係單侧出光， 發光二極體模組之照射角度及範圍極易受其所採 用之發光二極體類型所限，照射範圍比較窄，照明 效果不佳。 6 200929461 【發明内容】 有鑒於此，有必要提供一種照射範圍較 有散熱結構之發光二極體模組。 一種具有散熱結構之發光二極體模組， 散熱器及貼置於該散熱器之複數發光二 元，該散熱器包括一導熱座及由該導熱座延 之複數散熱鰭片，該導熱座具有朝向不同 ◎面，該發光二極體單元貼置於該吸熱面而朝 方向照射。 與習知技術相比，所述散熱器供發光二 元貼置之吸熱面朝向不同，而使位於該吸熱 光二極體單元朝向不同方向照射，從而使該 模組之照射角度及範圍得以擴大。 【實施方式】 ® 如圖1和圖2所示，本發明具有散熱結 光二極體模組包括一散熱器10及貼置於該 10之複數發光二極體單元30。 所述散熱器10由擠壓一體成型，其包 熱座12及從該導熱座12向外延伸之複數散 14。該散熱器10之橫切面大致呈梯形。該 12大致呈V形。該導熱座12具有一第一 122及從該第一吸熱部122相對兩側斜向外 廣之具 包括一 極體單 伸而出 之吸熱 向不同 極體單 面之發 二極體 構之發 散熱器 括一導 熱鰭片 導熱座 吸熱部 延伸之 7 200929461 二第二吸熱部124。每一第二吸熱部124包括複數 _ 臺階（未標示）。該第一吸熱部122具有一平面第 * 一吸熱面（未標示），以供所述發光二極體單元 30貼置。該第二吸熱部124之每一臺階具有一平 面第二吸熱面（未標示），以供所述發光二極體單 元30貼置。該第一吸熱部122之第一吸熱面與第 二吸熱部124之第二吸熱面朝向不同，該第二吸熱 &面相對於該第一吸熱面斜向外傾斜。本實施例中， 位於第一吸熱部 1 22同一侧之臺階之第二吸熱面 之朝向相同，但不同於第一吸熱部122另一側之臺 階之第二吸熱面。可以理解地，位於第一吸熱部 1 22同一側之複數臺階之第二吸熱面之朝向也可各 不相同。所述散熱鰭片14相互平行從該第一吸熱 部1 22及第二吸熱部1 24 —體延伸而出。該複數散 熱鰭片 14垂直於該第一吸熱部 122之第一吸熱 ❹面。該複數散熱鰭片14之末端平齊。 所述每一發光二極體單元30包括一長條形電 路板31及均勻間隔呈線性設置於該電路板3 1上之 複數發光二極體33。 所述複數發光二極體單元30並行貼置於所述 散熱器10導熱座12之第一吸熱部122之第一吸熱 面及第二吸熱部124之第二吸熱面。該第二吸熱部 124每一臺階之第二吸熱面貼置一個所述發光二極 體單元30。從而該第二吸熱部124上之發光二極 8 200929461 體單元30與該第一吸熱部122上之發光二極體單 元30之朝向不同。 ' 所述發光二極體模組可根據實際需要應用到 各種燈具中。工作時，所述發光二極體通電點亮， 其產生之熱量通過電路板31由所述散熱器10之導 熱座12吸收，進而由所述散熱鰭片14散發出去。 與習知技術相比，所述散熱器10供發光二極 0體單元30貼置之導熱座12之第一吸熱部122之第 一吸熱面及第二吸熱部 124之第二吸熱面朝向不 同，而使位於該第一吸熱部1 22及第二吸熱部124 之發光二極體單元30之照射方向不同，而使該發 光二極體模組朝向不同方向照射，照射角度不受限 於所採用之發光二級管3 3之類型，二極體模組之 照射角度及範圍得以擴大。 綜上所述，本發明符合發明專利要件，爰依法 ®提出專利申請。惟，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在爰依本發.明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 圖1係本發明具有散熱結構之發光二極體模 組之立體分解圖。 圖2係圖1中具有散熱結構之發光二極體模組 之立體組裝圖 9 200929461 圖3係圖2之俯視圖。 圖4係圖2之主視圖。 圖5係圖2之側視圖。 【主要元件符號說明】 ❹ 散熱器 10 導熱座· 12 第一吸熱部 122 第二吸熱部 124 散熱鰭片 14 發光二極體單元 30 電路板 31 發光二極體 33 10200929461 IX. Description of the invention: '[Technical field to which the invention belongs] The invention relates to a light-emitting diode module, in particular to a light-emitting diode module having a heat dissipation structure. [Prior Art] As a highly efficient light source, the light-emitting diode has been widely used in various fields, such as environmental protection, high brightness, power saving, and long life. However, when a light-emitting diode works, a large amount of heat is generated, and in particular, some high-power light-emitting diodes for illumination, if the heat is not released in time, it is prone to overheating, which leads to a decrease in luminous efficiency. In order to dissipate the heat generated by the light-emitting diodes in time to maintain the normal operating temperature, the plurality of light-emitting diodes are usually placed on a heat sink to form a light-emitting diode module having a heat-dissipating structure. The modules are applied to different lighting fixtures according to actual needs. The conventional LED module includes a flat heat sink and a plurality of light emitting diodes mounted on one side of the heat sink. When the light-emitting diode is illuminated, the heat generated by it is dissipated into the surrounding air via the heat sink. The light-emitting diodes are arranged linearly and uniformly, and since the light-emitting diode system emits light on one side, the illumination angle and range of the light-emitting diode module are extremely limited by the type of the light-emitting diode used, and the illumination range is compared. Narrow, poor lighting. 6 200929461 SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a light-emitting diode module having a radiation-dissipating structure. A light emitting diode module having a heat dissipating structure, a heat sink and a plurality of light emitting diodes attached to the heat sink, the heat sink comprising a heat conducting seat and a plurality of heat radiating fins extended by the heat conducting seat, the heat conducting seat having The light-emitting diode unit is attached to the heat absorbing surface and is irradiated in a direction toward the ◎ surface. Compared with the prior art, the heat sink faces the heat absorbing surface of the illuminating unit, and the illuminating light diode unit is irradiated in different directions, thereby expanding the irradiation angle and range of the module. [Embodiment] ® As shown in FIG. 1 and FIG. 2, the heat-dissipating junction diode module of the present invention comprises a heat sink 10 and a plurality of light-emitting diode units 30 attached thereto. The heat sink 10 is integrally formed by extrusion, and the heat sink 12 and the plurality of fins 14 extending outward from the heat conducting seat 12 are dispersed. The cross section of the heat sink 10 is substantially trapezoidal. The 12 is substantially V-shaped. The heat conducting base 12 has a first 122 and a slanting outwardly from the opposite sides of the first heat absorbing portion 122. The heat sink includes a heat-dissipating fin heat-sinking heat-absorbing portion extending 7 200929461 and a second heat absorbing portion 124. Each of the second heat absorbing portions 124 includes a plurality of steps (not shown). The first heat absorbing portion 122 has a planar first heat absorbing surface (not shown) for attaching the light emitting diode unit 30. Each step of the second heat absorbing portion 124 has a flat second heat absorbing surface (not shown) for the light emitting diode unit 30 to be placed. The first heat absorbing surface of the first heat absorbing portion 122 is different from the second heat absorbing surface of the second heat absorbing portion 124, and the second heat absorbing surface is inclined obliquely outward with respect to the first heat absorbing surface. In this embodiment, the second heat absorbing surface of the step on the same side of the first heat absorbing portion 126 has the same orientation, but is different from the second heat absorbing surface of the step on the other side of the first heat absorbing portion 122. It will be understood that the orientation of the second heat absorbing surface of the plurality of steps on the same side of the first heat absorbing portion 126 may also be different. The heat dissipating fins 14 extend from the first heat absorbing portion 1 22 and the second heat absorbing portion 1 24 in parallel with each other. The plurality of heat radiating fins 14 are perpendicular to the first heat absorbing surface of the first heat absorbing portion 122. The ends of the plurality of heat dissipation fins 14 are flush. Each of the light emitting diode units 30 includes an elongated circuit board 31 and a plurality of light emitting diodes 33 uniformly spaced apart from the circuit board 31. The plurality of light emitting diode units 30 are placed in parallel on the first heat absorbing surface of the first heat absorbing portion 122 of the heat conducting portion 12 of the heat sink 10 and the second heat absorbing surface of the second heat absorbing portion 124. The second heat absorbing portion 124 is attached to the second heat absorbing surface of each step to the one of the light emitting diode units 30. Therefore, the body 2 of the light-emitting diodes 20 200929461 on the second heat absorbing portion 124 is different from the direction of the light-emitting diode unit 30 on the first heat absorbing portion 122. The LED module can be applied to various lamps according to actual needs. In operation, the light-emitting diode is electrically lit, and the generated heat is absorbed by the heat conducting seat 12 of the heat sink 10 through the circuit board 31, and is further radiated by the heat radiating fins 14. Compared with the prior art, the first heat absorbing surface of the first heat absorbing portion 122 of the heat conducting portion 12 and the second heat absorbing surface of the second heat absorbing portion 124 of the heat sink 10 to which the light emitting diode body unit 30 is placed are different in orientation. The illumination direction of the light-emitting diode unit 30 located in the first heat absorbing part 1 22 and the second heat absorbing part 124 is different, and the light-emitting diode module is irradiated in different directions, and the irradiation angle is not limited to The type of the light-emitting diode 3 3 is used, and the illumination angle and range of the diode module are enlarged. In summary, the present invention meets the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a light-emitting diode module having a heat dissipation structure of the present invention. 2 is a perspective assembled view of the light emitting diode module having the heat dissipation structure of FIG. 9 200929461 FIG. 3 is a top view of FIG. Figure 4 is a front view of Figure 2. Figure 5 is a side view of Figure 2. [Main component symbol description] 散热器 Heatsink 10 Thermal pad · 12 First heat absorbing part 122 Second heat absorbing part 124 Heat sink fin 14 Light emitting diode unit 30 Circuit board 31 Light emitting diode 33 10