CN201203085Y - Heat sink for lighting equipment - Google Patents

Abstract

The utility model discloses lighting apparatus's heat abstractor, lighting apparatus include at least: the heat dissipation device is arranged at the seat body and is provided with a heat dissipation substrate mixed by ceramic particles and a plurality of nano-scale inorganic semiconductor particles, the light source is arranged on the heat dissipation substrate, the heat source generated by the light emission of the light source generates a thermoelectric effect on the heat dissipation substrate, and the heat source is dissipated from the other side of the heat dissipation substrate, so that the heat dissipation effect is effectively achieved, wherein the heat dissipation device can be applied to lighting equipment such as automobile headlamps, flashlights, table lamps, projection lamps, street lamps, fish gathering lamps, indoor or outdoor illuminating lamps and the like.

Description

Heat sink for lighting equipment

technical field

The utility model relates to a heat dissipation device for lighting equipment, and aims to provide a heat dissipation device that can effectively achieve the effect of heat dissipation and has a simple structure, and can be applied to automobile headlights, flashlights, table lamps, projection lights, street lights, and fish-collecting lights. , Indoor or outdoor lighting and other lighting equipment.

Background technique

Recently, light-emitting diodes (Light Emitting Diodes, referred to as LEDs) have the advantages of power saving, long life, and no mercury pollution, and have gradually replaced traditional light bulbs and are widely used in various lighting equipment. And no matter what kind of lighting body is used, it will generate heat due to internal loss and function conversion during lighting. This heat will increase the temperature of the lighting device, and make various components easy to damage or shorten the life. The heat generated by the device has attracted everyone's attention.

The conventional street lamp structure is not equipped with any heat dissipation device, so that the heat generated by the lighting device cannot be removed in a timely manner; and the lighting device is not completely sealed, dust, moisture, mosquitoes, etc. may enter the lampshade, causing the inside of the lampshade to be dirty and affecting the lighting effect and brightness. Therefore, a street lamp structure with heat dissipation device has been developed. Please refer to the patent No. M292042 in Taiwan, China. As shown in FIG. There is a partition 14 in the middle to divide the accommodating space into a first space 111 and a second space 121 . Wherein there is an opening 141 on the dividing plate 14 for a thermally conductive substrate 15 to be set, and the thermally conductive substrate 15 is larger than the opening 141, and is installed above the opening 141 so that the opening 141 is closed, and the second space 121 is completely In addition, several LED lamps 13 are arranged on the other side of the heat conducting substrate 15 . A heat conduction member 16 transfers the heat generated by the LED lamp 13 to the heat dissipation fins 18 through the heat conduction substrate 15, and the fan 17 passes the heat on the heat dissipation fins 18 through the air guide holes provided in the upper cover 11 (not shown in the figure). display) and dissipate out to achieve the cooling effect.

However, due to the limited space inside the lampshade and the limited number of heat dissipation fins installed in this street lamp structure, the heat dissipation effect is not good. In order to install the heat dissipation fins and fan, the lampshade must be enlarged so that the overall The size of the street lamp structure becomes larger; at the same time, each street lamp needs to be installed with at least one fan; the service life of the fan is limited, and because the street lamps are all located at a higher position, it is not easy to detect when the fan is damaged, and it is inconvenient to replace. Thus affecting the lighting efficiency.

Utility model content

In view of this, the technical problem solved by the utility model is to improve the heat dissipation device of the lighting equipment to provide a heat dissipation device that can effectively achieve the effect of heat dissipation and has a simple structure, and can be applied to automobile headlights, flashlights, desk lamps, etc. , projection lamps, street lamps, fishing lamps, indoor or outdoor lighting and other lighting equipment.

In order to achieve the above disclosure, the utility model is a heat dissipation device for lighting equipment. The lighting equipment at least includes: a base for supporting the heat dissipation device and a light source; a heat dissipation device. The heat dissipation device is provided with a heat dissipation substrate mixed with ceramic particles and a plurality of nano-scale inorganic semiconductor particles; at least one light source is arranged on the heat dissipation substrate. The heat source generated by the light source causes the heat dissipation substrate to generate thermoelectric effect, and dissipates the heat source from the other side of the heat dissipation substrate to effectively achieve the effect of heat dissipation.

And the utility model has following advantage compared with conventional:

1. The conventional heat dissipation method uses heat conduction, but the utility model uses the thermoelectric effect to make the yin and yang atoms collide and couple to make the energy disappear, thereby causing a cooling effect, and the heat dissipation effect is better.

2. The utility model can replace the conventional heat dissipation structure (including heat dissipation fins, fans, heat pipes, etc.) by using a single heat dissipation substrate.

3. The structure of a single heat dissipation substrate can greatly reduce the volume of the overall lighting device, and can be designed into different shapes according to the needs, making the appearance of the overall lighting device more practical and beautiful.

Description of drawings

Fig. 1 is a structural schematic diagram of a cooling device in a conventional street lamp;

Fig. 2 is a structural schematic diagram of the heat dissipation device applied to a street lamp in the utility model;

3A is a schematic structural view of the first embodiment of the heat sink in the present invention;

3B is a schematic structural view of the second embodiment of the heat sink in the present invention;

FIG. 3C is a schematic structural view of the third embodiment of the heat sink in the present invention;

Fig. 4 is the schematic structural view of the fourth embodiment of the cooling device in the utility model;

Fig. 5 is a schematic structural view of the fifth embodiment of the heat dissipation device in the present invention;

Fig. 6 is a schematic structural view of the sixth embodiment of the heat dissipation device in the present invention;

Fig. 7 is a structural schematic diagram of the seventh embodiment of the heat dissipation device in the present invention;

Fig. 8 is an exploded view of the structure of the heat dissipation device applied to the flashlight in the utility model;

Fig. 9 is a perspective view of the structure of the heat dissipation device applied to the flashlight in the utility model;

Fig. 10 is a perspective view of the structure of the heat dissipation device applied to a desk lamp in the present invention;

Fig. 11 is a structural schematic diagram of the application of the cooling device in the utility model to indoor and outdoor lighting;

Fig. 12 is a structural schematic diagram of the application of the heat dissipation device in the utility model to two-way lighting indoor and outdoor lighting.

【Description of figure number】

Upper cover 11 The first space 111

Cover 12 Second Space 121

LED lamp 13 partition 14

Hole 141 Thermal Conduction Substrate 15

Thermal Conductor 16 Fan 17

Cooling fins 18 Lighting equipment 20

Body 21 Lampshade 211

Support frame 212 Heat sink 22

Heat dissipation substrate 221 Body 222

Radiating fins 223 Wavy heat sink body 224

Accommodating part 225 Light source 23

Conductive contact 231 Light-emitting chip 232

Encapsulation gel 233 Conductive and thermal conduction layer 24

Pattern 241 Power input point 242

Carrier board 25 Conductive circuit 251

Power input point 252 Adhesive heat conduction layer 253

Fixture 254 Flashlight 30

Table lamp 40 Lighting lamp 50

Shell 51

Detailed ways

The features of the utility model can be clearly understood by referring to the detailed description of the drawings and the embodiments.

The heat dissipation device of the utility model can be applied to lighting equipment such as automobile headlights, flashlights, desk lamps, projection lights, street lights, fish-collecting lights, indoor or outdoor lights, etc., not only can achieve better heat dissipation effect, but also has a simple structure and is not easy to use. As in the conventional lighting device (such as the street lamp shown in FIG. 1 ), structures such as cooling fins and fans need to be installed for heat dissipation, so that the structure of the lighting device of the present invention is simple and the volume is small.

As shown in Figure 2, it is a structural schematic diagram of the heat dissipation device of the present invention applied to a street lamp, wherein the lighting equipment 20 at least includes:

Base body 21, the base body 21 is used to bear the cooling device 22 and the light source 23, and the base body 21 is further provided with a lampshade 211 to protect the cooling device 22 and the light source 23, and one side of the base body 211 is connected with a support frame 212;

Heat dissipation device 22, the heat dissipation device 22 is located at the base 21, please also refer to shown in Figure 3A-C, the heat dissipation device 22 is provided with a heat dissipation substrate 221 mixed by ceramic particles A and a plurality of nano-scale inorganic semiconductor particles B ;

At least one light source 23, the light source 23 is located on the heat dissipation substrate 221, and the light source 23 is provided with a conductive contact 231, the light source 23 can be laser, infrared, carbon nanotubes, OLED, HID, LED and light bulbs, etc. Glowing components.

Wherein, in the first embodiment shown in FIG. 3A , a conductive and thermally conductive layer 24 is provided between the light source 23 and the heat dissipation substrate 221, and the conductive and thermally conductive layer 24 can be a silver glue layer, so that the light source 23 can be fixed on the heat sink. On the substrate 221, the conductive and heat-conducting layer 24 further forms a plurality of patterns 241 that are electrically connected to the conductive contacts 231, and is provided with a power input point 242; of course, the pattern can be nickel and tin plated on a silver pattern.

In the second embodiment shown in FIG. 3B , the heat dissipation substrate 221 is further provided with a plurality of pit-shaped accommodating portions 225, and a light source 23 and a conductive and heat-conducting layer 24 can be arranged in the accommodating portion 225, and the light source 23 can be It is a packaged light-emitting diode, and the conductive contact 231 is arranged at the bottom to form an electrical connection with the conductive and heat-conducting layer 24 .

In the third embodiment shown in FIG. 3C , the heat dissipation substrate 221 is further provided with a plurality of pit-shaped accommodation parts 225, and the light source 23 and the conductive and heat-conducting layer 24 can be arranged in the accommodation part 225, and the light source 23 is at least Including the light-emitting chip 232 , the conductive and heat-conducting layer 24 is disposed between the light-emitting chip 232 and the heat dissipation substrate 221 , and the accommodating portion 225 is further provided with an encapsulant 233 to cover the light-emitting chip 232 .

In addition, a carrier board 25 is provided between the light source 23 and the heat dissipation substrate 221. In the fourth embodiment shown in FIG. and a power input point 252, and an adhesive heat conduction layer 253 may be further provided between the heat dissipation substrate 221 and the carrier plate 25, so that the heat dissipation substrate 221 and the carrier plate 25 can be adhered and fixed to each other through the adhesive heat conduction layer 253, wherein the The thermally conductive layer 253 can be thermally conductive glue or silver glue; of course, the heat dissipation substrate and the carrier board can also be assembled and fixed by a fixing piece, as shown in the fifth embodiment of FIG. 5, the fixing piece 254 can be a screw, The fixing member 254 is disposed between the heat dissipation substrate 221 and the carrier board 25 .

And the effect of heat dissipation substrate 221 is: when the heat source that each light source 23 works sends, makes this heat source conduct to heat dissipation substrate 221, makes this heat dissipation substrate 221 produce thermoelectric effect, wherein the N, P type semiconductor in this heat dissipation substrate body The temperature difference generates thermoelectromotive force, changes the current flow direction, and dissipates the heat source from the other side of the heat dissipation substrate 221 to effectively achieve the effect of heat dissipation, and cools the heat sources of each light source to ensure the working performance and efficiency of the light source.

In addition, the heat dissipation substrate can be flat, as shown in FIGS. The substrate can also be of different shapes, and in another embodiment as shown in FIG. In yet another embodiment shown in FIG. 7 , the heat dissipation substrate 221 may have a flat body 222 , and a plurality of corrugated heat sinks 224 extend from the side of the body 222 away from the light source 23 , so that the body 222 and The light source 23 contacts and conducts the heat source emitted by the light source 23 to the other side, and then uses the plurality of cooling fins 223 or the plurality of wave-shaped cooling fin bodies 224 to further dissipate the heat source to the outside.

Of course, the heat dissipation device of the present utility model can also be applied to a flashlight 30 (as shown in FIG. 8 and FIG. 9 ), a table lamp 40 (as shown in FIG. 10 ), or an indoor or outdoor lighting lamp 50 (as shown in FIG. 11 ), etc. In the lighting equipment, the lighting equipment can emit light in one direction or in multiple directions. As shown in FIG. As shown in FIG. 12 , it is bidirectional light emitting. At least one side of the heat sink 22 is provided with a light source 23 to form a bidirectional light emitting lighting device; it can also be further provided with a heat dissipation component ( Such as heat dissipation fins or fans or a combination thereof), which can further enhance its heat dissipation effect.

In addition, as shown in the embodiment of FIG. 11 , the fixing member 254 can be locked into the housing 51 of the illuminating lamp, and a heat dissipation gap P can be formed between the heat dissipation substrate 221 and the housing 51 .

And the utility model has following advantage compared with conventional:

1. The conventional heat dissipation method uses heat conduction, but the utility model uses the thermoelectric effect to make the yin and yang atoms collide and couple to make the energy disappear, thereby causing a cooling effect, and the heat dissipation effect is better.

2. The utility model can replace the conventional heat dissipation structure (including heat dissipation fins, fans, heat pipes, etc.) by using a single heat dissipation substrate.

3. The structure of a single heat dissipation substrate can greatly reduce the volume of the overall lighting device, and can be designed into different shapes according to the needs, making the appearance of the overall lighting device more practical and beautiful.

In summary, the utility model provides a better and feasible heat dissipation device for lighting equipment, so an application for a new patent is submitted according to law; moreover, the technical content and technical characteristics of the utility model have been disclosed above, but those who are familiar with this technology Those who know the utility model may still make various replacements and modifications without departing from the spirit of the utility model based on the disclosure of the utility model. Therefore, the protection scope of the present utility model should not be limited to those disclosed in the embodiments, but should include various replacements and modifications that do not deviate from the present utility model, and are covered by the scope of the following patent applications.

Claims (15)

1. A cooling device for lighting equipment, characterized in that the lighting equipment at least includes: A base for supporting heat dissipation devices and light sources; A heat dissipation device, the heat dissipation device is arranged at the base, and the heat dissipation device is provided with a heat dissipation substrate mixed with ceramic particles and a plurality of nano-scale inorganic semiconductor particles; At least one light source is provided on the heat dissipation substrate. 2. The heat dissipation device for lighting equipment according to claim 1, characterized in that a conductive and heat-conducting layer is provided between the light source and the heat-dissipating substrate, the light source is provided with conductive contacts, and the conductive and heat-conducting layer further forms a plurality of conductive contacts. A pattern of electrical connections. 3. The heat dissipation device for lighting equipment according to claim 2, characterized in that, the conductive and heat-conducting layer is further provided with a power input point. 4 . The heat dissipation device for lighting equipment according to claim 1 , wherein the heat dissipation substrate is provided with at least one pit-shaped accommodating portion. 5. The heat dissipation device for lighting equipment according to claim 1, wherein a carrier plate is provided between the light source and the heat dissipation substrate. 6. The heat dissipation device for lighting equipment according to claim 5, wherein a plurality of conductive lines and power input points are provided on the carrier board. 7. The heat dissipation device for lighting equipment according to claim 5, wherein an adhesive heat conduction layer is further provided between the heat dissipation substrate and the carrier plate. 8 . The heat dissipation device for lighting equipment according to claim 5 , wherein a fixing member for assembling and fixing the heat dissipation substrate and the support plate is further provided between the heat dissipation substrate and the carrier plate. 9. The heat dissipation device for lighting equipment according to claim 1, 2 or 5, characterized in that the heat dissipation substrate is flat. 10. The heat dissipation device for lighting equipment according to claim 1, 2 or 5, wherein the heat dissipation substrate has a flat body, and a plurality of heat dissipation fins extend from the side of the body away from the light source. 11. The heat dissipation device for lighting equipment according to claim 1, wherein a lampshade is further provided on the base. 12. The heat dissipation device for lighting equipment according to claim 1, wherein a supporting frame is further connected to one side of the base body. 13. The heat dissipation device for lighting equipment according to claim 1, wherein the light source is arranged on more than one side of the heat dissipation device. 14. The heat dissipation device for lighting equipment according to claim 1, characterized in that, the heat dissipation substrate is further provided with a heat dissipation assembly on the other side of the light source. 15. The heat dissipation device for lighting equipment according to claim 1, wherein the heat dissipation component is a heat dissipation fin or a fan or a combination thereof.

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