200915055 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱模組之製作方法，尤指一種可 堆疊出所需型態之散熱單元，並增加各散熱板體與外部空 氣之接觸面積，而達到具有較佳之散熱效果者。 【先前技術】 按，一般習用之散熱裝置係將複數熱導管之一端接合 基座，且於複數散熱韓片上分別設有複數同軸之穿孔， 之後將各散熱鰭片藉由穿孔逐一堆疊於各熱導管上，讓各 政熱…片與熱導管固接，且使各散熱籍片平行排列，使其 面與面相互訝應，而令各散熱鰭片之間具有適當之寬度。 藉此構成一散熱裝置，可將該基座直接設置於主機板之 CPU或其他電子發熱元件上，使該基座吸收發熱元件之熱 源而將熱;原由基座傳導至各熱導管上，再配合各散熱轉 片進打散熱；3，亦可於各散熱鰭片之-側設置-風扇， 讓風扇導引氣體至各散減片上，藉以辅助各散熱轉片 吸收熱源之散逸。 乃所 就，二^f狀散熱裝置單獨使用或配合風扇進行％ …、疋於各散熱鰭片係呈面與面相互對應之設置月 /、第片散熱韓片會擋住後面之各散埶缺# 各散_輿空氣接觸之裸露部分較少，導=散2戍 無，風扇使用時，有空氣對流不佳之情:致置 合π置風扇使料’同樣會目為各散麟片與空氣接g 200915055 裸露部分較少，導致風扇導引氣體時其第一片散熱鰭片會 擋住後面之各散熱鰭片，造成氣體無法導引至各散熱鰭片 上，導致各散熱鰭片之受風面積有限，而無法達到較佳之 散熱效果。 【發明内容】 因此，本發明之主要目的係在於，可堆疊出所需型態 之散熱單元，並增加各散熱板體與外部空氣之接觸面積， 而達到具有較佳之散熱效果。 為達上述之目的，本發明之一種散熱模組之製作方法 的第一態樣，包含下列步驟： (1) 提供一導熱單元，其包含複數熱導管及一基座，該 些熱導管分別具有一受熱段與一冷卻段，該些受熱 段結合於該基座； (2) 提供複數散熱板體，該些散熱板體分別於其外周緣 設有相鄰之複數凸出部，該些散熱板體分別於其表 面設有複數固定孔； (3 )將該些散熱板體相互錯位且間隔堆疊以形成一散 熱單元，使該散熱板體之該凸出部露出於相鄰之該 散熱板體之二該凸出部之間；以及 (4)使該散熱單元利用該些固定孔穿設於該些冷卻段 上。 本發明之一種散熱模組之製作方法的第二態樣，包含 下列步驟： 200915055 (1) 提供一導熱單元，其包含複數熱導管及一基座，該 些熱導管分別具有一受熱段與一冷卻段，該些受熱 段結合於該基座； (2) 提供複數散熱單元，該些散熱單元分別具有複數散 熱板體，該些散熱板體分別於其外周緣設有相鄰之 複數凸出部，該些散熱板體分別於其表面設有複數 固定孔； (3) 使該散熱單元之該些散熱板體相互同位且間隔堆 疊； (4) 將該些散熱單元相互錯位且間隔堆疊，使該散熱單 元同位之該些凸出部露出於相鄰之該散熱單元二 同位之該些凸出部之間； (5) 使該些散熱單元利用該些固定孔穿設於該些冷卻 段上。 U 【實施方式】 請參閱『第一圖及第二圖』所示，係分別為本發明之 製作方法示意圖及本發明第一實施例之立體外觀示意圖。 如圖所示，本發明之一種散熱模組之製作方法的第一態 樣，其至少包含下列步驟： (1)提供一導熱單元1，其包含複數熱導管1 1及一基 座1 2，該些熱導管1 1分別具有一受熱段1 1 1 與一冷卻段1 1 2，該些受熱段1 1 1結合於該基 座1 2 ; 7 200915055 (2) 提供複數散熱板體2 1，該些散熱板體2 1分別於 其外周緣設有相鄰之複數凸出部2 3，該些散熱板 體2 1分別於其表面設有複數固定孔2 5及複數 穿孔2 6 ’該些散熱板體2 1係分別可為一環形板 體或一弧形板體； (3) 將該些散熱板體2 1相互錯位且間隔堆疊以形成 一散熱單元2 ’使該散熱板體2 1之該凸出部2 3 .露出於相鄰之該散熱板體2 1之二該凸出部2 3 之間；以及 (4) 使該散熱單元2利用該些固定孔2 5穿設於該些 冷卻段1 1 2上，該些散熱板體2 1堆疊後形成螺 旋狀之散熱單元2，其增加各散熱板體2 1與外部 空氣之接觸面積。 。月參閱『第一圖及第二圖』所示，係分別為本發明第 :實施例之立體外觀示意圖及本發明第一實施例之側視狀 態示意圖。如圖所示，當本發明於運用時，係可將導熱單 π 1之基座1 2直接與主機板之CPU或其他電子發熱元件 直接接觸（®未示），使該基座丨2吸收發熱元件之熱源， 且將熱源由基座1 2傳導至各熱導管1 i之受熱端工工 1 ’使熱導管1 1藉由其内部工作流體之氣液相變化，而 快速將受熱端1 1 1之熱源傳導至冷卻端丄丄2，再由各 散，板體2 1吸收’如此’即可利用冷卻端丨丨2配合散 熱單元2之各散熱板體2 1進行賴，而由於該散熱單元 2上每一相鄰散熱板體2 1外周緣之凸出部2 3係相互錯 200915055 位，因此，可增加各散熱板體2 1與外部空氣之接觸面積， 而提升熱傳導效率；且當實際運用時，更可於散熱單元2 之一侧設置一風扇（圖中未示），使該風扇進行氣體之導 引，讓氣體導引至各散熱板體2 1之表面、中央及表面上 多數穿孔2 6處，藉以更快速達到各散熱板體2 1所吸收 熱源之散逸。 請參閱『第四圖』所示，係本發明第二實施例之立體 f 外觀示意圖。如圖所示，本發明之各散熱板體2 1除可為 I ' 上述第一實施例之型態外，其各散熱板體2 1 a亦可由多 數弧形板體對應而成，使各散熱板體2 1 a於組裝時，可 同樣使每一相鄰散熱板體2 la外周緣之凸出部2 3a相 互形成錯位，而形成另一散熱單元2a，亦可達到上述所提 相同之功效。 請參閱『第五圖』所示，係本發明第三實施例之立體 外觀示意圖。如圖所示，本發明之各散熱板體除可為上述 U 第一及第二實施例之型態外，其各散熱板體2 lb係可為 一環形板體，且各散熱板體2 lb周緣之凸出部2 3 b係為 大、小弧面相互配合之構型，使各散熱板體2 1b於組裝 時，可同樣使每一相鄰散熱板體2 1b外周緣之凸出部2 3 b分別相互形成錯位，形成另一散熱單元2 b，亦可達到 上述所提相同之功效。 請參閱『第六圖』所示，係本發明第四實施例之立體 外觀示意圖。請同時參考第一圖，本發明之一種散熱模組 之製作方法的第二態樣，其至少包含下列步驟： 200915055 (1) 提供一導熱單元丄，其包含複數熱導管丄丄及一基 座1 2，該些熱導管1丄分別具有一受熱段丄工工 與一冷卻段1 1 2 ’該些受熱段丄丄丄結合於該基 座1 2 ; (2) 提供複數散熱單元2 c，2 〇 c，該些散熱單元2 C，2 0 C分別具有複數散熱板體2丄C，該些散 熱板體2 1 c分別於其外周緣設有相鄰之複數凸 出部2 3 c，該些散熱板體2丄c分別於其表面設 有複數固定孔2 5 c，該些散熱板體2丄c係分別 可為一環形板體或一孤形板體； (3) 使該散熱單元2 c，2 Q g之該些散熱板體2丄c 相互同位且間隔堆疊； (4) 將該些散熱單元2 e，2 Q e相互錯位且間隔堆 疊，使該散熱單元2c，2〇c同位之該些凸出部 2 3 c露出於相鄰之該散熱單元2 c，2 〇 c二同 位之該些凸出部2 3 c之間； (5) 使該些散熱單元2 c，2 〇 c利用該些固定孔2 5 c穿設於該些冷卻段1 1 2上。 如第六圖所示，纟發明之各散熱板體除可為上述第 -、，及第三實施例之型態外，各散熱板體2lc於組裝 時’係使各散熱板體2le外周緣之凸出部2 3e分別相互 對應^而形成多數個散熱單元〜、20c，而每一相鄰之 散熱單2 Qe則以相互錯位之方式設置，同樣可讓 各散熱單元2c、2 Qc之凸出部2 3c形成錯位，亦可達 10 200915055 到上述所提相同之功效。 綜上所述，本發明散熱模組之製作方法可有效改善習 用之種種缺點，可堆疊出所需型態之散熱單元，並增加各 散熱板體與外部空氣之接觸面積，而達到具有較佳之散熱 效果，進而使本發明之產生能更進步、更實用、更符合使 用者之所需，確已符合發明專利申請之要件，爰依法提出 專利申請。 ^ 惟以上所述者，僅為本發明之較佳實施例而已，當不 Γ' 能以此限定本發明實施之範圍；故，凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 第一圖，係本發明之製作方法示意圖。 第二圖，係本發明第一實施例之立體外觀示意圖。 ϋ 第三圖，係本發明第一實施例之側視狀態示意圖。 第四圖，係本發明第二實施例之立體外觀示意圖。 第五圖，係本發明第三實施例之立體外觀示意圖。 第六圖，係本發明第四實施例之立體外觀示意圖。 【主要元件符號說明】 1 導熱單元 II 熱導管 III 受熱段 11 200915055 112 冷卻段 12 基座 2 散熱單元 2a 散熱單元 2b 散熱單元 2c 散熱單元 2 0c 散熱單元 2 1 散熱板體 2 1a 散熱板體 2 lb 散熱板體 2 1 c 散熱板體 2 3 凸出部 2 3a 凸出部 2 3b 凸出部 2 3c 凸出部 2 5 固定孔 2 5a 固定孔 2 5b 固定孔 2 5c 固定孔 2 6 穿孔 2 6a 穿孔200915055 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a method for manufacturing a heat dissipation module, and more particularly to a heat dissipation unit that can stack a desired type and increase the contact between each heat dissipation plate body and outside air. The area is achieved to achieve better heat dissipation. [Prior Art] According to the conventional heat dissipating device, one end of the plurality of heat pipes is joined to the pedestal, and a plurality of coaxial perforations are respectively disposed on the plurality of heat dissipating Korean sheets, and then the heat dissipating fins are stacked one by one by the perforations. On the catheter, the heat sheets are fixed to the heat pipe, and the heat-dissipating pieces are arranged in parallel so that the faces and the faces are mutually surprised, so that the heat-dissipating fins have an appropriate width. Thereby forming a heat dissipating device, the pedestal can be directly disposed on the CPU or other electronic heating element of the motherboard, so that the susceptor absorbs the heat source of the heating element to heat; the original pedestal is transmitted to each heat pipe, and then The heat dissipating fins can be used to dissipate heat; 3, a fan can be disposed on the side of each fin, and the fan can guide the gas to each of the strips to assist the heat dissipating fins to absorb the heat source. In other words, the two-figure heat-dissipating device is used alone or in combination with the fan. The heat-dissipating fins are arranged to face each other in a face-to-face manner. The first piece of heat-dissipating Korean film will block the back of the heat. #散散_舆The exposed part of the air contact is less, the guide = 2 戍, when the fan is used, there is a bad air convection: the π set fan will make the material 'the same will be the same as the air and the air Connected to 200915055, the bare part is less, causing the first heat sink fin of the fan to block the heat sink fins after the gas is guided, so that the gas cannot be guided to the heat sink fins, resulting in the wind receiving area of each heat sink fin. Limited, and can not achieve better heat dissipation. SUMMARY OF THE INVENTION Therefore, the main object of the present invention is to stack heat dissipation units of a desired type and increase the contact area between the heat dissipation plates and the outside air to achieve a better heat dissipation effect. For the above purpose, a first aspect of a method for fabricating a heat dissipation module of the present invention comprises the following steps: (1) providing a heat conduction unit comprising a plurality of heat pipes and a base, the heat pipes respectively having a heat receiving section and a cooling section, the heat receiving sections are coupled to the base; (2) providing a plurality of heat radiating plate bodies respectively provided with adjacent plurality of protruding portions on an outer peripheral edge thereof, the heat radiating portions The plate body is respectively provided with a plurality of fixing holes on the surface thereof; (3) the heat dissipation plate bodies are mutually displaced and spaced apart to form a heat dissipating unit, so that the protruding portion of the heat dissipating plate body is exposed to the adjacent heat dissipating plate The second portion of the body is between the protrusions; and (4) the heat dissipation unit is disposed on the cooling segments by using the fixing holes. A second aspect of the method for fabricating a heat dissipation module of the present invention comprises the following steps: 200915055 (1) Providing a heat conduction unit comprising a plurality of heat pipes and a base, the heat pipes respectively having a heat receiving section and a heat receiving unit a cooling section, the heat receiving sections are coupled to the base; (2) providing a plurality of heat dissipating units, each of the heat dissipating units having a plurality of heat dissipating plates respectively provided with adjacent plurality of protruding protrusions on an outer circumference thereof The heat dissipating plate body is respectively provided with a plurality of fixing holes on the surface thereof; (3) the heat dissipating plate bodies of the heat dissipating unit are in the same position and spaced apart from each other; (4) the heat dissipating units are misaligned and stacked at intervals, The protruding portions of the heat dissipating unit in the same position are exposed between the protruding portions of the adjacent heat dissipating unit; (5) the heat dissipating units are bored in the cooling segments by using the fixing holes on. [Embodiment] Please refer to the first drawing and the second drawing, which are schematic views of the manufacturing method of the present invention and a perspective view of the first embodiment of the present invention. As shown in the figure, a first aspect of a method for fabricating a heat dissipation module of the present invention includes at least the following steps: (1) providing a heat conduction unit 1 comprising a plurality of heat pipes 1 1 and a base 1 2, The heat pipes 1 1 respectively have a heat receiving section 1 1 1 and a cooling section 1 1 2, and the heat receiving sections 1 1 1 are coupled to the base 1 2 ; 7 200915055 (2) providing a plurality of heat radiating plates 2 1 The heat dissipating plate bodies 2 1 are respectively provided with adjacent plurality of protruding portions 23 on the outer peripheral edge thereof, and the heat dissipating plate bodies 2 1 are respectively provided with a plurality of fixing holes 25 and a plurality of perforations 2 6 ' on the surface thereof. The heat dissipation plate body 2 1 may be an annular plate body or a curved plate body respectively; (3) the heat dissipation plate bodies 2 1 are mutually displaced and spaced apart to form a heat dissipation unit 2 ′ such the heat dissipation plate body 2 1 The protruding portion 23 is exposed between the adjacent ones of the heat dissipating plate bodies 2 1 and the protruding portions 2 3 ; and (4) the heat dissipating unit 2 is disposed through the fixing holes 25 On the cooling sections 1 1 2, the heat dissipation plate bodies 21 are stacked to form a spiral heat dissipation unit 2, which increases the contact area between the heat dissipation plate bodies 21 and the outside air. . Referring to the first and second figures, respectively, the present invention is a perspective view of a third embodiment of the present invention and a side view of the first embodiment of the present invention. As shown in the figure, when the present invention is applied, the base 12 of the heat conduction single π 1 can be directly contacted directly with the CPU or other electronic heating element of the motherboard (® not shown), so that the base 丨 2 is absorbed. a heat source of the heating element, and the heat source is conducted from the susceptor 12 to the heating end of the heat pipes 1 i. 1 'The heat pipe 1 1 is rapidly changed by the gas-liquid phase of the internal working fluid, and the heating end 1 is quickly The heat source of 1 1 is transmitted to the cooling end 丄丄 2, and then absorbed by the respective plates 2 1 'so that the cooling end 丨丨 2 can be used to cooperate with the heat dissipating plates 2 1 of the heat dissipating unit 2, and The protruding portion 23 of the outer peripheral edge of each adjacent heat dissipating plate body 2 on the heat dissipating unit 2 is mutually misaligned with the position of 200915055, so that the contact area of each heat dissipating plate body 21 with the outside air can be increased, and the heat conduction efficiency is improved; When it is actually used, a fan (not shown) may be disposed on one side of the heat dissipating unit 2 to guide the gas to guide the gas to the surface, the center and the surface of each of the heat dissipating plates 2 1 . Most of the perforations are 26, so that the heat sink body 2 1 can be absorbed more quickly. The heat source is dissipated. Please refer to the fourth figure, which is a schematic view of the appearance of the stereo f of the second embodiment of the present invention. As shown in the figure, in addition to the first embodiment, the heat dissipation plate body 2 1 of the present invention may be formed by a plurality of curved plate bodies. When the heat dissipating plate body 2 1 a is assembled, the protruding portions 2 3 a of the outer peripheral edges of each adjacent heat dissipating plate body 2 la can be dislocated with each other to form another heat dissipating unit 2a, which can also achieve the same as mentioned above. efficacy. Referring to the fifth drawing, a perspective view of a third embodiment of the present invention is shown. As shown in the figure, in addition to the U first and second embodiments, each of the heat dissipating plate bodies of the present invention may be an annular plate body and each heat dissipating plate body 2 The embossing portion 2 3 b of the lb periphery is a configuration in which the large and small curved surfaces are matched with each other, so that when the heat dissipating plate bodies 21b are assembled, the outer peripheral edges of each adjacent heat dissipating plate body 2 1b can be similarly protruded. The portions 2 3 b are respectively displaced from each other to form another heat dissipating unit 2 b, and the same effects as mentioned above can be achieved. Referring to the sixth drawing, there is shown a perspective view of a fourth embodiment of the present invention. Referring to the first figure, a second aspect of the method for fabricating a heat dissipation module of the present invention includes at least the following steps: 200915055 (1) A heat conduction unit 丄 is provided, which includes a plurality of heat pipes and a base 1 2, the heat pipes 1丄 respectively have a heating section and a cooling section 1 1 2 'the heating section 丄丄丄 is coupled to the base 1 2 ; (2) providing a plurality of heat dissipating units 2 c, 2 〇c, the heat dissipation units 2 C, 2 0 C respectively have a plurality of heat dissipation plate bodies 2 丄 C, and the heat dissipation plate bodies 2 1 c are respectively provided with adjacent plurality of protrusions 2 3 c at the outer periphery thereof. The heat dissipation plate bodies 2丄c are respectively provided with a plurality of fixing holes 25c on the surface thereof, and the heat dissipation plate bodies 2丄c can respectively be an annular plate body or an orphan plate body; (3) the heat dissipation The heat dissipating plate bodies 2丄c of the unit 2c, 2Qg are in the same position and spaced apart from each other; (4) the heat dissipating units 2e, 2Qe are mutually displaced and spaced apart to make the heat dissipating unit 2c, 2〇 The protrusions 2 3 c of the same position are exposed between the adjacent protrusions 2 3 c of the adjacent heat dissipation unit 2 c, 2 〇 c; (5) Thermal unit 2 c, 2 c using the plurality of fixing square hole 2 5 c through 112 disposed on the plurality of cooling section. As shown in the sixth figure, in addition to the above-described first, third, and third embodiments, each of the heat dissipation plate bodies 11c is assembled to make the outer periphery of each of the heat dissipation plate bodies 2le. The protruding portions 2 3e respectively correspond to each other to form a plurality of heat dissipating units ～, 20c, and each adjacent heat dissipating unit 2 Qe is disposed in a manner of being displaced from each other, and the heat dissipating units 2c and 2 Qc can also be convex. The out part 2 3c is misaligned, and can also reach the same effect as the above mentioned by 10 200915055. In summary, the manufacturing method of the heat dissipation module of the present invention can effectively improve various disadvantages of the conventional use, and can stack the heat dissipation units of the required type, and increase the contact area between the heat dissipation plate bodies and the external air, thereby achieving better. The heat dissipation effect, in turn, makes the invention more progressive, more practical, and more in line with the needs of the user, and has indeed met the requirements of the invention patent application, and has filed a patent application according to law. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is limited to the scope of the present invention. Both effect changes and modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic diagram of the manufacturing method of the present invention. The second drawing is a schematic perspective view of the first embodiment of the present invention. The third drawing is a schematic view of a side view of the first embodiment of the present invention. The fourth figure is a schematic perspective view of a second embodiment of the present invention. The fifth drawing is a schematic perspective view of a third embodiment of the present invention. Fig. 6 is a perspective view showing the appearance of a fourth embodiment of the present invention. [Main component symbol description] 1 Heat conduction unit II Heat pipe III Heating section 11 200915055 112 Cooling section 12 Base 2 Heat sink unit 2a Heat sink unit 2b Heat sink unit 2c Heat sink unit 2 0c Heat sink unit 1 Heat sink body 2 1a Heat sink body 2 Lb Heat sink body 2 1 c Heat sink body 2 3 Projection 2 3a Projection 2 3b Projection 2 3c Projection 2 5 Fixing hole 2 5a Fixing hole 2 5b Fixing hole 2 5c Fixing hole 2 6 Perforation 2 6a perforation