200907234 九、發明說明： 【發明所屬之技術領域】 • 本發明涉及一種發光二極體燈具，尤係具有散熱模組 - 之發光二極體燈具。 【先前技術】 • 隨著科學技術進步，從一般鎢絲燈發展到現在之冷陰 極癸光燈管（Cold Cathode Fluorescent Lamp, CCFL)及發 • 光二極體（Light Emitting Diode, LED )，皆是朝向體積縮 小及扁平化之方向發展。 而目前CCFL因為體積幾乎是不能再縮小，而且CCFL 升壓到600伏特電壓時會發生干擾，另外CCFL會造成汞 污染等問題，使得部分國家也將予以禁用。而LED具有環 保、亮度高、省電、壽命長等諸多特點，所以LED將漸漸 取代CCFL。然而，現今高亮度LED所產生之局部熱量較 大，若要取代CCFL作為照明產品，則必須要有合適之散 % 熱設計；否則會造成LED發光效率降低及壽命縮短等問 . 題，所以現今LED封裝結構多利用金屬承載基板（Metal Core Print Circuit Board, MCPCB )作為散熱媒介，但 LED 仍無法以高密集度方式設置，原因在於散熱能力仍無法有 效突破，因此有關LED散熱是目前業界亟需克服之難題。 【發明内容】 一種發光二極體燈具，包括一燈罩、位於燈罩内部之 複數發光二極體，以及一散熱模組。其中，該散熱模組包 200907234 括一位於燈罩内部之吸熱部、一位於燈罩外部之散熱部， 以及一熱管，該熱管包括一蒸發段和一冷凝段。該散熱部 包括一基座及設於基座外側周面之複數散熱片。該熱管之 蒸發段與吸熱部接連，該熱管之冷凝段與散熱部之基座連 接。該等發光二極體分佈在吸熱部上。 與習知技術相比，本發明將熱管之冷凝段與散熱部之 基座連接，有利於熱管與散熱部之間之熱交換作用，可充 刀利用熱管將發光二極體產生之熱量快速地轉移到散熱 部，進而提高了散熱模組之散熱效率，從而可確保發光二 極體工作于正常、穩定地工作。 【實施方式】 如圖1至4所示，本發明之發光二極體燈具包括一發 光一極體模組100、一用以支撐並冷卻該發光二極體模组 1〇〇之散熱模組2〇〇、一套設於該散熱模組2〇〇上之反光罩 3〇〇,以及一設於該反光罩300上之燈罩4〇〇，其中該發光 一極體模組100位於燈罩400内。 構，其包括一内凹之上 通孔（圖中未示）。該 該反光罩300為内凹之碗狀結 表面（圖中未標），其中部具有— 反光罩300用以反射發光二極體模組1〇〇產生之光線令 發光二極體模組1〇〇產生之光線按照預定方向照射以增強 照明效果；例如圖i中燈具所處之位置，該反光罩3〇〇可 將發光二極體模組100產生之光線向上反射。 燈罩400 $中空結構並將發光二極體模組⑽罩設其 内’其通常是由透明之塑膠、玻璃或其他材料製成。該燈 7 200907234 罩400設於該反光罩3〇〇上而令反光罩3〇〇夾設於散熱模 組200與燈罩400之間。該燈罩400主要用以防止灰塵、 昆蟲等進入燈具内而影響發光二極體模組1〇〇之使用壽 命。另外，根據實際使用狀況，可以將反光罩3〇〇省略而 令一燈罩直接設於散熱模組200上。 為么光一極體模組1〇〇包括複數發光二極體及複 數電路板120 ’ 4等發光二極@Q安裝於相應之電路板 120上並與電路板120電性連接。 。亥政熱杈組200包括一位於燈罩4〇〇外部之散熱部 =〇、一位於燈罩400内部之吸熱部，以及三支熱管27〇。 每支Λ，、b 270包括與吸熱部連接之蒸發段，及與散熱部 210連接之冷凝段。該吸熱部呈桶狀，其可以進一步割^為 :沿豎直方向設置於散熱部21〇 i、呈筒狀之第—熱傳導 兀件230及-水平地設於該第—熱傳導元件23q上二 熱傳導元件250。 部之外形輪廓大致呈圓柱狀，其包括一圓 伸之複=Γ2’以及自該基座212外侧周面向外放射狀延 申之稷數政熱片214。相鄰之散熱片214之 道216以供氣流流過。該基 j形成一通 連接部，即位於基座212上伸出有環形 -下方之下連接…。該上連 接；而下連接部2124與—燈頭 /、U連 〒未不）連接，該燈頭 為了攸市％上獲得之標準件。三 基座加之内壁面，並沿基座212之U8均勻地形成於 之軸線方向延伸。該等 200907234 凹槽218用以容納熱管27〇之一部分。 每-熱管270呈乙型，包括傳 苐-傳熱段272端部垂直彎折延伸而出之2及-從 別，且第-傳熱段272比第二傳熱段 -：熱段 ::2之一部分’圖1中所示為第-傳熱物之下二 =固定於散熱部21〇内之-凹#2⑽ 二 冷凝段；第-傳熱段272之另 ”、'S 270之 值埶P 1刀圖1中所示為第— 傳熱& 272之上部分，與第„熱傳導 = 管270之蒸發段。此外，熱管⑽ 如妾為熱 二埶傳導亓仕弟一傳熱奴274與第 :250連接，故第二傳熱段Μ也為㈣ 之洛m口此設置，使熱管270之蒸發段呈寶曲 该彎曲之蒸發段可將吸埶部 ^ 收之熱董快速地傳導至洽凝 ;用：霄現對發光二極請之散熱功能。由於吸敎部； ::::收發光二極體110產生之熱量，對散熱模組· 牛^效果有較大影響，以下針對吸熱部之各部件做進一 ”兄月’以更好地了解散熱模組之工作過程。 該第一熱傳導元件230是設置於散熱部210之上連接 之上之一個中空六棱柱結構，其具有六個外側面 々一—個圓柱狀之内表面234。在第—熱傳導元件230之 、曾 卜側面232上，三個發光二極體110沿著第一熱傳 :23〇之軸線方向排列成一條直線。六個溝槽236對 ^ :佈在第一熱傳導元件230之内表面234，並沿著第一 :專‘元件230之軸線方向延伸。其中，每一個溝槽236 ’、卜側面232對應，並位於該對應外侧面232上三個發 200907234 光-極體110之正下方用以收容固定熱管謂第 段272之上部分。 寸… 如上所述，熱管270之第—傳熱段272之上部分對稱 地：置於第—熱傳導兀件23〇上之溝槽236内；而熱管 之第一傳熱段272之下部分設置於散熱部21〇上之凹槽218 内”此同呀，熱官270之第二傳熱段274位於第—埶傳 導元件230上方，並與第二熱傳導元件25〇連接。… 一該第二熱傳導元件25G為—六邊形之板狀結構，其包 匕一上表面252,用以承載三個發光二極體110及相應之電 板120;—下表自254，貼設於第一熱傳導元件，之上 方。三個槽道256對稱地形成於第二熱傳導元件25〇之下 = 254’該等槽冑256呈放射狀分佈且相交於第二熱傳導 =250之中心區域。換言之’該等槽道自第二埶傳 ^件⑽之中心區域向外呈放射狀延伸，且相鄰之槽道 〜之間之夾角約120度。當該第二熱傳導元件250安裝到 弟^傳導元件230上時，該等槽道256與熱管270之第 :傳=274相對應’並將熱管27〇之第二傳熱段Μ收 二IS於其内。如此，熱管270之第二傳熱段274在第 一熱傳V元件250内呈放射狀分佈。 ^上所述’發光二極體11〇及相應之電路板12〇設置 :之外表面’即第二熱傳導元件25〇之上表面况 莫’,、、傳導兀件230之外側面232。其中，位於第二熱傳 之二射：〇之上表面252之發光二極體110所產生之光線 a射方向，垂直於位於第-熱傳導㈣现之外侧面232 10 200907234 之發光二極體110所產生之光線之照射方向。這樣佈置， 使得發光二極體110在吸熱部上呈立體分佈而形成一立體 光源’可增強燈具之照明效果。 热傅V元件230、第 訊 < »V\ 將上述之立體光源，包括第 傳導元件250 ’以及發光二極體11〇，設於散熱部21〇上， 並令反光罩300套設於散熱部21〇之上連接部2122而使立 體光源收容於燈罩400内，即可組成發光二極體燈具。 ，在使用時，發光二極體no在電路板120控下產生 光線，起到照明效果；與此同時，發光二極體ιι〇產生之 熱量被吸熱部之第-熱傳導元件23〇、第二熱傳導元件25〇 吸收。第-熱傳導元件230、第二熱傳導元件25〇吸收之埶 量通過熱管謂傳遞給散熱部21〇之基座212而再傳遞: 其外部之散熱片214,並通過散熱片214將熱量散發到外部 環境中去。如此，發光二極體11〇產生之熱量可通過散妖 部210較大之散熱面積散發到外部環境中去。這樣一來， =光二極體U0可X作于正常溫度範圍内，可確保燈具之 照明效果並延長使使用壽命。 綜上所述，本發明發光二極體燈具將熱管27〇嵌設於 散^ 210之基座212，有利於熱管27〇與散熱部训之間 之熱父換作用，降低埶管27〇之、、w MW上 L、，、& 270之，皿度，進而可充分利用熱 二進:: 10產生之熱量快速地轉移到散熱部 2心進而“ 了散熱模組細之散熱效率，從而可確保發 光一'極體1 1 0工作干丨不奢、、®ΓΗ1 彳乍于正*Μ度鞄圍内，提昇燈具之照明效 果0 11 200907234 利申：τ’？發明符合發明專利要件，差依法提出專 1!:二所述者僅為本發明之較佳實施例，舉凡 …心本木技藝之人士，在^签壮4r於 友依本么明精神所作之等效修飾 或，交化，白應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1是本發明發光二極體燈具之立體圖。 圖2是圖1中發光二極體 體模组之立體圖。 之繼組與發光二極 分解圖。 主要元件符號說明】 發光二極體模組 100 電路板 120 散熱部 210 上連接部 2122 散熱片 214 凹槽 218 外側面 232 溝槽 236 上表面 252 槽道 256 圖3疋圖2中散熱模組與發光二極體模組之分解圖 圖4是圖2中散熱模組與發光二極體模組之另一角 發光二極體 110 散熱模組 200 基座 212 下連接部 2124 通道 216 第一熱傳導元件 230 内表面 234 第二熱傳導元件 250 下表面 254 熱管 270 12 200907234 第一傳熱段 反光罩 272 第二傳熱段 274 300 燈罩 400 13200907234 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a light-emitting diode lamp, in particular to a light-emitting diode lamp having a heat dissipation module. [Prior Art] • With the advancement of science and technology, from the development of general tungsten filament lamps to the current Cold Cathode Fluorescent Lamp (CCFL) and Light Emitting Diode (LED), It is developing in the direction of volume reduction and flattening. At present, the CCFL can hardly shrink because of the volume, and the CCFL will increase to 600 volts, and the CCFL will cause mercury pollution, which will be banned in some countries. LEDs have many features such as environmental protection, high brightness, power saving, and long life, so LEDs will gradually replace CCFL. However, today's high-brightness LEDs generate a large amount of local heat. If you want to replace CCFL as a lighting product, you must have a suitable heat-dissipation design. Otherwise, LED lighting efficiency will decrease and life will be shortened. The LED package structure uses the Metal Core Print Circuit Board (MCPCB) as the heat dissipation medium, but the LED cannot be set in a high-density manner. The reason is that the heat dissipation capability cannot be effectively broken. Therefore, the LED heat dissipation is urgently needed in the industry. Overcome the problem. SUMMARY OF THE INVENTION A light-emitting diode lamp includes a lamp cover, a plurality of light-emitting diodes located inside the lamp cover, and a heat dissipation module. The heat dissipation module package 200907234 includes a heat absorption portion inside the lamp cover, a heat dissipation portion located outside the lamp cover, and a heat pipe, and the heat pipe includes an evaporation portion and a condensation portion. The heat dissipating portion includes a base and a plurality of fins disposed on a peripheral surface of the outer side of the base. The evaporation section of the heat pipe is connected to the heat absorption portion, and the condensation section of the heat pipe is connected to the base of the heat dissipation portion. The light emitting diodes are distributed on the heat absorbing portion. Compared with the prior art, the present invention connects the condensation section of the heat pipe with the base of the heat dissipation portion, which is beneficial to the heat exchange between the heat pipe and the heat dissipation portion, and the heat generated by the light-emitting diode can be quickly charged by the knife. The transfer to the heat dissipating portion further improves the heat dissipation efficiency of the heat dissipating module, thereby ensuring that the light emitting diode works in a normal and stable manner. [Embodiment] As shown in FIG. 1 to FIG. 4, the LED device of the present invention comprises a light-emitting diode module 100, and a heat dissipation module for supporting and cooling the LED module 1 2〇〇, a reflector 3〇〇 disposed on the heat dissipation module 2〇〇, and a lamp cover 4〇〇 disposed on the reflector 300, wherein the light emitting body module 100 is located in the lampshade 400 Inside. The structure includes a recessed through hole (not shown). The reflector 300 is a concave bowl-shaped junction surface (not shown), and the middle portion has a reflector 300 for reflecting the light generated by the LED module 1 to make the LED module 1 The light generated by the 〇〇 is illuminated in a predetermined direction to enhance the illumination effect; for example, the position of the luminaire in FIG. i, the reflector 3 向上 can reflect the light generated by the LED module 100 upward. The lampshade 400 $ hollow structure and the light-emitting diode module (10) is housed therein. It is usually made of transparent plastic, glass or other material. The lamp 7 200907234 is provided on the reflector 3 and the reflector 3 is interposed between the heat dissipation module 200 and the lamp cover 400. The lampshade 400 is mainly used to prevent dust, insects, etc. from entering the lamp and affecting the service life of the LED module. Further, depending on the actual use, the reflector 3 can be omitted and a lamp cover can be directly disposed on the heat dissipation module 200. The light-emitting diode module 1 includes a plurality of light-emitting diodes and a plurality of circuit boards 120 ′ 4 and the like. The light-emitting diodes @Q are mounted on the corresponding circuit board 120 and electrically connected to the circuit board 120. . The Haizheng enthalpy group 200 includes a heat dissipating portion located outside the lampshade 4, a heat absorbing portion located inside the lampshade 400, and three heat pipes 27 〇. Each of the turns, b 270 includes an evaporation section connected to the heat absorbing portion, and a condensation section connected to the heat radiating portion 210. The heat absorbing portion has a barrel shape, and can be further cut into: a heat dissipating portion 21〇i disposed in a vertical direction, a first heat conducting member 230 in a cylindrical shape, and a horizontally disposed on the first heat conducting element 23q. Thermal conduction element 250. The outer contour of the portion is substantially cylindrical, and includes a circular extension Γ 2 ′ and a number of fins 214 extending radially outward from the outer circumferential surface of the susceptor 212 . Adjacent fins 214 are routed 216 for airflow. The base j forms a through-connecting portion, i.e., a ring-shaped lower-lower connection is formed on the base 212. The upper connection portion 2124 is connected to the lamp holder/, U-connector, and the lamp holder is a standard member obtained on the market. The three bases are added to the inner wall surface and are uniformly formed along the U8 of the base 212 in the axial direction. The 200907234 recess 218 is for receiving a portion of the heat pipe 27〇. Each heat pipe 270 is of a B-type, including the end of the transfer-heat transfer section 272 extending vertically and extending 2 and - and the first heat transfer section 272 is more than the second heat transfer section -: hot section: 2 is a part of 'the first heat transfer element shown in Fig. 1 = the concave - fixed #2 (10) two condensation section fixed in the heat sink portion 21; the value of the other heat transfer section 272, "S 270" The 埶P 1 knives are shown in Figure 1 as the upper part of the first heat transfer & 272, and the „thermal conduction = the evaporation section of the tube 270. In addition, if the heat pipe (10) is a hot two-conductor, the heat transfer slave 274 is connected with the first: 250, the second heat transfer section is also set to (4), so that the evaporation section of the heat pipe 270 is curved. The evaporation section can quickly transfer the heat from the suction part to the condensation; use: to solve the heat dissipation function of the light-emitting diode. Due to the suction part; :::: The heat generated by the light-emitting diode 110 has a great influence on the heat-dissipating module and the effect of the cow. The following is a better understanding of the components of the heat-absorbing part. The working process of the heat dissipation module. The first heat conduction element 230 is a hollow hexagonal prism structure disposed on the upper surface of the heat dissipation portion 210, and has six outer side surfaces - a cylindrical inner surface 234. On the side 232 of the heat conducting element 230, the three light emitting diodes 110 are arranged in a straight line along the axial direction of the first heat transfer: 23 。. The six grooves 236 are disposed on the first heat conducting element 230. The inner surface 234 extends along the axis direction of the first: special element 230. Each of the grooves 236 ′ and the side surface 232 correspond to each other and is located on the corresponding outer side 232 for three times of the 200907234 light-pole body. Directly below the 110 is used to receive the fixed heat pipe as the upper portion of the first segment 272. As shown above, the heat transfer portion 272 of the heat pipe 270 is partially symmetrically disposed: the groove disposed on the first heat transfer element 23 Inside the slot 236; and the first heat transfer section 272 of the heat pipe Disposed in the recess portion 218 of the heat radiating portion 21〇 "this same way, the second heat transfer section 270 of the official 274 located on the - above the skillfulness conduction member 230, and the second heat conducting element connected 25〇. The second heat conducting element 25G is a hexagonal plate-like structure, which covers an upper surface 252 for carrying three light emitting diodes 110 and corresponding electric boards 120; It is disposed above the first heat conduction element. Three channels 256 are symmetrically formed below the second thermal conduction element 25 = = 254'. The grooves 256 are radially distributed and intersect at a central region of the second thermal conduction = 250. In other words, the channels extend radially outward from the central region of the second member (10), and the angle between the adjacent channels is about 120 degrees. When the second heat conducting element 250 is mounted on the conductive element 230, the channels 256 correspond to the second pass of the heat pipe 270 and the second heat transfer section of the heat pipe 27 is received by the IS. Inside. Thus, the second heat transfer section 274 of the heat pipe 270 is radially distributed within the first heat transfer V element 250. The above-mentioned 'light-emitting diode 11' and the corresponding circuit board 12' are provided with an outer surface ′, that is, a surface condition 第二 above the second heat-conducting element 25 、, and an outer side 232 of the conductive element 230. Wherein, the light-emitting diode 110 generated on the surface 252 of the second heat transfer is perpendicular to the light-emitting diode 110 located on the side 232 10 200907234 of the first heat conduction (four). The direction of illumination of the generated light. The arrangement is such that the three-dimensional distribution of the light-emitting diodes 110 on the heat absorbing portion to form a three-dimensional light source' enhances the illumination effect of the luminaire. The heat-fusible V element 230, the first signal < »V\, the above-mentioned three-dimensional light source, including the first conductive element 250' and the light-emitting diode 11〇, are disposed on the heat-dissipating portion 21〇, and the reflector 300 is placed on the heat-dissipating portion The upper portion 21 is connected to the connecting portion 2122, and the three-dimensional light source is housed in the globe 400 to form a light-emitting diode lamp. When in use, the light-emitting diode no generates light under the control of the circuit board 120, and at the same time, the heat generated by the light-emitting diode ιι is absorbed by the first heat-conductive element 23 of the heat absorbing portion, and the second The heat conducting element 25 is absorbed. The amount of heat absorbed by the first heat conduction element 230 and the second heat conduction element 25 is transmitted to the susceptor 212 of the heat dissipation portion 21 through the heat pipe, and is transferred to the heat sink 214 outside thereof, and the heat is radiated to the outside through the heat sink 214. Go in the environment. Thus, the heat generated by the LEDs 11 can be dissipated into the external environment through the large heat dissipation area of the demon portion 210. In this way, the light diode U0 can be X in the normal temperature range to ensure the lighting effect of the lamp and prolong the service life. In summary, the light-emitting diode lamp of the present invention embeds the heat pipe 27〇 in the base 212 of the heat sink 210, which is beneficial to the heat father change between the heat pipe 27〇 and the heat-dissipation training, and reduces the heat pipe 27〇 , w MW on L,,, & 270, the degree of the dish, and then can make full use of the thermal binary:: 10 generated heat is quickly transferred to the heat sink 2 and then "the heat dissipation module fine heat dissipation efficiency, thus It can ensure that the illuminating one's body 1 1 0 work dry is not extravagant, and ΓΗ1 彳乍 in the positive * Μ degree , circumference, improve the lighting effect of the lamp 0 11 200907234 利申: τ'? Invention meets the invention patent requirements, The difference is according to the law. The two are only the preferred embodiment of the present invention. For those who are interested in the art of the heart, the equivalent modification of the spirit of the 4 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a light-emitting diode lamp of the present invention. FIG. 2 is a perspective view of the light-emitting diode body module of FIG. Group and illuminating dipole decomposition diagram. Main component symbol description] LED module 1 00 circuit board 120 heat sink 210 upper connection 2122 heat sink 214 groove 218 outer side 232 groove 236 upper surface 252 channel 256 Figure 3 疋 Figure 2 heat dissipation module and LED module exploded view Figure 4 It is the other end of the heat dissipation module and the light emitting diode module of FIG. 2, the light emitting diode 110, the heat dissipation module 200, the base 212, the lower connection portion 2124, the channel 216, the first heat conduction element 230, the inner surface 234, the second heat conduction element 250, the lower surface. 254 heat pipe 270 12 200907234 first heat transfer section reflector 272 second heat transfer section 274 300 lampshade 400 13