099年07月19日修正替換頁 1335403 六、發明說明： 【發明所屬之技術領威】 剛树明涉及〆種發光二極體燈具’尤係具有散熱模組之 發光二極體燈具° 【先前技術】Modified on July 19, 099, replace page 1354403. VI. Description of the invention: [Technology of the invention] Gang Shuming involves a variety of light-emitting diode lamps, especially LEDs with heat-dissipating modules. technology】
[0002] 隨著科學技術進梦’從一般鶴絲燈發展到現在之冷陰極 焚光燈管（Cold Cathode Fluorescent Lamp，CCFL )及發光二極體（Light Emitting Diode，LED) ’ ^ 皆是朝向體積縮小及扁平化之方向發展。 [0003] 而目前CCFL因為體積幾乎是不能再縮小，而且CCFL升壓 ' 到600伏特電壓時會發生干擾，II外CCFL會造成汞污染等 • 問題，使得部分國家也將予取禁1%。而iLE D具有環保、亮 度高、省電、壽命長等諸多特點，所以LED將漸漸取代 CCFL。然而’現今高亮度LED所產生之局部熱量較大，若 要取代C C F L作為照明產品’則必須要有合適之散熱設計 ;否則會造成LED發光效率降低及壽命縮短等問題，所以 # 現今led封裝結構多利用金屬承載基板（Metai Core[0002] With the advancement of science and technology, 'from the general crane lamp to the current Cold Cathode Fluorescent Lamp (CCFL) and Light Emitting Diode (LED)' ^ are all oriented The direction of volume reduction and flattening is developing. [0003] At present, CCFL is almost unable to shrink because of the volume, and CCFL boosts the interference to 600 volts, and the external CCFL will cause mercury pollution. Some countries will also ban 1%. The iLE D has many features such as environmental protection, high brightness, power saving and long life, so LED will gradually replace CCFL. However, 'the current heat generated by high-brightness LEDs is large. If you want to replace CCFL as a lighting product', you must have a proper heat dissipation design; otherwise it will cause problems such as reduced LED luminous efficiency and shortened life. So # now LED package structure Multi-use metal carrier substrate (Metai Core
Print Circuit Board, MCPCB)作為散熱媒介，但 LED仍無法以高密集度方式設置，原因在於散熱能力仍無 法有效突破，因此有關LED散熱是目前業界亟需克服之難 題。 【發明内容】 [0004] —種發光二極體燈具，包括一燈罩、位於燈罩内部之複 數發光二極體’以及一散熱模組。其中’該散熱模組包 括一位於燈罩内部之吸熱部、一位於燈罩外部之散熱部 096128539 表單編號A0101 第3頁/共16頁 0993258324-0 1335403 099年07月19日 ，以及一熱管，該熱管包括一蒸發段和一冷凝段。該散 熱部包括一基座及設於基座外側周面之複數散熱片。該 熱管之蒸發段與吸熱部接連，該熱管之冷凝段與散熱部 之基座連接。該等發光二極體分佈在吸熱部上。Print Circuit Board (MCPCB) is used as a heat sink, but LEDs cannot be set in a high-density manner because the heat dissipation capability cannot be effectively broken. Therefore, LED heat dissipation is an urgent problem in the industry. SUMMARY OF THE INVENTION [0004] A light-emitting diode lamp includes a lampshade, a plurality of light-emitting diodes located inside the lampshade, and a heat dissipation module. The heat dissipating module includes a heat absorbing portion located inside the lampshade and a heat dissipating portion 096128539 located outside the lampshade. Form No. A0101, page 3/16 pages 0993258324-0 1335403, July 19, 1999, and a heat pipe, the heat pipe It includes an evaporation section and a condensation section. The heat radiating portion includes a base and a plurality of fins disposed on a peripheral surface of the outer side of the base. The evaporation section of the heat pipe is connected to the heat absorption portion, and the condensation section of the heat pipe is connected to the base of the heat dissipation portion. The light emitting diodes are distributed on the heat absorbing portion.
[0005] 與習知技術相比，本發明將熱管之冷凝段與散熱部之基 座連接，有利於熱管與散熱部t間之熱交換作用，可充 分利用熱管將發光二極體產生之熱量快速地轉移到散熱 部，進而提高了散熱模組之散熱效率，從而可確保發光 二極體工作于正常、穩定地工作。 【實施方式】 [0006] 如圖1至4所示，本發明之發光二極體迻具包括一發光二 極體模組100、一用以支撐並冷卻該發光二極體模組100 之散熱模組200、一套設於該散熱模組200上之反光罩 300，以及一設於該反光罩300上之燈罩400，其中該發 光二極體模組1〇〇位於燈罩400内。 [0007] 該反光罩300為内凹之碗狀結構，其包括一内凹之上表面 (圖中未標），其中部具有一通孔（圖中未示）。該反 光罩300用以反射發光二極體模組100產生之光線，令發 光二極體模組1 〇 〇產生之光線按照預定方向照射以增強照 明效果；例如圖1中燈具所處之位置，該反光罩300可將 發光二極體模叙1〇〇產生之光線向上反射。 [0008] 燈罩400為中空結構並將發光二極體模組100罩設其内， 其通常是由透明之塑膠、玻璃或其他材料製成。該燈罩 400設於該反光罩300上而令反光罩300夾設於散熱模組 200與燈罩400之間。該燈罩400主要用以防止灰塵、昆 096128539 表單編號 A0101 第 4 頁/共 16 頁 0993258324-0 1335403 099年07月19日按正替換頁 蟲等進入燈具内而影響發光二極體模組100之使用壽命。 另外，根據實際使用狀況，可以將反光罩300省略而令一 燈罩直接設於散熱模組200上。 [0009] 該發光二極體模組100包括複數發光二極體110及複數電 路板120，該等發光二極體110安裝於相應之電路板120 上並與電路板120電性連接。 [0010] 該散熱模組200包括一位於燈罩400外部之散熱部210、 一位於燈罩400内部之吸熱部，以及三支熱管270。每一 • 支熱管270包括與吸熱部連接之蒸發段，及與散熱部210 連接之冷凝段。該吸熱部呈桶狀，其可以進一步劃分為 一沿豎直方向設置於散熱部210上、呈筒狀之第一熱傳導 • 元件2 3 0及一水平地設於該第一熱傳導元件2 3 0上之第二 熱傳導元件250。 [0011] 該散熱部210之外形輪廓大致呈圓柱狀，其包括一圓筒狀 之基座212，以及自該基座212外側周面向外放射狀延伸 之複數散熱片214。相鄰之散熱片214之間分別形成一通Compared with the prior art, the present invention connects the condensation section of the heat pipe with the base of the heat dissipation portion, which is beneficial to the heat exchange between the heat pipe and the heat dissipation portion t, and can fully utilize the heat generated by the heat pipe to the light-emitting diode. Quickly transfer to the heat sink, which improves the heat dissipation efficiency of the heat dissipation module, thus ensuring that the light-emitting diode works normally and stably. [Embodiment] As shown in FIGS. 1 to 4, the LED device of the present invention includes a light emitting diode module 100 and a heat dissipation for supporting and cooling the LED module 100. The module 200, a reflector 300 disposed on the heat dissipation module 200, and a lamp cover 400 disposed on the reflector 300, wherein the LED module 1 is located in the lamp cover 400. [0007] The reflector 300 is a concave bowl-like structure including a concave upper surface (not shown) having a through hole (not shown). The reflector 300 is configured to reflect the light generated by the LED module 100, and the light generated by the LED module 1 is irradiated in a predetermined direction to enhance the illumination effect; for example, the position of the lamp in FIG. The reflector 300 can reflect the light generated by the LED display. [0008] The lampshade 400 is a hollow structure and covers the LED module 100 therein, which is usually made of transparent plastic, glass or other materials. The lamp cover 400 is disposed on the reflector 300 such that the reflector 300 is interposed between the heat dissipation module 200 and the lamp cover 400. The lampshade 400 is mainly used to prevent dust, Kun 096128539 Form No. A0101, Page 4 of 16 0993258324-0 1335403, July 19, 1999, according to the replacement of the worm, etc. into the luminaire, affecting the LED module 100 Service life. Further, depending on the actual use, the reflector 300 can be omitted and a lamp cover can be directly disposed on the heat dissipation module 200. The LED module 100 includes a plurality of LEDs 110 and a plurality of circuit boards 120. The LEDs 110 are mounted on the corresponding circuit board 120 and electrically connected to the circuit board 120. [0010] The heat dissipation module 200 includes a heat dissipation portion 210 located outside the lampshade 400, a heat absorption portion located inside the lampshade 400, and three heat pipes 270. Each of the heat pipes 270 includes an evaporation section connected to the heat absorbing portion, and a condensation section connected to the heat radiating portion 210. The heat absorbing portion has a barrel shape, and can be further divided into a first heat conduction element 2 3 0 which is disposed on the heat dissipation portion 210 in a vertical direction, and is horizontally disposed on the first heat conduction element 2 3 0 The second thermal conduction element 250 is on. [0011] The heat dissipating portion 210 has a substantially cylindrical outer shape, and includes a cylindrical base 212 and a plurality of fins 214 extending radially outward from the outer circumferential surface of the base 212. Forming a pass between the adjacent fins 214
道21 6以供氣流流過。該基座212兩端分別凸伸出有環形 連接部，即位於基座212上方之上連接部2122和位於基座 21 2下方之下連接部2124。該上連接部2122與吸熱部連 接；而下連接部2124與一燈頭（圖中未示）連接，該燈 頭為可從市場上獲得之標準件。三個凹槽218均勻地形成 於基座212之内壁面，並沿基座212之軸線方向延伸。該 等凹槽218用以容納熱管270之一部分。 [0012] 每一熱管270呈L型，包括一第一傳熱段272及一從第一傳 0993258324-0 096128539 表單編號A0101 第5頁/共16頁 1335403 __ 099年07月19日修正替換頁 熱段272端部垂直彎折延伸而出之第二傳熱段274，且第 一傳熱段272比第二傳熱段274長。第一傳熱段272之一 部分，圖1中所示為第一傳熱段272之下部分，容納並固 定於散熱部210内之一凹槽218内，為熱管270之冷凝段 ;第一傳熱段2 72之另一部分，圖1中所示為第一傳熱段 272之上部分，與第一熱傳導元件230連接，為熱管270 之蒸發段。此外，熱管270之第二傳熱段274與第二熱傳 導元件250連接，故第二傳熱段274也為熱管270之蒸發 段。如此設置，使熱管270之蒸發段呈彎曲狀，且該彎曲 之蒸發段可將吸熱部吸收之熱量快速地傳導至冷凝段， _ 以實現對發光二極體110之散熱功能。由於吸熱部主要用 於吸收發光二極體110產生之熱量，對散熱模組200之散 熱效果有較大影響，以下針對吸熱部之各部件做進一步 說明，以更好地了解散熱模組200之工作過程。 [0013] 該第一熱傳導元件230是設置於散熱部210之上連接部 2122之上之一個中空六棱柱結構，其具有六個外側面232 及一個圓柱狀之内表面234。在第一熱傳導元件230之每 < 一個外側面232上，三個發光二極體110沿著第一熱傳導 元件230之軸線方向排列成一條直線。六個溝槽236對稱 地分佈在第一熱傳導元件230之内表面234，並沿著第一 熱傳導元件230之軸線方向延伸。其中，每一個溝槽236 與一外側面232對應，並位於該對應外側面232上三個發 光二極體110之正下方用以收容、固定熱管270第一傳熱 段272之上部分。 [0014] 如上所述，熱管270之第一傳熱段272之上部分對稱地設 096128539 表單編號A0101 第6頁/共16頁 0993258324-0 1335403 099年07月19日按正替換頁 置於第一熱傳導元件230上之溝槽236内；而熱管270之 第一傳熱段272之下部分設置於散熱部210上之凹槽218 内；與此同時，熱管270之第二傳熱段274位於第一熱傳 導元件230上方，並與第二熱傳導元件250連接。 [0015] 該第二熱傳導元件250為一六邊形之板狀結構，其包括一 上表面252，用以承載三個發光二極體110及相應之電路 板120 ; —下表面254，貼設於第一熱傳導元件230之上 方。三個槽道256對稱地形成於第二熱傳導元件250之下 表面254，該等槽道256呈放射狀分佈且相交於第二熱傳 導元件250之中心區域。換言之，該等槽道256自第二熱 傳導元件2 5 0之中心區域向外呈放射狀延伸，且相鄰之槽 道256之間之夾角約120度。當該第二熱傳導元件250安 裝到第一熱傳導元件230上時，該等槽道256與熱管270 之第二傳熱段274相對應，並將熱管270之第二傳熱段 274收容、固定於其内。如此，熱管270之第二傳熱段 274在第二熱傳導元件250内呈放射狀分佈。 [0016] 如上所述，發光二極體110及相應之電路板120設置在吸 熱部之外表面，即第二熱傳導元件250之上表面252與第 一熱傳導元件230之外側面232。其中，位於第二熱傳導 元件250之上表面252之發光二極體110所產生之光線之 照射方向，垂直於位於第一熱傳導元件230之外側面232 之發光二極體110所產生之光線之照射方向。這樣佈置， 使得發光二極體110在吸熱部上呈立體分佈而形成一立體 光源，可增強燈具之照明效果。 [0017] 將上述之立體光源，包括第一熱傳導元件230、第二熱傳 096128539 表單編號A0101 第7頁/共16頁 0993258324-0 1335403 099年07月19日庚正替換頁 導元件250，以及發光二極體110，設於散熱部210上， 並令反光罩300套設於散熱部210之上連接部21 22而使立 體光源收容於燈罩400内，即可組成發光二極體燈具。Lane 21 6 flows through the air supply. The two ends of the base 212 respectively protrude with an annular connecting portion, that is, an upper connecting portion 2122 above the base 212 and a lower connecting portion 2124 below the base 21 2 . The upper connecting portion 2122 is connected to the heat absorbing portion; and the lower connecting portion 2124 is connected to a base (not shown) which is a commercially available standard member. Three recesses 218 are uniformly formed on the inner wall surface of the base 212 and extend in the axial direction of the base 212. The grooves 218 are for receiving a portion of the heat pipe 270. [0012] Each heat pipe 270 is L-shaped, including a first heat transfer section 272 and a first pass 0993258324-0 096128539 form number A0101 page 5 / a total of 16 pages 1353403 __ 099 July 19 revised replacement page The end of the hot section 272 is bent vertically to extend out of the second heat transfer section 274, and the first heat transfer section 272 is longer than the second heat transfer section 274. A portion of the first heat transfer section 272, shown in FIG. 1, is a lower portion of the first heat transfer section 272, received and fixed in a recess 218 in the heat sink 210, which is a condensation section of the heat pipe 270; Another portion of the hot section 2 72, shown in Figure 1 as the upper portion of the first heat transfer section 272, is coupled to the first heat transfer element 230 as the evaporation section of the heat pipe 270. In addition, the second heat transfer section 274 of the heat pipe 270 is coupled to the second heat transfer element 250, so that the second heat transfer section 274 is also the evaporation section of the heat pipe 270. In this way, the evaporation section of the heat pipe 270 is curved, and the curved evaporation section can quickly transfer the heat absorbed by the heat absorption portion to the condensation section, so as to realize the heat dissipation function to the light-emitting diode 110. Since the heat absorbing portion is mainly used for absorbing the heat generated by the light emitting diode 110, the heat dissipation effect of the heat dissipation module 200 is greatly affected. The following describes the components of the heat absorbing portion to further understand the heat dissipation module 200. work process. [0013] The first heat conduction element 230 is a hollow hexagonal prism structure disposed on the connection portion 2122 above the heat dissipation portion 210, and has six outer side surfaces 232 and a cylindrical inner surface 234. On each <one outer side surface 232 of the first heat conduction element 230, three light emitting diodes 110 are arranged in a line along the axial direction of the first heat conduction element 230. The six trenches 236 are symmetrically distributed on the inner surface 234 of the first heat conducting element 230 and extend along the axis of the first heat conducting element 230. Each of the trenches 236 corresponds to an outer side surface 232 and is located directly below the three light emitting diodes 110 on the corresponding outer side surface 232 for receiving and fixing the upper portion of the first heat transfer portion 272 of the heat pipe 270. [0014] As described above, the first heat transfer section 272 of the heat pipe 270 is partially symmetrically disposed 096128539. Form No. A0101 Page 6 of 16 pages 0993258324-0 1335403 July 19, 19, according to the replacement page placed a heat transfer element 230 is disposed in the groove 236; and a lower portion of the first heat transfer portion 272 of the heat pipe 270 is disposed in the recess 218 on the heat sink portion 210; at the same time, the second heat transfer portion 274 of the heat pipe 270 is located The first heat conduction element 230 is above and connected to the second heat conduction element 250. [0015] The second heat conduction element 250 is a hexagonal plate-like structure, and includes an upper surface 252 for carrying three light-emitting diodes 110 and corresponding circuit boards 120; a lower surface 254, affixed Above the first heat conduction element 230. Three channels 256 are symmetrically formed on the lower surface 254 of the second thermal conduction element 250, which are radially distributed and intersect at a central region of the second thermal conduction element 250. In other words, the channels 256 extend radially outward from the central region of the second thermal conduction element 250, and the angle between adjacent channels 256 is about 120 degrees. When the second heat conduction element 250 is mounted on the first heat conduction element 230, the channels 256 correspond to the second heat transfer section 274 of the heat pipe 270, and the second heat transfer section 274 of the heat pipe 270 is received and fixed. Inside. As such, the second heat transfer section 274 of the heat pipe 270 is radially distributed within the second heat transfer element 250. [0016] As described above, the light emitting diode 110 and the corresponding circuit board 120 are disposed on the outer surface of the heat absorbing portion, that is, the upper surface 252 of the second heat conduction element 250 and the outer side surface 232 of the first heat conduction element 230. The illumination direction of the light generated by the LEDs 110 on the upper surface 252 of the second heat conduction element 250 is perpendicular to the illumination of the light generated by the LEDs 110 located on the outer side 232 of the first heat conduction element 230. direction. The arrangement is such that the light emitting diodes 110 are three-dimensionally distributed on the heat absorbing portion to form a three-dimensional light source, which can enhance the lighting effect of the light fixture. [0017] The above-mentioned three-dimensional light source, including the first heat conduction element 230, the second heat transfer 096128539 Form No. A0101, page 7 / a total of 16 pages 0993258324-0 1335403 099, July 19, Geng is replacing the page guide element 250, and The light-emitting diode 110 is disposed on the heat-dissipating portion 210, and the reflector 300 is sleeved on the connecting portion 21 22 of the heat-dissipating portion 210 to receive the three-dimensional light source in the lamp cover 400 to form a light-emitting diode lamp.
[0018] 在使用時，發光二極體110在電路板120控制下產生光線 ，起到照明效果；與此同時，發光二極體110產生之熱量 被吸熱部之第一熱傳導元件230、第二熱傳導元件250吸 收。第一熱傳導元件230、第二熱傳導元件250吸收之熱 量通過熱管270傳遞給散熱部210之基座21 2而再傳遞給 其外部之散熱片214，並通過散熱片214將熱量散發到外 部環境中去。如此，發光二極體110產生之熱量可通過散 熱部210較大之散熱面積散發到外部環境中去。這樣一來 ，發光二極體110可工作于正常溫度範圍内，可確保燈具 之照明效果並延長使使用壽命。 [0019] 綜上所述，本發明發光二極體燈具將熱管270嵌設於散熱 部210之基座212，有利於熱管270與散熱部210之間之熱 交換作用，降低熱管270之溫度，進而可充分利用熱管 270將發光二極體110產生之熱量快速地轉移到散熱部 210，進而提高了散熱模組2 00之散熱效率，從而可確保 發光二極體110工作于正常溫度範圍内，提昇燈具之照明 效果。 [0020] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 表單編號A0101 096128539 第8頁/共16頁 0993258324-0 1335403 099年07月19日核正替换頁 [0021] 圖1是本發明發光二極體燈具之立體圖。 [0022] 圖2是圖1中發光二極體燈具之散熱模組與發光二極體模 組之立體圖。 [0023] 圖3是圖2中散熱模組與發光二極體模組之分解圖。 [0024] 圖4是圖2中散熱模組與發光二極體模組之另一角度之分 解圖。 【主要元件符號說明】 [0025] 發光二極體模組：100[0018] In use, the light emitting diode 110 generates light under the control of the circuit board 120 to provide an illumination effect; at the same time, the heat generated by the light emitting diode 110 is absorbed by the first heat conduction element 230 of the heat absorption portion, and the second The heat conducting element 250 absorbs. The heat absorbed by the first heat conduction element 230 and the second heat conduction element 250 is transferred to the base 21 2 of the heat dissipation portion 210 through the heat pipe 270 and then transmitted to the external heat sink 214, and the heat is radiated to the external environment through the heat sink 214. go with. Thus, the heat generated by the light-emitting diode 110 can be dissipated to the external environment through the large heat dissipation area of the heat radiating portion 210. In this way, the light-emitting diode 110 can operate in a normal temperature range, ensuring the illumination effect of the lamp and prolonging the service life. [0019] In summary, the light-emitting diode lamp of the present invention has the heat pipe 270 embedded in the base 212 of the heat dissipation portion 210, which facilitates the heat exchange between the heat pipe 270 and the heat dissipation portion 210, and reduces the temperature of the heat pipe 270. In addition, the heat generated by the light-emitting diode 110 can be quickly transferred to the heat-dissipating portion 210 by using the heat pipe 270, thereby improving the heat-dissipating efficiency of the heat-dissipating module 200, thereby ensuring that the light-emitting diode 110 operates in a normal temperature range. Improve the lighting effect of the luminaire. [0020] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. [Simple description of the drawing] Form No. A0101 096128539 Page 8 of 16 0993258324-0 1335403 July 19, 1999, the replacement page [0021] FIG. 1 is a perspective view of the light-emitting diode lamp of the present invention. 2 is a perspective view of a heat dissipation module and a light emitting diode module of the light emitting diode lamp of FIG. 1. 3 is an exploded view of the heat dissipation module and the light emitting diode module of FIG. 2. 4 is an exploded view of another angle of the heat dissipation module and the light emitting diode module of FIG. 2. [Main component symbol description] [0025] LED module: 100
[0026] 電路板：120 [0027] 散熱部：210 [0028] 上連接部：2122 [0029] 散熱片：214 [0030] 凹槽：218[0026] Circuit board: 120 [0027] Heat sink: 210 [0028] Upper connection: 2122 [0029] Heat sink: 214 [0030] Groove: 218
[0031] 外側面：232 [0032] 溝槽：23 6 [0033] 上表面：252 [0034] 槽道：256 [0035] 第一傳熱段：272 [0036] 反光罩：300 [0037] 發光二極體：110 096128539 表單編號A0101 第9頁/共16頁 0993258324-0 1335403 099年07月19日接正替換頁 [0038] 散熱模組：200 [0039] 基座：212 [0040] 下連接部：2124 [0041] 通道：216 [0042] 第一熱傳導元件：230 [0043] 内表面：234 [0044] 第二熱傳導元件：250 [0045] 下表面：254 [0046] 熱管：270 [0047] 第二傳熱段：274 [0048] 燈罩：40 0 096128539 表單編號A0101 第10頁/共16頁 0993258324-0[0031] Outer Side: 232 [0032] Trench: 23 6 [0033] Upper Surface: 252 [0034] Channel: 256 [0035] First Heat Transfer Section: 272 [0036] Reflector: 300 [0037] Illumination Diode: 110 096128539 Form No. A0101 Page 9 / Total 16 Page 0993258324-0 1335403 099 July 19th Replacement Page [0038] Thermal Module: 200 [0039] Base: 212 [0040] Lower Connection Portion: 2124 [0041] Channel: 216 [0042] First Thermal Conduction Element: 230 [0043] Inner Surface: 234 [0044] Second Thermal Conduction Element: 250 [0045] Lower Surface: 254 [0046] Heat Pipe: 270 [0047] Second heat transfer section: 274 [0048] Lampshade: 40 0 096128539 Form No. A0101 Page 10 / Total 16 Page 0993258324-0