200829369 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種鑽石研磨碟片製程，特別是一種製造異 有等向性鑽石顆粒之研磨碟片的鑽石研磨碟片製程。 【先前技術】 近年來，由於積體電路antegrated Circuit，1C)技術發展棟 速且成热，使得半導體產業成為蓬勃發展的產業之一，其中半導 體產品可廣泛應用於資訊、通訊、消費性電子、工業儀器、運輸 及國防太空等領域，對電子產品影響很大，其重要性不可言喻。 其中，矽晶圓（SiliconWafer)為半導體產業中極為重要之讨 料，而矽晶圓必須先經過化學機械研磨（Chemicai Meehanieal Polishing，CMP)製程，使矽晶圓表面平整才可於其上進行製造 晶片之後續_，雜魏程之準確度及㈣。於化學 製程中所使狀研錄（Pdishing Pad)，目長期研磨翻，其研 磨粒子填塞人研磨輕隙巾造成研磨墊之研磨鱗下降，必須定 期修整研磨墊以去除殘留的雜質及研磨殘屑，使研磨墊維持錢 佳研磨狀態。因此，半導體工業鑽石堅硬之特性，將鑽石應 用於清除研磨墊之補墊修㈣（Padc_iti㈣〇上，而研雜 ，整器之外型係為圓盤狀或是圓環狀，亦稱為鑽石研磨碟片修整 器(Diamond Disk Pad Conditioner )。 " ^ 習知技術之鑽石研磨碟片製造方法係细f鍍法或是择& 形成金屬結合綱1以包覆鑽石難且_於金屬基 上。但，習用之兩種鑽石研磨碟片製造方法皆無法提供足夠:社 200829369… 合力將鑽石顆粒緊密地固著於金屬基材表面，導 • 合力不足而自鑽石研磨制整修器上脫落，而產切晶圓表岭 .損的問題，因此必須額外執行一道硬銲製程，以增知鑽石顆粒的 結合性，如此將導致製造工序及成本的增加。 另外’為了增加研磨碟片修整器之壽命及提高研磨特性，於 台灣專利公告第412461號專利及美國專利第5，⑻2,9ω號中，揭 露-種利用具規則性分钸孔洞之模孔或是篩網之方式，以使鑽石 馨顆粒具規則性地排列圖案於研磨工具上及其製程方法，取代了傳 統研紅具上讀弱粒轉機且不酬之排财式。此外，台 增專利弟5他6號專利揭露—種將鐵石顆粒等高均勻排列之方 法’係將磨料顆粒依適當間距刺於載具上之磨粒定位溝，似直 充於磨粒結合溝内之結合劑，使得磨料顆粒排列取向呈一致性: 台灣第412461號專利及美國第5，·，_號專利雖可達到使 各個鑽石顆粒以適當間距均勻地排列之目的，但由於所使用之模 φ孔歧__目尺寸較鑽石顆㈣大，鑽石顆粒僅能根據網目 位置規則㈣，而無法控制各個鑽石顆粒於排列位置上之取向 (〇職tat麵），導致鑽石碟上之鑽石露出高度參差不齊，而對鑽 石研磨碟片修整器之研磨均句性及使用壽命上有極大的不良影 響。此外，鑽石顆粒固箸排列於晶圓表面後，仍需經過一道硬鲜 '製程以使鑽石顆粒緊密地與晶圓表面結合，因而導致基材變形及 - 鑽石顆粒劣化之問題。 、，又’台灣弟541226號專利甩於排列鑽石顆粒之載具必須先銑 削出預疋形狀之定位溝，使得製造成本因載具額外的加工工序而 200829369 3加且為了㈣石顆粒趨於同—取向’將耗費較多製造時間於 擺放鑽石顆粒之工序上，致使生產效率無法大幅提升。、 上ϋ之自用鑽石研磨則之製造方法中，鑽石顆粒雖可規則 也句勻排列’但部然法使各個鑽石顆粒之取向呈一致性，以及需 要花費過多成本及製才可使純顆__向—致，致使 -產鑽石研磨碟仏整H之效轉低，並不符合目前要求之經濟 效益。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond grinding disc process, and more particularly to a diamond grinding disc process for producing a grinding disc of heterogeneous isotropic diamond particles. [Prior Art] In recent years, due to the integrated circuit and integrated technology of 1C) technology, the semiconductor industry has become one of the booming industries, among which semiconductor products can be widely used in information, communication, consumer electronics, Industrial instruments, transportation, and defense space have a great impact on electronic products, and their importance is inexplicable. Among them, Silicon Wafer is an extremely important material in the semiconductor industry, and the germanium wafer must first undergo a Chemicai Meehanieal Polishing (CMP) process to make the surface of the germanium wafer flat before it can be fabricated. The follow-up of the wafer, the accuracy of the Wei Wei and (4). In the chemical process, the Pdishing Pad is polished for a long period of time. The abrasive particles are filled with a light-gap towel to cause the polishing scale of the polishing pad to drop. The polishing pad must be regularly trimmed to remove residual impurities and grinding debris. , so that the polishing pad maintains Qian Jia grinding state. Therefore, the hard nature of the semiconductor industry diamonds, the use of diamonds in the cleaning pad repair pad (4) (Padc_iti (four) 〇, and research, the whole model is disc-shaped or ring-shaped, also known as diamonds Diamond Disk Pad Conditioner. " ^ The diamond grinding disc manufacturing method of the prior art is a fine f plating method or a combination of metal forming a metal bonding 1 to coat the diamond and _ to the metal base However, the two methods of manufacturing diamond grinding discs are not enough: Society 200829369... Together, the diamond particles are tightly fixed on the surface of the metal substrate, and the joint force is insufficient to fall off from the diamond grinding repairer. In order to increase the bonding of the diamond particles, it is necessary to additionally increase the bonding process of the diamond particles, which will lead to an increase in the manufacturing process and cost. In addition, 'in order to increase the grinding disc dresser The life and the improvement of the grinding characteristics are disclosed in Taiwan Patent Publication No. 412461 and U.S. Patent No. 5, (8) 2, 9 ω, which utilize a die hole or a screen having a regular split hole. In order to make the diamond granules regularly arranged on the grinding tool and its manufacturing method, it replaces the traditional research and red machine on the weak grain transfer machine and does not pay for the money. In addition, Tai Zeng patent brother 5 he 6 The patent discloses a method for uniformly arranging the contours of the iron particles. The abrasive particles are punctured at appropriate intervals on the abrasive grain positioning groove of the carrier, and the binder is directly filled in the abrasive grain bonding groove, so that the abrasive particles are arranged. Orientation is consistent: Taiwan Patent No. 412461 and US Patent No. 5, ·, _ can achieve the purpose of evenly arranging individual diamond particles at appropriate intervals, but because of the size of the mold φ hole Diamonds (4) are large, diamond particles can only be controlled according to the mesh position rule (4), and can not control the orientation of each diamond particle in the arrangement position (defective tat surface), resulting in the diamonds on the diamond discs showing high unevenness, while grinding the diamonds The grinding of the disc dresser has a great adverse effect on the sentence and the service life. In addition, after the diamond particles are solidly arranged on the surface of the wafer, it still needs a hard process to make the diamond particles. The dense ground is combined with the surface of the wafer, which causes the deformation of the substrate and the problem of deterioration of the diamond particles. Moreover, the patent of Taiwanese 541226, which is used for arranging diamond particles, must first mill the positioning groove of the pre-cut shape. The manufacturing cost is due to the additional processing steps of the vehicle. In order to increase the manufacturing time, the production efficiency cannot be greatly improved. In the manufacturing method of self-use diamond grinding, although the diamond particles can be arranged regularly and uniformly, the partial method makes the orientation of each diamond particle consistent, and it takes too much cost and system to make the pure __ As a result, the effect of producing diamond grinding discs has been reduced, which does not meet the current economic benefits.
[發明内容】 ^上的問題’本發明提供―種鑽石研磨碟片製程，藉以 ^先W技術之鑽石顆粒分布不均、方向取向親無序，造成鑽 硕粒高低不齊、以及製_於繁複，致使製造成本過高且❹ 效率不彰的問題。 一 4 树明露之鑽騎輕㈣程步驟，首域提供一具 ϋ個網目的編織層，並於編織層之兩面上塗佈有黏性材料， =成黏性層，接著提供-容置單S，並將黏性層軸至容置留 ==佈舒個鑽石麵至紐層上，並使伽顆粒分職 、爾層的各個網目中，接箸灌注—高分子材料至容置單元中 以使鑽石顆粒被固定於高分子分 疋、q刀丁讨科上，敢後硬化高分子材料， ==觀_働自_林贿，㈣到-鑽石 刀布均勻且取向性—致的鑽石研磨碟片基座。 祕，藉由一網目尺寸較為鑽石顆粒小_ θ以迫㈣石顆㈣特定 石顆粒排序整齊且具有等向性，並利用高分子材料提供鑽: 200829369 足夠的固著力，不需另外進行硬銲，而可簡化鑽石研磨碟片的製 程步驟，同時降低製造成本。 、 以上之關於本發日肋容之朗及以下之實施方式之說明係用 以示範與_本發明之顧，並域供本發明之專辦請範圍更 進一步之解釋。 【實施方式】 明，閱第1圖」至「第1〇圖」，係本發明之鑽石研磨碟片 製程之示意圖及步驟流程圖。 如「弟1圖」及「第10圖」所示，首先係提供一具有複數個 網目之編·織層221，並於編織層221之兩面上塗佈有黏性材料 一2 u形成一霉5性層220 (步驟跡），本發明所揭露之編織層 221係為-由多條缝騎蚊構成之尼龍網，並形成有多個尺 寸大小為19Q微米（μ„〇至22q微米（μπ〇的網目，而黏性材料 222包括但不侷限於低黏性膠帶、黏土等具有黏附性之軟質材料。 如「第2圖」、「第3Α圖」、「第3Β圖」、及「第1〇圖」所示， 接著提供一容置單元210，以做為製造鑽石研磨碟片之作業平台， 並黏附黏性層220於容置單元210中（步驟11〇)。其中，黏^層 “20係碏由一套設於平盤21丨之周緣之對位治具26〇，且根據對位 具260所形成之中空區域，而將黏性層220貼附於平盤211上， 當黏性層220貼附至平盤211後，便將對位治具26〇由平盤211 上取下，以得到一具有黏性層220之平盤211，接著以一對應於 平盤211之外環212套設於平盤211之周緣，以形成具有中空結 構之谷1早元210。其中，對位治具2㈤之高度係略高於平盤 8 200829369 之南度’以便於作業人員將黏性層220準確地貼附於平盤211上， 而外環212相對於對位治具260而言，其具有較高之高度，以形 成足夠之工作空間。 如「第4A圖」、「第4B圖」、及「第1〇圖」所示，接著佈植 複數個鑽石顆粒230至黏性層220上，並施加一適當壓力使鑽石 顆粒230分別黏附於黏性層220之各個網目中（步驟12〇)，而黏 附嵌設於網.目中之鑽石顆粒230粒徑約為25〇微米（μιη)至3〇〇 • 微米（阿），亦即鑽石顆粒230之粒徑尺寸略大於黏性層22〇之 網目尺寸，故當施加一壓力使鑽石顆粒23〇佈植於黏性層22〇時， 鑽石顆粒230將被迫以銳角端嵌入黏附於黏性層22〇之網目中， 而使得鑽石顆粒230均勻分布且具有一致之方向取向。 如「第5Α圖」、「第5Β圖」、及「第1〇圖」所示，接著灌注 一高分子材料240至容置單元210中（步驟13〇)，以覆蓋黏附於 黏性層220上之鑽石顆粒23〇。其中，高分子材料係用以做 • 為鑽石研磨碟片之基板材料，且本發明之高分子衬料240係為環 氧樹脂（epoxy resm)，以做為鑽石顆粒23〇之結合劑，如此將可 避尤砂技術之高㈣銲製程所造紅基材變形及鑽石顆粒劣化 之問題。 • '如「第6A圖」、「第6B圖」、及「第10圖」所示，高分子材 2 24〇經由自然硬化或是加工硬化之過程後，使鑽石顆粒咖緊 、山口著於阿刀子材斜240上，即可將高分子材料連同鑽石顆 粒230脫離於容置單元21〇中（步驟14〇)，而得到一均勾分布且 方向取向一致之鑽石顆粒230之圓盤狀高分子材料240基座。 200829369 如「第7A圖」、「第7B圖」、及「第1〇圖」所示，取出後妁 圓盤狀尚分子材料240，由於表面的平坦度不佳，為了提升研磨 碟片的整體平坦性，及改善鑽石顆粒23〇周緣的高分子材料24〇 於製程後產生凹陷的問題，更可選擇性地披覆一固化膠狀物25〇 於硬化之高分子材料240上（步驟15〇)，而此固化膠狀物25〇係 為-光固化膠（UV glue)，並藉由紫外光線的照射，使得光固化 膠250產生硬化，以得到一平整表面且具有鑽石顆粒23〇之鑽石 • 研磨碟片基座。 ' 如第8A圖」及「第犯圖」所示，其中黏性層之網目 的設計除了可為相同尺寸大小，更可輯為黏性層22σ外緣的網 目尺寸略小於中心位置的網目，而形成嵌附於外緣的鑽石顆粒2% 係以銳肖端朝上排列’細於巾雜置賴^顆粒23q以非銳角 端排列的鑽石研磨碟片基座；或是位於黏性層挪外緣的網目尺 寸略大於巾雜置_目，而形成外緣為雜角端排列的鑽石顆 _ 粒230，中〜位置以銳角端朝上排列的鑽石研磨碟片基座，以滿 足鑽石研磨碟片於研磨製程上的實際需求，但並不以本發明揭露 之不同尺寸與排列位置的網目型態為限。 、、/如第9八圖」及「第9B圖」所示，平盤211之形狀除了可 ‘ 為平整表面，更可於平盤211之中央位置形成一凸出部2m或是 一凹陷部2112 ’高分子材料240灌注至由外環212構成之容置空 ~間㈣加以成型，即_—巾間_或是凸起_石研磨碟片基 座藉由平盤211之表面型態的改變，而可得到對應於平盤211 表面型权預設形狀的高分子材料24Q基座，熟悉該項技術者亦 10 200829369 可將平盤211表面型態變化設計為各 磨碟片於實際應用在研磨製程 嫌’以滿足鑽石研 之 實施例為限。 )而木’亚不以本發明所揭露 本發明揭露之鑽石研廯磾片制如 根據紐層之網目位置，：以定:角::為磨料之鑽石顆粒係 鑽石顆粒分料恤㈣娜層上，使得 削性質，以读Μ曰社从 促升鑽石研磨碟之研磨切 ^1 效果，同時健L研麵的伸用 命命。另外，本發明利用高分子#料的固^的u 碟片基座，μ㈣進行硬銲製程，'騎=鑽石研磨 驟及製造成本。 廣石研磨碟片製程步 相本發日狀實齡彳揭露如 明，铵甸#羽化門以±^ 〜亚非用以限定本發 …」热白々目關议蟄者，在不脫離本發明 凡依本發明申請範圍所述 心和现圍内，舉 之變更，因此本發明之專t徵及精神當可做些許 利範圍所界定者為準。、又乾〜貝说令§兄明書所附之申請專 【圖式簡單說明】 第1圖為本發明之分解步驟之立體示意圖； 第/圖為本發明之分解步驟之立體示意圖； 第:3A圖為本發明之分解步驟之立體示意圖； 第，圖為本發明之分解步驟之剖面示意圖； =4人圖為本發明之分解步驟之立體示意圖； 第，圖為本發明之分解步驟之剖面示意圖； 第认圖為本發明之分解步驟之立體示意圖； 11 200829369 第5B圖為本發明之分解步驟之剖面示意圖； 第6A圖為本發明之分解步驟之立體示意圖； 第6B圖為本發明之分解步驟之剖面示意圖； 第7A圖為本發明之分解步驟之立體示意圖； 第7B圖為本發明之分解步驟之剖面示意圖； 第8A圖為本發明之鑽石顆粒黏附至不同尺寸大小之網目之剖面 不意圖， B 第8B圖為本發明之鑽石顆粒黏附至不同尺寸大小之網目之剖面 示意圖； 第9A圖為本發明之不同型態之平盤之剖面示意圖；· 第9B圖為本發明之不同型態之平盤之剖面示意圖；以及 第10圖為本發明之步驟流程圖。[Summary of the Invention] The problem of 'the present invention' provides a process for grinding diamond discs, whereby the diamond particles of the first W technology are unevenly distributed and the orientation orientation is disordered, resulting in unevenness of the drilled grain and the system. The complexity is complicated, and the manufacturing cost is too high and the efficiency is not good. A 4 tree Minglu drill rides a light (four) step, the first domain provides a braided layer of a mesh, and is coated with a viscous material on both sides of the braid, = a viscous layer, and then provides - accommodating Single S, and the adhesive layer is placed to the capacity == Bushu diamond surface to the new layer, and the gamma particles are divided into the mesh, the mesh of each layer, the infusion - polymer material to the receiving unit In order to make the diamond particles fixed on the polymer bifurcation, q knives, and then harden the polymer material, == view _ _ _ _ bribe, (four) to - diamond knives uniform and oriented - Diamond grinding disc base. Secret, by a mesh size smaller diamond particles smaller _ θ to force (four) stone particles (four) specific stone particles sorted neat and isotropic, and using polymer materials to provide drill: 200829369 sufficient fixing force, no additional brazing It simplifies the process steps of diamond grinding discs while reducing manufacturing costs. The above description of the embodiments of the present invention and the following embodiments are used to demonstrate the scope of the present invention and further explain the scope of the invention. [Embodiment] The drawings and the flow charts of the steps of the diamond grinding disc of the present invention are shown in the drawings. For example, as shown in "Day 1" and "Pic 10", a woven layer 221 having a plurality of meshes is first provided, and a viscous material is coated on both sides of the woven layer 221 to form a mold. The fifth layer 220 (step trace), the braided layer 221 disclosed in the present invention is a nylon mesh composed of a plurality of stitched mosquitoes, and formed with a plurality of sizes of 19Q micrometers (μ 〇 to 22 q micrometers (μπ) The mesh of the crucible, and the adhesive material 222 includes, but is not limited to, a soft material such as a low-adhesive tape or clay, such as "Fig. 2", "3rd drawing", "3rd drawing", and " As shown in FIG. 1 , a accommodating unit 210 is provided as a working platform for manufacturing a diamond grinding disc, and the adhesive layer 220 is adhered to the accommodating unit 210 (step 11 〇). "The 20-series is provided by a set of counter-aligning tools 26" disposed on the periphery of the flat plate 21丨, and the adhesive layer 220 is attached to the flat plate 211 according to the hollow region formed by the alignment member 260. After the adhesive layer 220 is attached to the flat plate 211, the alignment fixture 26 is removed from the flat plate 211 to obtain a flat layer having the adhesive layer 220. 211, then a ring corresponding to the outer ring 212 of the flat plate 211 is sleeved on the periphery of the flat plate 211 to form a valley 1 having a hollow structure. The height of the alignment fixture 2 (5) is slightly higher than the flat plate. 8 200829369 South 'to facilitate the operator to accurately attach the adhesive layer 220 to the flat plate 211, and the outer ring 212 has a higher height relative to the alignment fixture 260 to form sufficient Work space. As shown in Figure 4A, Figure 4B, and Figure 1, a plurality of diamond particles 230 are implanted onto the viscous layer 220 and a suitable pressure is applied to the diamond particles 230. Adhesively adhered to each mesh of the adhesive layer 220 (step 12〇), and the diamond particles 230 embedded in the mesh have a particle size of about 25 μm to 3 μm. That is, the particle size of the diamond particles 230 is slightly larger than the mesh size of the adhesive layer 22, so when a pressure is applied to cause the diamond particles 23 to be implanted in the adhesive layer 22, the diamond particles 230 are forced to be embedded at the acute end. Adhered to the mesh of the adhesive layer 22, so that the diamond particles 230 are evenly distributed and have Directional orientation. As shown in Figure 5, Figure 5, and Figure 1, a polymer material 240 is then poured into the housing unit 210 (step 13) to cover the adhesion. The diamond particles 23 on the adhesive layer 220. The polymer material is used as a substrate material for the diamond grinding disc, and the polymer lining 240 of the present invention is an epoxy resm. As a bonding agent for diamond particles 23, this will avoid the problem of high red (4) deformation of the red substrate and deterioration of diamond particles during the welding process. • 'As shown in Figure 6A and Figure 6B And "Picture 10", after the process of natural hardening or work hardening, the polymer particles are tightly packed, and the mountain pass is placed on the slanting 240 of the knife, so that the polymer material can be The diamond particles 230 are separated from the accommodating unit 21 (step 14A) to obtain a pedestal of the disc-shaped polymer material 240 of the diamond particles 230 which are uniformly distributed and oriented in the same direction. 200829369 As shown in Figure 7A, Figure 7B, and Figure 1, the disk-shaped molecular material 240 is removed and the flatness of the surface is not good. The flatness and the improvement of the polymer material 24 around the circumference of the diamond particles 24 cause a problem of depression after the process, and more selectively coat a cured gel 25 on the hardened polymer material 240 (step 15) And the cured adhesive 25 is a UV glue, and the light curing adhesive 250 is hardened by irradiation of ultraviolet light to obtain a diamond having a flat surface and having diamond particles of 23 inches. • Grinding the disc base. As shown in Figure 8A and the "figure map", the design of the mesh of the adhesive layer can be the same size, and the mesh size of the outer edge of the adhesive layer 22σ is slightly smaller than the mesh of the central position. 2% of the diamond particles embedded in the outer edge are arranged with the sharp side end facing up. The diamond grinding disc base which is arranged in a non-sharp end of the particle 23q; or in the adhesive layer The mesh size of the outer edge is slightly larger than that of the towel, and the diamond granules 230 with the outer edge arranged at the corner ends are formed, and the diamond grinding disc bases with the acute end angles arranged upward are arranged to meet the diamond grinding. The actual requirements of the disc on the grinding process, but not limited to the mesh size of the different sizes and arrangement positions disclosed in the present invention. , as shown in Fig. 9 and Fig. 9B, the shape of the flat plate 211 can be a flat surface, and a projection 2m or a recess can be formed at the center of the flat plate 211. 2112 'Polymer material 240 is poured into the space formed by the outer ring 212 to form (4), that is, the _-towel-to-toilet _ or the _ stone-grinding disk base is formed by the surface type of the flat disk 211 Change, and the 24Q base of the polymer material corresponding to the preset shape of the surface type of the flat plate 211 can be obtained, and the person familiar with the technology also has 10 200829369. The surface shape change of the flat plate 211 can be designed as a practical use of each grinding disc. The grinding process is suspected to meet the requirements of the Diamond Research Institute. And the wood of the invention is not disclosed by the present invention. The diamond mortar piece disclosed in the present invention is as follows according to the mesh position of the layer: the diamond: the diamond particle granules of the abrasive layer (4) On the top, the nature of the cut is made to read the effect of the grinding and polishing of the diamond grinding discs, and the life of the health researcher. In addition, the present invention utilizes a solid-state u-disc pedestal of a polymer material, and a (4) hard soldering process, 'riding = diamond grinding step and manufacturing cost. Guangshi Grinding Disc Process Steps The hair is in the form of a real-time 彳 彳 如 , , 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵 铵The scope and spirit of the present invention are subject to change without departing from the scope of the invention as defined by the scope of the invention. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 3A is a schematic perspective view of the decomposition step of the present invention; the figure is a schematic cross-sectional view of the decomposition step of the present invention; the figure of 4 is a schematic perspective view of the decomposition step of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5B is a schematic cross-sectional view showing an exploded step of the present invention; FIG. 6B is a perspective view showing an exploded step of the present invention; A schematic cross-sectional view of the decomposition step; FIG. 7A is a schematic perspective view of the decomposition step of the present invention; FIG. 7B is a schematic cross-sectional view showing the decomposition step of the present invention; FIG. 8A is a cross-sectional view of the diamond particles of the present invention adhered to meshes of different sizes Without intending to, FIG. 8B is a schematic cross-sectional view of the diamond particles of the present invention adhered to meshes of different sizes; FIG. 9A is a different form of the present invention. FIG. 9B is a schematic cross-sectional view of a different type of flat plate of the present invention; and FIG. 10 is a flow chart of the steps of the present invention.
12 200829369 【主要元件符號說明】 步驟100 提供一具有複數個網目之編織層，並於編織層外 ~ 步驟110 塗佈黏性材料，以形成黏性層 提供一容置單元，並黏附黏性層於容置單元中 步驟120 佈植複數個鑽石顆粒至黏性層上，並黏附於黏性 層之各個網目中 步驟130 灌注高分子材料至容置單元中 φ 步驟14〇 使高分子材料硬化並連同鑽石顆粒脫離於容置單 元 步驟150 披覆一固化膠狀物於硬化之高分子材料上 210 容置單元 211 平盤 2111 凸岀部 2112 凹陷部 212 • 外環 220 霉占性層 221 編織層 222 黏性材料 230 鑽石顆粒 - 240 南分子材料 ^ 250 固化膠狀物 260 對位治具 1312 200829369 [Description of main component symbols] Step 100 provides a woven layer with a plurality of meshes, and applies a viscous material outside the woven layer to step 110 to form a viscous layer to provide a accommodating unit and adhere the adhesive layer. Step 120 in the accommodating unit implants a plurality of diamond particles onto the adhesive layer and adheres to each mesh of the adhesive layer. Step 130: Inject the polymer material into the accommodating unit φ Step 14 硬化 harden the polymer material and And the diamond particles are separated from the accommodating unit. Step 150 is coated with a solidified gel on the hardened polymer material. 210 accommodating unit 211 flat disk 2111 convex portion 2112 concave portion 212 • outer ring 220 mold layer 221 woven layer 222 Adhesive Material 230 Diamond Particles - 240 South Molecular Material ^ 250 Curing Glue 260 Counter Fixture 13