200812924 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種切割裝置，其係適用於由玻璃、陶 •瓦等硬脆性材料所形成的被切割物、尤其是薄狀板之被切 •告il物的切割等，特別是例如用於液晶&電漿顯示面板製程 之玻璃基板的切割。 【先前技術】 ^於習知之貼合玻璃基板切割方法，其特徵為由2片坡 埚基板貼合所形成的貼合基板，於其切割溝之相對面以一 橡膠板按住，該切割溝係以超硬合金刀輪等玻璃切割刀具 所形1，沿切割道（scribe line)施加壓力，使切割溝產生 垂直裂痕（crack)以使玻璃基板分割。（例如請參閱專 文獻1) π自知之玻璃切割方法，其特徵在於玻璃板之 方^面侧，以鑽石圓刀（diamond disk saw)形成一斜拉痛 並藉=對拉痕面，且被拉痕圍繞之範圍的外侧加熱，使 璃板變形，藉由變形使斜拉痕瞬間從加熱面穿入到相 面進而使圍繞拉痕的部分分離。（例如請參閱專利文獻 又及，於習知之玻璃切割方法與I置提案，其特徵 於玻璃薄板表面，以二氧化碳雷射、HF雷射或彻雷 等=光照射，藉由局部施熱、急速冷卻，在玻璃薄板 二、、㈣變形下，使玻璃薄板分裂。“列如請參閱 又，於習知之硬脆性材料切财法雜案，其特徵 6 200812924 於由玻璃、氧化銘陶甍等硬脆性材料所形成之被加工材料 W的邊緣近旁至少2點，於此情形時，切割預定線（切割 溝預定線）近旁的2點，同時以二氧化碳雷射或YAG雷 射等雷射束（laser beam)進行照射，產生初始龜裂，使雷 射束照射位置之間產生特殊的熱應力分布，於拉伸應力大 於雷射束的1點照射同時，控制應力的發生狀態，以提高 切割斷裂控制。（例如請參閱專利文獻4) 又及，於習知之玻璃基板切割方法及裝置，係於各部 位的能量密度平均，且具備一加熱工程，其雷射束的焦點 以縱長形順著切割方向作雷射束照射，使玻璃基板的切割 部加熱；及一冷卻工程，其係藉由雷射束照射，將受熱過 的切割部急速冷卻以形成一微裂痕，而使微裂痕之形成得 以活性化，進而提高生產性。（例如請參閱專利文獻5) 又，於習知之玻璃製品或結晶化玻璃製品的加工方法 及製造方法，其特徵為具有一薄形化工程，係預先使加工 部位比他部薄；及一開孔或切割加工工程，係對該加工部 位進行雷射照射。（例如請參閱專利文獻6) 其他之習知之玻璃板切割裝置等提案，其特徵為具備 一破裂（cracking)機構，係使玻璃板切割之始初點產生 微細裂痕；一加熱機構，係使玻璃板吸收至少1點的照射 束照射；一冷卻機構，係於至少1點的雷射束照射加熱後， •藉由冷卻流體將玻璃板冷卻；一照射機構，係於包含制動 • ( braking)機構之玻璃板切割裝置，以雷射束進行第1二 氧化碳雷射束照射；一第1控制機構，係以控制照射機構 的指定範圍；及一制動工程，係藉由配設於第1二氧化碳 7 200812924 雷射束照射機構後部之第1冷卻機構的冷卻流體，以控制 玻璃板切割道的形成。（例如請參閱專利文獻7) 【專利文獻】 1、 日本特開平6-48755號公報 2、 日本特開平7-223828號公報 3、 日本特開平9-12327號公報 4、 日本特開平7-328781號公報 5、 日本特開2005-247603號公報 6、 日本特開2000-219528號公報 7、 日本特表2006-513121號公報 然而，上述習知技術仍有下述不完善之處。亦即，於 專利文獻1的技術中5當於切割溝之相對面以橡膠按住 時，會使玻璃基板受到衝擊，玻璃板受到衝擊影響，容易 產生破裂或裂痕，或電線被切斷等，而降低玻璃板製品品 質。 於專利文獻2的技術中，拉痕發展方向控制困難，使 玻璃板内部產生裂痕，造成製品品質不良。 於專利文獻3及專利文獻4的技術中，由於雷射光的 照射輸出必須加大，而會影響切割溝的斜度，而使玻璃板 的朝内方向產生裂痕，或於沿切割溝產生玻璃片剝裂等現 •象，而降低玻璃板製品的性能。 - 又，於專利文獻3的技術中，於沿著雷射束行徑誘導 裂痕之際，叉開的裂痕會跟隨雷射束照射位置的移動路徑 發展，而會有影響加工精度之慮。 8 200812924 又及，於專利文獻4的技術中， 由此束子中心及周邊之間發 :于束照射時’藉 壯能芬#…+ 周化的溫度條件、材料表面之4离丨 狀恶及材料巾的纽㈣#❹ =表面之政亂 力）集中破壞，亦或♦月邱# + ” 使…、應力（引伸張 力時，甚至會= = 獻3的技術相同，於誘導龜裂之& 且亦與專利文 射束照射位置的移動路#發展，開的龜裂會跟隨雷 題。 、 k成加工精度不良的問 進行5的技術中’於藉由雷射照射對加工零件 订開孔或㈣加I前’必需預先 位薄的薄形化工程，如此 了使加工σΡ位比他部 壓形機，而右iw/ 序多’也必須要有薄形化 小钱而有增加製造成本的問題。 於專利文獻6及專利文獻7的姑个士 射設備及所需光與用、真2 的技街中’由於必須有雷 用甚古而:予周…又備等複雜裝置構成，且該設備費 用甚回，而有成本極高的問題。 【發明内容】 =於上述課題，本發明之目的係提供—種切割裝 β方止裂痕發生、無損被切割物之品質、精確且稃定 地切割被切割物的切割裝置。 、積確軋疋 玻璃如=專=圍/1項之切割裝置，餘 物，料硬脆性材料所形成的被切割 物之^丢^為/ 切削工具，係配置於可接觸到被切割 主切割部位；及一位移機構，係、可沿著切割部位 200812924 在刀削工具及被切割物之間 包含一刀刃部，、運動Q其中，切削工具 發熱體，係能將刀物之尖緣部；及一 溫，且藉由位移機構，於、古:至^被切副物之軟化點以上高 •刃部之間作相對運動=叫物及經由加熱體受熱的刀 -割。 縣，龍切_之㈣部位作切削切 加熱二=:r=部位，且藉由發熱體 高溫。切削工呈則^、f熱至被切割物之軟化點以上 相對運動。亦即移機構’於與被切割㈣ 沿著指定切割部二::刀因 切割部位，係藉由刀 =則物之指定 對應的溝部。並且，於此π;:緣^形成與該尖緣部形狀 過的尖緣邻ΑΛβ於此，由於該切割部位藉由受熱 以上高/使；:if度激增地加熱至被切割物之軟化點 形。==大緣部所接觸部位的被切割物產生塑性變 落，進：麟成為切屑，並從被切繼 「切削」）。 1刀位’使被切割物切割（狹義為 切達到軟化點以上高溫’沿著所希望 .呈接編丨 施以高溫的切削工具，而以該切削工 力:::r?rr藉由熱膨漲向㈣ 宝物总執^私 之接觸部位’由於溫度激增使被切 塑性^上’而使該接觸部位的被切割物產生 ，亚猎此使壓縮應力釋放。從而，藉由 10 200812924 ::::邊發生的_應力，而使被切割物未發生裂痕等 因此，如申請專利範圍第丨項之切钙 ，的尖緣部受熱至被切割物之軟化點以上，並盘=刀: 割，且不會有㈣不_現了^皮㈣物精確且穩定地切 如申請專利範圍第2項之切 項之附屬項，其係更具備一m編/、係依附於第1 體的溫度，於使用切削工且:t工料構，用於控制發熱 部的溫度能維;對被切割物作切削時，使刀刃 如申請專利範圍第2項之切割裝置， 旳/皿度此維持在一定溫度。 穩定的熱張應力作用，而更可將被===生 割，且不會有切割不良的現象。物倩確且‘疋地切 項之：ΓΓ利範圍第3項之切割裝置，其係依附於第2 = -配 :二==r_偵測導 被切割物所~或刀刀部對 邻=請，範圍第3項之切割裝置，其係藉由控制 度她所發出剩訊號 及被切割物之間所產生之相對運動]; 11 200812924 娜刀的深度進行適當控制。因此，於使用切削 割物的切肖;:件:Ji:?，之間作相對運動，使被切 確且，地切割且不會有切割不良的現象。 項到第3項所有之附:項頁 切削工具之欲切削部位預先備一加熱機構，其係將 構，= f第4項之切繼，其係藉由加熱機 地藉由切削工i，:切削部位預先加熱。因此，能更簡單 且，曰更可提古i削、切割物加熱到軟化點以上溫度。而 保穩定Ltr 且使切削性穩定化，進而更能確 如申請專利範圍第5項之 項之附屬項，其係更具備_、冷其係依附於第4 M ^ M JLL· L 7 Ρ ϋ構，其係使|f由加埶機 -、真=^ 部位冷卻，以將切削工具之欲切削部二 故以加熱機構加熱’且—邊以冷 如申請專利範圍第5項之切到壯罢甘二邊切削 所欲切削的部位藉由加敎機構^衣、謂切削工具 行冷卻。因此，構加熱’且同時以冷卻機構進 、士丄 田刀为具之欲切削部位（切宝丨J部位）之 =物=熱散發時’能夠防正熱往該被嶋 白擴放。因而’於被切割物例如液晶面板的情 防止對驅動電極等各種電極模、曰、六/ '、此。 劑等有不良影響的熱往面方向擴散:：可面 性能低劣等不完善問題。 方止液S曰面板的 12 200812924 藉由本發明之切割裝置，可防止裂痕發生、無損被切割物 之品質、精確且穩定地切割被切割物。 【實施方式】 圖1係為顯示依據本發明之實施例之一切割裝置之一 例示圖的局部立體圖；圖2係為顯示適用於圖1實施例之 肖J八之例示圖的平面視圖。本發明係為一種切判裝 置，一其係適用於切料學玻璃、石英玻璃，及其他之玻璃、 陶兗、矽晶（silicon)、半導體材料等硬脆性材料。以下， 將参照相關圖式’說明依本發明較佳實施例之㈣裝置 =特別^於例如液晶及電漿顯示面板製程之玻璃板的 切告彳。 請參照圖1所示，依據本發明較佳實施 裝置10，其係包合—士 π &丨τ g Μ 匕3切則工具12。該切削工具12配置於 :接觸到被切割物(被加工物)例如長方形玻璃板w之指 疋㈣部位ω (狹義為「切削部位〜)。該切削工具12， ^略f之，於玻璃板W切割的局部部位（與後述之刀刃部 的刃尖部相當）使該玻璃板w達到軟化點以上高溫，於本 貫，例中，例如可於約㈣^丨⑻叱範目的高溫，精確 且同速控m其構成係為於—陶 度偵測器及一發埶體，以香埶5 μ 4 . 知”、、魈以又熱至—定溫度之刀刃部的刃尖 和對玻璃few之指定切割部位ω作切削切割。 亦即，例如請參照圖2所示，該切削工具12包含一 =:上見為5角形狀之切削工具本體14。該切削工具本 脰Η ^一例如由陶莞所形成的陶竟基板Μ。該陶竟基 13 200812924 板16,於其長軸方向之一端侧包含一例如V字形的刀刃部 18。該刀刃部18具有一刃尖部20，亦即尖緣部，用以切 削被切割物玻璃板W。該刃尖部20位於該陶瓷基板16之 一方主面侧之刀刃部18的頂端部。 ' 又，該切削工具本體14,宜使用例如氧化矽、氧化鋁、 •氧化錯、氧化鈦、紅柱石（莫來石，mullite)等做為絕緣 材料。 於該陶瓷基板16之一方主面，形成一平面視為U字 形的溫度偵測器22。於該溫度偵測器22的一端及他端， 可分別連接電極22a及電極22b。該電極22a及電極22b， 分別由金、金及銅的合金所形成。於此情形時，該溫度偵 測器22宜使用例如由鎳鉻合金及鎳銘合金、白金及白金 錄等構成的熱電對，又及，由白金、金一钽合金等所構成 的電阻體。 又，於陶瓷基板16之一方主面侧，形成一絕緣層24， 用以覆蓋溫度偵測器22，其係由例如二氧化矽所形成。絕 緣層24的形成材料，除二氧化石夕外，亦宜使用例如氧化 石夕、氧化銘、氧化錯、氧化鈦、紅柱石等做為絕緣材料。 又及，於陶瓷基板16之一方主面侧，在絕緣層24的 上面，配設一例如「匚」字形的發熱體26。該發熱體26 係由碳化矽等抗發熱體所形成。於此情形時，溫度偵測器 -22配設於發熱體26的近旁。又，該發熱體26的形成材料， —除碳化矽外，亦宜使用例如氧化锆等。 又及，於陶瓷基板16之一方主面侧，在除了發熱體 26的一端部26a及他端部26b以外之發熱體26的上面， 14 200812924 形成一耐磨耗層28。該耐磨耗層28係由氧化鈇、ι化欽 等所形成。又，該耐磨耗層的形成材料，除氧化教及氣化 鈥外，宜使用例如碳化鎢、碳化鈦、礙化硼等。 又及，於陶究基板16之一方主面侧，在發熱體％的 一端部26a及他端部26b的上面，分別連接由金、^及銅 的合金等所形成的電極30a及電極30b。 接著，兹就該切削工具12之製造方法之一、斑參 照例如圖3A、圖3B、圖4A、圖4B、圖5A、圖I、、圖 6A、圖6 B、圖7A、圖7B及圖8A及圖8B說明如下。 育先，例如請參照圖3A及圖3B所示，例如 直方體形氧化锆等所形成的陶瓷基板16,在陶瓷基板16200812924 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a cutting device which is suitable for being cut by a hard and brittle material such as glass, ceramic tile or the like, especially a thin plate. • Cutting of il materials, etc., in particular, for example, cutting of a glass substrate for a liquid crystal & plasma display panel process. [Prior Art] A conventional method for bonding a glass substrate, which is characterized in that a bonded substrate formed by laminating two corrugated substrates is held by a rubber sheet on the opposite side of the cutting groove, the cutting groove In the shape of a glass cutting tool such as a superhard alloy cutter wheel, pressure is applied along the scribe line to cause a vertical crack in the cutting groove to divide the glass substrate. (For example, please refer to the special literature 1) π self-explanatory glass cutting method, which is characterized in that the side of the glass plate is formed by a diamond disk saw to form a diagonal pull pain and borrowing a pair of pull marks, and The outer side of the range surrounded by the pull marks is heated to deform the glass sheet, and the deformation causes the oblique pull marks to instantaneously penetrate from the heating surface to the phase surface to separate the portion surrounding the pull marks. (For example, please refer to the patent documents and the conventional glass cutting method and I proposal, which are characterized by the surface of the glass sheet, with carbon dioxide laser, HF laser or ray, etc., by local light application, rapid heating Cooling, under the deformation of the glass sheet 2, (4), the glass sheet is split. "See for example, in the customary hard and brittle material cutting the wealth of miscellaneous cases, its characteristics 6 200812924 in the glass, oxidized Ming Tao and other hard At least 2 points near the edge of the material W to be processed by the brittle material, in this case, 2 points near the predetermined line (the predetermined line of the cutting groove), and a laser beam such as a carbon dioxide laser or a YAG laser (laser) Beam) is irradiated to produce an initial crack, which causes a special thermal stress distribution between the laser beam irradiation positions. When the tensile stress is greater than the 1 point of the laser beam, the stress is generated to improve the cutting fracture control. (See, for example, Patent Document 4) Further, the conventional glass substrate cutting method and apparatus are characterized in that the energy density of each part is averaged and a heating project is provided, and the laser beam is provided. The focal point is irradiated with a laser beam in a longitudinal direction along the cutting direction to heat the cutting portion of the glass substrate; and a cooling process is performed by irradiating the laser beam to rapidly cool the heated cutting portion to form a micro crack. Further, the formation of the micro-cracks is activated, and the productivity is improved. (For example, refer to Patent Document 5) Further, a conventional glass product or a method and a method for producing a crystallized glass article are characterized in that they have a thin shape. The chemical engineering is to make the processing part thinner than the other part in advance; and an opening or cutting process is performed by laser irradiation on the processing part (see, for example, Patent Document 6) Other conventional glass plate cutting devices and the like It is characterized in that it has a cracking mechanism for causing fine cracks at the beginning of the cutting of the glass sheet; a heating mechanism for illuminating the glass sheet to absorb at least one point of the irradiation beam; and a cooling mechanism for at least 1 After the laser beam is heated by the spot, the glass plate is cooled by the cooling fluid; an illumination mechanism is attached to the glass plate containing the brake mechanism. a first CO 2 laser beam irradiation with a laser beam; a first control mechanism for controlling a specified range of the illumination mechanism; and a braking project by a first carbon dioxide 7 200812924 laser beam irradiation mechanism The cooling fluid of the first cooling mechanism in the rear portion is used to control the formation of the dicing of the glass sheet. (For example, see Patent Document 7) [Patent Document] 1. Japanese Patent Laid-Open No. Hei 6-48755, No. 7-223828 Japanese Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Bulletin However, the above-mentioned conventional techniques still have the following imperfections. That is, in the technique of Patent Document 1, when the opposite side of the cutting groove is pressed by the rubber, the glass substrate is subjected to an impact, the glass plate is affected by the impact, cracks or cracks are easily generated, or the electric wires are cut, etc. And reduce the quality of glass plate products. In the technique of Patent Document 2, it is difficult to control the development direction of the pull marks, and cracks are generated inside the glass sheet, resulting in poor quality of the product. In the techniques of Patent Document 3 and Patent Document 4, since the irradiation output of the laser light must be increased, the inclination of the cutting groove is affected, and a crack is generated in the inward direction of the glass plate, or a glass piece is generated along the cutting groove. Stripping and other phenomena, and reducing the performance of glass sheet products. Further, in the technique of Patent Document 3, when the crack is induced along the path of the laser beam, the crack of the divergence follows the movement path of the irradiation position of the laser beam, which may affect the processing accuracy. 8 200812924 In addition, in the technique of Patent Document 4, between the center of the beam and the periphery: when the beam is irradiated, the temperature condition of the Zeng Zengneng#...+periphery, the surface of the material is 4 Material towel's New (four) #❹ = surface of political power) concentrated damage, or ♦ month Qiu # + ” make..., stress (when stretching tension, even = = offer 3 technology is the same, inducing cracking & And it also develops with the moving path of the patent beam irradiation position, and the crack will follow the problem. k, the processing accuracy is poor, and the technique of 5 is used to 'open the machined parts by laser irradiation. Hole or (4) plus I before 'requires pre-thin thinning process, so that the processing σ Ρ position is better than the other part of the press, and the right iw / order more ' must also have thinning money and increase manufacturing costs The problems in the patents 6 and the patent documents 7 and the required light and use, the real 2 in the technical street 'because there must be a lot of use: the week ... and the preparation of complex devices, and The cost of the equipment is very high, and there is a problem of extremely high cost. SUMMARY OF THE INVENTION The object of the present invention is to provide a cutting device for cutting a crack in the shape of a square, preventing damage to the quality of the object to be cut, and accurately and surely cutting the object to be cut. The cutting device of one item, the remainder, the material of the hard and brittle material formed by the cutting object is a cutting tool, which is arranged to be contacted with the main cutting part to be cut; and a displacement mechanism, which can be along The cutting portion 200812924 includes a blade portion between the cutting tool and the object to be cut, and the movement Q, wherein the cutting tool heating element is capable of the sharp edge portion of the blade; and a temperature, and by the displacement mechanism, Ancient: To the higher than the softening point of the cut by-cuts • Relative movement between the blade parts = the object and the knife-cutting that is heated by the heating body. The county, the dragon cut _ (four) part for cutting and heating 2 =: r = part, and by the high temperature of the heating element. The cutter shows that the heat of the heat is above the softening point of the object to be cut. That is, the moving mechanism is cut and cut (four) along the specified cutting part:: The part is the groove corresponding to the designation of the knife = the object. Wherein: the edge ^ is formed with the sharp edge of the sharp edge portion of the edge ΑΛ β, since the cut portion is heated or higher by heating;: if degree is heated to the softening point shape of the cut object == The material to be cut at the edge of the large edge is plastically deformed, and the stalk becomes a chip and is cut from the cut. 1 knife position 'cuts the cut object (narrowly, cuts to a high temperature above the softening point) along the desired. The cutting tool is applied to the high temperature cutting tool, and the cutting force:::r?rr by heat Swelling to (4) The total contact point of the treasure is 'the plasticity is caused by the temperature increase, so that the cut part of the contact part is generated, and the sub-hunting causes the compressive stress to be released. Thus, by 10 200812924 :: :: _ stress occurs at the edge, so that the cut object does not crack, etc. Therefore, as in the cutting edge of the scope of the patent application, the sharp edge portion is heated to above the softening point of the cut object, and the disk = knife: cut And there will be no (four) no _ existing ^ skin (four) objects accurately and steadily cut as an accessory of the second item of the patent application scope, which has a temperature of one m / / is attached to the temperature of the first body In the use of the cutter and: t material structure, used to control the temperature energy dimension of the heat-generating part; when cutting the object to be cut, the cutting edge is as in the cutting device of the second application of the patent scope, and the 旳/dish degree is maintained at a certain level. Temperature. Stable hot tensile stress, and more will be cut by ===, without cutting Bad phenomenon. Material Qian is indeed and 'cutting the item: the cutting device of the third item of profit range, which is attached to the second = - match: two == r_ detect the cut object ~ or knife The knives are adjacent to the cutting device of the third item, which is controlled by the degree of control and the relative motion between the cuts and the cuts. 11 200812924 The depth of the Nadao is appropriately controlled. In the use of cutting cuts;: piece: Ji:?, the relative movement between them, so that the cut and cut, and there will be no bad cutting. Item to item 3 all attached: The cutting part of the page cutting tool is prepared with a heating mechanism, which is constructed by the following, and the fourth item of the f is cut, which is heated by the cutter i: the cutting part is preheated. It is simple and can be used to heat the cutting material to a temperature above the softening point, while stabilizing the Ltr and stabilizing the machinability, and thus more accurately as an accessory of the item 5 of the patent application. More _, cold is attached to the 4th M ^ M JLL · L 7 Ρ , structure, which makes |f by the twisting machine -, true = ^ The position is cooled, so that the cutting part of the cutting tool is heated by the heating mechanism, and the part is cooled as the fifth part of the patent application scope is cut to the part to be cut by the two sides of the cutting machine by the twisting mechanism ^ The clothes, that is, the cutting tools are cooled. Therefore, the heating is carried out, and at the same time, the cooling mechanism is introduced, and the stone cutting tool is used as the cutting part (the part of the cutting material). This is expanded by the whitening of the enamel. Therefore, in the case of a material to be cut, for example, a liquid crystal panel, it is prevented from diffusing to the surface of the electrode, such as a driving electrode, which is adversely affected by various types of electrode molds, ruthenium, hexagrams, etc.: Unsatisfactory problems such as inferior performance. 12 200812924 of the liquid stop S 曰 panel The cutting device of the present invention can prevent the occurrence of cracks, damage the quality of the cut object, and accurately and stably cut the cut object. [Embodiment] Fig. 1 is a partial perspective view showing an exemplary view of a cutting device according to an embodiment of the present invention; and Fig. 2 is a plan view showing an exemplary view suitable for the embodiment of Fig. 1. The invention is a cutting device, which is suitable for cutting glass, quartz glass, and other hard and brittle materials such as glass, ceramic, silicon, semiconductor materials and the like. Hereinafter, the device according to the preferred embodiment of the present invention will be described with reference to the related drawings, which are particularly useful for glass plates such as liquid crystal and plasma display panel processes. Referring to Fig. 1, a preferred embodiment 10 of the present invention is provided with a tool 12 for inclusion of a π & 丨τ g Μ 匕3 cutting tool. The cutting tool 12 is disposed so as to be in contact with a workpiece (subject to be processed) such as a finger 疋 (4) portion ω of a rectangular glass plate w (narrowly referred to as "cutting portion 〜"). The cutting tool 12, ^ slightly f, on the glass plate The partial portion of the W-cut (corresponding to the edge portion of the blade portion to be described later) causes the glass sheet w to reach a high temperature above the softening point, and in the present example, for example, the temperature can be high and accurate, for example, about (4)^(8) The same speed control m is composed of a ceramic detector and a hairpin, with a scent of 5 μ 4 . Knowing, 魈, and heat to the tip of the blade and the glass. The specified cutting portion ω is used for cutting and cutting. That is, for example, as shown in Fig. 2, the cutting tool 12 includes a cutting tool body 14 having a 5-corner shape. The cutting tool is a ceramic substrate formed by, for example, Tao Wan. The ceramic substrate 13 200812924 has a blade portion 18 on one side of its long axis direction, for example, a blade portion 18 having a V shape. The blade portion 18 has a blade edge portion 20, i.e., a sharp edge portion, for cutting the glass sheet W to be cut. The tip end portion 20 is located at the tip end portion of the blade portion 18 on the one main surface side of the ceramic substrate 16. Further, as the cutting tool body 14, for example, yttria, alumina, oxidized oxidized, titanium oxide, and mullite are used as the insulating material. On one of the main faces of the ceramic substrate 16, a temperature detector 22 whose plane is regarded as a U-shape is formed. The electrode 22a and the electrode 22b can be respectively connected to one end and the other end of the temperature detector 22. The electrode 22a and the electrode 22b are each formed of an alloy of gold, gold, and copper. In this case, it is preferable to use a thermoelectric pair composed of, for example, a nickel-chromium alloy and a nickel-alloy alloy, a platinum alloy, a platinum alloy, or the like, and a resistor body made of platinum, gold-iridium alloy or the like. Further, on one side of the main surface of the ceramic substrate 16, an insulating layer 24 is formed to cover the temperature detector 22, which is formed of, for example, hafnium oxide. As the material for forming the insulating layer 24, in addition to the oxidized stone, it is also preferable to use, for example, oxidized stone, oxidized, oxidized, titanium oxide, andalusite as an insulating material. Further, on one of the main surface sides of the ceramic substrate 16, a heat generating body 26 of, for example, a U shape is disposed on the upper surface of the insulating layer 24. The heating element 26 is formed of an anti-heat generating body such as tantalum carbide. In this case, the temperature detector -22 is disposed in the vicinity of the heating element 26. Further, as a material for forming the heating element 26, in addition to the niobium carbide, for example, zirconium oxide or the like is preferably used. Further, on one of the main surface sides of the ceramic substrate 16, a wear-resistant layer 28 is formed on the upper surface of the heat generating body 26 excluding the one end portion 26a and the other end portion 26b of the heat generating body 26. The wear resistant layer 28 is formed of ruthenium oxide, oxime, or the like. Further, in addition to the oxidation teaching and vaporization, the material for forming the wear-resistant layer is preferably made of, for example, tungsten carbide, titanium carbide, or boron. Further, on one of the main surface sides of the ceramic substrate 16, an electrode 30a and an electrode 30b formed of an alloy of gold, copper, and copper are connected to the upper end portion 26a of the heating element % and the upper surface of the end portion 26b. Next, one of the manufacturing methods of the cutting tool 12 and the spot reference are as shown in, for example, FIGS. 3A, 3B, 4A, 4B, 5A, 1, 6, 6A, 6B, 7A, 7B, and 8A and 8B are explained below. For example, referring to Figs. 3A and 3B, for example, a ceramic substrate 16 formed of a zetagonal zirconium oxide or the like is formed on the ceramic substrate 16.
Si::::由金—钽合金等所形成的溫度偵測器22,並 的态22的一端及他端，分別連接例如由金及銅 + 口孟厅形成的電極22a及電極22bc3該溫度偵测器22及 b 其係措由以錢度（sputtering )等薄膜形成 方法一體形成於陶瓷基板16的上面。 、 16的1人例如請苓照圖4A及圖4B所示，於陶瓷基板 的箄膜面’形成一用以覆蓋溫度偵測器22及電極22a、22b 方法形成其係例如由二氧化矽所形成的絕緣層藉由濺度等 ▲ 】如明芩知圖5A及圖5B所示，於陶瓷基板16 、薄膜：V在絕緣層24的上面，形成-做為發熱體26的 法形成，、係例如由碳化矽所形成的抗熱發體藉由濺度等方 及例如請苓照圖6A及圖所示，於陶瓷基板 15 200812924 16之一方主面侧，在除了發熱體26的一端部26a及他端 部26b以外之發熱體26的上面形成一薄膜，其係例如由 氮化鈦所形成的耐磨耗層28藉由濺度等方法形成。 又及，例如請參照圖7A及圖7B所示，於陶瓷基板 16之一方主面侧，在發熱體26的一端部26a及他端部26b 的上面形成一薄膜，其係分別由金、金及銅的合金等所形 成的電極30a及電極30b藉由濺度等方法形成。 接著，例如請參照圖8A及圖8B所示，該切削工具本 體14之長軸方向的一端側，藉由刀具研磨形成一平面視 為V字形的刀刃部18。於此情形時，於陶瓷基板16之一 方主面侧，在刀刃部18的頂端部，形成一切削被切割物 玻璃板W的刃尖部20。 於本實施例之切割裝置10,對切削工具12的電極 30a、30b例如施加直流電壓通電，使做為發熱體26的抗 熱發熱體發熱，而使其表面溫度上昇至一定溫度，例如約 600°C〜1000°C範圍的高溫。又，亦可例如藉由將施加直 流電壓變更成施加電波電壓，以提高電壓，進而更提高發 熱體26的上昇溫度。 於本實施例之切割裝置10,其係藉由適當的位移機構 (無圖式），於切削工具12及玻璃板W (被切割物）之間 產生相對運動。亦即，位移機構（無圖式）係由例如包含 發動機（無圖式）及制動器（無圖式）之驅動機構所構成， 使切削工具12之刀刃部18及/或玻璃板W(被切割物）， 沿著指定切割部位作相對位移。於本實施例中，其構成係 為例如將玻璃板W (被切割物）固定在載置桌（無圖式） 16 200812924 4，並使切削工具12沿著所希望切割部位⑴移動。 ，此，玻璃板w(被切割物）之所希望切割部位①， 在=:丨如ν字形溝部4G同時，其形狀係與例如圖工所 不之错由X熱至一定溫度之刀刀部18之刃，丨、 、 尖部20的形狀對應，同時，該切割;：①藉= S i部I局部且溫度激增加熱至玻璃板心 ° )之权化點以上。因而，使該刀尖部20所接觸邱& 的玻璃板W (被切割物）產生塑 =尸位 部分成為切屬c，可從玻璃板w (被切霸丨 :著:::一一(一切割(:義 於此情形時，被刀尖部2〇按住的部 ，漲產生壓縮應力，且以該刃尖部2Q所接觸到㈣^ =向其周邊擴散’然而該刃尖部2〇之接觸部位，由於 2激增加熱使玻璃板w (被切割物）達職化點以上: 引料接觸部位的玻璃板w (被切割物）產生塑性變形， ，猎此使壓縮應力擴散。又，由於玻璃板w (被綱物） ㈣’因此㈣接觸部位的周邊藉由壓縮 :/ ’而使玻璃板W(被切割物）不發生裂痕等破裂 f月形。 因，’依據本實施例之切割裝置1G，可防止裂痕發 ，、無損玻璃板W(被切割物）之品質，精確且穩定地ς 割玻璃板W (被切割物）。 、又於本貝轭例之切割装置10，溫度偵测器U係藉 由溫度控制機構（.無圖式）作控制，依據此溫度控制機構， 17 200812924 構成於使用切削工具12對玻璃板w (被切割物）作切 削％，使刀刃部18之刃尖部2〇的溫度能維持在一定溫 度“於此情形，可依據玻璃板w (被切割物）其玻璃材料 種類之物性不同、軟化點不同，以因應切割對象之被切割 物的軟化點，進行適當之刃尖部20的溫度設定。 -、又及，於本實施例之切割裝置1〇中構成一控制部（無 圖式），其係於使用切削工具12對玻璃板w (被切割物） 作切削時，根據溫度偵測器22所發出的偵測訊號，於切 削工具12及玻璃板W (被切割物）之間所產生之相對運 動的速度及/或刀刃部對被切割物所切的深度進行控 制於本貝知例，藉由控制部，可適當控制切削工具工2 的移動及溝部40的深度 、 因此，於本實施例之切割裝置10中，將加熱至玻璃 (被切割物）之軟化點以上溫度的刃尖部與該玻 璃板W (被切割物）的切割位置ω接觸，並使切削工具 12及玻璃板W (被切割物）之間產生相對運動，而沿著^斤 希望玻璃板W (被切割物）的切割部位ω，即能夠無衝擊 地對玻璃板W (被切割物）精確且穩定地作切削切割。 “又，藉由溫度控制機構，由於能於使用切削工具12 對玻璃板W (被切割物）作切削時，使刀刃部18之刃尖 ，20的溫度能維持在一定溫度，因此能夠沿著溝部卯ς -疋地產生塑性變形，而更可將玻璃板w (被切割物）精確 _且穩定地作切削切割，且不會有切割不良的現象。 又及，藉由控制部，可根據溫度度偵測器22所發出 的债測訊號，於切削工具12及玻璃板w (被切割物^之 18 200812924 間所產生之相對運動的士亲声月/ + 對玻璃柘w r ~ 又/或刀刀部18的刃尖部20 :=W (被切割物）所切的深度進行控制。因 12對玻璃板w (被切割物）作切削之際，' 了根據刀刃部1 8之77，丨、立β ο n 及玻璃杯度條件和㈣1工具12 切判物）的士(ΐ物）之間的相對運動，使玻璃板w (被 W:被= 最佳狀態，而更可將玻璃板 現U物）精確且穩定地切割，且不會有切割不良的 28待由^例中’由於切削工具12的耐磨耗層 12 in 化料卿成，因聽使錢切削工具 刀割物)作切削時，能夠防止切割部位 = ::?尖部2〇。又，防止玻璃材料附著於刃 ::::，亦可例如將離型嶋於刃尖部2 0的部 位 I成一離型層。 成—二此切削卫具12，於刀刃部18之頂端部的部分形 = =;)，的尖緣部’然做為切削被切割 亦可形成2=)。’然刀刃部18〇字形的棱線部全部 圖9係為顯示依據本發明之其他實施例之一 之一例示圖的局部立體圖。 比r圖1戶:不之實施例和圖1〜圖8B所示之上述實施例相 工=’Λ—預先加熱的不同構成點，特別是，於使用切削 2對玻璃板w (被切割物）作切削時，在切削工具 藉由二T徑之前’可將切削工具12之欲切削的部位， 曰田、：、加熱機構預先加熱。又，用於圖9所示之實施 19 200812924 :1之切割裝置10的切削工具12，和上述實施例所示之切 削工具12，具有相同構造，且可達到相同作用及效果。 、亦即，於圖9所示之實施例之一切割裝置1〇，包人上 ==賺1〇的構成，更包含-做為加熱:構 、、乳化妷雷射等雷射器50。此雷射器5〇具有一雷射光 源52，其雷射光之輸出，係藉由例如圓筒透鏡乃至圓筒 面，使玻璃板W (被切割物）上的雷射照射像（ 如長橢圓形的雷射光源。於此情形，如圖9所示， ==源52照射出的雷射*54，於切削工具12的前 受熱擴圓形光束點56’該光束點56則她 口而，於圖9所不之實施例，切削工具12之欲 Γΐ更點56縣受熱，與上述實施例相比 受二刀削工具12，使玻璃板w(被切割物) ㈣Λ : 因此，圖9所示之實施例-切 告表置10，和圖1〜闰+ 圖8B所不之貫施例相比較， 古 切削，刀肖陶定化，而可.更確保穩定的:工:“ 到4:一？!為顯示依據本發明之另-其他實施例之-切 ϋ衣置之例示圖的局部立體圖 —圖10所不之實施例和圖1〜圖8Β及圖9所示 =Γ: ’有—使之冷卻的不同構成點，特別是二 使用切削工具12對功琅虹w Γ、“ ^ 乂 切削工且w (被切割物）作切削時，在 5 12 機構進行加熱，同時’ 丄可—邊藉由雷射等加熱 J % 邊猎由冷卻機構進行冷卻。 20 200812924 ^ 10 且可達到相同作用及效=㈣j工具12，具有相同構造， 上述Π,嫩所示之實施例之-切割裝置10,包含 機構⑼的構:施一切割裝置10的構成，更有-冷卻 f的構成。该冷卻機構60包含例如—呈有吹 的冷卻用氣體吹出導总π , A /、有人出口 62a 透過呈有於孚A,、、S 。此冷卻用氣體吹出導管a， 等輸送管以體之通管(pip〇、抽製管（tube) 氣體例鄉料（無圖式），連接成為冷卻用 供給源m縮機及鼓風機等的壓縮空氣 出導管62，^ Γ 。於圖1所示之實施例，冷卻用氣體吹 玻璃拓wr人出口幻。其係能與被切削工具12切削之 於盆被切割物）之切削部位的長度對應，且形成一 t，、長軸方向延設一連串吹出口。 ^ ’做為—冷卻用氣體，除上述之壓縮空氣以外，亦 # 例如氮氣。又，做為一冷卻用氣體吹出導管62的 ^ 口 62。亚不限定為圖10所示之一連串吹出口，亦可 ^ Γ由例如沿吹出口之長軸方向排列之多數個吹出噴 鳴（無圖式）。 、 ，圖10所示之實施例，切削工具12所欲切削的部位 切剎部位ω)，依據藉由光束點56預先受熱，並一邊藉 由切削工具12，對該受熱部位（切割部位ω)作切削，能 更有效率地將切屑c除去，於此同時加上本實施例，藉由 πρ钱構6〇的動作，使冷卻用的壓縮空氣從冷卻用氣體 吹出導管62的吹出口 62a流向藉由雷射光54的受熱部位 21 200812924 (切割部位ω)。因此’圖1〇所示之實施例，使用切削工 具12對玻$板ψ (被切割物）的指定切削部位ω作切削 時，能夠防止熱從該切削部位ω往玻璃板W (被切割物） 的面方向擴散。 一方面，切割部位ω無法被冷卻機構冷卻時，當藉由 田射光54 $熱部位（切割部位之玻璃板^ (被切割 物）内的熱散發時，例如圖U^(A)所*，形成一往玻 祝板W (被切割物）的面方向擴散的分布狀態。 相對於此，如圖10之切割裝置10所示，切削工且12 之所欲切削的部位（切割部位ω)，在藉由加熱機構受熱同 時、，以冷部機構60冷卻之情形時，可防止於該切割部位ω 之被切割物内的熱散發往該被切割物的面方向擴散。於此 情形時’由於切割部位ω無法被冷卻機構6Q冷卻，因此 —圖11之（B )所不，該熱散發形成一往玻璃板w (被 切軎彳物）的厚度方向延伸的分布狀態。 囚此 仍闺川所示之實施例之切割裝置1〇，加上圖 L 〜二 ：：圖9所示之實施例所達成的效果，而能夠防止 =反方向擴散，而當該切割裝置10用於液晶 …;二t顯示面板(PDP)、有機EL、場發射平面顯 #平面直角顯示器' (FPD裝置）、數位微鏡事 切财丄,寺電氣光學顯示器之大型基板之 刀a ’可絲成於_純、喊基 =電極、共通電極等各種電極、液晶、密封㈣板= 劑等不受到影響。 按耆 22 200812924 裝置之液晶面板之一例示圖的局部放大剖面圖，圖12B係 為使用該切割裝置、圖12A係為顯示切割液晶面板時的局 部放大剖面圖、圖12C係為顯示使用該切割裝置後之已切 告J狀悲之液晶面板的局部放大剖面圖。 概略s之’此液晶面板7 0 ’其係由於^ 具有共通電極 -72a之上層玻璃基板72，和一具有驅動電極74a之下層基 板74之間，夾著一液晶76，並以樹脂等密封材料封止所 構成。就單片之液晶面板70而言，其係一能夠「多片截 取」該單片尺寸之液晶面版70的大型基板上，進行一包 含共通電極72a、驅動電極74a、及其他電極（無圖式）之 各種電極模式的形成工程，並將形成含有複數個電極模式 之大型基板貼合後，藉由圖10所示之切割裝置10，切割 成所希望尺寸，而製造出多片的單片液晶面板70。 此液晶面板70，其上層玻璃基板72及下層玻璃基板 • 74的指定切割部位ω，係以圖10所示之切割裝置10進行 切割。如圖12所示，首先，使下層玻璃基板74之切割部 位ω，與切削工具12的刃尖部20相對面，並例如置放且 固定於載置台80後，藉由切削工具12進行切割。又，當 下層玻璃基板74之切割終了，使上層玻璃基板72的切割 部位ω，與切削工具12的刃尖部20相對面，並置放且固 定於載置台80，沿著切割部位ω以相同方法進行切割。 ’ 於此情形，於圖10所示之切割裝置10，如前所述， 、使用該切削工具12之已切削部位及使用該切削工具12之 欲切削部位，由於係藉由冷卻機構60進行冷卻，因此可 防止對共通電極72a、驅動電極74a、液晶76、密封材料 23 200812924 78及接著劑等有不良影響的熱往上層玻璃基板72及下層 玻璃基板74的面方向擴散。 因此’藉由上層玻璃基板72及下層玻璃基板74的面 方向擴散之熱的不良影響，使該玻璃板w (被切割物）的 面内方向產生裂痕，且該玻璃板（被切割物）沿著溝部40 作邛分性剝洛，亦即，能夠防止玻璃片產生剝落等，及使 液晶面板製品的性能降低等不完善。而，如圖1〇所示之 切告彳1置10用於液晶面板的製程時，可得到一種切割方 去，其係可使液晶面板製品的玻璃基板的性能不降低且效 率佳。 【圖式簡單說明】 本發明之上述目的、其他目的與特徵及優點，可藉由 實施方式的說明與參照下述圖式而得以更顯清楚，其中： 圖1係為顯示依據本發明之實施例之一切割裝置之一 例示圖的局部立體圖； ^ 工具之一例示 圖2係為顯示適用於圖1實施例之切削 圖的平面視圖； 之制、及圖一3 B係為顯示適用於圖1實施例之切削工具 .,,之例不圖，特別是圖3Α係為顯示於陶瓷基 之溫度偵測器之形成狀態的立體圖、及圖3Β為其側 工且 度偵 =4Α及圖4Β係為顯示適用於圖i實施例之切削 之衣造方法之一例示圖，料 %別疋圖4A係為顯示於溫 24 200812924 上之絕緣體之形成狀態的立體圖、及圖4β為其側 之#:二二圖3係為顯示適用於圖1實施例之切削工具 开圖，特別是圓5A係為顯示發孰體之 形成狀悲的立體圖、及圖5B為其側視圖；“、、體之 之穿=^1圖紐係為顯示適用於圖1實施例之切削工具 之® ’特別是® 6A係為顯示於發熱體 圖之7形成狀態的立體圖、及圖6B為其侧視圖； 之R方μ 係為顯示適用於圖1實施例之切削工具 罔^ 恶 圖、及圖^為其侧視圖； 之Μ方h #'為顯示適用於圖1實施例之切削工具 研磨^》刃Γ例示圖，特別是圖δΑ係為顯示藉由刀具 形成狀態的立體圖、及圖8Β為其侧視圖； Θ糸為頻不依據本發明之其他實施例之一切割裝置 例示圖的局部立體圖； =10係為顯示依據本發明之另—其他實施例之一切 口 J衣置之一例示圖的局部立體圖； 的局圖116係為顯示圖1G實施例之作用及效果 構;1卻日± Θ ’圖11A係為顯示當切割部位無法被冷卻機 割部位之玻璃板(被燦^ 構a卻日ι°ρ放大圖、圖llB係為顯示當㈣部位被冷卻機 傅令郃時，於切割部之 丨例 狀態的局部放大圖； 板（破切割物）内之熱散發 圖2Α ®12Β及圖12C係為顯示適用於圖1〇實施 25 200812924 例之切割裝置之液晶面板之一例示圖的局部放大剖面 圖，圖12B係為使用該切割裝置、圖12A係為顯示於將液 晶面板切割成指定規格時的局部放大剖面圖、圖12C係為 顯示使用該切割裝置後之已切割狀態之液晶面板的局部 放大剖面圖。 【主要元件符號說明】 10 切割裝置 12 切削工具 14 切削工具本體 16 陶瓷基板 18 刀刃部 20 刃尖部 22 溫度偵測器 22a、22b 電極 24 絕緣體 26 發熱體 28 耐磨耗層 30a、30b 電極 40 溝部 50 雷射器 52 雷射光源 54 雷射光 56 光束點（雷射照射像） 60 冷卻機構 26 200812924 62 冷卻用氣體吹出導管 62a 吹出口 70 液晶面板 72 上層玻璃基板 72a 共通電極 74 下層玻璃基板 74a 驅動電極 76 液晶 78 密封材料 80 載置台 ω 切割部位 W 玻璃板（被切割物） c 切屑 27Si:::: a temperature detector 22 formed of a gold-bismuth alloy or the like, and one end and the other end of the state 22 are respectively connected to the electrode 22a and the electrode 22bc3 formed of gold and copper + mouth chambers. The detectors 22 and b are integrally formed on the ceramic substrate 16 by a film forming method such as sputtering. For example, as shown in FIG. 4A and FIG. 4B, a method for covering the temperature detector 22 and the electrodes 22a and 22b is formed on the tantalum surface of the ceramic substrate, for example, by using cerium oxide. The formed insulating layer is formed by the method of forming the heat generating body 26 on the ceramic substrate 16 and the film V on the upper surface of the insulating layer 24 by the sputtering degree, etc., as shown in FIG. 5A and FIG. 5B. For example, the heat-resistant body formed of tantalum carbide is subjected to sputtering or the like, and, for example, as shown in FIG. 6A and FIG. 6 , on one side of the main surface of the ceramic substrate 15 200812924 16 , except for one end portion of the heat generating body 26 . A film is formed on the upper surface of the heating element 26 other than the 26a and the other end portion 26b, and is formed, for example, by a method such as sputtering by the wear-resistant layer 28 formed of titanium nitride. Further, for example, as shown in FIG. 7A and FIG. 7B, a film is formed on one of the main surface side of the ceramic substrate 16 on the upper end portion 26a and the other end portion 26b of the heating element 26, respectively, which are made of gold and gold. The electrode 30a and the electrode 30b formed of a copper alloy or the like are formed by a method such as sputtering. Next, for example, as shown in Figs. 8A and 8B, one end side of the cutting tool body 14 in the longitudinal direction is formed by a tool grinding to form a blade portion 18 which is V-shaped in plan view. In this case, a blade edge portion 20 for cutting the glass sheet W to be cut is formed on the one end side of the ceramic substrate 16 at the tip end portion of the blade portion 18. In the cutting device 10 of the present embodiment, for example, a DC voltage is applied to the electrodes 30a and 30b of the cutting tool 12 to cause the heat-resistant heat generating body as the heat generating body 26 to generate heat, and the surface temperature thereof is raised to a certain temperature, for example, about 600. High temperature in the range of °C ~ 1000 °C. Further, for example, by changing the applied DC voltage to the applied radio wave voltage, the voltage can be increased, and the rising temperature of the heat generating body 26 can be further increased. The cutting device 10 of the present embodiment generates relative motion between the cutting tool 12 and the glass sheet W (cut object) by a suitable displacement mechanism (not shown). That is, the displacement mechanism (not shown) is constituted by, for example, a drive mechanism including an engine (not shown) and a brake (not shown), so that the blade portion 18 of the cutting tool 12 and/or the glass plate W (cut) ()), relative displacement along the specified cutting site. In the present embodiment, for example, the glass plate W (cut object) is fixed to a mounting table (not shown) 16 200812924 4, and the cutting tool 12 is moved along the desired cutting portion (1). Here, the desired cutting portion 1 of the glass plate w (cut object) is at the same time as the 丨-shaped groove portion 4G, and the shape thereof is, for example, a knife blade portion that is heated by X heat to a certain temperature. The edge of the 18, the shape of the tip 20 corresponds to the shape of the tip 20, and at the same time, the cutting;: 1 borrows the upper portion of the S i portion I and the temperature increases the heat to the center of the glass plate. Therefore, the glass plate W (cut object) in contact with the blade tip portion 20 is made into a plastic corpse portion to be a subordinate c, which can be cut from the glass plate w (cut:::: one by one) (One cut (in this case, the portion that is held down by the tip 2) generates a compressive stress, and is contacted by the tip 2Q (4) ^ = spreads to the periphery thereof. At the contact point of 2〇, the glass plate w (cut material) reaches the service point or higher due to the 2 heat increase: the glass plate w (cut object) at the contact contact portion is plastically deformed, and the hunting stress diffusion is spread. Because the glass plate w (is the object) (four) 'thus (4) the periphery of the contact portion is compressed by /' to make the glass plate W (cut object) crack without cracking or the like, because, according to the present embodiment The cutting device 1G prevents cracking, and does not damage the quality of the glass sheet W (cut object), and accurately and stably cuts the glass sheet W (cut object). Further, in the cutting device 10 of the present embodiment, The temperature detector U is controlled by a temperature control mechanism (.not shown), according to the temperature control mechanism, 17 20 0812924 is configured to cut the glass plate w (cut object) by using the cutting tool 12 so that the temperature of the blade tip portion 2 of the blade portion 18 can be maintained at a constant temperature. "In this case, it can be cut according to the glass plate w (cut) The material of the glass material has different physical properties and different softening points, and the temperature of the blade tip 20 is appropriately set in accordance with the softening point of the object to be cut. - Moreover, the cutting device 1 of the present embodiment 〇 constituting a control unit (not shown) for cutting the glass plate w (cut object) using the cutting tool 12, based on the detection signal from the temperature detector 22, on the cutting tool 12 and The speed of the relative movement between the glass sheets W (cut objects) and/or the depth at which the blade portions cut the cut objects are controlled by the present example, and the cutting tool can be appropriately controlled by the control unit 2 The movement and the depth of the groove portion 40. Therefore, in the cutting device 10 of the present embodiment, the blade tip portion heated to a temperature higher than the softening point of the glass (cut object) and the glass plate W (cut object) are cut. Position ω contact, and A relative movement between the cutting tool 12 and the glass plate W (cut object) is generated, and along the cutting portion ω of the desired glass plate W (cut object), the glass plate W can be impactlessly The cutting and cutting are performed accurately and stably. "In addition, by the temperature control mechanism, since the cutting edge of the glass plate W (cut object) can be cut by using the cutting tool 12, the temperature of the blade edge of the blade portion 18 can be 20 It maintains a certain temperature, so it can be plastically deformed along the groove, and the glass plate w (cut object) can be cut accurately and stably without cutting. And, by the control unit, according to the debt measurement signal sent by the temperature detector 22, the relative movement of the cutting tool 12 and the glass plate w (cutted by the object 18 200812924) + Control the depth of the glass 柘 ~ ~ and / or the cutting edge portion 20 of the blade portion 18 : = W (cut object). When 12 pairs of glass sheets w (cut objects) are cut, 'by the blade portion 18 of 77, 丨, 立 β ο n and glass cup conditions and (4) 1 tool 12 cuts) The relative motion between the glass plate w (W: is the best state, and the glass plate can be used to cut the U material) accurately and stably cut, and there will be no bad cutting 28 in the case When the wear-resistant layer 12 in the cutting tool 12 is cut into a material, the cutting portion = ::? Further, the glass material is prevented from adhering to the blade ::::, for example, the portion I which is released from the blade edge portion 20 into a release layer. In the second embodiment, the cutting edge 12 is formed at the tip end portion of the blade portion 18 = =;), and the sharp edge portion is formed as a cutting to form 2 =). All of the ridge portions of the U-shaped blade portion 18 are shown in a partial perspective view showing an exemplary view of one of the other embodiments of the present invention. Ratio r: Figure 1: The embodiment and the above-described embodiment shown in Figs. 1 to 8B are the same as the structure of the above-mentioned embodiment = 'Λ-preheating, especially in the use of cutting 2 pairs of glass sheets w (cut objects) When cutting, the portion of the cutting tool 12 to be cut, the field, and the heating mechanism can be preheated before the cutting tool passes the two-T diameter. Further, the cutting tool 12 for the cutting device 10 of the embodiment 19 200812924:1 shown in Fig. 9 has the same configuration as the cutting tool 12 shown in the above embodiment, and the same action and effect can be attained. That is, in the cutting device 1 of one embodiment shown in Fig. 9, the composition of the package ==1 earned, and further includes - as the heating: structure, emulsified krypton laser and the like. The laser device 5 has a laser light source 52, and the output of the laser light is irradiated with a laser image (such as a long ellipse) on the glass plate W (cut object) by, for example, a cylindrical lens or a cylindrical surface. Shaped laser source. In this case, as shown in Fig. 9, == laser 52 illuminated by source 52, heated in front of the cutting tool 12, rounded beam point 56', the beam point 56 is her mouth In the embodiment shown in Fig. 9, the cutting tool 12 is heated to 56 points, and the two-blade tool 12 is used to make the glass plate w (cut object) (four) compared with the above embodiment: Therefore, Fig. 9 The illustrated embodiment - the cut-off table is set to 10, compared with the example of Figure 1 ~ 闰 + Figure 8B, the ancient cutting, the knife xiao tao, but can ensure more stable: work: "to 4: 一?! is a partial perspective view showing an illustration of a cutting garment according to another embodiment of the present invention - an embodiment of Fig. 10 and Figs. 1 to 8 and Fig. 9 = Γ: 'There are different constituent points for cooling, especially when using the cutting tool 12 for the work 琅 w “, " ^ 乂 cutter and w (cut object) for cutting, at 5 12 Heating is carried out, and at the same time, it can be cooled by a cooling mechanism by heating J% by laser or the like. 20 200812924 ^ 10 And the same effect and effect can be achieved = (4) j tool 12, having the same structure, the above-mentioned Π, tender place The cutting device 10 of the illustrated embodiment comprises a mechanism (9) configured to apply a cutting device 10, and further has a configuration of cooling fins. The cooling mechanism 60 includes, for example, a blowing gas for blowing a total of π. , A /, a person exits 62a through the presence of Yu Fu A,,, S. This cooling gas is used to blow out the conduit a, and the delivery pipe is used as a body pipe (pip〇, pumping tube (tube) gas routine materials (none In the embodiment shown in Fig. 1, the cooling gas supply glass is connected to a compressed air outlet duct 62, such as a cooling supply source m reducer and a blower. The cutting tool 12 cuts the length of the cutting portion of the bowl to be cut, and forms a t, and a series of air outlets are extended in the long axis direction. ^ 'As a cooling gas, in addition to the above compressed air,亦# For example, nitrogen. Also, as a cooling The body 62 is not limited to one of the series of outlets shown in Fig. 10, and may be blown out by a plurality of blows (not shown), for example, arranged along the long axis direction of the outlet. In the embodiment shown in Fig. 10, the portion of the cutting tool ω) to be cut by the cutting tool 12 is heated in advance by the beam spot 56, and the heated portion (cutting portion ω) is cut by the cutting tool 12. In addition, in the present embodiment, the compressed air for cooling is flown from the air outlet 62a of the cooling gas blowing duct 62 by the operation of πρ钱6〇. The heated portion 21 of the laser light 54 200812924 (cutting portion ω). Therefore, in the embodiment shown in Fig. 1A, when the cutting tool 12 is used to cut the specified cutting portion ω of the glass plate (cut object), heat can be prevented from the cutting portion ω toward the glass plate W (cut object) ) The direction of the surface spreads. On the one hand, when the cutting portion ω cannot be cooled by the cooling mechanism, when it is emitted by the heat of the field light 54 (the glass plate (cut object) of the cutting portion, for example, U^(A)*, A distribution state in which the surface of the glass plate W (cut object) is diffused. In contrast, as shown by the cutting device 10 of FIG. 10, the portion of the cutter (12) to be cut (the cutting portion ω) is When the heating mechanism is heated and cooled by the cold portion mechanism 60, heat in the object to be cut at the cutting portion ω can be prevented from being diffused toward the surface of the object to be cut. In this case, The portion ω cannot be cooled by the cooling mechanism 6Q, and therefore, the heat dissipation is formed in a distribution state extending in the thickness direction of the glass sheet w (cut object). The cutting device 1 of the embodiment shown, in addition to the effect achieved by the embodiment shown in FIG. 9 and FIG. 9, can prevent the diffusion in the opposite direction, and when the cutting device 10 is used for the liquid crystal... t display panel (PDP), organic EL, field emission plane display #平Right-angle display '(FPD device), digital micro-mirror cuts the money, the large substrate of the temple electrical optical display knife a ' can be made into _ pure, shouting base = electrode, common electrode and other electrodes, liquid crystal, sealed (four) board The agent is not affected. The partial enlarged cross-sectional view of one of the liquid crystal panels of the device according to 耆22 200812924, FIG. 12B is a partial enlarged cross-sectional view and the figure when the cutting liquid crystal panel is used for display. 12C is a partially enlarged cross-sectional view showing a liquid crystal panel which has been clarified by the use of the cutting device. The liquid crystal panel 70 of the schematic embodiment has a common glass-72a upper glass substrate 72. And a liquid crystal 76 is sandwiched between a substrate 74 having a driving electrode 74a and a liquid crystal 76. The liquid crystal panel 70 of the single piece can be "multi-piece cut". On a large substrate of a monolithic liquid crystal panel 70, a formation process of various electrode patterns including a common electrode 72a, a drive electrode 74a, and other electrodes (not shown) is performed, and a complex is formed. After the large-sized substrate of the plurality of electrode patterns is bonded, the plurality of single-piece liquid crystal panels 70 are manufactured by cutting the desired size by the cutting device 10 shown in Fig. 10. The liquid crystal panel 70, the upper glass substrate 72 thereof And the designated cutting portion ω of the lower glass substrate 74 is cut by the cutting device 10 shown in Fig. 10. As shown in Fig. 12, first, the cutting portion ω of the lower glass substrate 74 and the cutting edge of the cutting tool 12 are used. The portion 20 is opposite to the surface and is, for example, placed and fixed to the mounting table 80, and is cut by the cutting tool 12. Further, when the cutting of the lower glass substrate 74 is finished, the cutting portion ω of the upper glass substrate 72 and the cutting tool 12 are cut. The blade tip portion 20 is opposed to the surface, and is placed and fixed to the mounting table 80, and is cut in the same manner along the cutting portion ω. In this case, in the cutting device 10 shown in FIG. 10, as described above, the cut portion of the cutting tool 12 and the portion to be cut using the cutting tool 12 are cooled by the cooling mechanism 60. Therefore, heat that adversely affects the common electrode 72a, the drive electrode 74a, the liquid crystal 76, the sealing material 23 200812924 78, and the adhesive can be prevented from diffusing in the surface direction of the upper glass substrate 72 and the lower glass substrate 74. Therefore, the surface of the glass plate w (cut object) is cracked by the adverse effect of the heat of the surface of the upper glass substrate 72 and the lower glass substrate 74, and the glass plate (cut object) is along the edge. The groove portion 40 is subjected to splitting, that is, it is possible to prevent the glass sheet from being peeled off and the like, and to impair the performance of the liquid crystal panel product. On the other hand, when the process shown in Fig. 1 is used for the liquid crystal panel process, a cutting method can be obtained which can improve the performance of the glass substrate of the liquid crystal panel article without being lowered and the efficiency is good. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more apparent from 1 is a partial perspective view of one of the cutting devices; ^ one of the tools is illustrated in FIG. 2 is a plan view showing a cutting chart suitable for the embodiment of FIG. 1; the system is shown in FIG. The cutting tool of the first embodiment is not shown, and in particular, FIG. 3 is a perspective view showing the state of formation of the temperature detector of the ceramic base, and FIG. 3 is a side view of the side and the degree is 4 Α and FIG. FIG. 4A is a perspective view showing a state in which the insulator is applied to the embodiment of FIG. i, and FIG. 4A is a perspective view showing the formation state of the insulator on the temperature 24 200812924, and FIG. 4 is a side view thereof. Fig. 2 is a perspective view showing the cutting tool suitable for the embodiment of Fig. 1. In particular, the circle 5A is a perspective view showing the formation of the hairpin body, and Fig. 5B is a side view thereof; Wear = ^ 1 map button for the display is suitable for Figure 1 For example, the cutting tool ® 'Special® 6A is a perspective view showing the state in which the heat generating body 7 is formed, and FIG. 6B is a side view thereof; and the R square μ is a cutting tool suitable for the embodiment of FIG. 1 . ^ 恶 diagram, and diagram ^ is its side view; the square side h #' is an example of the cutting tool that is applied to the cutting tool of the embodiment of Fig. 1, in particular, the figure δΑ is used to show the state of the tool formation. 3D is a side view of the cutting device according to one of the other embodiments of the present invention; =10 is a display showing one of the other embodiments according to the present invention. A partial perspective view of an illustration of a garment; a map 116 of the embodiment shows the function and effect of the embodiment of FIG. 1G; 1 day ± Θ ' Figure 11A is a glass panel showing that the cutting portion cannot be cut by the cooling machine (After the ^ 却 却 ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι Figure 2Α®12Β and Figure 12C are for the display 1A is a partially enlarged cross-sectional view showing an example of a liquid crystal panel of a cutting device of the example of 200812924, wherein FIG. 12B is a partial enlarged cross-sectional view showing the use of the cutting device and FIG. 12A for cutting the liquid crystal panel into a specified specification. Fig. 12C is a partially enlarged cross-sectional view showing the liquid crystal panel in a cut state after using the cutting device. [Description of main components] 10 Cutting device 12 Cutting tool 14 Cutting tool body 16 Ceramic substrate 18 Blade portion 20 Tip portion 22 Temperature detectors 22a, 22b Electrode 24 Insulator 26 Heating element 28 Abrasion resistance layer 30a, 30b Electrode 40 Groove 50 Laser 52 Laser source 54 Laser light 56 Beam spot (laser illumination image) 60 Cooling mechanism 26 200812924 62 Cooling gas blowing pipe 62a Blowing port 70 Liquid crystal panel 72 Upper glass substrate 72a Common electrode 74 Lower glass substrate 74a Driving electrode 76 Liquid crystal 78 Sealing material 80 Mounting table ω Cutting site W Glass plate (cut object) c Chip 27