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TWI456647B - Scribe device - Google Patents

Scribe device Download PDF

Info

Publication number
TWI456647B
TWI456647B TW101102475A TW101102475A TWI456647B TW I456647 B TWI456647 B TW I456647B TW 101102475 A TW101102475 A TW 101102475A TW 101102475 A TW101102475 A TW 101102475A TW I456647 B TWI456647 B TW I456647B
Authority
TW
Taiwan
Prior art keywords
mounting member
gas
cutter wheel
scribing head
cover
Prior art date
Application number
TW101102475A
Other languages
Chinese (zh)
Other versions
TW201246345A (en
Inventor
Toru Naruo
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011104632A external-priority patent/JP5285740B2/en
Priority claimed from JP2011104631A external-priority patent/JP5346984B2/en
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201246345A publication Critical patent/TW201246345A/en
Application granted granted Critical
Publication of TWI456647B publication Critical patent/TWI456647B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Claims (4)

一種刻劃裝置，具有刻劃頭，此刻劃頭具備將刀輪保持為可轉動之刀安裝構件、及將形成於前述刀安裝構件之支持軸透過軸承支持為可旋動之保持具，前述刻劃頭係支持於設有為了使該刻劃頭移動之導引部與為了檢出該刻劃頭之位置之位置檢出機構之導引棒，藉由使前述刀輪在加工對象之基板上轉動，在沿前述導引棒之方向形成刻劃槽，其特徵在於：於前述刻劃頭之前述刀輪與前述導引棒之間形成有從前述刀輪之側方，朝向與前述刻劃槽之形成方向正交之方向吹出沖洗用氣體之氣體吹出口，以前述沖洗用氣體不會吹向前述導引棒，而是朝向前述刀輪之刃前緣部分吹送之方式，構成前述氣體吹出口之方向。 A scribing device having a scribing head, wherein the scribing head has a knife mounting member for holding the cutter wheel to be rotatable, and a holder for supporting the support shaft of the knife mounting member to be supported as a rotatable holder, The scribing head system supports a guide bar provided with a guide portion for moving the scribing head and a position detecting mechanism for detecting the position of the scribing head, and the cutter wheel is placed on the substrate to be processed Rotating upwardly, forming a scribed groove along the direction of the guiding rod, wherein a side of the cutter wheel and the guiding rod are formed from the side of the cutter wheel, facing the foregoing The gas blowing port for blowing the rinsing gas is blown in a direction in which the grooving direction is orthogonal to each other, and the rinsing gas is blown toward the leading edge portion of the cutter wheel to form the gas. The direction of the outlet. 如申請專利範圍第1項之刻劃裝置，其中，於前述氣體吹出口與前述刀安裝構件之間安裝有外罩，此外罩作為用來阻止廢材侵入之分隔壁，且設有使朝向前述刀輪之沖洗用氣體沿前述基板面通過之開口。 The scoring device of claim 1, wherein a cover is attached between the gas outlet and the blade mounting member, and the cover serves as a partition wall for preventing intrusion of waste materials, and is provided to face the knife The rinsing gas of the wheel passes through the opening of the substrate surface. 如申請專利範圍第2項之刻劃裝置，其中，前述氣體吹出口與前述外罩之開口沿著被加工之基板面形成為於橫方向細長。 The scoring device of claim 2, wherein the gas outlet and the opening of the outer cover are formed to be elongated in a lateral direction along a surface of the substrate to be processed. 如申請專利範圍第2或3項之刻劃裝置，其中，於前述刻劃頭之保持具，分別藉由導引滾輪安裝構件可轉動地支持有夾前述刀安裝構件排列為直線狀之一對導引滾輪， 前述外罩係固定於前述導引滾輪安裝構件之單側側面且安裝為圍著刀安裝構件之單側側面。The scoring device of claim 2, wherein the holder of the scoring head is rotatably supported by the guide roller mounting member, and the pair of the knife mounting members are arranged in a straight line. Guide roller, The cover is fixed to one side of the guide roller mounting member and is mounted to surround the one side of the blade mounting member.
TW101102475A 2011-05-09 2012-01-20 Scribe device TWI456647B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011104632A JP5285740B2 (en) 2011-05-09 2011-05-09 Scribing equipment
JP2011104631A JP5346984B2 (en) 2011-05-09 2011-05-09 Scribing equipment

Publications (2)

Publication Number Publication Date
TW201246345A TW201246345A (en) 2012-11-16
TWI456647B true TWI456647B (en) 2014-10-11

Family

ID=47120194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101102475A TWI456647B (en) 2011-05-09 2012-01-20 Scribe device

Country Status (3)

Country Link
KR (1) KR101345614B1 (en)
CN (1) CN102775054B (en)
TW (1) TWI456647B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103641297A (en) * 2013-12-11 2014-03-19 中国电子科技集团公司第二研究所 Glass marking device capable of accurately controlling pressure of cutter head
JP6515518B2 (en) * 2014-12-12 2019-05-22 三星ダイヤモンド工業株式会社 Holder, holder unit and scribing device
KR102078666B1 (en) * 2019-09-27 2020-02-19 권순일 Vinyl Cutting Head
CN118418299A (en) * 2023-05-05 2024-08-02 李灵灵 Ore slicing equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM246795U (en) * 2003-12-02 2004-10-11 Chipmos Technologies Inc Cutting tool of semiconductor sawing blade
TW200812924A (en) * 2006-07-20 2008-03-16 Takita Res & Dev Co Ltd Cutting apparatus
TW200906746A (en) * 2007-08-10 2009-02-16 Mitsuboshi Diamond Ind Co Ltd Scribing head, scribing device, and scribing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090841A (en) * 1983-10-25 1985-05-22 Amagasaki Kosakusho:Kk Apparatus for positioning cutter in plate glass cutting machine
JP4191304B2 (en) * 1999-03-03 2008-12-03 三星ダイヤモンド工業株式会社 Chip holder
JP2001311819A (en) * 2000-04-28 2001-11-09 Shin Sti Technology Kk Method for preventing deposition of minute foreign matter on color filter surface, scribing device and breaking device
JP4843180B2 (en) * 2002-12-12 2011-12-21 三星ダイヤモンド工業株式会社 Chip holder, scribing head, scribing device and scribing method
JP5177520B2 (en) * 2007-12-25 2013-04-03 日本電気硝子株式会社 Glass plate edge grinding apparatus and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM246795U (en) * 2003-12-02 2004-10-11 Chipmos Technologies Inc Cutting tool of semiconductor sawing blade
TW200812924A (en) * 2006-07-20 2008-03-16 Takita Res & Dev Co Ltd Cutting apparatus
TW200906746A (en) * 2007-08-10 2009-02-16 Mitsuboshi Diamond Ind Co Ltd Scribing head, scribing device, and scribing method

Also Published As

Publication number Publication date
CN102775054A (en) 2012-11-14
KR101345614B1 (en) 2013-12-27
TW201246345A (en) 2012-11-16
KR20120125947A (en) 2012-11-19
CN102775054B (en) 2015-09-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees