200810059 九、發明說明： 【發明所屬之技術領域】 及其結構 …本發明為一種發光二極體(Light Emitting Diode，LED)座體的 i造方法及其結構’特難為—種剌於高神發光三極體(獅 P〇:r hght emitting diode)照明單體之發光二極體座體的製造方法 【先前技術】 -枚^年^ ’由於發S二鋪之發光效率持續的改善，使得發光 :用市場大幅度成長。發光二極體之所以能有如此高的 ίΐϊΐϊ ’主要的成長動力有二，首先是將發光二極體應用於 爾絲、市射，發光二健與冷陰極螢光燈 -_替代應用。其次是在 用ίf體與白熾燈泡或螢光燈間的替代應 成長動力中，發光二剛具有環保、省 早H 優勢，再者「歐盟勘6年禁用采」的環 保法規二更疋驅動*光二鋪市場成長的主因。 θ。2 L係為一習知發光二極體座體結構10之立體 i 2Β 賴與料力狀剖視圖。 體座體結構H) , 構之舰目。胃知發光二極 及-絕緣座體13 :習鄉光政=二;至少-導線架12 ;以 熱基座η絲物12^體結構1G製糾，因為散 12在製造時，因相互接====免f熱f座11及導線架 所以在絕緣座體u成型製造時二妾進而造成_•的現象。 i ==座體 針14只是臨時使用之成型製 — 成里作業凡成及脫模後，頂針14將會與習 5 200810059 = 咖發先二極體座體結構 ，頂針開口 15產生渗‘現象，如===或座氣有機會 後，容易產生有氣、環氧樹脂或娜在烘烤固ί 再二ίΐί;度:令發光二極體之出發光效率大打折扣。 丄、L 决毛光—極體座體結構10，苴萝i生夕半挪, =座f3之成型，然後再將散熱基座 或基入以作結合。爲了 體13填入 ；4；!^^ - 之、、、口構，以增加散熱基座u盥 々成乂化 而此種先料料_ ” 輒體13接觸面之雜力。然 座體13 入H再組合散熱基座11之方式，因為絕緣 仍^不足^ 了 ^ 咬花之職，因此在結構之穩固性 之間隙^ 氣會經由散録座11與絕緣座體13間 、、态二白知發光二極體座體結構10，在封裝座體内施以填充 體^ 脂切膠時’也會緩慢地沿著散熱基座11與絕緣座 =3^間之_ ’滲漏到絕緣座體13的外部，形成毛細流通現象。 ίΪΙ的情況之下，封裝座體内填充液態的環氧樹脂或石夕膠在烘 奋後，將會產生更多的氣泡或類似水泡的嚴重瑕疵。同時也 二因放熱基座11與絕緣座體13接觸面之磨擦力不足，使散熱 土座11鬆脫、滑動，造成封已裝好的發光二極體中，連接發光二 極體晶粒40 (半導體晶片）和導線架12間的微細金屬線6〇斷裂， 造成嚴重的缺失。 【發明内容】 本發明主要係要改善發光二極體座體結構製造完成後，遺留 200810059 下來的頂爛π和散絲座11與絕緣賴13間 队多漏的現象，而以成叙先二極體在封裝製程 題。此外、本發明將組合後之散熱基座、絕緣 ^具内，再進行絕緣座體成型健之製造方法，=== 其與絕緣座體接觸之表面，係形成有不_狀之』 订％緣座體之成型時，熱融後之轉料會填 : 隙，而冷卻後會緊密的相互咬合。因此將可使得 結構之結構行為變得非常的穩固。 。 D…_ 爲，上述之功效，本發㈣提供—種㈣二極 方法，其包括下列步驟··提供一散熱基座 衣二 基=’又絕緣件相對於固晶區之位置，設有一開口;提^ 於:Γ件之第二側面側，且導線架係藉由絕緣 二絕緣，導線架置人塑型模具内’又塑型模具内絕J ΐ脫空間，進城緣座體之成型作業；以及進行塑型模具 甘A i達上述之功Α本發明又提供—種發光二極體座體結構， ;、二丄：散熱基座，其具有—固晶區；—絕緣件，具有-第- 二勾fr二ΓΤ係與散熱基座貼合’又絕緣件相對 口；至少一導線架，設置於絕緣件之 Ρ续广舻ΐΐ線木係糟由絕緣件與散熱基座電性隔離；以及 Γ i f触包覆於散齡座、絕緣件及導線架週邊並形成完i 之發光二極體座體結構。 风兀正 藉由本發_實施，至少可以達到下列之進步功效： 避免頂針開口造成水氣或澄氣滲透之現象，提高發光二極體 200810059 製程品質及良率 、提高散熱基座與絕緣座體接 體座體結叙光二極 氣之滲透，並防止封裝作鞏士吊，固’且旎阻絕水氣或溼 石夕膠滲漏料部的現^ ㈣填充液11的環氧樹脂或 、實的將導線架與散熱基座 複雜性，進而 【實施方式】 細說=發日_徵與實施方式，11配合圖示作最佳實施例詳 <發光一極體座體製造方法實施例>200810059 IX. Description of the invention: [Technical field to which the invention pertains] and its structure... The present invention is a method for fabricating a light-emitting diode (LED) body and its structure, which is particularly difficult to Method for manufacturing a light-emitting diode body of a illuminating triode (L ght r r r emitting 照明 照明 【 【 【 【 先前 先前 先前 先前 枚 枚 枚 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于Luminescence: A substantial increase in the market. The reason why the LEDs can have such a high degree of growth is that the main growth power is two. The first is to apply the LEDs to Ershi, City, Luminous and Cold Cathode Fluorescent Lamps. Secondly, in the alternative growth power between the ίf body and the incandescent bulb or fluorescent lamp, the illuminating two has the advantages of environmental protection and early H, and the environmental protection regulations of the “European Union for 6 years of banned mining” are more driven* The main reason for the growth of the market. θ. 2 L is a cross-sectional view of a stereoscopic i 2 Β and material force of a conventional light-emitting diode base structure 10. Body structure H), the structure of the ship. The stomach knows that the light-emitting diode and the insulating body 13: Xixiang Guangzheng = two; at least - the lead frame 12; the heat base η wire material 12 ^ body structure 1G system correction, because the dispersion 12 is manufactured, due to mutual connection = === Free f-seat 11 and lead frame, so the phenomenon of _• is caused by the formation of the insulating base u. i == seat pin 14 is only a temporary molding system - after the operation and demoulding, the thimble 14 will be with the Xi 5 200810059 = coffee first polarized body structure, ejector opening 15 phenomenon If the === or the seat has a chance, it is easy to produce gas, epoxy or na in baking. 度: The luminous efficiency of the LED is greatly reduced.丄, L 毛 光 —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— In order to fill the body 13; 4;!^^ -, the mouth structure, in order to increase the heat sink base u 盥々 而 而 此种 此种 此种 此种 此种 此种 此种 此种 此种 接触 接触 接触 接触 接触 接触 接触 接触 。 。 。 。 。 。 13 Into the H and then combine the way of the heat sink base 11, because the insulation is still insufficient ^ ^ The position of the bite, so in the gap between the stability of the structure ^ gas will pass between the scatter block 11 and the insulating seat 13, The two white light-emitting diode body structure 10, when the filler body is applied in the package body, will also slowly leak along the heat-dissipating base 11 and the insulating seat=3^ The outside of the insulating base 13 forms a capillary flow phenomenon. In the case of a vacuum, the epoxy resin or the Shiqi gum filled in the package body will generate more bubbles or a serious blisters after drying. At the same time, because the frictional force of the contact surface of the heat-releasing base 11 and the insulating base 13 is insufficient, the heat-dissipating earth seat 11 is loosened and slipped, and the light-emitting diode is connected in the sealed light-emitting diode. The fine metal wire 6 between the 40 (semiconductor wafer) and the lead frame 12 is broken, causing a serious defect. The invention mainly aims to improve the phenomenon that the top rot π and the loose wire seat 11 and the insulating lining 13 are leaked after the completion of the light-emitting diode structure, and the sigma-first diode is In addition, the present invention combines the heat-dissipating susceptor and the insulating tool in the heat-insulating base and the insulating tool, and then performs the manufacturing method of the insulating body forming, and the surface of the insulating seat is in contact with the insulating seat. When the shape of the body is formed, the heat transfer will fill the gaps, and after cooling, they will closely engage each other. Therefore, the structural behavior of the structure will be very stable. D..._ The above-mentioned effect, the present invention (4) provides a (four) two-pole method, which comprises the following steps: providing a heat-dissipating base 2 base = 'and the position of the insulating member relative to the solid crystal region, providing an opening; : the second side of the element, and the lead frame is insulated by insulation, the wire is placed in the mold of the human mold, and the J ΐ 空间 space in the mold is formed, and the forming work of the seat body into the city is performed; The mold is made of the above-mentioned work, and the present invention provides Light diode body structure, ;, two: heat sink base, which has a - solid crystal region; - insulating member, has - the first two hook fr two tantalum and the heat sink base fit 'and the opposite side of the insulating member; At least one lead frame disposed on the insulating member is electrically insulated from the heat sink base by the insulating member; and the if contact is wrapped around the loose seat, the insulating member and the lead frame and formed The light-emitting diode structure of i. The wind is being used to achieve at least the following advancement effects: Avoid the phenomenon of water vapor or gas penetration caused by the thimble opening, and improve the quality and good quality of the light-emitting diode 200810059 Rate, improve the penetration of the heat-dissipating pedestal and the insulating seat body to prevent the penetration of the two-pole gas, and prevent the package from being used as a slinger, solid and damper to prevent moisture or wet stone etched into the material part (4) The epoxy resin of the filling liquid 11 or the actual construction of the lead frame and the heat dissipation base is complicated, and further, the embodiment is described in detail with reference to the drawings and the preferred embodiment. One pole body manufacturing method embodiment >
2 3圖所不’係為本發明之—種發光二極體鋪 tt元成絕緣座體製作時之分解實施例圖。如第4圖所示，係為 =明之-種發光二極體座體製造方法流程圖。本實施 J 电光^極體座體結構2〇之製造方法，其包括下列步驟：2 3 is a diagram of an exploded embodiment of a light-emitting diode package of the present invention. As shown in Fig. 4, it is a flow chart of a method for manufacturing a light-emitting diode body. The manufacturing method of the J electro-optical body structure 2〇 comprises the following steps:
^彳’、、政熱基座(sii):散熱基座η例如銅、錫、鋼或鐵等金 屬材質亦或陶£、玻璃等非金屬材f所製成，其具有 散敎 特性者。 狀… 一 一散熱基座11主要係用以置放發光二極體晶粒40，並且對發 光二極體晶粒40產生散熱/散熱之功效，因此散熱基座11具有^ 以與發光二極體晶粒40結合之一固晶區111。 散熱基座11除了可以是一平板之型體外，亦可以為一凸形型 體，也就是說，可以在平板狀散熱基座11之一側，以一體成型之 製造方式製造出一延伸部112。當散熱基座11設計成為一凸形型 體時，固晶區111將會形成於延伸部112處，也就是形成於延伸 8 200810059 口P 112之上方端部，而此時，絕緣件 延伸部112.的週邊，意即讓出固晶區m的汗空好套設於 為了使發光二極體晶粒4〇能更方便的a 發光二極體晶粒40上覆罢取弁房或者方便後續於 則狀表面m，例如螺紋、咬花、凸體或H J有U f于絕緣座體13之成型作業時，熱融後之注膠料tli不= =114之間隙’所以當注膠料冷卻固化後，散教美座、鮮 氧計Γΐΐίίίίΐ透、防止封裝作業時’施以填充液態的環 虱树知或矽膠沴漏到外部的現象，同時也因此 絕緣座體!3穩固且緊密的結合，所 體:體二：2 結構行為變得非常的穩固。 ㈣體、、、。構20之 π接ΪΙ不矣表面114之設計外，散熱基座η其與絕緣座體 =或视則型體，例如三角型、矩型、五^了鑽 形 =所&之夕邊㈣體，係泛指任何非圓型、圓柱型或球型之型 j ’如此將可防止散熱基座u在絕緣座體13内旋 結構不穩定的現象。 、取 ^提供一絕緣件(S12”絕緣件21，特別係為一絕緣墊片，其主 2用以阻絕散熱基座n與導線架12間之電性連接並維持^目 的間隙，不直接接觸到。 絕緣件21具有一第一側面2Π及一第二侧面212，第一侧面 211係與散熱基座n貼合，又絕緣件21相對於固晶區I”之位 置，設有一開口 213。設置開口 213之目的係要讓發光二極體晶 粒4〇，在不受絕緣件21干涉之情況下，能完整的結合於散熱基 9 200810059 座11之固晶區111上。 當散熱基座11設計成為一凸型 將會套設於散熱基座η其延伸緣件21之開口犯 之套設作業或者考慮職座體丨 4 =緣件η 為中心向四週放射狀的延伸為較佳。 係由開口 213 拉）例如工程塑膠、麥 成有=緣Γ亦可以為一金屬材質且於金屬材質之表面形 提供至少一導線架(S13) ··導線牟 Γί!：ίΓ 對導綠加η ΜΑ,且甘、、且^尤一極體晶粒40會對應到一 導ΐϋ 置於絕緣件21之第二側面212，如此、 定的ί卩/可^糟由絕緣件21與散熱基座η電性_並維持一 疋的間隙，不直接接觸到。 二般導線架12的形式，除了有金屬製的導線架12之外，其 SiLjTp瓦电路板(以陶究為基材並於基材上製*電路者)或印刷 J ( nnting Circuit Board, PCB) ··.# , 12 之功此。 提供一塑型模具並組合(S14):塑型模具50,主要用以製造絕 座，13 ’、且於製造絕緣座體13時將散熱基座η、絕緣件Μ及 導、ΐ架12^也一併一體成型包覆其中，又絕緣座體13 一般係以 塑膠，或環氧樹脂加以製成。當麵模具5G提供後，接著將組合 後之散熱^座11、絕緣件21及導線架12置入塑型模具50内。 口為塑型模具5〇内同時具有一絕緣座體13之形成空間，因此當 10 200810059^彳', political pedestal (sii): the heat sink η such as copper, tin, steel or iron metal material or ceramic, glass, and other non-metal materials f, which have the characteristics of divergence. The heat dissipation base 11 is mainly used for arranging the light-emitting diode die 40 and generating heat dissipation/heat dissipation effect on the light-emitting diode die 40. Therefore, the heat dissipation base 11 has a light-emitting diode The bulk crystal grains 40 incorporate one of the die bonding regions 111. The heat sink base 11 can be a convex type body in addition to a flat plate type, that is, an extension portion 112 can be manufactured in an integrally formed manner on one side of the flat heat dissipation base 11 . . When the heat dissipation base 11 is designed as a convex shape, the die bonding region 111 will be formed at the extension portion 112, that is, at the upper end portion of the extension 8 200810059 port P 112, and at this time, the insulator extension portion The surrounding area of 112. means that the sweat of the solid crystal region m is well set on the a light-emitting diode die 40 for making the light-emitting diode die 4 more convenient. Subsequent to the surface m of the shape, such as a thread, a flower bite, a convex body or a HJ having a U f in the molding operation of the insulating seat 13, the hot-melt glue tli is not ===114 gap, so when the glue is applied After cooling and solidification, the fascinating seat and the fresh oxygen meter Γΐΐ ί ί ί 、 、 、 、 ' ' ' ' ' ' ' ' ' 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装Combination, body: Body 2: 2 Structural behavior becomes very stable. (4) Body, and. The structure of the π junction is not the design of the surface 114, the heat dissipation pedestal η and the insulating body = or the visible body, such as triangular, rectangular, five-shaped diamond = the edge of the & The body generally refers to any type of non-circular, cylindrical or spherical type. This will prevent the unstable structure of the heat-dissipating base u in the insulating base 13 from being unstable. Providing an insulating member (S12) insulating member 21, in particular, an insulating spacer, the main body 2 is for blocking the electrical connection between the heat dissipation base n and the lead frame 12 and maintaining the gap of the purpose, not directly contacting The insulating member 21 has a first side surface 2Π and a second side surface 212. The first side surface 211 is attached to the heat dissipation base n, and the insulating member 21 is disposed at an position relative to the die bonding area I". The purpose of the opening 213 is to allow the light-emitting diode die 4 to be completely bonded to the solid crystal region 111 of the heat-dissipating base 9 of the heat sink base 9 without interference of the insulating member 21. 11 is designed to be a convex type that will be placed over the opening of the heat-dissipating base η with its extended edge member 21, or it is preferable to extend radially around the center of the body member 4 = edge member η. It is pulled by the opening 213. For example, engineering plastic, maicheng has = edge Γ can also be a metal material and provides at least one lead frame (S13) on the surface of the metal material. · Wire 牟Γί!: Γ Γ ΜΑ, and Gan, and ^ a pole body grain 40 will correspond to a guide ΐϋ placed The second side edge 212 of the member 21, thus, given ί Jie / bad η ^ may be a heat sink 21 and the insulating member electrically _ piece goods and maintaining a gap, it is not directly accessible. In the form of the second lead frame 12, in addition to the metal lead frame 12, the SiLjTp tile circuit board (which is based on ceramics and made on the substrate) or printed J ( nnting Circuit Board, PCB) ··.# , 12 The merits of this. A plastic mold is provided and combined (S14): a mold 50 is mainly used for manufacturing a seat, 13', and the heat sink base η, the insulating member 导 and the guide truss 12^ are manufactured when the insulating seat 13 is manufactured. It is also integrally molded and covered, and the insulating seat 13 is generally made of plastic or epoxy resin. After the surface mold 5G is supplied, the combined heat sink 11, the insulator 21, and the lead frame 12 are placed in the mold 50. The mouth is a plastic mold 5 同时 has a space for forming an insulating seat 13 , so when 10 200810059
此一步驟也係將完成絕緣座體13成型作業 於絕緣座體13之注膠料冷卻後，進行塑型模具 如此即可完成發光二極體座體結構2〇之製作。 <發光二極體座體結構20實施例> 如第5圖所不，係為第3圖之發光二極體座體結構如之剖視 實施例圖。第6圖所示，係為本發明又一種發光二極體座體^構 30丄尚未完成絕緣座體製作時之分解施例圖。如第7圖所示，係 為第6圖完成絕緣座體製作後之發光二極體座體結構3〇剖視實施 例圖。本實施例為一種發光二極體座體結構2〇，其包括：一&熱 、 基座11，一絕緣件21 ;至少一導線架12 ;以及一絕緣座體13。 政熱基座11，係例如銅、錫、鋼或鐵等金屬材質亦或陶竞、 玻璃等非金屬材質所製成，其具有良好之導熱特性者。 散熱基座11主要係用以置放發光二極體晶粒4〇，並且對發 光二極體晶粒40產生散熱/散熱之功效，因此散熱基座u具有一 用以與發光二極體晶粒40結合之固晶區111。 ^ 散熱基座11除了可以是一平板之型體外，亦可以為一凸形型 體，也就是說，可以在平板狀散熱基座11之一側，以_體成^之 製造方式製造出一延伸部112。當散熱基座11設計成為_凸形型 200810059 體時，固晶區m將會形成於延伸部112處，也就是固晶區⑴ 將會形成於延伸部112之上方端部，而此時，絕緣件21之開口 213係正好套設於延伸部112的週邊。 為了使發光二極體晶粒40能更方便的結合，或者方便於發光 二極體晶粒4〇上覆蓋取光層或光㈣換層(例如白光的螢光粉塗 佈層等），因此固晶區ni亦可再次形成有一凹槽部113。This step also completes the molding operation of the insulating base 13 after the injection molding of the insulating base 13 is cooled, and then performs a molding die to complete the fabrication of the LED body structure. <Light Emitting Diode Block Structure 20 Embodiment> FIG. 5 is a cross-sectional view showing the structure of the light-emitting diode of FIG. Fig. 6 is a view showing an exploded embodiment of the invention in which the light-emitting diode body structure 30 is not completed yet. As shown in Fig. 7, Fig. 6 is a cross-sectional view showing an embodiment of the light-emitting diode body structure after the insulating spacer is fabricated. The embodiment is a light-emitting diode body structure 2A, comprising: a & heat, a base 11, an insulating member 21; at least one lead frame 12; and an insulating base 13. The political pedestal 11 is made of a metal material such as copper, tin, steel or iron, or a non-metallic material such as Tao Jing or glass, and has good thermal conductivity. The heat dissipation base 11 is mainly used for arranging the light-emitting diode die 4 〇 and has the effect of dissipating heat/dissipating heat to the light-emitting diode die 40. Therefore, the heat dissipation base u has a crystal for emitting light and a diode. The grain 40 is bonded to the die bonding region 111. ^ The heat sink base 11 can be a convex type body in addition to a flat plate type, that is, it can be manufactured on one side of the flat heat sink base 11 by a manufacturing method. Extension 112. When the heat dissipation base 11 is designed to be a convex type 200810059 body, the solid crystal region m will be formed at the extension portion 112, that is, the solid crystal region (1) will be formed at the upper end portion of the extension portion 112, and at this time, The opening 213 of the insulating member 21 is just sleeved around the periphery of the extending portion 112. In order to make the light-emitting diode die 40 more convenient to bond, or to facilitate the light-emitting diode die 4 to cover the light-receiving layer or the light (four) layer (for example, a white phosphor powder coating layer, etc.) The groove portion 113 may be formed again in the die bonding region ni.
散熱基座11其與絕緣座體13接觸之表面，9係形成有一不規 則狀表面114，例如螺紋、咬花、凸體或凹體之表面等。當進行 絶緣座體13之成型作業時，熱融後之注膠料會填滿不規則狀表面 114之間隙所以§注膠料冷卻固化後，散熱基座η與絕緣座體 13就會緊密_互咬合。這樣相互f密咬合的結果，不但可使散 熱基座11與絕緣座體13穩固且緊密的組合，可以阻絕水氣或渔 氣之滲透，同時也因此使得發光二極體座體結構2〇之結構 得非常的穩固。 ” 除了不規則狀表面114之設計外，散熱基座n其與絕緣座體 13接觸之表面，亦可設計為多邊型型體或不規則型體(圖未 例如三角型、矩型、五角型、鑽石型···等。此處所指之多邊形型 體’係泛指任何非®型、圓柱型或球型之型體者，如此將可防止 散熱基座11於絕緣座體13旋轉，而造成結構不穩定的現象。 絕緣件21，特別係為一絕緣墊片，其主要係用以阻絕散熱美 座11與導線帛12間之電性連接。絕緣件21具有一第一侧面 及-第二側面212，第-側面211係與散熱基座n貼合，又絕 件21相對於固晶區ιη之位置，設有一開口 213。設置開口 之目的係要瓖發光二極體晶粒4〇，在不受絕緣件21干涉之情況 下，能完整的結合於散熱基座η之固晶區m上。 當散熱基座11設計成為一凸型體時，絕緣件21之開口 將會套设於散熱基座11其延伸部112之週邊。 12 200810059 爲了方便絕緣件21之套設作業或者考慮成型時轉' 現象，絕緣件21形成有至少-剖開部214，又剖開部214 ^由 口 213為中心向四週放射狀的延伸為較佳。 絕緣件21 —般係選自一鐵氟龍、一塑膠(例如工程塑膠、夹 =、-陶曼、-木質及-橡膠材質之其中之—。或者、絕緣夕i 亦可以為一金屬材質且於金屬材質之表面形成有一絕緣層。 導線架12，導線架12的設置，可使得發光二極體晶曰粒4〇藉 由极細金屬線60(打線)與與導線架的電性連接，並且使 二極體晶粒4G能與外部電力電性連接、導通。導線架12通士為 ，對的叹置’母一組發光一極體晶粒4〇會對應到一對導線架I〕 導線，12設置於絕緣件21之第二侧面212，如此、導線架12就 可以藉由絕緣件21與散熱基座n電性隔離並維持一定的間隙， 不直接接觸到。 ^ —般導線架12的形式，除了有金屬製的導線架12之外，其 它例如陶兗電路板(以陶甍為基材並於基材上製有電路者)或印^ 猶板（Printing CircuitBoard，PCB) ...等’一同樣具有導線架 12 之功能。 絕緣座體13，包覆於散熱基座u、絕緣件21及導線架12週 L於製造絶緣座體13時可將散熱基座11、絕緣件及導線芊 =等也-併-體成型，郷成完整讀光二極體座 、、彖座體13 -般係以塑膠料以塑型模具5G成型之方式加以製成。 而所謂的成型作業可以是射出成型、注膠成型或膠注成型…等任 何一種方式。 二般於生產製造時，爲了大量生產，因此可將上述各實施例 基座U ; 一絕緣件21 ;至少一導線架12等，藉由其它臨 ^料件，使其相互連接成板狀或絲狀，如此便可以整片或整 捲的加以大量製造，以提高生產效率。 13 200810059 惟上述各實施例係用以說明本發明之 該技術者能瞭解本發明之崎並據以實施，而=的在使熟習 利範圍’故凡其他未脫離本發 本發明之專 或修改，仍應包含細下所述之完成之等敦， 14 200810059 【圖式簡單說明】 ^知發光—極體座體結構之立體圖。 Ϊ 2B 二緣座體與導線架之剖視圖。 第3 發光二極體座體結構之剖視圖。 Θ 發光二極體座體結構尚未完成絕緣座 十 體製作時之分解實施例圖。 ^ Ξΐ系為ΐ發明之—種發光二極_體製造方法流程圖。 圖#、為m發光二滅座體結構之舰實施姻。 弟圖係為本發明又一種發光二極體座體結構尚未完成絕緣座 ^ 體製作時之分解施例圖。 第7圖係為第6圖完成絕緣座體製作後之發光二極體座體結構剖 視實施例圖。 【主要元件符號說明】 習知發光二極體座體結構 放熱基座 固晶區 延伸部 凹槽部 不規則狀表面 導線架 絕緣座體 頂針 頂針開口 發光二極體座體結構 絕緣件 第一侧面 10 11 111 112 113 114 12 13 14 15 20、30 21 211 15 200810059 212 213 214 40 50 60 第二侧面 開口 剖開部 發光二極體晶粒 塑型模具 金屬線 16The surface of the heat sink base 11 which is in contact with the insulating base 13 is formed with an irregular surface 114 such as a thread, a flower bite, a surface of a convex body or a concave body, and the like. When the molding work of the insulating seat 13 is performed, the hot-melt injection molding material fills the gap of the irregular surface 114. Therefore, after the injection molding material is cooled and solidified, the heat dissipation base η and the insulating base 13 are tight. Intertwined. As a result of such mutual engagement, the heat sink base 11 and the insulating base 13 can be stably and tightly combined, and the penetration of moisture or fish gas can be blocked, and at the same time, the light-emitting diode body structure can be prevented. The structure is very stable. In addition to the design of the irregular surface 114, the surface of the heat dissipation base n which is in contact with the insulating base 13 may also be designed as a polygonal type or an irregular type (for example, a triangular type, a rectangular type, or a pentagon type). , diamond type, etc.. The polygonal body referred to herein refers to any type of non-® type, cylindrical type or spherical type, so that the heat dissipation base 11 can be prevented from rotating on the insulating base 13 The insulating member 21 is mainly used to block the electrical connection between the heat-dissipating body 11 and the lead wire 12. The insulating member 21 has a first side and a The two side surfaces 212, the first side surface 211 is attached to the heat dissipation base n, and the opening 21 is provided with an opening 213 with respect to the position of the solid crystal area. The purpose of the opening is to illuminate the LED die. , without being interfered by the insulating member 21, can be completely integrated on the solid crystal region m of the heat dissipation base η. When the heat dissipation base 11 is designed as a convex body, the opening of the insulating member 21 will be sleeved. On the periphery of the extension portion 112 of the heat dissipation base 11. 12 200810059 To facilitate the insulation In the case of the arranging operation of 21 or considering the turning phenomenon during molding, the insulating member 21 is formed with at least a cut-away portion 214, and the cut-away portion 214 is preferably extended radially from the center of the opening 213. The insulating member 21 is preferably It is usually selected from a Teflon, a plastic (such as engineering plastics, clip =, - Tauman, - wood and - rubber material - or, insulating ii i can also be a metal material and metal material The surface is formed with an insulating layer. The lead frame 12 and the lead frame 12 are arranged such that the light-emitting diodes 4 are electrically connected to the lead frame by the ultra-fine metal wires 60 (wire bonding) and the diodes are The body die 4G can be electrically connected and electrically connected to the external power. The lead frame 12 is a passer-by, and the pair of sighs 'the mother set of the light-emitting one-pole die 4 〇 will correspond to a pair of lead frames I] wires, 12 settings In the second side 212 of the insulating member 21, the lead frame 12 can be electrically isolated from the heat dissipation base n by the insulating member 21 and maintain a certain gap, and is not directly contacted. In the form of the lead frame 12, In addition to the metal lead frame 12, other such as ceramic circuit boards (with Tao A substrate (and a circuit board is fabricated on a substrate) or a printed circuit board (PCB), etc., also has the function of a lead frame 12. The insulating base 13 is covered on the heat sink base u, The insulating member 21 and the lead frame 12 can form the heat-dissipating base 11, the insulating member and the wire 芊=, etc., and form the complete reading diode seat and the squat body. 13 - The plastic material is made by molding 5G of plastic mold. The so-called molding operation can be any one of injection molding, injection molding or injection molding. Mass production, so the base U of the above embodiments; an insulating member 21; at least one lead frame 12, etc., can be connected to each other into a plate shape or a filament shape by other processing members, so that the whole piece can be Or the whole volume is mass-produced to increase production efficiency. 13 200810059 The above embodiments are merely illustrative of the invention and can be implemented by the skilled person of the present invention, and the scope of the invention is not limited to the specifics or modifications of the present invention. , should still contain the details of the completion of the described, 14 200810059 [Simple description of the diagram] ^ Know the luminescence - the perspective view of the polar body structure. Ϊ 2B Cross-sectional view of the two-edge body and lead frame. A cross-sectional view of the third light-emitting diode body structure. Θ The LED body structure has not yet completed the decomposition example of the insulating seat. ^ The system is a flow chart of a method for manufacturing a light-emitting diode. Figure #, is the implementation of the ship of the m-lighting two-seat structure. The figure is an exploded view of another embodiment of the invention in which the light-emitting diode body structure has not been completed. Fig. 7 is a cross-sectional view showing the structure of the light-emitting diode body after the fabrication of the insulating spacer in Fig. 6. [Main component symbol description] Conventional light-emitting diode body structure exothermic pedestal solid crystal region extension groove irregular surface lead wire frame insulation seat thimble thimble opening light-emitting diode body structure insulation first side 10 11 111 112 113 114 12 13 14 15 20, 30 21 211 15 200810059 212 213 214 40 50 60 Second side opening cut-out light-emitting diode die-molding die metal wire 16