200819902 九、發明說明： 【發明所屬之技術領域】 本發明係一種光學鏡頭模組之製造方法及架構，其係先透過晶圓製造 方式製造體積咼度準確之基板，並於該基板上鑽設多個孔洞，以作為透鏡 基座，並於該透鏡基座上之孔洞中分別安裝光學透鏡，再將至少一片之透 鏡基座與影像感測器晶圓板垂直疊置並黏合在一起，成為晶圓型態之多透 鏡光學鏡頭模組，再切割成單體之多透鏡光學鏡頭模組，因各片透鏡基座 間及透鏡基座與影像感測器晶圓板間之距離精準，如此不需微調光學透鏡 與於像感測益晶圓板間，進而可大量生產並提高良率者。 【先前技術】 現今之光學鏡頭模組係被廣泛運用於照相裝置，例如數位相機、照相 手機、網路攝影機，然而無論是相機鏡頭模組、手機鏡頭模組或網路攝影 機鏡頭模組，於組裝時，皆需經過校正及調試，以便達到準確之焦距，請 參照第1圖所示，傳統照相之光學鏡頭模組100係由光學透鏡1〇1、光學透 鏡基座(Barrel)·、光學透鏡底鋪older侧及影像感測器1〇4及影像 感測電路105所組成；組裝時，先將光學透鏡1〇1放置在透鏡基座1〇2上， 再將組合好之透鏡基座102以螺絲紋結構旋入光學透鏡底座1〇3中以觀 # 焦距，並與影像感測器104及影像感測電路板105結合構裝成光學鏡頭模 組，然而因組裝時，必須以旋轉方式上下移動透鏡基座1〇2與影像感測器 104之距絲調縣距，彳钱距校準好後，獅職定，如此—來，因其組 f構件«，製造及組裝程序複雜，造成其製造之良率低，因此成本相對 提高，又因域鏡基座102 -般係以瓣材f製造，在組裝時，需上下移 動透鏡基座102，以調整光學透鏡1〇1在影像感測器1〇4上之成像，如此轉 動透鏡基，102時容易造成磨損，而造成落灰現象，影響鏡頭内之清潔度， 且其體積高度在機械技術上有無法準確控制光學透鏡1〇1至影像感測器ι〇4 距離，在製造時有其不便及缺點。 200819902 【發明内容】 本發明即針對前述先前技狀缺點，而研究出-種絲綱模組之製 造方法及架構。 ^本發明之一目的，在提供一種光學鏡頭模組之製造方法，其係先透過 s曰圓製&方式製造體躺度科之基板，並於該基板上鑽設多個孔洞，以 ^為透絲;t ’此光學透絲座上之倾大小與絲透鏡大小補合，光 子透鏡可準確的放置於光學賴^基座之上黏合成―組光學透鏡模組，勿需 =機械螺紋、、，σ構之兩件式光學透鏡基座(趾代，舰齡)做微調聚焦， 製造良率可大幅提升，且可以減少組裝工時及降低成本並可縮小體積，使 相機光學鏡職組成為—種可縣安裝之電子零件。 本發批3 -目的，在提供—觀學綱模組之架構，其設有一影像 感測器晶圓板，該影像感測器晶圓板上黏合有至少一片之光學透鏡基座， 可因基座與影像感關板之距離精確’而不需做微調聚焦，進而達到 節省工時及成本之目的。 【實施方式】 本發明揭示-種辨鏡聰組之製造方法及_，本實補係以相機 為例，其t，請參照第2、3、5圖所示，其製造方法步驟如下： 步驟1 ··先透過晶®製造方式製造體積高度準確之基板丨（於本實施例 之基板為玻璃板，惟熟悉該項技藝者’仍可以其他材質實施），並於該基板 1上鑽設多個孔洞11，以作為透鏡基座1〇。 步驟2 ··將多個光學透鏡2〇分別安裝於透鏡基座1〇上之^^同u中， 形成一組單透鏡光學透鏡模組，該孔洞n之孔徑係配合光學透鏡2〇之直 k，使兩者之結合非常契合，兩者之結合可以黏合方式達成。 步驟3 ·視所茜解析度尚低，將已於透鏡基座安置完成光學透鏡2〇 單獨放置，或將一片以上之透鏡基座10垂直疊置一起形成多透鏡光學透鏡 模組。 6 200819902 步驟4 :將上述步驟組成之光學透鏡模組結合於影像感測器晶圓板30 上’形成相機光學鏡頭模組’該影像感測器晶圓板3〇與光學透麵組相對 位置設有影像感測器31。 步驟5 :切割相機光學鏡頭模組，形成類裸晶形態之單體之相機光學鏡 頭模組。 步驟6:將此相機絲_模_職或以裸晶形態與電路板接合應用 於相機、照相手機，網路攝影機等設備。 如此-來’可因本發明製造方法，係以晶圓製造技術精準控制光學透 鏡至影像細ϋ之触，無需雛裝後侧雜，由於整個製歸半導體 製程處理無人工組裝流程，故產能與良率皆可大幅提升。 請參照第4、5、6圖所示，本發明之架構為設有一影像感測器晶圓板 30 ’該影像感測器晶圓板3〇上設有影像感測器31，該影像感測器晶圓板 30上黏合有-片或-片以上垂直疊置在一起之透鏡基座1〇，該透鏡基座1〇 係藉由晶圓技術製作完成，而成為一體積高度準確之光學透鏡基座，該透 鏡基座10上設有孔洞11，該孔洞η上裝設有光學透鏡2〇，該等光學透鏡 20與該等孔洞11完全契合，如此，可因透鏡基座1〇之高度精確，而不需 做微調聚焦，進而達到節省工時及成本之目的。 表亍、上所述’本發明在物品形狀、構造、結構上屬首先發明，且可改良 習用技術之各種缺點’在使用上能增進功效，合於實用，充份符合發明專 利要件，實為一理想之發明。 【圖式簡單說明】 第1圖為習用裝置之示意圖。 第2圖為本發明之製造方法步驟示意圖。 第3圖為本發明於基板製作光學透鏡基座之示意圖。 第4圖為本發明之光學透鏡基座與像感測器晶圓板之組合示意圖。 第5圖為本發明之組裝完成之斷面示意圖。 200819902 第6圖為本發明之切割成單個相機光學鏡頭模組之斷面示意圖。 【主要元件符號說明】 基板 1 透鏡基座 10 孔洞 11 光學透鏡 20 影像感測器晶圓板 30 影像感測器 31200819902 IX. Description of the Invention: [Technical Field] The present invention relates to a method and an architecture for manufacturing an optical lens module, which is to manufacture a substrate of accurate volume and precision on a substrate by means of wafer fabrication. a plurality of holes are used as lens bases, and optical lenses are respectively mounted on the holes in the lens base, and at least one lens base is vertically stacked and bonded to the image sensor wafer plate. The wafer type multi-lens optical lens module is further cut into a single multi-lens optical lens module, because the distance between each lens base and the lens base and the image sensor wafer plate is accurate, so It is necessary to fine-tune the optical lens between the image sensor and the wafer, so that it can mass produce and improve the yield. [Prior Art] Today's optical lens modules are widely used in camera devices, such as digital cameras, camera phones, and webcams. However, whether it is a camera lens module, a mobile phone lens module, or a network camera lens module, When assembling, all need to be calibrated and debugged in order to achieve accurate focal length. Please refer to Figure 1, the traditional photographic optical lens module 100 is composed of optical lens 〇1, optical lens pedestal (Barrel), optical The lens bottom layer is formed on the old side of the lens and the image sensor 1〇4 and the image sensing circuit 105. When assembling, the optical lens 1〇1 is first placed on the lens base 1〇2, and the combined lens base is assembled. The screw lens is screwed into the optical lens base 1〇3 to view the focal length, and is combined with the image sensor 104 and the image sensing circuit board 105 to form an optical lens module. However, it must be rotated when assembled. The method moves up and down the lens base 1〇2 and the image sensor 104 from the silk to the county distance. After the money is calibrated, the lion is fixed, so that, due to its group f component, the manufacturing and assembly process is complicated. Causing its manufacture The rate is low, so the cost is relatively increased, and the domain mirror base 102 is generally made of the valve material f. When assembling, the lens base 102 needs to be moved up and down to adjust the optical lens 1〇1 in the image sensor 1 4 on the imaging, so rotating the lens base, 102 is easy to cause wear, resulting in ash falling, affecting the cleanliness inside the lens, and its volumetric height can not accurately control the optical lens 1〇1 to image sensing The distance between the ι〇4 is inconvenient and disadvantageous in manufacturing. 200819902 SUMMARY OF THE INVENTION The present invention has been made in view of the aforementioned disadvantages of the prior art, and has been developed to produce a method and architecture for a silk class module. An object of the present invention is to provide a method for manufacturing an optical lens module, which is to first manufacture a substrate of a body lying through a s-circle & method, and drill a plurality of holes on the substrate to It is a silk thread; t 'the tilt of the optical needle holder is complementary to the size of the wire lens, and the photon lens can be accurately placed on the optical susceptor to form a group optical lens module, without the need for a mechanical thread ,,, σ structure of the two-piece optical lens base (toe generation, age) to fine-tune the focus, manufacturing yield can be greatly improved, and can reduce assembly man-hours and reduce costs and reduce the size, so that the camera optical mirror The composition is an electronic component that can be installed in the county. The purpose of the present invention is to provide an image sensor wafer board with at least one optical lens base bonded to the image sensor wafer board. The distance between the pedestal and the image sensing board is accurate 'without fine-tuning focus, which saves labor and cost. [Embodiment] The present invention discloses a method for manufacturing a spectroscopy group, and the present invention is exemplified by a camera. For the t, please refer to the figures 2, 3, and 5, and the manufacturing method steps are as follows: 1 ············································································ A hole 11 is used as the lens base 1〇. Step 2 · Mounting a plurality of optical lenses 2〇 on the lens base 1〇, forming a set of single-lens optical lens modules, the aperture of the hole n is matched with the optical lens 2 k, the combination of the two is very compatible, the combination of the two can be achieved by bonding. Step 3: Depending on whether the resolution is still low, the optical lens 2 is placed separately on the lens base, or more than one lens base 10 is vertically stacked to form a multi-lens optical lens module. 6 200819902 Step 4: Combine the optical lens module composed of the above steps on the image sensor wafer board 30 to form a camera optical lens module. The image sensor wafer plate 3 is opposite to the optical transparency group. An image sensor 31 is provided. Step 5: Cutting the camera optical lens module to form a single-camera optical lens module. Step 6: Apply this camera to the camera or camera phone, network camera, etc. in conjunction with the board. In this way, the manufacturing method of the present invention can precisely control the optical lens to the fine touch of the image by the wafer manufacturing technology, and there is no need for the rear side of the splicing, since the whole process of the semiconductor manufacturing process has no manual assembly process, the capacity and The yield can be greatly improved. Referring to FIG. 4, FIG. 5 and FIG. 6, the architecture of the present invention is such that an image sensor wafer board 30 is provided. The image sensor wafer board 3 is provided with an image sensor 31. The lens wafer board 30 is bonded with a lens base 1 垂直 or a plurality of vertically stacked lens pedestals 1 〇, which is fabricated by wafer technology to become a volumetric and highly accurate optical a lens base, the lens base 10 is provided with a hole 11 on which the optical lens 2 is mounted, and the optical lens 20 is completely matched with the holes 11, so that the lens base 1 can be Highly accurate, without the need to fine-tune the focus, thus saving time and cost. In the above description, the invention is first invented in the shape, structure and structure of the article, and can improve various disadvantages of the conventional technology, which can enhance the efficacy in use, is practical and fully meets the requirements of the invention patent, and is actually An ideal invention. [Simple description of the drawing] Fig. 1 is a schematic view of a conventional device. Figure 2 is a schematic view showing the steps of the manufacturing method of the present invention. Fig. 3 is a schematic view showing the fabrication of an optical lens base on a substrate according to the present invention. Figure 4 is a schematic view showing the combination of the optical lens base and the image sensor wafer board of the present invention. Figure 5 is a schematic cross-sectional view showing the assembly of the present invention. 200819902 Figure 6 is a schematic cross-sectional view of the optical lens module cut into a single camera of the present invention. [Main component symbol description] Substrate 1 Lens base 10 Hole 11 Optical lens 20 Image sensor wafer board 30 Image sensor 31