Claims (1)
1320871 f A牟’糸^修正補充 十、申請專利範圍： 1. 一種光學鏡頭模組之製造方法，其製作步驟包括： 先透過晶圓製造方式製造體積、高度準確之基板，並於該基板上鑽設多 個孔洞’以作為透鏡基座； 將多個光學透鏡分別結合於光學透鏡基座上之孔洞中，形成單透鏡光學 透鏡模組，該孔洞之孔徑係配合光學透鏡之直徑，使兩者之結合非常契 合； 將載有光學透鏡之基板與影像感測器晶圓板結合在一起，形成相機光學 鏡頭模組； 切割基板上之相機光學鏡頭模組，以形成類裸晶形態之單體之相機光學 鏡頭模組。 2. 如申請專利範圍第1項所述之光學鏡頭模組之製造方法，其可將單片透 鏡基座疊置在影像感測器晶圓板。 3. 如申請專利範圍第1項所述之光學鏡頭模組之製造方法，其可將數片透 鏡基座疊置在影像感測器晶圓板。 4. 如申請專利範圍第1項所述之光學鏡頭模組之製造方法，其透鏡基座與 光學透鏡以黏合方式組合在一起。 5. 如令請專利範圍第1項所述之光學鏡頭模組之製造方法，其相機光學鏡 頭模組經封裝或以裸晶形態與電路板接合應用於相機、照相手機，網路 攝影機等設備。 6. -種光學鏡頭模組之架構，其設有―影像感測“jg板，該影像感測器 晶圓板上黏合有一個或一個以上重疊在一起之透鏡基座，該透鏡基座係 藉由晶ED技術製作方式’喊為-體積、高度準確之基座，該透鏡基座 上設有孔洞，該孔洞上裝設有光學透鏡，該光學透鏡與該等孔洞完全契 1320871 年 ^日修正補充1320871 f A牟'糸^Revision Supplement 10. Patent Application Range: 1. A method for manufacturing an optical lens module, the manufacturing steps comprising: first manufacturing a volumetric, highly accurate substrate by means of wafer fabrication, and on the substrate Drilling a plurality of holes as a lens base; respectively, combining a plurality of optical lenses into holes in the base of the optical lens to form a single lens optical lens module, the aperture of the hole being matched with the diameter of the optical lens, so that The combination of the two is very suitable; the substrate with the optical lens and the image sensor wafer plate are combined to form a camera optical lens module; the camera optical lens module on the substrate is cut to form a single crystal-like form Body camera optical lens module. 2. The method of manufacturing an optical lens module according to claim 1, wherein the single lens substrate is stacked on the image sensor wafer. 3. The method of manufacturing an optical lens module according to claim 1, wherein a plurality of lens pedestals are stacked on the image sensor wafer board. 4. The method of manufacturing an optical lens module according to claim 1, wherein the lens base and the optical lens are combined in an adhesive manner. 5. The method for manufacturing an optical lens module according to claim 1, wherein the camera optical lens module is packaged or bonded to the circuit board in a bare crystal form for use in a camera, a camera phone, a network camera, etc. . 6. The structure of an optical lens module, comprising: an image sensing "jg board, the image sensor wafer board is bonded with one or more lens bases that are overlapped together, the lens base system By means of the crystal ED technology, the method is called a volume-sized, highly accurate pedestal, and the lens base is provided with a hole, and the hole is provided with an optical lens, and the optical lens is completely compatible with the holes 1320871 Amendment