200816908 九、發明說明： 【發明所屬之技術領域】 ； 本發明涉及一種散熱模組，特別係一種用於對發熱電 •子元件散熱之散熱模組。 【先前技術】 隨著中央處理器（CPU)等電子元件功率之不斷提高， 散熱問題越來越受到人們重視，在電腦中更是如此。為了 在有限之空間内高效地帶走系統產生之熱量，一般將鰭片 式散熱器或熱管式散熱器置於電子元件上對電子元件散 熱。為將電子元件產生之熱量快速地傳遞至散熱器上，一 般於散熱器與電子元件間設一集熱塊，該集熱塊系由銅等 高導熱性材料製成，利用其高導熱性迅速均勻地將電子元 件產生之熱量傳遞至熱管。集熱塊與電子元件之間之接觸 好壞直接影響到電子元件熱量散發之快慢。由於電子元件 之體積較小，而集熱塊系一平板狀結構與電子元件之間形 成面接觸，因而集熱塊與電子元件之間之接觸面積大小基 本上由電子元件之表面積決定，因而接觸面積有限，進而 影響其散熱性能。因此如何改進集熱塊結構，增大其與電 子元件之接觸面積，進而提升散熱性能，成為設計人員急 需解決之問題。 【發明内容】 有鑒於此，實有必要提供一種提升與發熱電子元件接 觸面積之散熱模組。 本散熱模組用於對發熱電子元件散熱，包括集熱塊、 6 200816908 熱官从及韓片組，該集熱塊具有上表面及與之相對之 面該熱管-端與該韓片多且熱連#，另一端與 -表面熱連接，該集熱塊上表面上設有一凹槽，兮；= .元件收料該凹抑。 料熱電子 a本政熱模組用於對發熱電子元件散熱，包括集熱塊、 底座、熱管及鰭片、挺，該集熱塊設置在底座上，該熱管連 接於集熱塊與鰭片組之間，該集熱塊之其中—表面内陷形 成凹槽，該凹槽具有底面及複數個侧面，該凹槽收容發熱 電子元件於其内，該凹槽之底面及側面包覆該發熱電子元 件之外表面。 與習知技術相比，該集熱塊上之凹槽能與發熱電子元 實見立體之接觸，增大其間之接觸面積，減小其間之熱 阻’從而提高整個散熱模組之熱傳導效率。 【實施方式】 請同時參考圖1至圖3，該散熱模組包括底座1〇、埶 4 \\\ 管30、鰭片組9〇及集熱塊50。 底座10之大致中央位置設一容置槽14,用以容置集熱 塊50。容置槽14之四周分別形成一安裝孔16，用以容置 彈簧螺絲40 ’以將底座鎖固在主機板（未示出）上。在 底座10之底面彎曲設置一曲型槽12，用以容置熱管3〇。 底座10上之容置槽14與該曲型槽12相貫穿連通，從而使 放置在曲型槽12内之熱管30能直接與放置在容置槽14内 之集熱塊熱連接。 鰭片組90由複數片狀鰭片92平行排列設置而成，相 7 200816908 "、間形成供強制氣流（風向如圖3中箭頭所示）通 匕之机道94。其中每一鰭片92之底邊形成一方形缺口％， 連成一體形成D容置空間。熱管30包括置 3U^12内之蒸發端31及自蒸發端31延伸之冷凝端 亦形成為西型狀以與曲型槽12對應設置， =冷牡32容置於各⑽92之缺π%所形成之容置空間 攸而與鰭片組9〇熱速接。該熱管3〇 、、， 加與集熱塊5G及鰭片組9G之接觸面積。’、、、 ’以增 呈方二=中1=集熱塊:全:結構示意圖。集熱塊50 50置於容置槽14内，其具有下表面衣成。該集熱塊 之上表面54，下表面52與熱管3〇及二下表面52相對 50之下表面52與熱管30之間還填充通吊在集熱塊 使集熱塊50與熱管3G接觸更為緊密，^、、介面材料2〇 ’ 集熱塊50之上表面54上設有-凹槽5/、小其間之熱阻。 置發熱電子元件80，如電腦之中央處硬凹槽56用以容 56具有四個側面57及-個底® 58，相^ (圖5)。該凹槽 成圓弧倒角。該等側面57與底面58垂：兩側面57之間形 底面58圍成-大體成長方體之空間從而侧面57與 側面57之高度大體由該發熱電子元只面58之大小2及 決定，使該凹槽56能足夠容置該發熱^之表面積及高度 通常情況下，在該發熱電子元件8〇與#兀件80於其内 面之間亦填充—層熱介面材料70，凹槽56之各接觸 組裝時’將熱管30之蒸發端3 =熱里之傳遞。 置在底座10之曲型 8 200816908 槽12内，冷凝端32與鳍片組3〇相連。集熱塊5〇放置於 底座10上之容ί槽14内，並使發熱電子元件80收容於其 •上表面54之凹槽56内，熱管3〇之蒸發端31設于容置槽 ★ 14之部分與集熱塊50之下表面52通過熱介面材料2〇熱連 接，該熱介面材料可減小接觸熱阻。在底座1〇之頂面 與熱管30之蒸發端31之末端對應之位置處還貼設一層熱 介面材料20a，用以與另一發熱電子元件（圖未示）如電腦 之南橋晶片組、北橋晶片組等接觸，從而對其進行散熱。 最後可用彈簧螺絲40通過裝配孔16將底座1〇鎖固在主機 板上。發熱電子元件80產生之熱量經集熱塊5〇傳遞到熱 管30，然後經過熱管30傳遞到鰭片組9〇，並借強制氣流 對鰭片組90進行吹拂，從而使發熱電子元件8〇產生之熱 里旎及時地排出，保證該發熱電子元件8〇在正常之溫度下 工作。 又 由於集熱塊50上形成凹槽56結構，使發熱電子元件 80埋覆於集熱塊50内，不僅凹槽56之底面58與發熱電子 ^件80接觸，其各個側面57也與發熱電子元件8〇接觸， 一而構成立體即二維之包覆接觸方式，增大了與發熱電子 元件80之接觸面積，因而能更加快速地將發埶 ，生之熱量傳遞W，使整個散熱模組之散熱性能得到提 局〇 综^所述，本發明符合發明專利之要件，爰依法提出 ，申胃准以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修錦 200816908 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 、 圖1為本發明散熱模組一較佳實施方式及相關元件之 ,立體分解圖。 圖2為圖1另一角度之立體分解圖。 圖3為圖1之組裝圖。 圖4為集熱塊之結構不意圖。 圖5為集熱塊與相關元件結合之剖示圖。 【主要元件符號說明】 底座 10 曲型槽 12 容置槽 14 安裝孔 16 熱界面材料 20、20a、70 数管 /、、、 30 蒸發端 31 冷凝端 32 彈簧螺絲 40 集熱塊 50 下表面 52 上表面 54 凹槽 56 侧面 57 底面 58 發熱電子元件 80 鰭片組 90 鰭片 92 流道 94 缺口 96200816908 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for dissipating heat from a heating element. [Prior Art] As the power of electronic components such as a central processing unit (CPU) continues to increase, the problem of heat dissipation has received more and more attention, especially in computers. In order to efficiently remove the heat generated by the system in a limited space, a finned heat sink or a heat pipe heat sink is generally placed on the electronic component to dissipate heat from the electronic component. In order to quickly transfer the heat generated by the electronic component to the heat sink, a heat collecting block is generally disposed between the heat sink and the electronic component, and the heat collecting block is made of a highly thermally conductive material such as copper, and the high thermal conductivity is utilized rapidly. The heat generated by the electronic components is evenly transferred to the heat pipes. The contact between the heat collecting block and the electronic component directly affects the speed of heat dissipation of the electronic component. Since the electronic component has a small volume, and the heat collecting block forms a surface contact between the flat structure and the electronic component, the contact area between the heat collecting block and the electronic component is basically determined by the surface area of the electronic component, and thus the contact The area is limited, which in turn affects its heat dissipation performance. Therefore, how to improve the structure of the heat collecting block and increase the contact area with the electronic component, thereby improving the heat dissipation performance, has become an urgent problem for designers. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipation module that improves the contact area with a heat-generating electronic component. The heat dissipation module is used for dissipating heat from the heat-generating electronic component, including the heat collecting block, and the heat-receiving block has an upper surface and a surface opposite thereto, and the heat pipe-end and the Korean film are more than The other end is thermally connected to the surface, and the upper surface of the heat collecting block is provided with a groove, and the component receives the concave. The heat medium is used to dissipate heat from the heat-generating electronic components, including the heat collecting block, the base, the heat pipe and the fins, and the heat collecting block is disposed on the base, and the heat pipe is connected to the heat collecting block and the fin Between the groups, the surface of the heat collecting block forms a groove, and the groove has a bottom surface and a plurality of side surfaces, wherein the groove receives the heating electronic component therein, and the bottom surface and the side surface of the groove cover the heat The outer surface of the electronic component. Compared with the prior art, the groove on the heat collecting block can be in solid contact with the heat generating electron element, thereby increasing the contact area therebetween and reducing the thermal resistance therebetween, thereby improving the heat conduction efficiency of the entire heat dissipation module. [Embodiment] Referring to FIG. 1 to FIG. 3 simultaneously, the heat dissipation module includes a base 1 〇, a \ 4 \\\ tube 30, a fin set 9 〇, and a heat collecting block 50. A receiving groove 14 is disposed at a substantially central position of the base 10 for receiving the heat collecting block 50. A mounting hole 16 is formed around the accommodating groove 14 for accommodating the spring screw 40' to lock the base to the main board (not shown). A curved groove 12 is bent on the bottom surface of the base 10 for accommodating the heat pipe 3〇. The accommodating groove 14 of the base 10 communicates with the curved groove 12, so that the heat pipe 30 placed in the curved groove 12 can be directly connected to the heat collecting block placed in the accommodating groove 14. The fin set 90 is formed by a plurality of fin fins 92 arranged in parallel, and a phase 94 is formed between the phases 7 200816908 " for forced airflow (wind direction as indicated by the arrow in Fig. 3). The bottom edge of each of the fins 92 forms a square notch %, which is integrally formed to form a D-receiving space. The heat pipe 30 includes an evaporation end 31 disposed in the 3U^12 and a condensation end extending from the evaporation end 31. The condensation end is also formed in a west shape to correspond to the curved groove 12, and the cold mushroom 32 is accommodated in each of the (10) 92. The accommodating space formed is connected to the fin group 9 at a thermal speed. The heat pipe 3〇, and the contact area of the heat collecting block 5G and the fin group 9G. ',,, ' to increase the square 2 = medium 1 = heat block: full: structure diagram. The heat collecting block 50 50 is placed in the accommodating groove 14 and has a lower surface. The upper surface 54 of the heat collecting block, the lower surface 52 and the heat pipe 3 and the lower surface 52 are opposite to each other. The lower surface 52 and the heat pipe 30 are also filled and suspended in the heat collecting block to make the heat collecting block 50 and the heat pipe 3G contact. For the tightness, the interface material 2〇' is provided with a recess 5/, a small thermal resistance between the upper surface 54 of the heat collecting block 50. The heat-generating electronic component 80, such as the hard recess 56 at the center of the computer, has a side surface 57 and a bottom plate 57 (Fig. 5). The groove is chamfered in a circle. The side surfaces 57 and the bottom surface 58 are suspended: the bottom surface 58 between the two side surfaces 57 encloses a space of a substantially rectangular growth body, and the height of the side surface 57 and the side surface 57 is substantially determined by the size 2 of the heat generating electron element only surface 58 and The groove 56 can be sufficiently accommodating the surface area and height of the heat generating surface. Usually, the heat generating electronic component 8A and the inner surface 80 are also filled with a layer of thermal interface material 70, and the contacts of the groove 56 are contacted. When assembled, 'the evaporation end of the heat pipe 30 = the transfer of heat. Placed in the curved shape 8 200816908 of the base 10, the condensation end 32 is connected to the fin set 3〇. The heat collecting block 5 is placed in the cavity 14 of the base 10, and the heat-generating electronic component 80 is received in the recess 56 of the upper surface 54. The evaporation end 31 of the heat pipe 3 is disposed in the receiving groove ★ 14 The portion is thermally coupled to the lower surface 52 of the heat collecting block 50 via a thermal interface material 2, which reduces the contact thermal resistance. A thermal interface material 20a is further disposed on the top surface of the base 1 at a position corresponding to the end of the evaporation end 31 of the heat pipe 30 for use with another heat-generating electronic component (not shown) such as a south bridge chipset of the computer, the north bridge. The wafer set is in contact with it to dissipate heat. Finally, the base 1b can be locked to the main board by the mounting holes 16 by the spring screws 40. The heat generated by the heat-generating electronic component 80 is transferred to the heat pipe 30 through the heat collecting block 5, and then transferred to the fin group 9 through the heat pipe 30, and the fin group 90 is blown by the forced air flow, so that the heat-generating electronic component 8 is generated. The heat is discharged in time to ensure that the heat-generating electronic component 8 is operated at a normal temperature. Moreover, since the heat generating electronic component 80 is buried in the heat collecting block 50 due to the structure of the recess 56 formed on the heat collecting block 50, not only the bottom surface 58 of the recess 56 is in contact with the heat generating electronic component 80, but also the respective side surfaces 57 are also associated with the heat generating electrons. The element 8 is in contact with each other to form a three-dimensional, two-dimensional coating contact mode, which increases the contact area with the heat-generating electronic component 80, thereby enabling the heat generation and the heat generation to be transmitted more quickly, so that the entire heat dissipation module The heat dissipation performance has been improved. The present invention complies with the requirements of the invention patent, and is proposed according to law. The above description is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are Equivalent repairs 200816908 or variations in accordance with the spirit of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of a preferred embodiment and related components of a heat dissipation module of the present invention. Figure 2 is an exploded perspective view of another angle of Figure 1. Figure 3 is an assembled view of Figure 1. Fig. 4 is a schematic view showing the structure of the heat collecting block. Figure 5 is a cross-sectional view showing the combination of the heat collecting block and the related elements. [Main component symbol description] Base 10 Curved groove 12 accommodating groove 14 Mounting hole 16 Thermal interface material 20, 20a, 70 Number of tubes /,,, 30 Evaporating end 31 Condensing end 32 Spring screw 40 Heat collecting block 50 Lower surface 52 Upper surface 54 groove 56 side 57 bottom surface 58 heat-emitting electronic component 80 fin set 90 fin 92 flow path 94 notch 96