TW200816890A - Method for fabricating high-density circuit board structure - Google Patents

Abstract

A method for fabricating a high-density circuit board structure is disclosed, including the steps of: providing a core board having a first surface and a second surface opposing one another and an opening intersecting the first and second surfaces; forming a conductive layer on the surfaces of the core board and the opening thereof; forming a resistant layer on the conductive layer and a plurality of openings to expose partial surfaces of the core layer and the opening in the resistant layer; forming a first and a second circuit layers respectively by a plating technique in the opening of the resistant layer formed on the first and second surfaces of the core board; forming an integrally-made conductive pillar in the opening of the core board and a contact pad on the surface of the conductive pillar, thereby achieving improved electrical performance and reliability by the plated conductive pillar and increasing the density of the conductive pillar in the middle layer of the circuit board for facilitating a fine-circuitry fabrication process.

Description

200816890 IX. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a high-density circuit board structure, and a method for manufacturing a circuit board structure of germanium density. 『[Prior Art] With the high development of the semiconductor industry and the high-performance wafers, the boards used to carry the chips also need to improve signal transmission, improvement = and control impedance. However, in order to meet the development trend of thinness, thinness, versatility, high speed and high frequency of semiconductor packages, the board has been developed toward fine, thin wires and small wires. Existing board processes have been reduced to 22 micron from traditional (10) micron line sizes, including Line Width, Space, and Aspect ratio, and continue to be oriented toward smaller line accuracy development of. In order to improve the wiring precision of the circuit board for semiconductor chip packaging, the industry has developed a layering technology (Built_up), that is, using a layer-adding layer to alternately stack multiple layers on the surface of a core board (c〇^ circuit board). The electrical layer and the circuit layer are formed with an electrical connection between the circuit of the core plate and the lower surface of the core plate through a plating via (PTH), and the process of the plating via is to affect the circuit board density. The essential. Please read the 1A to 1D drawings, which is the method of the conventional core circuit board. As shown in FIG. 1A, a core layer 1〇〇 having a thin metal layer 1〇1, such as a resin-coated copper foil (RCC), is provided, and a plurality of core layer openings are provided therein. 102. As shown in FIG. 1B, a copper plating and patterning process is performed to deposit a wiring layer 1〇3 on the surface of the core 5 and a hole wall of the core layer opening (7) 2 on the surface of the core 5 19716 200816890 4 . There is a metal layer. As shown in FIG. 1C, a conductive or non-conductive plug material ιι (such as a plug resin or a copper-containing conductive paste) is filled to fill the residual void of the core layer opening, and the galvanic via is formed. The inner layer circuit layer 103 of the upper and lower surfaces of the core layer 100 is electrically connected. As shown in Fig. 1D, the excess plug material 11 is removed by a brushing process to maintain the flatness of the core circuit board surface. Since the plug hole material 102a needs to be filled with the plug hole material n, the electric clock via hole 102a must be kept in an appropriate size to fill the plug hole material 11 into the hole. Thus, the core layer opening hole 1〇2 The size is difficult to be small, and the spacing between the plated vias 102 and Yiuza is difficult to be reduced. Therefore, it is not possible to fabricate the local density money via holes in the interface board for the application of the fine line process. Moreover, the circuit board has more filling and brushing processes in the process, thereby increasing the manufacturing cost of the circuit board. Figure. Ns rm is another cross-section of the circuit board structure. 22ΦΛ The circuit layer 2〇, 21 is through the conductive blind hole = electrical connection. The conductive blind hole 22 also needs to be filled with the plug hole material 23, and the narrow hole chicken, especially when the circuit board 2 has a different degree of difference than the broken m, the plug hole material cannot be effectively filled into the conductive blind hole "medium" and the base hole is bad. The situation of 'making the conductive blind hole. It is easy to $2: This situation is easy to produce a flashover in the subsequent thermal cycle process. The reliability of the circuit board structure is reduced. Therefore, how to provide a circuit board method In order to avoid the conventional technology 19716 6 200816890 Z core. The high-density electroplating circuit can not be formed in the circuit board, the reliability of the circuit board is affected, and the process becomes fine. It has become a 营5 bat w θ plus special lack of attention In view of the above-mentioned shortcomings of the prior art, in view of the shortcomings of the above-mentioned prior art, a method for providing a high-density circuit board structure is as follows: the main f: is to electrically connect the core to the core. Lei Shu Xiegu, A丄I clothing® t green road, can be improved: +; the density of the layout in the X-ray plate, and can be applied to the fine line f. Another object of the present invention is to provide - System method, to improve the reliability and electrical function of the circuit board The road board, and the structure of the two hairpins = one purpose is to provide a high-density circuit board structure clothing, the low cost of the circuit board structure process. 'Structure = description 2: A high-density circuit board: the clothing f includes: providing a core board having a first and second surface and forming a right in the core board

The heart of V, ·> has at least one through the first and second surfaces: /S ^" the surface of the plate and the opening thereof forms a conductive layer; in the layer of the conductive core Forming a plurality of openings to expose the cold-electric layer of the surface of the plate 4 and the surface guide of the opening, and electroplating forming the first and the second in the opening of the core:: Dijon, two ^ ^ formed in the opening of the core plate of the 5th core, the body formed by the conductive sub-surface formed on the surface of the conductive column to form a contact pad. Another embodiment of the method for manufacturing a high-density circuit board structure of the present invention, wherein the core plate is flying out of the ancient stone, the core plate of the surface of the body, and the opening of the first and second surfaces of the core of the core; In the core 19716 7 200816890 : = a conductive layer is formed on the surface; the first conductive layer of the core plate is electroplated to form a gold layer, and (4) the j layer fills the opening; The first and second surfaces of the core plate = and the first conductive layer covered thereby, leaving a filling (4) (4) to form a conductive pillar filled in the opening; the core plate is first: conductive a second conductive layer is formed on the outer surface of the column;

十山'θ 73(四)成—resist layer ′ and the resist layer has a plurality of open cores out of the first and second surfaces of the core plate and a portion of the second conductive layer on the opposite surface of the conductive pillar; and the core plate The first and second surface resistive layer openings are divided into the first and second circuit layers, and the contact pads are respectively formed on the opposite surfaces of the conductive pillars. The method of manufacturing includes removing the resist layer and the conductive layer covered thereby; and the core plate is an insulating plate, and the resin-bonded copper has a circuit of electric=plate; The conductive via (ρτΗ) or the conductive via is electrically connected to the two surfaces of the core board; and the opposite surfaces of the conductive pillar respectively have a contact land and the two contacts The pads are respectively electrically connected to the first and second circuit layers. Further, the first and second surfaces of the core plate and the first and second circuit layers are formed to form a line build-up structure. The structure includes a dielectric layer, a circuit layer stacked on the dielectric layer, and a conductive structure formed in the dielectric layer, and the conductive structure in the circuit build-up structure is electrically connected to the first a second circuit layer; further comprising a plurality of electrical connection pads on the outer surface of the line build-up structure, and a second 19716 8 200816890 - , » solder resist layer formed on the outer surface of the line build-up structure, and having the solder resist layer Multiple solder mask opening to electrically connect the layered structure . Therefore, the method for manufacturing the high-density circuit board structure of the present invention mainly forms a conductive pillar directly in the opening of a core plate through the electroplating process, and serves as an electrical connection for the circuit layer on the surface of the core plate. Moreover, it is not necessary to fill the plug hole material in the electric conduction via hole as in the prior art, thereby reducing the size of the electric ore conductor, and increasing the density of the plating via hole in the core plate, and can be applied to the fine line process. In addition, the present invention does not require additional filling of the 'hole f brushing process, thereby saving process cost and improving the reliability of the circuit board, so as to prevent the plug hole material caused by the hole filling process from being effectively filled. The hole is left in the plated through hole and the bubble is serious; the reliability of the plate is lacking. </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; [First Embodiment]

3A to 3C, 4A to 4D, and 5A to 5F are schematic cross-sectional views showing a first embodiment of the method for fabricating a high-density circuit board according to the present invention. Please refer to the figures 3A to 3C for forming a conductive layer=Bei Shi on the surface of the core board. As shown in FIG. 3A, a core board 30 of a double-sided resin-bonded copper j is provided. The core board 30 has a first surface 3〇a and a second surface 30b opposite to the surface of the brother, on the first surface 3〇a and the second 19716 9 200816890 * ι« , ^ /, having a metal 镔 301, and at the core The plate 30 is formed with at least one opening 3〇〇 extending through the surface of the main-comparison team of the 篦一芬荣r 〇〇; as shown in Fig. 3B, removing the core plate 3 筮 本 本 本 本〇1, and the roughened surface is opened/formed in the gold surface m, the surface 30a, the second surface 30b, and the opening 300 of the second surface ; surface and the second surface ;; as shown in FIG. 3C , in the reed 33. And the surface of the opening 300 is formed with a conductive I as a main metal or alloy or a plurality of layers of gold. _ lead, 锡, tin, tin, chrome, titanium, copper-chromium alloy Or one of the group of tin polyethyl phthalate, or a conductive polymer material such as &amp; ▲ to the amine or organic polymer. The second reading of the 4th to 4D drawings is another way to form a conductive layer on the surface of the core board. As shown in Figure 4, the core of the Jiang Banyi circuit board is a fey: a string of fish with a line on the surface. A plate 31, the core plate 31 has a first surface 31a and a first body, and a second surface 31b opposite to the surface, on the first surface 31 &amp; and pressing 3 3 knives - single-sided resin Pressing the copper box 311, the resin 3: on the surface of a dielectric layer 311 &amp; - formed on the surface - metal box • 3 i 1 b ' such as the 4P4 with &amp; a map does not have the resin compression The copper foil 3 i 丨 2 is formed with at least one through hole 31 〇; as shown in Fig. 4c; : '(4) the metal claws on the surface of the (4) grease-bonded copper box 311, and the ^ Ή = 31a and the second The surface of the dielectric layer 311a of the surface 311?, and the surface of the dielectric layer 311a; as shown in Fig. 4D, the dielectric layer 31 of the core plate 31: the surface Φ 3la and the second surface Mb, and the opening A conductive layer 33 is formed on the surface of the hole (10). Referring to Figures 5A through 5F, as shown in Figure 5A, a core panel 32 such as 19716 10 200816890 insulating sheet is provided, the core panel 32 having a first surface 32a and a second surface opposite the first surface a core plate of 32b &amp; and an opening formed in the core plate 32 with at least one of the first and second surfaces extending as shown in FIG. 5B, and then on the first surface 32a of the core plate 32, A conductive layer 33 is formed on the surface of the two surfaces 32b and the openings 32A. The following embodiment is described by taking the core plate 32 of the insulating plate as an example.曰f, as shown in FIG. 5C, on the first and bottom of the core plate 32, a resist layer 34 is formed on the H ^ f 33. The resist layer can be a germanium, such as a dry film or a liquid photoresist. Layer (phQtQresist), and can be formed by coating or laminating on the surface of the conductive layer 33, (4) patterning process by exposure 3, 4 〇 development, etc., and forming a plurality of 'Qiu Ba ^ out the core board The first and second surfaces 32a, 32b of 32: t: a conductive layer 33 and a conductive layer 33 corresponding to the location of the opening 320 of the core plate 32. ^ As shown in Fig. 5, the core plate 32 is subjected to an electroplating process, and the diameter is used to (10), "hunting the electric layer 33 as the current conducting path 板 ~ the opening 32 of the plate 32" The electric column 35 is formed on the first and second main surfaces 32b of the first and second main slaves, and the first circuit layer 35U is formed with a first circuit layer (35) and a second circuit layer 35b. The pillars 35 are connected to each other: the second layer is formed with a contact pad 351, and the contact layer 351 is electrically connected: two: the circuit layer is electrically connected by the conductive pillars 35. The figure is removed, the barrier layer 34 is removed. And the conductive layer 19716 11 200816890 '1 1 33, the technical system for removing the remote resist layer 34 and the u long-term power-storing layer 33 is for the sake of the industry. In the following, the circuit is provided on the core board 32, the first line layer 35a and the contact pad 351 according to the actual electrical design, and the line layer structure 36 is formed on the core board 32 and the second circuit layer: the contact 塾351i Forming another line build-up structure: the structure 36'36' includes a dielectric layer 3 - a circuit layer 362, 369, 、, ζ π / ^ and 幵 &gt; into the dielectric layer of the lightning, = 363, 363, and the conductive structure, such as, 363, respectively, electrically connected to the circuit layer 35a and the second circuit layer; Further, the outer surface of the line build-up structure 36 / 6 ′ has a plurality of electrical connection pads, and the line build-up structures 36 , 36 have a solder resist layer 37 , “ , and the solder resist layer 37 is formed on the outer surface. 37, having a plurality of solder mask openings 37 (), 37 (), to expose the line build-up structures 36, 36, the electrical connection pads 364, 364. [Brief Example] The following is a schematic cross-sectional view showing a second embodiment of the method for manufacturing a high-density circuit board structure according to the present invention; a double-sided resin such as the foregoing embodiment is provided. The core plate 30 of the laminated copper foil, or the core plate 31 of the circuit board having the circuit on the surface, or the core plate 32' such as the insulating plate, is exemplified by the core plate 32 of the insulating plate. Referring to FIG. 6A, firstly, a core plate 32 having a first surface 32a and a second surface 32b opposite to the first surface is provided, and at least one through the first and the second is formed in the core plate 32. The opening 32 of the two surfaces 32a, 32b. 19716 12 200816890 * β · , see the 6B R ^ - 32a, the second surface 32 / the first surface 33a of the S-core core plate 32. The first conductive Lu 3;: The surface of the hole 320 is formed by a layer of a first-conducting layer, and may be composed of ',,, genus, sm or a layer of gold (4) I &quot;1 molecular material. Ming Duo 6C Figure, into the snow, your brakes 33a as Lei Fayang,,, and the clothing process 'by the first conduction; ha as a current conduction path, 俾 该 该 该 该 该 该 该 该 b b b b 该 该 该 该 32 32 32 The two surfaces, there is a guide 35, a layer 52, and is formed by electroplating in the aperture coffee, see Figure 6D, removing the metal layer 352 of the core plate 3, 32b and its: Filled in the opening / ¥ electric layer only please refer to (4) picture, here:: plate column 3325... 32a, 32b and the surface of the conductive column 35 aau ^ αλ. and the formation of the surface The second conductive layer 33b of the second 暮泰® 33b' is mainly composed of a layer of the voltaic layer of the VV, and the 玄 _, ― σ gold or the deposited layer of gold 鸯 layer can also be composed of a conductive polymer material. () Please refer to the first figure, in the second conductive layer 33bimK == and a plurality of openings 34 are formed in the layer 34. To expose the portion of the opposite surface of the conductive layer 33br321^5 Secondly, referring to FIG. 6G, 'the electric money process, the opening of the resist layer 34 on the faces 32a, 32b of the core plate 32 by the second conductive layer 电流 being the current conduction path' Only the middle knives are electroplated to form a first liter layer W, 3%, and the surface of the conductive pillars 35 is electrically recorded with a contact 塾chuan, and can be contacted by the contact pads 351 of the conductive pillars 35. 19716 13 200816890 • ». Electrically connecting the first and second circuit layers 35a, 35b. Referring to Figure 6H, the resist layer 34 and the second conductive layer 33b covered therein are removed. The subsequent complex can be formed on the "Hui core ~ board 32, the first circuit layer 35a and the contact 塾 351 according to the actual electrical design needs. Structure 36, and another line build-up structure % is formed on the core board 32, the second circuit layer 3 and the contact pad 351, and the structure I%' includes a dielectric layer 361, 361', 4 placed The / electrical layer. The upper circuit layer 362, 362, and the conductive structure 363 formed in the dielectric layer, and the conductive structures 363, 363' are electrically connected to the first circuit layer 35a and the second circuit layer 35b, respectively. The build-up structure %, 36, the outer surface has a plurality of electrical connections 塾 364, 364, the outer sound-increasing structure 3 6 , 3 6 ' outside the line and its gentleman 0 曰 3, the outer surface is formed with a solder resist layer 37 37, and the solder resist layer, 37' has a plurality of solder mask openings 37A, 37A to expose the circuit reinforcing structures 36, 36, the electrical connection pads 364, 364.

V In summary, the high-density circuit board structure of the present invention is formed by forming a conductive pillar having a contact pad in the core plate to electrically connect the first via holes of the two surfaces of the core plate through the electro-mine process. And the younger-line, without the need to fill the base material in the plating, thereby reducing the size of the conductive column between the layers of the board, which can increase the density of the conductive pillars in the core board, and can be applied to the fine line process. From, w ^ 肀, in addition, as described above, the present invention is not filled

And the brushing process, so it can be awkward, L ^. That is the cost of thirsty clothes, and can improve the board: to avoid the self-information caused by the hole filling process to fill the electric mine conduction hole and electricity Coton hole (four) bubble, serious = 19716 14 200816890 The lack of reliability of the board. The above-described embodiments are merely illustrative of the principles of the invention and are not intended to limit the invention. Anyone who is familiar with the art is effective, and the above embodiment is repaired under the spirit of the present invention: = violated =. Therefore, the scope of protection of the present invention should be as described later: the scope of the application. Figure 1A to 1D is a schematic cross-sectional view of a conventional core circuit board. Figure 2 is a schematic cross-sectional view of another conventional circuit board structure; Figures 3A to 3C are FIG. 4A to FIG. 4D are schematic cross-sectional views showing another embodiment of forming a conductive layer on the surface of the core plate of the high-density circuit board structure of the present invention; FIG. 5A to 5F are the manufacturing method of the high-density circuit board structure of the present invention (a schematic sectional view of the first embodiment; and the sixth embodiment of the high-density circuit board structure according to the second embodiment of the present invention) Schematic diagram of the cross section. [Main component symbol description] 100 core layer 101 metal thin layer 102a electroplated via hole 102 core layer opening 103 circuit layer 15 19716 200816890

11 2 20 &gt; 21 ^ 362 &gt; 22 23 30, 31, 32 300, 310, 320 301, 311b 30a, 31a, 32a 30b, 31b, 32b 311a, 36 361 311 33a 33b 33 34 340 351 352 35 35a 35b 36, 36, 363, 363, plug hole material circuit board: 'circuit layer conductive blind hole base hole material core plate open hole metal foil first surface second surface dielectric layer resin laminated copper foil first conductive layer second Conductive layer conductive layer resistive layer opening contact pad metal layer conductive column first circuit layer second circuit layer line build-up structure conductive structure 16 19716 200816890 I 1 / 364, 364, 37, 37, 370, 370, electrical connection pad Solder layer solder mask opening

17 19716

Claims (1)

200816890 X. Patent Application Range: 1 · The method for fabricating a south density circuit board structure includes: providing a core board having first and second surfaces, and forming at least one through the first and the second in the core board a conductive layer is formed on the surface of the core plate and the opening thereof; a resist layer is formed on the conductive layer, and a plurality of openings are formed in the resist layer to expose a surface of the core plate portion and the opening a conductive layer on the surface; and forming a first and a second circuit layer respectively in the barrier openings of the first and second surfaces of the core plate, and forming an integrally formed conductive pillar in the opening of the core plate And forming a contact pad on the surface of the conductive pillar. 2. The method of fabricating a high-density circuit board structure according to the scope of the patent application, wherein the core board is an insulating board. 3. The method for manufacturing a high-density circuit board structure according to the scope of the patent application, ί, wherein the core plate is a resin-bonded copper foil, and has a metal foil on the first surface and the second surface of the core plate, and The opening is formed in the core plate and the metal foil is removed. 4. The method of claim 1, wherein the core board is a circuit board having a line, and the first surface and the second surface of the core board are respectively pressed by a single side. a resin-bonded copper foil having a metal foil formed on one surface of a dielectric layer, the opening is formed in the core plate having the resin-bonded copper foil, and the resin pressure is removed Metal foil on the surface of the copper foil. 18 19716 200816890 5· 6· 8· The method of hitting the high-density circuit board structure of claim 1 of the patent scope includes removing the resist layer and the conductive layer it covers. Go, ^In the method of the high-density circuit board structure of the fifth item of the π patent range, the first surface of the core board and the first-line layer form a linear connection::: the conductive structure in the build-up structure" The method for manufacturing the high-density circuit board structure of the sixth aspect of the patent, 2 is formed on the second surface of the core board and the second circuit layer to form another: electric:: layer structure, and the line build-up structure has a conductive structure The electric twin is connected to the second circuit layer. The utility model relates to a system for manufacturing a high-density circuit board structure of the sixth or seventh item, wherein the circuit-added structure comprises a dielectric layer and a circuit stacked on the electric layer. a layer, and a conductive structure formed in the dielectric layer. 9. The method for manufacturing a high-density circuit board structure according to claim 8 of the patent application, the surface of the line-added structure Φ has a plurality of electrical connection pads. The method for manufacturing a high-density circuit board structure according to the ninth aspect of the patent, comprising forming a solder resist layer on the surface of the line build-up structure, and forming a plurality of solder mask openings in the solder resist layer to expose the line build-up structure Electrical connection pads on the outer surface. The method for manufacturing a density-density circuit board structure comprises: providing a core board having a first surface and a surface of the 杜-、, Handi, and forming at least the first and the flute in the core board. a surface of the surface of the core plate and the opening thereof; a first conductive layer 19716 19 11. 200816890 * », a layer; the surface of the core plate and the opening thereof Forming a metal layer on a conductive layer and filling the metal layer with the opening; 'changing—removing the metal layer of the first and second surfaces of the core plate and the first conductive layer of the same Filling a metal layer in the opening to form a conductive pillar filled in the opening; 7 forming a second conductive layer on the first and second surfaces of the core plate and the outer surface of the conductive pillar; Forming a resist layer on the first V electrical layer, and forming a plurality of openings in the resist layer to expose the second conductive layer of the first and second surfaces of the core plate and the opposite surface of the conductive main body; The first and second circuit layers are respectively formed in the barrier openings of the first and second surfaces of the core plate, and contact ridges are formed on the opposite surfaces of the conductive columns. In the method of manufacturing a high-density circuit board structure of the patent range f u, the core board is an insulating board. In the method of manufacturing the high-density circuit board structure of the patent item U, 2, the core plate is a resin-bonded copper enamel, and has a metal foil on the first surface and the first surface of the core plate, and the core The opening is formed in the plate to remove the metal foil. 14.= The method for manufacturing the high-density circuit board structure of the U-month patent track, the middle '(4) core plate is _ the circuit board with the line, respectively pressed on the first surface and the second surface of the core ΐ The single-sided resin is laminated with copper, and the resin-bonded copper box is formed on one surface of the dielectric layer to have a 19716 20 200816890 * *« » metal crucible in the core plate having the resin pressed copper drop The opening is formed, and the metal foil of the surface of the resin-bonded copper foil is removed. The method for fabricating the high-density circuit board structure of claim U includes removing the resist layer and the second conductive layer covered thereby. 16. If the high-density circuit board junction θ 1 of the 15th item of the application (4) is included in the first surface of the core plate and the first circuit layer to form a ^ f = layer structure ' / the circuit has a conductive structure The structure is connected to the first circuit layer. The method for manufacturing the high-density circuit board structure of the 16th item, forming a structure on the second surface of the core board and the second circuit layer, and the (4) build-up junction has a conductive structure electrically connected to the first Two circuit layers. The high-density circuit board structure of the 16 or 17 item is a structure on the dielectric layer. And a guide formed in the dielectric layer. 19. As in the scope of the patent application, the green, 々, and the member's method of manufacturing the circuit board structure, 20 such as Shen Zhi 2, ', ~ layer structure The outer surface has a plurality of electrical connection pads.彳 Item 19 of the high-density circuit board in the 19th layer forms a solder mask on the surface of the structure, and the soldering surface is electrically connected: the opening is opened to expose the line build-up structure. 19716 21