TW200801057A - Process for producing polishing pad - Google Patents
Process for producing polishing padInfo
- Publication number
- TW200801057A TW200801057A TW096113792A TW96113792A TW200801057A TW 200801057 A TW200801057 A TW 200801057A TW 096113792 A TW096113792 A TW 096113792A TW 96113792 A TW96113792 A TW 96113792A TW 200801057 A TW200801057 A TW 200801057A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- urethane composition
- pads
- bubbles
- dispersed
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/28—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/30—Making multilayered or multicoloured articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006115881A JP2007283712A (ja) | 2006-04-19 | 2006-04-19 | 溝付き長尺研磨パッドの製造方法 |
| JP2006115878A JP4730605B2 (ja) | 2006-04-19 | 2006-04-19 | 長尺研磨パッドの製造方法 |
| JP2006115864 | 2006-04-19 | ||
| JP2006115872A JP4817432B2 (ja) | 2006-04-19 | 2006-04-19 | 長尺研磨パッドの製造方法 |
| JP2007088355A JP2007307699A (ja) | 2006-04-19 | 2007-03-29 | 研磨パッドの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200801057A true TW200801057A (en) | 2008-01-01 |
Family
ID=38625069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096113792A TW200801057A (en) | 2006-04-19 | 2007-04-19 | Process for producing polishing pad |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW200801057A (zh) |
| WO (1) | WO2007123168A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112428165A (zh) * | 2020-10-22 | 2021-03-02 | 德阳展源新材料科技有限公司 | 一种阻尼布抛光垫的制备方法 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG162794A1 (en) | 2005-07-15 | 2010-07-29 | Toyo Tire & Rubber Co | Layered sheets and processes for producing the same |
| JP4884726B2 (ja) | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
| KR101181885B1 (ko) | 2006-09-08 | 2012-09-11 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| JP2008105213A (ja) * | 2006-10-24 | 2008-05-08 | Inoac Corp | 紫外線硬化発泡シートの製造方法 |
| WO2008087797A1 (ja) | 2007-01-15 | 2008-07-24 | Toyo Tire & Rubber Co., Ltd. | 研磨パッド及びその製造方法 |
| JP5145972B2 (ja) * | 2008-01-24 | 2013-02-20 | 株式会社ブリヂストン | 発泡樹脂シートの製造方法 |
| JP4593643B2 (ja) | 2008-03-12 | 2010-12-08 | 東洋ゴム工業株式会社 | 研磨パッド |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1985005314A1 (fr) * | 1984-05-16 | 1985-12-05 | Washi Kosan Co., Ltd. | Procede et installation de production en continu de plaques de plastique |
| JP3549219B2 (ja) * | 1993-03-15 | 2004-08-04 | セーレン株式会社 | フォーム複合体の製造法 |
| JPH11138564A (ja) * | 1997-11-05 | 1999-05-25 | Sekisui Chem Co Ltd | 発泡体及び床暖房用床材の製造方法 |
| US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
| JP4606733B2 (ja) * | 2003-12-22 | 2011-01-05 | 東洋ゴム工業株式会社 | 研磨パッドおよび半導体ウエハの研磨方法 |
| KR101107044B1 (ko) * | 2004-12-10 | 2012-01-25 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 연마 패드의 제조 방법 |
| JP4884726B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
-
2007
- 2007-04-19 TW TW096113792A patent/TW200801057A/zh unknown
- 2007-04-19 WO PCT/JP2007/058494 patent/WO2007123168A1/ja not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112428165A (zh) * | 2020-10-22 | 2021-03-02 | 德阳展源新材料科技有限公司 | 一种阻尼布抛光垫的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007123168A1 (ja) | 2007-11-01 |
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