200800528 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於局部切割一堆疊薄膜之方法及 設備，該堆疊薄膜係由至少第一樹脂層和配置於該第一樹 脂層上之第二樹脂層所組成，係從該第二樹脂層之側裁 切’同時留下配置於一橫方向之該堆疊薄膜的一部分。 【先前技術】 舉例來說，使用於液晶面板之基材、使用於印刷電路 板之基材和用於電漿面板之基材包含一光敏性基層薄膜 (光敏性胚料），其具有黏貼於一基材表面之一光敏性樹脂 層。該光敏性基層薄膜通常被建構爲一熱塑性樹脂層（緩衝 層）、一光敏性材料層（阻抗層）和一保護薄膜之一堆疊總 成，其係連續地堆疊於一基底薄膜（可撓性塑性支撐層）上。 用於黏貼此一光敏性基層薄膜之設備，通常在操作上 以給定之間隔進給如玻璃基材、樹脂基材等，且將保護薄 膜長度從對應於黏貼在各基材上之光敏性材料層長度的該 光敏性堆疊薄膜剝離。 在光敏性堆疊薄膜被進給至該黏貼設備前，保護薄膜 必須在一預設的位置被切除。特別地，保護薄膜被切除的 同時，留下配置於薄膜一橫方向中之光敏性堆疊薄膜的一 部分。此一裁切過程係爲一局部裁切過程。 一用以執行局部裁切過程之已知薄模裁切設備，例 如，被揭示於日本公開待審專利公告第11-179693號。如 附圖之第1 2圖中所示，所揭示之薄膜裁切設備具有一對引 200800528 導滾輪2 a、2 b，其用以進給一堆疊薄膜1和一可移動構件 4 ’其可移動地安裝於一軌道3以沿其移動。此軌道3朝橫 向於堆疊薄膜1藉由此等導引滾輪2a、2b而被進給的方向 延伸。 一轉軸6被同軸地配置於一水平空心軸5的內側，其 被安裝於可移動構件4上。一盤形切刀7被安裝於轉軸6 的一端上。被建構成與盤形切刀7成一對稱關係的另一盤 形切刀9，被安裝於轉軸6的另一端上。 一切刀基座8以面對的方式被配置於盤形切刀7、9上 且具有堆疊薄膜1插入於其間。切刀收容部8a、8b被安裝 於切刀基座8上，各自與盤形切刀7、9的裁切刃7 a、9 a 接合。 當盤形切刀7、9被保持於一不可旋轉狀態時，盤形切 刀7、9被橫向地移動通過堆疊薄膜1，而使盤形切刀7、9 的裁切刃7a、9a局部地裁切堆疊薄膜1。此時，由於裁切 刃7a、9a與堆疊薄膜1保持一滑動接觸，當裁切堆疊薄膜 1時，裁切刃7a、9a易產生薄膜碎片。 【發明内容】 本發明的主要目的在於提供一種用於局部裁切一堆疊 薄膜之方法及設備，其使用一簡單的製程與裝置而產生一 乾淨咼品質的最終成品，同時於裁切堆疊薄膜時，減少薄 膜碎片的產生。 依據本發明，其提供有一種用於局部切割一堆疊薄膜 之方法及設備，堆疊薄膜係由至少第一樹脂層和配置於此 200800528 第一樹脂層上之第二樹脂層所組成，係從第二 裁切，同時留下配置於一堆疊方向之堆疊薄膜 一可旋轉切刀相對於堆疊薄膜而橫向通過 動，以在堆疊薄膜中形成第一裁切區域，其係 離方向中之第二樹脂層的一後端。可旋轉切刀 局部地裁切堆疊薄膜之切刀，當此切刀橫向通 的同時於其上旋轉。 一不可旋轉固定切刀相對於堆疊薄膜而橫 薄膜移動，以在堆疊薄膜中形成第二裁切區域 在一剝離方向中之第二樹脂層的一前端。此不 切刀包括一用於局部地裁切堆疊薄膜之切刀， 通過堆疊薄膜的同時保持一給定的姿態。不可 刀可包括一盤形切刀（此後稱爲一固定圓形切7： 形切刀（一固定的多邊形刀）、一壓迫切刀（固定 用於局部切割該堆疊薄膜之設備，較佳爲 機構，其可橫向通過堆疊薄膜移動，其中可旋 可旋轉固定切刀，係以對應於第一裁切區域和 域彼此相隔之一距離的間隔而被安裝於移動機 用於局部切割堆疊薄膜之設備，較佳爲具 通過堆疊薄膜移動之第一移動機構，可旋轉切 於此第一可移動機構上；和一可橫向通過堆疊 第二移動機構，不可旋轉固定切刀係被安裝於 動機構上。 用於局部切割堆疊薄膜之設備，較佳爲包 樹脂層之側 的一部分。 堆疊薄膜移 作爲在一剝 包括一用於 過堆疊薄膜 向通過堆疊 ，其係作爲 可旋轉固定 當切刀橫向 旋轉固定切 ί )、一多邊 刀）等。 具有一移動 轉切刀和不 第二裁切區 構上。 有一可橫向 刀係被安裝 薄膜移動之 此第二可移 括一可橫向 200800528 通過堆疊薄膜移動之移動機構；一安裝於移 刀；和一與切刀結合之固定機構，其用以使 作爲該可旋轉切刀和不可旋轉固定切刀的功 堆疊薄膜較佳爲包括一光敏性堆疊薄膜 第一樹脂層之一光敏性樹脂層。 依據本發明，由於作爲第二樹脂層在該 後端之第一局部裁切區域，係藉由可旋轉切 效地防止薄膜碎片於該第一局部裁切區域中 脂層在第一局部裁切區域有剝離的傾向。然 裁切區域相對於其剝離方向而作爲第二樹脂 果，當第二樹脂層被剝離時，第一樹脂層不 剝離。 由於作爲在其剝離方向中之該第二樹脂 一局部裁切區域，係藉由不旋轉固定切刀而 靠地防止第一樹脂層在第二局部裁切區域變 因此，當第二樹脂層被剝離時，可防止 剝離方向中之前端被不必要地剝離。因此， 質被改善。當被局部切割時，堆疊薄膜的品 同時防止薄膜碎片附著於切刀上，且切刀可 因此，堆疊薄膜使用一簡單製程與裝置 切成一高品質，同時當堆疊薄膜被局部地裁 產生薄膜碎片。 本發明以上和其他的目的、特徵和優點 動機構上之切 切刀能選擇地 ，其包含作爲 其剝離方向的 刀形成，而有 產生。第一樹 而，第一局部 層的後端。結 會作不必要的 層的前端之第 形成，得以可 成剝離。 第一樹脂層在 堆疊薄膜的品 質可被維持， 被更有效地清 而被局部地裁 切時，可防止 將由以下的說 200800528 明當藉由說明例顯示之本發明較佳實施例的圖式而變得更 明白。 【實施方式】 第1圖槪要地顯示一製造設備20，其包含依據本發明 第一實施例之一局部裁切設備。製造設備20在製造使用於 液晶面板或有機EL面板之彩色濾光片的一製程中，被操作 以轉移一長條狀光敏性胚料22(光敏性堆疊薄膜）之光敏性 樹脂層29(說明於後）於玻璃基材24上。 第2圖顯示於橫截面中，使用於製造設備20中之光敏 性胚料22。光敏性胚料22包括與一抗靜電層25結合之一 可撓曲基底薄膜（支撐層）26的一堆疊總成、一緩衝層（熱塑 性樹脂層）27、一中間層（阻氧薄膜）28、作爲一阻抗層之一 ( 光敏性樹脂層（第一樹脂層）29和一保護薄膜（第二樹脂 層）3 0。或者，光敏性胚料2 2僅包括有基底薄膜2 6、光敏 性樹脂層29和保護薄膜30。 基底薄膜26係由聚對苯二甲酸乙二醇酯（PET)所製 成。儲藏層27係由乙烯和乙烯氧化物的一共聚物所製成。 中間層28係由聚乙烯醇（PVA)所製成。光敏性樹脂層29係 由包含一鹼溶性黏結劑、一單體、——光聚合引發劑和一著 色劑之一已著色光敏性樹脂合成物所製成。保護薄膜30係 由聚乙烯、聚丙烯或相似物所製成。 如第1圖中所示，製造設備20具有一胚料捲出機構 32，於其中容納有以一已捲繞光敏性胚料22形式之一光敏 性胚料捲22a且供作從光敏性胚料捲22a捲出光敏性胚料 200800528 22而使用·’依據本發明第一實施例之一局部裁切設備36， 其用以在被捲出之光敏性胚料22的保護薄膜3〇中，形成 一可橫向裁切之第一局部裁切區域3 4a及可橫向裁切之第 二局部裁切區域34b ;和一標籤黏貼機構40，其用以黏貼 黏性標籤38(見第3圖）至保護薄膜30，而每個標籤皆具有 一非黏著區38a。 ’ 從標籤黏貼機構40的下游處，配置有一儲藏機構42， 其用以將光敏性胚料22的進給模式由一間斷進給模式改 變至一連續進給模式；一剝離機構44，其用以從光敏性胚 料22剝離特定長度的保護薄膜30 ; —加熱機構45，其用 以加熱一玻璃基材24至一預設的溫度且進給已加熱之玻 璃基材24至一黏貼位置；和一黏貼機構46，其用以黏貼光 敏性樹脂層2 9至玻璃基材24，光敏性樹脂層29藉由剝離 保護薄膜3 0而被暴露出來。一工件，其係由玻璃基材24 和藉黏貼機構46而朝玻璃基材24黏貼之光敏性胚料22所 構成，在此後將被稱作爲一”黏貼基材24a”。 一用以直接地檢測第一局部裁切區域34a及/或第二局 部裁切區域34b(此後僅稱作爲“第一局部裁切區域34a”）之 檢測機構47，其被置於光敏性胚料22的一邊界處，被配置 於黏貼機構46中接近黏貼位置的上游處。一中間基材胚料 裁切機構48,其用以於兩相鄰基材24間裁切該光敏性胚料 22，被配置於黏貼機構46的下游處。一胚料裁切機構48a， 其係當製造設備20開始及結束其操作時被操作’被配置於 中間基材胚料材切機構4 8的上游。 -10- 200800528 一結合基底49，其用以結合實際上被使用完之一光敏 性胚料22的後端和將被使用之一新的光敏性胚料22的前 端，被配置於接近胚料捲出機構32的下游處。結合基底49 其下游處隨之有一薄膜端部位置檢測器5 1，由於在光敏性 胚料捲22a中的捲繞不規則性，其用以控制光敏性胚料22 的橫向移動。 局部裁切設備36被配置於一對滾輪50的下游處，其 計算被捲繞於該胚料捲出機構32內之光敏性胚料捲22a的 直徑。如第4和第5圖中所示，局部裁切設備36具有一可 在橫方向（由箭頭B所指）中移動之移動機構52，其係垂直 於光敏性胚料22被進給的方向（由箭頭A所指）。 移動機構52包括一線性馬達，其具有朝箭頭B之方向 延伸之一軌道54。第一裁切機構56和第二裁切機構58， 兩者皆可調整高度，被安裝於移動機構52上。移動機構52 可包括任何不同的結構，諸如使用一齒條和一小齒輪之自 我推進結構，以取代線性馬達。 第一裁切機構5 6具有第一基座60和一可藉由軸承 64(見第5圖）而在該第一基座60上旋轉地支撐之轉軸62。 •-旋轉切刀，如一旋轉圓形切刀（切刀）66，被固定地安裝 於轉軸62的遠端上，以與轉軸62 —體地旋轉。旋轉圓形 切刀66具有一裁切刃66a，其可爲一雙面刃或一單面刃。 裁切刃66a形成第一局部裁切區域34a，在其剝離方向作爲 某一長度之保護薄膜30的後端。一推壓滾輪67被安裝於 轉軸62上，當光敏性胚料22藉由旋轉圓形切刀66而被部 -11- 200800528 分地裁切時，其用以推壓並保持光敏性胚料22。 第二裁切機構58具有第二基座68和支撐於此第二基 座68上之一固定軸70。此固定軸70可相對於第二基座68 繞其本身之軸心轉動一預設角度而作角度調整。一不可旋 轉切刀，如一固定圓形切刀7 2，被固定地安裝於固定軸7 0 的遠端上，以與固定軸70 —體地旋轉。固定圓形切刀72 具有一裁切刃72a，其可爲一兩面刃或一單面刃。一推壓滾 輪7 6藉由一位於固定軸7 0末端之一軸承7 4而被旋轉地支 撐。固定圓形切刀72形成第二局部裁切區域34b，在其剝 離方向作爲某一*長度之保護薄膜30的前端。 第二裁切機構58可使用如一棘輪機構（未顯示），在固 定圓形切刀72形成第二局部裁切區域34b時，每次轉動一 預設角度而對固定軸70作角度調整。 棘輪機構可包括如揭不於日本公開待審專利公告第 1 1 - 1 79693號中的棘輪機構。 如第6圖中所顯示，一切刀收容部基座8 〇被配置於面 對旋轉圓形切刀66和固定圓形切刀72 ,且光敏性胚料22 插入於其等之間。切刀收容部基座8 0包括一金屬板且朝箭 頭B所指的方向延伸。切刀收容部基座8〇具有一對凹處 81a、81b界定於其上表面中，且朝箭頭b所指的方向延伸 於旋轉圓形切刀66和固定圓形切刀72的移動範圍內。樹 脂製的收容部8 2 a、8 2 b被各自地置放於凹處8 1 a、8 1 b中。 如第2圖中所示’第一局部裁切區域34a和第二局裁 切區域34b至少需形成穿過保護薄膜3〇。事實上，旋轉圓 -12- 200800528 形切刀66和固定圓形切刀72被設計成切入光敏性樹脂層 29和中間層28，以可靠地裁切保護薄膜30。 第一局部區域34a和第二局部裁切區域34b用於設定 介於兩相鄰玻璃基材24間之間隔。例如，第一和第二局部 材切區域34a、34b被形成於保護薄膜30中從玻璃基材24 之各邊緣向內間隔10mm之處。插入於玻璃基材24之第一 和第二局部裁切區域34a、34b之間的保護薄膜30之截面， ^ 當光敏性樹脂層29作爲支架而在黏貼機構46中被黏貼於 玻璃基材24時，功能如一遮罩，將隨後說明。 標籤黏貼機構40供應黏性標籤3 8用以互相連接一前 剝離區30aa和一後剝離區30ab，以在玻璃基材24之間留 下保護薄膜30的一殘留區30b。如第2圖中所示，將起初 被剝離之前剝離區30aa和隨後被剝離之後剝離區30ab，被 置於殘留區30b的各側。 如第3圖中所示，每個黏性標籤3 8具有一矩形帶狀， φ 且係由如保護薄膜30之相同樹脂材料所製成。每個黏性標 籤38包含一位於中央的非黏性區（或微黏區）3 8a，其不具有 黏性；及各自配置於非黏性區38a的縱向相對端上之第一 黏性區38b及第二黏性區38c，換言之，在黏性標籤38的 縱向相對端部上。第一黏性區38b和第二黏性區38c各被 黏貼至前剝離區30aa和後剝離區30ab處。 如第1圖中所示，標籤黏貼機構40具有吸盤墊84a至 8 4e，以黏貼最多七個相間隔之黏性標籤38，或如第一實施 例中之五個相間隔之黏性標籤。用以從下面保持光敏性胚 ^13- 200800528 料22的一可垂直移動之支撐基座86，被配置於黏性標籤 38藉由吸盤墊84a至84e而黏著至光敏性胚料22之位置。 儲藏（reservoir)機構42用於吸收間斷進給模式與連續 進給模式之間的速度差，其中間斷進給模式係使光敏性胚 料22被進給至儲藏機構42的上游；而連續進給模式係使 光敏性胚料22被進給到儲藏機構42的下游。儲藏機構42 亦具有擺盪器9 1，其包括兩可擺動滾輪90用以防止光敏性 胚料22受到張力變化之影響。擺盪器9 1視被儲藏之光敏 性胚料22之長度而定，可具有一或三個或更多個滾輪90。 .配置於儲藏機構42之下游的剝離機構44，包括一吸筒 92，用以減少光敏性胚料22從剝離機構44被進給時的張 力變化，且亦可用以穩定光敏性胚料22被堆疊時的張力。 一剝離滾輪93被配置於靠近吸筒92處。以一尖銳剝離角 度通過剝離滾輪93而從光敏性胚料22剝離之保護薄膜 30,除了殘留區域30b之外，被一保護薄膜捲取軸94捲繞。 將張力傳給光敏性胚料22的張力控制機構96，被配置 於剝離機構44的下游。張力控制機構96具有一可致動之 汽缸98，用以使張力擺盪器1〇〇作角位移，而調整與張力 擺盪器1 00保持滾動接觸之光敏性胚料22的張力。張力控 制機構96可僅在需要時被使用，且可被省掉。 檢測機構47包含光電感測器1 02，如雷射感測器、光 感測器、或類似者，用以直接地檢測：由於在第一局部裁 切區域34a中之楔形溝槽、由保護薄膜30不同的厚度所產 生的階段，或其結合，而引起在光敏性胚料22中之變化。 -14- 200800528 來自光電感測器102之檢測訊號被使用作爲一邊界位置訊 號，其代表在保護薄膜30中之邊界位置。光電感測器1 〇2 被配置成與一支撐滾輪1 0 3面對的關係。或者，可使用如 一 CCD相機或相似物之非接觸位移計（non-contact displacement gauge)或影像檢查機構，以取代光電感測器 102。 藉由檢測機構47所檢測之第一局部裁切區域34a的位 置資料，可及時地被統計處理且轉換成圖形資料。當藉由 ^ 檢測機構47所檢測之位置資料顯示一過度的變化或偏差 時，製造設備20可產生一警告。 製造設備20可使用一不同系統以產生邊界位置訊號。 依據此一不同系統，第一局部裁切區域34a不被直接地檢 測’而在光敏性胚料22上作記號。例如，孔或凹處可在該 局部裁切殷備36中被形成於光敏性胚料22中之靠近第一 局部裁切區域34a處，或光敏性胚料22可藉由一雷射光束 應 或一水噴射而劃一細長切槽，或也可藉由一噴墨器或一印 表機而作記號。位於光敏性胚料22上之記號被檢測，其中 檢測訊號被使用作爲邊界位置訊號。 加熱機構45包含一進給機構104，其用以使玻璃基材 24作爲工件而朝箭頭C的方向進給。進給機構104具有複 數個由合成樹脂所形成之盤形進給滾輪106,其被排列於箭 頭C的方向。加熱機構45同時包含一收容部108用以收容 玻璃基材24，加熱機構45被配置於箭頭C之方向進給機 構1 04的上游處。加熱機構45更包括複數個配置於收容部 -15- 200800528 108下游處之加熱爐110。 加熱機構45隨時監控玻璃基材24的溫度 構45檢測到異常溫度的情況，加熱機構45停. 106,或發出一警告，且傳送指示故障之資訊， 排出異常的玻璃基材24，且其同時也被使用於 生產管理。進給機構104可具有一未圖示之氣 用以在玻璃基材24朝箭頭C的方向進給時將美 一用以儲藏複數個玻璃基材24的基材儲廊 被配置於加熱機構45的上游處。基材儲藏支架 置於排除其進料槽及排出槽之外的三個側邊之 除風扇單元（或風管單元）122。風扇單元122將 淨空氣排出到基材儲藏支架1 20中。儲藏於基 120之玻璃基材24藉由一機器手124之臂124a 126而個別地吸引，且從基材儲藏支架120取出 部108中。 黏貼機構46具有一對垂直隔開且被加熱至 的堆疊橡膠滾輪130a、130b。支撐滾輪132a、 與各個堆疊橡膠滾輪130a、130b作滾動接觸。支 藉由一滾輪夾持單元134而被壓抵於堆疊橡膠 一接觸防止滾輪1 3 6被可移動地配置於靠 13 0a處，用以防止光敏性胚料22與橡膠滾輪 用以預熱光敏性胚料22至一預設溫度的預熱| 配置接近於黏貼機構46的上游處。該預熱單元 熱施加機構，如一紅外線棒狀加熱器或相似物 。在加熱機 止進給滾輪 其可被用來 品質控制或 動升降板， ^升高。 ξ支架120， 120包括配 各個灰塵移 電中性的乾 材儲藏支架 上之吸盤墊 並嵌入收容 一預設溫度 132b被保持 撐滾輪132b 滾輪130b 。 近橡膠滾輪 1 3 0 a接觸。 I元137 ，被 ;1 3 7包括一 -16- 200800528 薄膜進給滾輪138a和基材進給滾輪138b被配置於黏 貼機構46和中間基材胚料裁切機構48之間。一冷卻機構 140被配置於中間基材胚料裁切機構48的下游處，且一基 底剝離機構1 42被配置於冷卻機構1 40的下游處。冷卻機 構140在光敏性胚料22藉由黏貼基材24a和一隨後的黏貼 基材24a之間的中間基材胚料裁切機構48切斷之後，供應 冷空氣至一黏貼基材24a。具體上，冷卻機構140以1.0至 2.0m/min之速率範圍供應具有10°C溫度之冷空氣。然而， ^ 冷卻機構140可被省略，且黏貼基材24a可在光敏性堆疊 體儲藏支架1 5 6中被自然地冷卻。 配置於冷卻機構1 40的下游處之基底剝離機構1 42，具 有複數個吸盤墊144，用以吸引一黏貼基材24a的下表面。 當黏貼基材24a藉由吸盤墊144在吸力下被吸引時，基底 薄膜26和殘留區域30b從黏貼基材24a處藉由一機器手146 而被剝離。排出電中性之乾淨空氣至該黏貼基材24a之堆 ^ 疊區域的四側之電中性的空氣鼓風機（未顯示），被配置於 吸盤墊1 44的上游、下游和側面處。基底薄膜26和殘留區 域30b可從已黏貼之基材24a處被剝離，而其上用以支撐 黏貼基材24a之一平檯被垂直地、傾斜地朝向，或上下翻 轉以促進灰塵的移除。 基底剝離機構1 42係跟隨在光敏性堆疊體儲藏支架 156的下游處，以儲藏複數個光敏性堆疊體150。當基底薄 膜26和殘留區域30b從黏貼基材24a處藉由該基底剝離機 構142而被剝離時被製造的一光敏性堆疊體150,藉由一機 -17- 200800528 器手152之臂152a上之吸盤墊154而被吸引，且接著從基 底剝離機構1 42處取出並置放到光敏性堆疊體儲藏支架 156 中。 光敏性堆疊體儲藏支架1 5 6包括配置於排除其進料槽 及排出槽之外的三個側邊之各個灰塵移除風扇單元（或風 管單元）1 22。風扇單元1 22排出電中性之乾淨空氣到光敏 性堆疊體儲藏支架1 5 6中。 在製造設備20中，胚料捲出機構32、局部裁切設備 36、標籤黏貼機構40、儲藏機構42、剝離機構44、張力控 制機構96和檢測機構47係配置於黏貼機構46的上方。反 之，胚料捲出機構32、局部裁切設備36、標籤黏貼機構40、 儲藏機構42、剝離機構44、張力控制機構96和檢測機構 47可配置於黏貼機構46的下方，以黏貼上下翻轉的光敏性 樹脂層29到玻璃基材24的下表面。或者，製造設備20的 零件可整體以線性圖案的方式排列。 製造設備20整體藉由一堆疊程序控制器1 60而控制。 製造設備20亦具有一堆疊控制器162、一基材加熱控制器 1 64和一基底剝離控制器1 66等，用以控制製造設備20的 不同功能元件。此等控制器藉由一線上製程中（in-process) 網路而互相連接。 堆疊製程控制器160被連接至包含製造設備20之一工 廠網路，且根據由一工廠CPU(未顯示）所提供之指令資訊 (條件設定和生產資訊）而執行生產之資訊處理，如生產管 理及機構操作管理。 -18- 200800528 堆疊控制器1 62作爲一製程主控器以控制製造設備20 的功能組件。堆疊控制器1 62作爲一控制機構，用以例如 根據藉由光敏性胚料22之第一和第二局部裁切區域34a、 34b的檢測機構47所檢測之位置資訊而控制加熱機構45。 基底剝離控制器1 66控制基底剝離機構1 42以從黏貼 機構46供應之黏貼基材24a處剝離基底薄膜26,且同時排 出光敏性堆疊體1 50至一下游製程。基底剝離控制器1 66 同時處理關於黏貼基材24a和光敏性堆疊體1 50的資訊。 ® 使用於製造設備20之安裝空間可藉由一分隔壁170而 被分隔成第一無麈室172a和第二無麈室172b。第一無塵室 172a中內藏有從胚料捲出機構32至張力控制機構96範圍 內之許多組件。第二無塵室172b中內藏有檢測機構47，和 其他跟隨著檢測機構47的組件。第一無麈室1 72a和第二 無塵室172b經由一貫穿區174而彼此連接。 依據本發明之實施例執行局部裁切方法之製造設備20 _ 的操作，將在以下說明。 如第1圖中所示，在胚料捲出機構32中，光敏性胚料 22從光敏性胚料捲22a處被捲出且被進給至局部裁切設備 3 6 〇 在局部裁切設備3 6中，如第4至6圖中所示，移動機 構52同步於光敏性胚料22而朝箭頭B之方向橫向移動通 過光敏性胚料2 2，而光敏性胚料2 2係朝箭頭A所指的方 向進給，因而局部地裁切光敏性胚料2 2。當光敏性胚料2 2 保持爲靜止時，局部裁切設備3 6也可局部地裁切光敏性胚 -19- 200800528 料22。 具體上，第一裁切機構56和第二裁切機構58被安裝 於移動機構52上。第一裁切機構56的旋轉圓形切刀66和 該第二裁切機構58的固定圓形切刀72彼此一致地朝箭頭B 所指的方向移動。 此時，旋轉圓形切刀66以一所要深度切入光敏性胚料 22的第一局部裁切區域34a中，且在朝箭頭B的方向橫向 移動通過光敏性胚料2 2之時旋轉。因此，從保護薄膜3 0 ^ 被切至所要深度之一切槽被形成於光敏性胚料22(見第2 圖）的第一局部裁切區域34a中。 固定圓形切刀72切入光敏性胚料22的第二局部裁切 區域中，且在朝箭頭B之方向橫向移動通過光敏性胚料22 之時，被保持爲不旋轉。因此，從保護薄膜30被切至所要 深度之一切槽，在與第一局部裁切區域34 a(見第2圖）隔開 一預設距離的一位置處被形成於光敏性胚料22的第二局 部裁切區域34b中。 由於第一局部裁切區域34a係藉由旋轉圓形切刀66而 形成，依據第一實施例時，旋轉圓形切刀66有效地防止薄 膜碎片在第一局部裁切區域34a之附近產生。 此時，如第7圖中所示，光敏性樹脂層2 9易於第一局 部裁切區域34a處剝離。然而，第一局部裁切區域34a相 對於其剝離方向係作爲某一長度之保護薄膜3 〇的後端。因 此，當保護薄膜30被剝離時，光敏性樹脂層29不致不必 要地剝離。 -20- 200800528 光敏性樹脂層2 9容易剝離之處的第一局部载切區域 34a，係位於保護薄膜30的殘留區域30b之前端處。殘留 區域30b將不被作爲一轉移區，而隨後被丟棄。當第一局 部裁切區域34a藉由旋轉圓形切刀66而形成時，可能產生 之薄膜碎片被有效地減少，因此將被製出之光敏性堆疊體 的品質不致降低。 第二局部裁切區域34b係藉由固定圓形切刀72而形 成。因此，光敏性樹脂層29被防止於第二局部裁切區域34b 處剝離。第二局部裁切區域34b相對其剝離方向而作爲某 一長度之保護薄膜30的前端。因此，當保護薄膜30被剝 離時，光敏性樹脂層29有效地被防止剝離，且僅保護薄膜 30被可靠地並順利地剝離。 因此，光敏性胚料22使用一簡單製程和裝置而局部地 裁切成高品質，同時當光敏性胚料2 2被局部地裁切時，可 防止薄膜碎片的產生。尤其，當該光敏性胚料22被局部地 裁切時易產生的薄膜碎片，被防止附著至旋轉圓形切刀 66，故旋轉圓形切刀66可極有效地清潔。 進行一項試驗，以比較由一習知局部裁切設備和由第 一實施例之局部裁切設備所產生之局部裁切狀態。在此試 驗中，第一局部裁切區域34a和第二局部裁切區域34b係 藉由習知之局部裁切設備的固定圓形切刀而形成；而第一 局部裁切區域34a和該第二局部裁切區域34b亦使用依據 第一實施例之局部裁切設備的旋轉圓形切刀66和該固定 圓形切刀72而各自形成。第8圖顯示試驗結果。 -21- 200800528 在習知之局部裁切設備中，由於第一局部裁切區域34a 和第二局部裁切區域34b皆使用固定圓形切刀而形成，故 產生一相當數量的薄模碎片。移除附著至固定圓形切刀之 薄膜碎片費時費事，且光敏性胚料22不被局部地裁切成一 高品質完成品。 然而，在依據第一實施例之局部裁切設備的情況，當 光敏性胚料22被局部地裁切時所產生之薄膜碎片減少，且 有效地防止光敏性樹脂層29在轉移區中剝離。 ® 接著，局部裁切光敏性胚料22被進給至標籤黏貼機構 40，以在支撐基座86上放置保護薄膜30的一黏貼區。在 標籤黏貼機構40中，一預設數量的黏性標籤38藉由吸盤 墊84a至84e而在吸力下被吸引保持，且黏性標籤38越過 其殘留區30b而被牢固地黏貼至保護薄膜30的前剝離區 30aa和後剝離區30ab (見第3圖）。 例如，具有五個黏性標籤3 8黏貼於其上之光敏性胚料 0 22，藉由儲藏機構42而與所供應之光敏性胚料22受到之 張力的變化隔離，且接著光敏性胚料22被連續地進給至剝 離機構44。在剝離機構44中，光敏性胚料22的基底薄膜 26被吸引至吸筒92。保護薄膜30從光敏性胚料22處剝離， 留下殘留區30b。保護薄膜30藉由剝離滾輪93以一尖銳剝 離角度而被剝離，且被捲繞於保護薄膜捲軸94上。較佳爲 使一電中性之空氣流至保護薄膜30被剝離之區域中。 此時，由於光敏性胚料22藉由吸筒92 '而被牢固地保 持，當保護薄膜30從光敏性胚料22剝離時所產生之衝撃 -22- 200800528 不會從吸筒92傳送至下游之光敏性胚料22。必然地，此衝 擊不會傳送至黏貼機構46，且因此玻璃基材24的堆疊區域 被有效地防止於其中產生帶狀瑕疵區。 在保護薄膜30從基底薄膜26處藉由剝離機構44剝離 而留下該殘留區3Ob之後，光敏性胚料22藉由張力控制機 構96而調整張力，且接著光敏性胚料22的局部裁切區域 34 ·藉由檢測機構47的光電感測器1 〇2檢測。 根據局部裁切區域34的檢測資訊，薄膜進給滾輪138a 被旋轉以朝向黏貼機構46進給一預設長度之光敏性胚料 22°此時，接觸防止滾輪136在光敏性胚料22之上方等待， 而橡膠滾輪130b被配置於光敏性胚料22之下方。 在加熱機構45中，在加熱爐110中之加熱溫度被設定 至依據在黏貼機構46中所使用的堆疊溫度之値。機器手 124抓取儲藏於基材儲藏支架〗20中之一玻璃基材24，且 將所抓取之玻璃基材24導入至收容部108。在收容部108 中，玻璃基材24藉由進給機構104之進給滾輪106，以一 間斷進給模式，而連續地從收容部1 08進給至加熱爐1 1 0。 在加熱爐110中，玻璃基材24在朝箭頭C之方向的加 熱機構45之下游端處，被準確地停止於一給定的停止位 置。玻璃基材24被暫時地定位於與光敏性胚料22之光敏 性樹脂層29的黏貼區域對齊的橡膠滾輪1 30a、1 30b之間。 接著，滾輪夾持單元134被操作以升高支撐滾輪132b 和橡膠滾輪130b，因此在一預設壓力下將玻璃基材24夾持 於該等橡膠滾輪之間130a、130b。橡膠滾輪130a被旋轉以 -23-200800528 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a method and apparatus for partially cutting a stacked film, the stacked film being composed of at least a first resin layer and disposed on the first resin layer The second resin layer is formed by cutting from the side of the second resin layer while leaving a portion of the stacked film disposed in a lateral direction. [Prior Art] For example, a substrate for a liquid crystal panel, a substrate for a printed circuit board, and a substrate for a plasma panel include a photosensitive base film (photosensitive blank) which is adhered to A photosensitive resin layer on one surface of a substrate. The photosensitive base film is generally constructed as a thermoplastic resin layer (buffer layer), a photosensitive material layer (impedance layer), and a protective film stack assembly, which are continuously stacked on a base film (flexibility) Plastic support layer). An apparatus for adhering such a photosensitive base film, which is usually operatively fed at a given interval, such as a glass substrate, a resin substrate, etc., and has a protective film length from a photosensitive material corresponding to each of the substrates. The photosensitive stack film of the layer length is peeled off. The protective film must be removed at a predetermined position before the photosensitive stacked film is fed to the bonding apparatus. In particular, while the protective film is being removed, a portion of the photosensitive stacked film disposed in the transverse direction of the film is left. This cutting process is a partial cutting process. A known thin-die cutting apparatus for performing a partial cutting process is disclosed, for example, in Japanese Laid-Open Patent Publication No. 11-179693. As shown in FIG. 12 of the accompanying drawings, the disclosed film cutting apparatus has a pair of guides 200800528 guide rollers 2a, 2b for feeding a stacked film 1 and a movable member 4' It is movably mounted on a track 3 to move along it. This track 3 extends in a direction transverse to the direction in which the stacked film 1 is fed by the guide rollers 2a, 2b. A rotary shaft 6 is coaxially disposed inside the horizontal hollow shaft 5, and is attached to the movable member 4. A disc cutter 7 is attached to one end of the rotary shaft 6. Another disc cutter 9, which is constructed to form a symmetrical relationship with the disc cutter 7, is attached to the other end of the rotary shaft 6. All of the knife bases 8 are disposed on the disk cutters 7, 9 in a facing manner with the stacked film 1 interposed therebetween. The cutter housing portions 8a, 8b are attached to the cutter base 8, and are respectively engaged with the cutting edges 7a, 9a of the disk cutters 7, 9. When the disc cutters 7, 9 are held in a non-rotatable state, the disc cutters 7, 9 are laterally moved through the stacked film 1 to partially cut the cutting edges 7a, 9a of the disc cutters 7, 9. The stacked film 1 is cut. At this time, since the cutting edges 7a, 9a maintain a sliding contact with the stacked film 1, the cutting edges 7a, 9a are liable to cause film fragments when the stacked film 1 is cut. SUMMARY OF THE INVENTION It is a primary object of the present invention to provide a method and apparatus for partially cutting a stacked film that uses a simple process and apparatus to produce a clean final quality finished product while simultaneously cutting the stacked film. To reduce the generation of film fragments. According to the present invention, there is provided a method and apparatus for partially cutting a stacked film, the stacked film being composed of at least a first resin layer and a second resin layer disposed on the first resin layer of 200800528, Second cutting, while leaving a stacked film disposed in a stacking direction, a rotatable cutter is laterally moved relative to the stacked film to form a first cutting region in the stacked film, which is in the direction of the second resin A back end of the layer. Rotary cutter The cutter that stacks the film is partially cut, and the cutter rotates while it is laterally open. A non-rotatable fixed cutter moves across the film relative to the stacked film to form a front end of the second resin layer in the peeling direction of the second cut region in the stacked film. The cutter does include a cutter for partially cutting the stacked film by stacking the film while maintaining a given posture. The non-knife may include a disc cutter (hereinafter referred to as a fixed circular cut 7: a shaped cutter (a fixed polygonal knife), a pressing knife (fixed to partially cut the stacked film, preferably a mechanism movable laterally through the stacked film, wherein the rotatable rotatable fixed cutter is mounted to the mobile machine for partially cutting the stacked film at an interval corresponding to a distance between the first cutting region and the domain The device preferably has a first moving mechanism that moves through the stacked film and is rotatably cut on the first movable mechanism; and a second movable mechanism that can be laterally stacked, the non-rotatable fixed cutter is mounted on the moving mechanism The apparatus for partially cutting the stacked film is preferably a part of the side of the resin-coated layer. The stacked film is moved as a strip for covering the film through the stack, which is rotatably fixed when the cutter is laterally Rotate fixed cut ί ), a multilateral knife). It has a moving cutter and a second cutting zone. a second movable mechanism capable of moving the transverse blade to be mounted by the mounting film; a moving mechanism capable of moving through the stacked film; a mounting mechanism on the moving blade; and a fixing mechanism combined with the cutting blade for The work stack film of the rotatable cutter and the non-rotatable fixed cutter preferably comprises a photosensitive resin layer of a first resin layer of a photosensitive stacked film. According to the present invention, since the first partial cut region of the rear end as the second resin layer is rotatably prevented, the film layer is prevented from being cut in the first partial portion in the first partial cut region by the rotation. The area has a tendency to peel off. However, the cut region is the second resin as it is in the peeling direction, and when the second resin layer is peeled off, the first resin layer is not peeled off. Since the second resin is partially cut in the peeling direction, the first resin layer is prevented from being changed in the second partial cut region by not rotating the fixed cutter, so that when the second resin layer is At the time of peeling, the front end in the peeling direction can be prevented from being unnecessarily peeled off. Therefore, the quality is improved. When partially cut, the product of the stacked film simultaneously prevents the film fragments from adhering to the cutter, and the cutter can thus cut the film into a high quality using a simple process and a device, while the stacked film is partially cut to produce a film chip. . The above and other objects, features and advantages of the present invention are selectively produced by a cutter which includes, as its peeling direction, a knife formation. The first tree, the back end of the first partial layer. The knot will form the first layer of the front end of the unnecessary layer, which can be peeled off. The quality of the first resin layer in the stacked film can be maintained, and is more effectively cleared and partially cut, thereby preventing the pattern of the preferred embodiment of the present invention which will be apparent from the following description by way of example. Become more aware. [Embodiment] Fig. 1 schematically shows a manufacturing apparatus 20 including a partial cutting apparatus according to a first embodiment of the present invention. The manufacturing apparatus 20 is operated to transfer a photosensitive resin layer 29 of a long photosensitive paste 22 (photosensitive stacked film) in a process of manufacturing a color filter for a liquid crystal panel or an organic EL panel (illustration Thereafter, it is on the glass substrate 24. Figure 2 shows the photosensitive billet 22 used in the manufacturing apparatus 20 in cross section. The photosensitive billet 22 includes a stack assembly of a flexible base film (support layer) 26 in combination with an antistatic layer 25, a buffer layer (thermoplastic resin layer) 27, and an intermediate layer (oxygen barrier film) 28. As one of the resistive layers (photosensitive resin layer (first resin layer) 29 and a protective film (second resin layer) 30. Alternatively, the photosensitive billet 2 2 includes only the base film 26, photosensitivity The resin layer 29 and the protective film 30. The base film 26 is made of polyethylene terephthalate (PET), and the storage layer 27 is made of a copolymer of ethylene and ethylene oxide. It is made of polyvinyl alcohol (PVA). The photosensitive resin layer 29 is composed of a photosensitive photosensitive resin composition containing an alkali-soluble binder, a monomer, a photopolymerization initiator, and a coloring agent. The protective film 30 is made of polyethylene, polypropylene or the like. As shown in Fig. 1, the manufacturing apparatus 20 has a blank unwinding mechanism 32 in which a photosensitive light is accommodated. a photosensitive blank 22 in the form of a photosensitive blank 22 and supplied as a photosensitive billet 22a rolls out the photosensitive billet 200800528 22 and uses a partial cutting device 36 according to the first embodiment of the present invention for forming a protective film 3 in the photosensitive film 22 that is taken up. a first partial cutting area 34a that can be laterally cut and a second partial cutting area 34b that can be laterally cut; and a label bonding mechanism 40 for adhering the adhesive label 38 (see Fig. 3) to protection The film 30, and each of the labels has a non-adhesive area 38a. 'From the downstream of the label attaching mechanism 40, a storage mechanism 42 is disposed for the feed mode of the photosensitive billet 22 from a break feed mode. Changing to a continuous feed mode; a stripping mechanism 44 for stripping a specific length of the protective film 30 from the photosensitive billet 22; a heating mechanism 45 for heating a glass substrate 24 to a predetermined temperature And feeding the heated glass substrate 24 to a pasting position; and an adhesive mechanism 46 for adhering the photosensitive resin layer 29 to the glass substrate 24, and the photosensitive resin layer 29 is peeled off by the protective film 30. Exposed to a workpiece, which is made of glass 24 and the photosensitive blank 22 adhered to the glass substrate 24 by the adhesive mechanism 46, which will hereinafter be referred to as a "adhesive substrate 24a". One is used to directly detect the first partial cut region 34a and a detection mechanism 47 of the second partial cut region 34b (hereinafter simply referred to as "first partial cut region 34a") which is placed at a boundary of the photosensitive blank 22 and disposed in the pasting mechanism 46 An intermediate substrate blank cutting mechanism 48 for cutting the photosensitive blank 22 between two adjacent substrates 24 is disposed downstream of the bonding mechanism 46. An embryo The cutting mechanism 48a is operated 'as disposed upstream of the intermediate substrate blank cutting mechanism 48 when the manufacturing apparatus 20 begins and ends its operation. -10- 200800528 A bonding substrate 49 for combining the rear end of one photosensitive billet 22 which is actually used and the front end of a new photosensitive billet 22 to be used, which is disposed close to the billet Downstream of the unwinding mechanism 32. The bonded substrate 49 is followed by a film end position detector 51, which is used to control the lateral movement of the photosensitive billet 22 due to the winding irregularity in the photosensitive billet roll 22a. The partial cutting device 36 is disposed downstream of the pair of rollers 50, which calculates the diameter of the photosensitive blank roll 22a wound in the blank take-up mechanism 32. As shown in Figures 4 and 5, the partial cutting device 36 has a moving mechanism 52 movable in the lateral direction (indicated by arrow B) which is perpendicular to the direction in which the photosensitive blank 22 is fed. (indicated by arrow A). The moving mechanism 52 includes a linear motor having a track 54 extending in the direction of arrow B. The first cutting mechanism 56 and the second cutting mechanism 58, both of which are height adjustable, are mounted to the moving mechanism 52. The moving mechanism 52 can include any of a variety of configurations, such as a self-propelled structure that uses a rack and a pinion to replace the linear motor. The first cutting mechanism 56 has a first base 60 and a shaft 62 rotatably supported on the first base 60 by bearings 64 (see Fig. 5). • A rotary cutter, such as a rotary circular cutter (cutter) 66, is fixedly mounted on the distal end of the rotary shaft 62 to rotate integrally with the rotary shaft 62. The rotary circular cutter 66 has a cutting edge 66a which may be a double-sided edge or a single-sided edge. The cutting edge 66a forms a first partial cut region 34a which is a rear end of the protective film 30 of a certain length in the peeling direction thereof. A pressing roller 67 is mounted on the rotating shaft 62. When the photosensitive billet 22 is cut by the portion -11-200800528 by rotating the circular cutter 66, it is used to push and hold the photosensitive billet 22 . The second cutting mechanism 58 has a second base 68 and a fixed shaft 70 supported on the second base 68. The fixed shaft 70 is angularly adjustable relative to the second base 68 by a predetermined angle about its own axis. A non-rotating cutter, such as a fixed circular cutter 72, is fixedly mounted on the distal end of the fixed shaft 70 to rotate integrally with the fixed shaft 70. The fixed circular cutter 72 has a cutting edge 72a which may be a two-sided blade or a single-sided blade. A push roller 7 6 is rotatably supported by a bearing 74 at the end of the fixed shaft 70. The fixed circular cutter 72 forms a second partial cut region 34b which is a front end of the protective film 30 of a certain length in the peeling direction. The second cutting mechanism 58 can use a ratchet mechanism (not shown) to angularly adjust the fixed shaft 70 each time a predetermined angle is rotated each time the fixed circular cutter 72 is formed to form the second partial cut region 34b. The ratchet mechanism may include a ratchet mechanism as disclosed in Japanese Laid-Open Patent Publication No. 1 1 -1 79693. As shown in Fig. 6, all of the blade housing bases 8 are disposed in the face-rotating circular cutter 66 and the fixed circular cutter 72, and the photosensitive blank 22 is inserted between them. The cutter housing base 80 includes a metal plate and extends in the direction indicated by the arrow B. The cutter housing base 8 has a pair of recesses 81a, 81b defined in its upper surface and extending in the direction indicated by the arrow b within the range of movement of the rotary circular cutter 66 and the fixed circular cutter 72. . The resin-made housing portions 8 2 a, 8 2 b are placed in the recesses 8 1 a, 8 1 b, respectively. As shown in Fig. 2, the first partial cut region 34a and the second partial cut region 34b need to be formed at least through the protective film 3''. In fact, the rotating circle -12-200800528 shaped cutter 66 and fixed circular cutter 72 are designed to cut into the photosensitive resin layer 29 and the intermediate layer 28 to reliably cut the protective film 30. The first partial region 34a and the second partial cut region 34b are used to set the spacing between two adjacent glass substrates 24. For example, the first and second partial cut regions 34a, 34b are formed in the protective film 30 at intervals of 10 mm inward from the edges of the glass substrate 24. A section of the protective film 30 interposed between the first and second partial cut regions 34a, 34b of the glass substrate 24, ^ is adhered to the glass substrate 24 in the pasting mechanism 46 as the photosensitive resin layer 29 as a holder When the function is as a mask, it will be explained later. The label attaching mechanism 40 supplies the adhesive label 38 for interconnecting a front peeling zone 30aa and a rear peeling zone 30ab to leave a residual area 30b of the protective film 30 between the glass substrates 24. As shown in Fig. 2, the peeling zone 30aa before being peeled off and the peeling zone 30ab after being peeled off are placed on each side of the residual zone 30b. As shown in Fig. 3, each of the adhesive labels 38 has a rectangular strip shape, φ and is made of the same resin material as the protective film 30. Each adhesive label 38 comprises a centrally located non-adhesive zone (or micro-adhesive zone) 38a that is non-tacky; and a first viscous zone each disposed on a longitudinally opposite end of the non-adhesive zone 38a. 38b and the second viscous zone 38c, in other words, on the longitudinally opposite ends of the viscous label 38. The first viscous zone 38b and the second viscous zone 38c are each adhered to the front peeling zone 30aa and the back peeling zone 30ab. As shown in Fig. 1, the label attaching mechanism 40 has suction pad pads 84a to 84e for attaching up to seven spaced-apart adhesive labels 38, or five spaced-apart adhesive labels as in the first embodiment. A vertically movable support base 86 for holding the photosensitive embryos from below is disposed on the adhesive label 38 to be adhered to the photosensitive billet 22 by the suction pad pads 84a to 84e. A reservoir mechanism 42 for absorbing a speed difference between the intermittent feed mode and the continuous feed mode, wherein the intermittent feed mode causes the photosensitive billet 22 to be fed upstream of the storage mechanism 42; and the continuous feed The mode causes the photosensitive billet 22 to be fed downstream of the storage mechanism 42. The storage mechanism 42 also has a swinging device 9 1 including two swingable rollers 90 for preventing the photosensitive billet 22 from being affected by changes in tension. The oscillating device 9 1 may have one or three or more rollers 90 depending on the length of the photosensitive photosensitive blank 22 to be stored. The peeling mechanism 44 disposed downstream of the storage mechanism 42 includes a suction tube 92 for reducing the change in tension when the photosensitive billet 22 is fed from the peeling mechanism 44, and also for stabilizing the photosensitive billet 22 Tension when stacking. A peeling roller 93 is disposed adjacent to the suction cylinder 92. The protective film 30 peeled off from the photosensitive blank 22 by the peeling roller 93 at a sharp peeling angle is wound by a protective film take-up shaft 94 in addition to the residual region 30b. The tension control mechanism 96 that transmits the tension to the photosensitive blank 22 is disposed downstream of the peeling mechanism 44. The tension control mechanism 96 has an actuatable cylinder 98 for angularly displacing the tension swinger 1 to adjust the tension of the photosensitive billet 22 which is in rolling contact with the tension swinger 100. The tension control mechanism 96 can be used only when needed and can be omitted. The detecting mechanism 47 includes a photo-sensing device 102, such as a laser sensor, a photo sensor, or the like, for directly detecting: due to the wedge-shaped groove in the first partial cutting region 34a, protected by The stages produced by the different thicknesses of the film 30, or combinations thereof, cause variations in the photosensitive billet 22. -14- 200800528 The detection signal from the photodetector 102 is used as a boundary position signal, which represents the boundary position in the protective film 30. The photoinductor 1 〇 2 is configured to face the support roller 1 0 3 . Alternatively, a non-contact displacement gauge or an image inspection mechanism such as a CCD camera or the like may be used instead of the photodetector 102. The position data of the first partial cutting area 34a detected by the detecting mechanism 47 can be statistically processed and converted into graphic data in time. The manufacturing apparatus 20 can generate a warning when the positional data detected by the detecting means 47 indicates an excessive change or deviation. Manufacturing device 20 can use a different system to generate boundary position signals. According to this different system, the first partial cut region 34a is not directly detected' and is marked on the photosensitive blank 22. For example, a hole or a recess may be formed in the photosensitive blank 36 adjacent to the first partial cut region 34a in the partially cut blank 36, or the photosensitive blank 22 may be coated by a laser beam Or a water jet to draw an elongated slot, or it can be marked by an inkjet or a printer. A mark on the photosensitive blank 22 is detected, wherein the detection signal is used as a boundary position signal. The heating mechanism 45 includes a feed mechanism 104 for feeding the glass substrate 24 as a workpiece in the direction of arrow C. The feed mechanism 104 has a plurality of disc-shaped feed rollers 106 formed of synthetic resin which are arranged in the direction of the arrow C. The heating mechanism 45 also includes a housing portion 108 for housing the glass substrate 24, and the heating mechanism 45 is disposed upstream of the feeding mechanism 104 in the direction of the arrow C. The heating mechanism 45 further includes a plurality of heating furnaces 110 disposed downstream of the housing portions -15-200800528108. The heating mechanism 45 monitors the temperature structure 45 of the glass substrate 24 to detect an abnormal temperature at any time, and the heating mechanism 45 stops. 106, or issues a warning, and transmits information indicating the failure, and discharges the abnormal glass substrate 24, and simultaneously Also used in production management. The feeding mechanism 104 may have a gas (not shown) for arranging the substrate storage rack for storing the plurality of glass substrates 24 in the heating mechanism 45 when the glass substrate 24 is fed in the direction of the arrow C. Upstream. The substrate storage holder is placed in a fan unit (or duct unit) 122 that is disposed on three sides excluding its feed and discharge slots. The fan unit 122 discharges the clean air into the substrate storage holder 120. The glass substrate 24 stored on the base 120 is individually attracted by the arms 124a 126 of a robot hand 124 and is taken out from the substrate storage holder 120. The bonding mechanism 46 has a pair of stacked rubber rollers 130a, 130b that are vertically spaced apart and heated. The support roller 132a is in rolling contact with each of the stacked rubber rollers 130a, 130b. The support is pressed against the stacking rubber by a roller clamping unit 134. The contact preventing roller 163 is movably disposed at the 1300 to prevent the photosensitive blank 22 and the rubber roller from being used for preheating the photosensitive The preheating of the raw material 22 to a predetermined temperature is disposed close to the upstream of the bonding mechanism 46. The preheating unit is a heat applying mechanism such as an infrared rod heater or the like. In the heating machine, the feed roller can be used for quality control or moving the lifting plate, ^ raised. The cymbal holders 120, 120 include a suction pad pad on each of the dust-moving neutral dry storage holders and are embedded in a predetermined temperature 132b to be held by the rollers 132b. Near rubber roller 1 3 0 a contact. The I-137, 137, 137 includes a -16-200800528 film feed roller 138a and a substrate feed roller 138b are disposed between the adhesive mechanism 46 and the intermediate substrate blank cutting mechanism 48. A cooling mechanism 140 is disposed downstream of the intermediate substrate blank cutting mechanism 48, and a substrate peeling mechanism 142 is disposed downstream of the cooling mechanism 140. The cooling mechanism 140 supplies cold air to an adhesive substrate 24a after the photosensitive blank 22 is cut by the intermediate substrate blank cutting mechanism 48 between the adhesive substrate 24a and a subsequent adhesive substrate 24a. Specifically, the cooling mechanism 140 supplies cold air having a temperature of 10 ° C at a rate ranging from 1.0 to 2.0 m/min. However, the cooling mechanism 140 can be omitted, and the adhesive substrate 24a can be naturally cooled in the photosensitive stacked storage holder 156. The substrate peeling mechanism 142 disposed downstream of the cooling mechanism 140 has a plurality of chuck pads 144 for attracting a lower surface of the adhesive substrate 24a. When the adhesive substrate 24a is attracted by the suction pad 144 under suction, the base film 26 and the residual region 30b are peeled off from the adhesive substrate 24a by a robot hand 146. An electrically neutral air blower (not shown) that discharges electrically neutral clean air to the four sides of the stacking region of the adhesive substrate 24a is disposed upstream, downstream, and side of the chuck pad 144. The base film 26 and the residual region 30b can be peeled off from the adhered substrate 24a, and the platform on which one of the adhesive substrates 24a is supported is vertically, obliquely oriented, or turned up and down to promote dust removal. Substrate stripping mechanism 1 42 follows downstream of photosensitive stack storage shelf 156 to store a plurality of photosensitive stacks 150. A photosensitive stack 150 is manufactured when the base film 26 and the residual region 30b are peeled off from the adhesive substrate 24a by the substrate peeling mechanism 142, by the arm 152a of a machine -17-200800528 hand 152 The suction pad 154 is attracted and then removed from the substrate peeling mechanism 1 42 and placed into the photosensitive stack storage holder 156. The photosensitive stack storage rack 156 includes respective dust removing fan units (or duct units) 1 22 disposed on three sides excluding its feed chute and discharge chute. The fan unit 1 22 discharges the electrically neutral clean air into the photosensitive stack storage holder 156. In the manufacturing apparatus 20, the billet unwinding mechanism 32, the partial cutting device 36, the label attaching mechanism 40, the storage mechanism 42, the peeling mechanism 44, the tension control mechanism 96, and the detecting mechanism 47 are disposed above the attaching mechanism 46. On the contrary, the blank take-up mechanism 32, the partial cutting device 36, the label sticking mechanism 40, the storage mechanism 42, the peeling mechanism 44, the tension control mechanism 96, and the detecting mechanism 47 can be disposed under the adhesive mechanism 46 to be attached upside down. The photosensitive resin layer 29 is to the lower surface of the glass substrate 24. Alternatively, the parts of the manufacturing apparatus 20 may be arranged in a linear pattern as a whole. Manufacturing device 20 is generally controlled by a stacking program controller 160. Manufacturing apparatus 20 also has a stack controller 162, a substrate heating controller 164 and a substrate stripping controller 166, etc. for controlling the different functional components of manufacturing apparatus 20. These controllers are interconnected by an in-process network. The stacking process controller 160 is connected to a factory network including one of the manufacturing equipment 20, and performs production information processing such as production management according to instruction information (condition setting and production information) provided by a factory CPU (not shown). And institutional operation management. -18- 200800528 Stack controller 1 62 acts as a process master to control the functional components of manufacturing equipment 20. The stack controller 1 62 serves as a control mechanism for controlling the heating mechanism 45 based on, for example, position information detected by the detecting mechanism 47 of the first and second partial cutting regions 34a, 34b of the photosensitive billet 22. The substrate peeling controller 1 66 controls the substrate peeling mechanism 1 42 to peel off the base film 26 from the adhesive substrate 24a supplied from the pasting mechanism 46, and simultaneously discharges the photosensitive stack 150 to a downstream process. The substrate peeling controller 1 66 simultaneously processes information about the adhesive substrate 24a and the photosensitive stack 150. The installation space for the manufacturing apparatus 20 can be partitioned into a first chamberless chamber 172a and a second chamberless chamber 172b by a partition wall 170. The first clean room 172a contains a number of components ranging from the billet take-up mechanism 32 to the tension control mechanism 96. The second clean room 172b contains a detection mechanism 47 and other components that follow the detection mechanism 47. The first chamberless chamber 1 72a and the second clean room 172b are connected to each other via a through region 174. The operation of the manufacturing apparatus 20_ performing the partial cutting method according to an embodiment of the present invention will be described below. As shown in Fig. 1, in the billet take-up mechanism 32, the photosensitive billet 22 is taken up from the photosensitive billet roll 22a and fed to the partial cutting device 3 6 局部 in the partial cutting device In the case of 3-6, as shown in Figs. 4 to 6, the moving mechanism 52 is moved in the direction of the arrow B laterally through the photosensitive billet 22 in synchronization with the photosensitive billet 22, and the photosensitive billet 2 2 is directed to the arrow. The direction indicated by A is fed, so that the photosensitive billet 2 2 is partially cut. When the photosensitive billet 2 2 is kept stationary, the partial cutting device 36 can also partially cut the photosensitive embryo 19-200800528. Specifically, the first cutting mechanism 56 and the second cutting mechanism 58 are mounted on the moving mechanism 52. The rotating circular cutter 66 of the first cutting mechanism 56 and the fixed circular cutter 72 of the second cutting mechanism 58 move in the direction indicated by the arrow B in unison with each other. At this time, the rotary circular cutter 66 is cut into the first partial cut region 34a of the photosensitive billet 22 at a desired depth, and is rotated while moving laterally through the photosensitive billet 2 2 in the direction of the arrow B. Therefore, all the grooves cut from the protective film 3 0 ^ to the desired depth are formed in the first partial cut region 34a of the photosensitive blank 22 (see Fig. 2). The fixed circular cutter 72 is cut into the second partial cut region of the photosensitive billet 22, and is kept non-rotating as it moves laterally through the photosensitive billet 22 in the direction of the arrow B. Therefore, all the grooves from which the protective film 30 is cut to a desired depth are formed on the photosensitive billet 22 at a position spaced apart from the first partial cut region 34a (see FIG. 2) by a predetermined distance. The second partial cut is in the area 34b. Since the first partial cutting area 34a is formed by rotating the circular cutter 66, according to the first embodiment, the rotating circular cutter 66 effectively prevents the film fragments from being generated in the vicinity of the first partial cutting area 34a. At this time, as shown in Fig. 7, the photosensitive resin layer 29 is easily peeled off at the first partial cut region 34a. However, the first partial cut region 34a is a rear end of the protective film 3 某一 of a certain length with respect to the peeling direction thereof. Therefore, when the protective film 30 is peeled off, the photosensitive resin layer 29 is not peeled off unnecessarily. -20- 200800528 The first partial carrier region 34a where the photosensitive resin layer 209 is easily peeled off is located at the front end of the residual region 30b of the protective film 30. Residual area 30b will not be treated as a transfer area and will subsequently be discarded. When the first partial cut region 34a is formed by rotating the circular cutter 66, the film fragments which may be generated are effectively reduced, so that the quality of the photosensitive stack to be produced is not lowered. The second partial cutting area 34b is formed by fixing a circular cutter 72. Therefore, the photosensitive resin layer 29 is prevented from being peeled off at the second partial cut region 34b. The second partial cut region 34b serves as the front end of the protective film 30 of a certain length with respect to the peeling direction. Therefore, when the protective film 30 is peeled off, the photosensitive resin layer 29 is effectively prevented from peeling, and only the protective film 30 is reliably and smoothly peeled off. Therefore, the photosensitive billet 22 is locally cut into a high quality using a simple process and apparatus, and at the same time, when the photosensitive billet 2 2 is partially cut, the generation of film fragments can be prevented. In particular, the film fragments which are easily generated when the photosensitive billet 22 is partially cut are prevented from adhering to the rotary circular cutter 66, so that the rotary circular cutter 66 can be extremely effectively cleaned. An experiment was conducted to compare the partial cutting state produced by a conventional partial cutting device and the partial cutting device of the first embodiment. In this test, the first partial cut area 34a and the second partial cut area 34b are formed by a fixed circular cutter of a conventional partial cutting apparatus; and the first partial cut area 34a and the second The partial cut region 34b is also formed separately using the rotary circular cutter 66 and the fixed circular cutter 72 according to the partial cutting device of the first embodiment. Figure 8 shows the test results. In the conventional partial cutting apparatus, since the first partial cutting area 34a and the second partial cutting area 34b are formed using a fixed circular cutter, a considerable amount of thin mold fragments are produced. Removing the film fragments attached to the fixed circular cutter takes time and effort, and the photosensitive billet 22 is not partially cut into a high quality finished product. However, in the case of the partial cutting device according to the first embodiment, the film fragments generated when the photosensitive billet 22 is partially cut are reduced, and the photosensitive resin layer 29 is effectively prevented from being peeled off in the transfer region. ® Next, the partially cut photosensitive billet 22 is fed to the label attaching mechanism 40 to place an adhesive area of the protective film 30 on the support base 86. In the label attaching mechanism 40, a predetermined number of adhesive labels 38 are attracted and held under suction by the suction pad pads 84a to 84e, and the adhesive label 38 is firmly adhered to the protective film 30 over the residual portion 30b thereof. The front peeling zone 30aa and the back peeling zone 30ab (see Figure 3). For example, the photosensitive billet 0 22 having the five adhesive labels 38 adhered thereto is isolated from the tension of the supplied photosensitive billet 22 by the storage mechanism 42, and then the photosensitive billet 22 is continuously fed to the peeling mechanism 44. In the peeling mechanism 44, the base film 26 of the photosensitive blank 22 is attracted to the suction cylinder 92. The protective film 30 is peeled off from the photosensitive billet 22, leaving a residual area 30b. The protective film 30 is peeled off by the peeling roller 93 at a sharp peeling angle, and is wound around the protective film reel 94. Preferably, an electrically neutral air flows into the region where the protective film 30 is peeled off. At this time, since the photosensitive billet 22 is firmly held by the suction cylinder 92', the punch 22-200800528 generated when the protective film 30 is peeled off from the photosensitive billet 22 is not transported from the suction cylinder 92 to the downstream. Photosensitive blank 22. Inevitably, this impact is not transmitted to the pasting mechanism 46, and thus the stacked region of the glass substrate 24 is effectively prevented from producing a band-shaped crotch region therein. After the protective film 30 is peeled off from the base film 26 by the peeling mechanism 44 to leave the residual region 30b, the photosensitive blank 22 is tensioned by the tension control mechanism 96, and then the partial cutting of the photosensitive blank 22 is performed. The area 34 is detected by the photodetector 1 〇 2 of the detecting mechanism 47. According to the detection information of the partial cutting area 34, the film feeding roller 138a is rotated to feed a predetermined length of the photosensitive billet 22 toward the bonding mechanism 46. At this time, the contact preventing roller 136 is above the photosensitive billet 22. Waiting, the rubber roller 130b is disposed below the photosensitive blank 22. In the heating mechanism 45, the heating temperature in the heating furnace 110 is set to be based on the stacking temperature used in the pasting mechanism 46. The robot hand 124 grabs one of the glass substrates 24 stored in the substrate storage holder 20, and introduces the grasped glass substrate 24 to the accommodating portion 108. In the accommodating portion 108, the glass substrate 24 is continuously fed from the accommodating portion 108 to the heating furnace 110 by the feed roller 106 of the feeding mechanism 104 in an intermittent feed mode. In the heating furnace 110, the glass substrate 24 is accurately stopped at a given stop position at the downstream end of the heating mechanism 45 in the direction of the arrow C. The glass substrate 24 is temporarily positioned between the rubber rollers 130a, 130b aligned with the adhesion area of the photosensitive resin layer 29 of the photosensitive blank 22. Next, the roller holding unit 134 is operated to raise the support roller 132b and the rubber roller 130b, thereby holding the glass substrate 24 between the rubber rollers 130a, 130b at a predetermined pressure. The rubber roller 130a is rotated to -23-
200800528 將熱熔化之光敏性樹脂層29轉移，即堆疊至玻璃基才 上。 光敏性樹脂層29在以l.〇m/min至10.0m/min的 範圍進給之情況下被堆疊至玻璃基材24上。該等橡膠 130a、13 0b的溫度在90 °C至140 °C範圍內；硬度在40 的範圍內，且施加50 N/cm至400 N/cm範圍內的壓力 壓力）。 包括光敏性胚料22黏貼於其上之玻璃基材24之 貼基材24a，朝箭頭C之方向被進給一特定距離，而 基材24a藉由冷卻機構1 40冷卻，且接著被輸送至基 離機構142。在基底剝離機構142，當黏貼基材24a藉 盤墊144而吸引時，基底薄膜26和殘留區30b藉由機 146剝離，因此產生一光敏性堆疊體150。 此時，電中性之乾淨空氣從配置於吸盤墊1 44之 處、下游處和側邊之空氣鼓風機處被排出至黏貼基材 堆疊區域的四側。光敏性堆疊體1 50藉由機器手1 52 152a而被保持且被置放到光敏性堆疊體儲藏支架156 第9圖係顯示本發明第二實施例之一局部裁切設 180之立體圖。局部裁切設備180的零件與第一實施倒 部裁切設備3 6相同者賦予相同的符號，並省略其詳| 明。相同零件賦予相同符號並省略其說明之方式，也 黏貼於隨後即將說明的本發明第三實施例中。 局部裁切設備180包含可朝箭頭B之方向橫向卷 過光敏性胚料22之第一移動機構1 82，且第一裁切機 ί 24 速度 ί滾輪 至90 (線性 已黏 黏貼 底剝 丨由吸 丨器手 上游 24a 之臂 〇 備 J之局 扭說 同樣 ;動通 構56 -24- 200800528 被安裝於第一移動機構182上·。局部裁切設備ι8〇更包含 第二移動機構1 84，其亦可橫向移動通過光敏性胚料22， 且第二裁切機構58被安裝於第二移動機構184上。 依據第二實施例，第一移動機構1 82和第二移動機構 184爲可個別致動，以使第一裁切機構56的旋轉圓形切刀 66和第二裁切機構58的固定圓形切刀72各自形成第一局 部裁切區域34a和第二局部裁切區域34b。因此，在第二局 部裁切區域34b藉由固定圓形切刀72形成之後，光敏性胚 料22可朝箭頭A之方向中進給，且第一局部裁切區域34a 可藉由旋轉圓形切刀66形成。 第1 0圖係顯示依據本發明第三實施例之一局部裁切設 備190之立體圖。第11圖係顯示局部裁切設備190之立體 圖，係顯示相反側。 局部裁切設備190包括一移動機構192,其可橫向移動 通過光敏性胚料22，且一裁切機構194被安裝於移動機構 1 92上。一轉軸1 96旋轉地支撐在裁切機構1 94。一圓形切 刀刃198被固定地安裝於轉軸196的一端上，且一推壓滾 輪202藉由一軸承200而安裝於轉軸196上，以僅在一方 向中旋轉。 如第11圖中所示，一固定機構203被安裝於轉軸196 的另一端上，以固定轉軸196而防止其轉動。固定機構203 包含一同軸地安裝於轉軸196上且可藉由一棘爪206而喔 合之棘輪204,其一端擺動地支撐在裁切機構194之基座的 樞軸208上。棘爪206在操作上被連結至裁切機構194之 -25- 200800528 基座之致動器2 1 0的驅動軸2 1 2。 致動器2 1 0可包括一汽缸、一電磁螺線管，或馬達和 凸輪的結合。固定機構203可包括一電磁制動器、一離合 器等，以取代棘輪204和棘爪206，用以固定轉軸196而防 止其轉動。 當致動器210被操作以縮回驅動軸212時，連結至驅 動軸212之棘爪206繞著樞軸208而朝遠離棘輪204之方 向作角度移動。棘爪206脫離棘輪204，因此允許轉軸196 與裁切機構1 94 一同自由地旋轉。圓形切刀1 98如今作爲 一旋轉圓形切刀。 當移動機構192在朝箭頭B1所指的方向移動時，圓形 切刀1 9 8也朝箭頭B 1所指的方向橫向移動通過光敏性胚料 22，同時於光敏性胚料22中繞其本身之軸心而形成第一局 部裁切區域34a。此時，推壓滾輪202被允許與轉軸196經 由軸承200而一體地旋轉。 在第一局部裁切區域34a形成之後，固定機構203之 致動器2 1 0被操作以伸出驅動軸2 1 2。棘爪、206朝向棘輪 2 04作角度移動直到棘爪206與該棘輪204囌合爲止。因 此’轉軸196被保持爲一不可旋轉狀態，使得裁切機構194 不可旋轉。該形切刀刃198如今作爲爲一固定圓形切刀。 當移動機構192朝箭頭B2所指的方向移動時，圓形切 刀刃198也朝箭頭B2所指的方向橫向移動通過光敏性胚料 22 ’同時被固定以防止其旋轉，而在光敏性胚料22中形成 第二局部裁切區域34b。此時，推壓滾輪2〇2被允許藉由軸 -26- 200800528 承20 0而相對於轉軸1 96旋轉。推壓滾輪202推壓並保持 光敏性胚料22於適當位置，同時在光敏性胚料22上旋轉。 在第三實施例中，裁切機構194之單一圓形切刀198 得以依照該固定機構203如何操作而選擇地作爲可旋轉圓 形切刀或固定圓形切刀的功能。包含單一裁切機構1 9 4之 局部裁切設備1 9 0在尺寸上係相當小，而仍可提供如第一 和第二實施例之局部裁切設備相同之優點。 雖然本發明的特定較佳實施例已詳細地顯示與說明， 但應該了解在不違離如在該所附申請專利範圍內所界定之 本發明的範圍下，可對該等實施例作任何不同的變化及修 改。 【圖式簡單說明】 第1圖係爲一製造設備的一槪要側視圖，其包含本發 明第一實施例的一局部裁切設備； 第2圖係爲使用於第1圖所示之製造設備中之一長條 %敏性胚料的一放大局部橫截面圖； 第3圖係爲具有黏性標籤黏接於其上之長條光敏性胚 料捲的一放大局部俯視圖； 第4圖係爲局部裁切設備的立體圖； 第5圖係爲局部裁切設備的俯視圖； 第6圖係爲局部裁切設備的側視圖； 第7圖係爲具有由局部裁切設備所形成之第一和第二 胃部载切區域之一光敏性胚料的橫截面圖； 第8圖係爲在一試驗時所產生之表，係比較由一習知 -27- 200800528 局部裁切設備和本發明第一實施例之局部裁切設備所產生 之局部裁切狀態； 第9圖係爲本發明第二實施例之局部裁切設備的立體 圖； 第1 0圖係爲依據本發明第三實施例之〜局部裁切設備 的立體圖； 弟11圖係爲顯不於第10圖中局部裁切設備，由其相 反側處所描繪的立體圖； • 第12圖係爲一習知局部裁切設備之〜垂直橫截面圖。 【主要元件符號說明】 2 0 製 造 設備 22 光 敏 性胚料（堆 堆 疊 ) 22a 光 敏 性胚料捲 24 玻 璃 基材 26 基 底 薄膜（支撐 層 ) 27 緩 衝 層（熱塑性 樹 脂 層 ) 29 光 敏 性樹脂層（第 一 樹 脂層） 30 保 護 薄膜（第二 樹 脂 層 ) 32 胚 料 捲出機構 34 局 部 裁切區域 36 ' 180、 190 局 部 裁切設備 40 籤 黏 貼機構 52、 18 2 > 184、 192 移動機構 56 > 58 ^ 194 裁 切 機構 -28- 200800528200800528 The heat-melted photosensitive resin layer 29 is transferred, i.e., stacked on a glass substrate. The photosensitive resin layer 29 is stacked on the glass substrate 24 while being fed in a range of from 1. m/min to 10.0 m/min. The temperatures of the rubbers 130a, 130b are in the range of 90 °C to 140 °C; the hardness is in the range of 40, and a pressure pressure in the range of 50 N/cm to 400 N/cm is applied). The substrate 24a comprising the glass substrate 24 to which the photosensitive blank 22 is adhered is fed a specific distance in the direction of the arrow C, and the substrate 24a is cooled by the cooling mechanism 140 and then transported to Base off mechanism 142. At the substrate peeling mechanism 142, when the adhesive substrate 24a is attracted by the disk pad 144, the base film 26 and the residual region 30b are peeled off by the machine 146, thereby producing a photosensitive stack 150. At this time, the electrically neutral clean air is discharged from the air blowers disposed at the downstream, and side of the suction pad 1 44 to the four sides of the stacking region of the adhesive substrate. The photosensitive stack 150 is held by the robot 1 52 152a and placed on the photosensitive stack storage holder 156. Fig. 9 is a perspective view showing a partial cut setting of a second embodiment of the present invention. The parts of the partial cutting device 180 are the same as those of the first embodiment of the inverted cutting device 36, and the detailed description thereof is omitted. The same components are given the same reference numerals and the description thereof is omitted, and is also attached to the third embodiment of the present invention to be described later. The partial cutting device 180 includes a first moving mechanism 1 82 that can be rolled laterally across the photosensitive blank 22 in the direction of arrow B, and the first cutting machine ί 24 speed ί roller to 90 (linear adhered to the bottom strip) The arm of the suction device 24a is the same as that of the arm assembly. The movable mechanism 56 - 24 - 200800528 is mounted on the first moving mechanism 182. The partial cutting device ι8〇 further includes the second moving mechanism 1 84 It can also be moved laterally through the photosensitive blank 22, and the second cutting mechanism 58 is mounted on the second moving mechanism 184. According to the second embodiment, the first moving mechanism 182 and the second moving mechanism 184 are Individually actuated such that the rotating circular cutter 66 of the first cutting mechanism 56 and the fixed circular cutter 72 of the second cutting mechanism 58 each form a first partial cut region 34a and a second partial cut region 34b Therefore, after the second partial cut region 34b is formed by the fixed circular cutter 72, the photosensitive blank 22 can be fed in the direction of the arrow A, and the first partial cut region 34a can be rotated by the circle Forming cutter 66 is formed. Figure 10 shows a third embodiment in accordance with the present invention. A perspective view of a partial cutting apparatus 190. An eleven-dimensional view showing a partial cutting apparatus 190 showing the opposite side. The partial cutting apparatus 190 includes a moving mechanism 192 that is laterally movable through the photosensitive billet 22 And a cutting mechanism 194 is mounted on the moving mechanism 109. A rotating shaft 196 is rotatably supported by the cutting mechanism 94. A circular cutting edge 198 is fixedly mounted on one end of the rotating shaft 196, and is pushed The pressure roller 202 is mounted on the rotating shaft 196 by a bearing 200 to rotate in only one direction. As shown in Fig. 11, a fixing mechanism 203 is attached to the other end of the rotating shaft 196 to fix the rotating shaft 196. The fixing mechanism 203 includes a ratchet 204 coaxially mounted on the rotating shaft 196 and engageable by a pawl 206, one end of which is swingably supported on a pivot 208 of the base of the cutting mechanism 194. The pawl 206 is operatively coupled to the drive shaft 2 1 2 of the actuator 2 1 0 of the cutting mechanism 194. The actuator 2 1 0 may include a cylinder, an electromagnetic solenoid , or a combination of a motor and a cam. The securing mechanism 203 can include An electromagnetic brake, a clutch, etc., in place of the ratchet 204 and the pawl 206, for fixing the shaft 196 to prevent rotation thereof. When the actuator 210 is operated to retract the drive shaft 212, the pawl 206 coupled to the drive shaft 212 An angular movement about the pivot 208 in a direction away from the ratchet 204. The pawl 206 disengages from the ratchet 204, thereby allowing the spindle 196 to freely rotate with the cutting mechanism 1 94. The circular cutter 1 98 is now a rotating circle Cut the knife. When the moving mechanism 192 is moved in the direction indicated by the arrow B1, the circular cutter 198 is also moved laterally through the photosensitive blank 22 in the direction indicated by the arrow B1 while being wound around the photosensitive blank 22 The first partial cutting area 34a is formed by the axis of itself. At this time, the pressing roller 202 is allowed to rotate integrally with the rotating shaft 196 via the bearing 200. After the first partial cut region 34a is formed, the actuator 2 10 of the fixing mechanism 203 is operated to extend the drive shaft 2 1 2 . The pawl 206 moves angularly toward the ratchet 2 04 until the pawl 206 is brought into engagement with the ratchet 204. Therefore, the rotating shaft 196 is maintained in a non-rotatable state, so that the cutting mechanism 194 is not rotatable. The cutting edge 198 is now used as a fixed circular cutter. When the moving mechanism 192 moves in the direction indicated by the arrow B2, the circular cutting edge 198 also moves laterally in the direction indicated by the arrow B2 through the photosensitive blank 22' while being fixed to prevent its rotation, while in the photosensitive billet A second partial cut region 34b is formed in 22. At this time, the pushing roller 2〇2 is allowed to rotate relative to the rotating shaft 1 96 by the shaft -26-200800528. The push roller 202 pushes and holds the photosensitive billet 22 in place while rotating on the photosensitive billet 22. In the third embodiment, the single circular cutter 198 of the cutting mechanism 194 is selectively functioning as a rotatable circular cutter or a fixed circular cutter in accordance with how the fixing mechanism 203 operates. The partial cutting device 190 comprising a single cutting mechanism 194 is relatively small in size while still providing the same advantages as the partial cutting devices of the first and second embodiments. Although the preferred embodiment of the invention has been shown and described in detail, it is to be understood that the embodiments may be varied without departing from the scope of the invention as defined by the appended claims. Changes and modifications. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a manufacturing apparatus including a partial cutting apparatus according to a first embodiment of the present invention; and FIG. 2 is a manufacturing apparatus used in FIG. An enlarged partial cross-sectional view of one of the strips of the % sensitive billet in the apparatus; Fig. 3 is an enlarged partial top view of the strip of photosensitive photosensitive web to which the adhesive label is adhered; It is a perspective view of a partial cutting device; Figure 5 is a top view of the partial cutting device; Figure 6 is a side view of the partial cutting device; Figure 7 is a first form formed by the partial cutting device And a cross-sectional view of a photosensitive blank of one of the second stomach-loaded regions; Figure 8 is a table produced during a test, compared with a conventional cutting device of the conventional -27-200800528 and the present invention The partial cutting state produced by the partial cutting device of the first embodiment; FIG. 9 is a perspective view of the partial cutting device of the second embodiment of the present invention; FIG. 10 is a third embodiment of the present invention ~ Stereo view of the partial cutting device; Brother 11 is not shown in Figure 10 Medium partial cutting device, a perspective view depicted by the opposite side; • Figure 12 is a vertical cross-sectional view of a conventional partial cutting device. [Main component symbol description] 2 0 Manufacturing equipment 22 Photosensitive billet (stack stack) 22a Photosensitive billet roll 24 Glass substrate 26 Base film (support layer) 27 Buffer layer (thermoplastic resin layer) 29 Photosensitive resin layer ( First resin layer 30 protective film (second resin layer) 32 blank unwinding mechanism 34 partial cutting area 36 '180, 190 partial cutting device 40 labeling mechanism 52, 18 2 > 184, 192 moving mechanism 56 > 58 ^ 194 Cutting Mechanism-28 - 200800528
62 > 196 轉 軸 66、 72 旋 轉 圓 形 切 刀 66a ' 72a 裁 切 刃 67 ' 76 、 202 推 壓 滾 輪 70 固 定 軸 104 進 給 機 構 130 a 、130b 橡 膠 滾 輪 160 堆 疊 程 序 控 制器 198 圓 形 切 刀 203 固 定 機 構 204 棘 輪 206 棘 爪 210 致 動 器62 > 196 Rotary shaft 66, 72 Rotary circular cutter 66a ' 72a Cutting edge 67 ' 76 , 202 Push roller 70 Fixed shaft 104 Feed mechanism 130 a , 130b Rubber roller 160 Stacking program controller 198 Circular cutter 203 fixing mechanism 204 ratchet 206 pawl 210 actuator