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TW200736374A - Polishing composition and polishing method - Google Patents

Polishing composition and polishing method

Info

Publication number
TW200736374A
TW200736374A TW096104156A TW96104156A TW200736374A TW 200736374 A TW200736374 A TW 200736374A TW 096104156 A TW096104156 A TW 096104156A TW 96104156 A TW96104156 A TW 96104156A TW 200736374 A TW200736374 A TW 200736374A
Authority
TW
Taiwan
Prior art keywords
polishing
polishing composition
fatty acid
acid ester
polyoxyethylene sorbitan
Prior art date
Application number
TW096104156A
Other languages
English (en)
Inventor
Shuhei Yamada
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of TW200736374A publication Critical patent/TW200736374A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • EFIXED CONSTRUCTIONS
    • E06DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06BFIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B9/00Screening or protective devices for wall or similar openings, with or without operating or securing mechanisms; Closures of similar construction
    • E06B9/24Screens or other constructions affording protection against light, especially against sunshine; Similar screens for privacy or appearance; Slat blinds
    • E06B9/40Roller blinds
    • E06B9/42Parts or details of roller blinds, e.g. suspension devices, blind boxes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/04Aqueous dispersions
    • EFIXED CONSTRUCTIONS
    • E06DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06BFIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B9/00Screening or protective devices for wall or similar openings, with or without operating or securing mechanisms; Closures of similar construction
    • E06B9/56Operating, guiding or securing devices or arrangements for roll-type closures; Spring drums; Tape drums; Counterweighting arrangements therefor
    • E06B9/58Guiding devices
    • EFIXED CONSTRUCTIONS
    • E06DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06BFIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B9/00Screening or protective devices for wall or similar openings, with or without operating or securing mechanisms; Closures of similar construction
    • E06B9/56Operating, guiding or securing devices or arrangements for roll-type closures; Spring drums; Tape drums; Counterweighting arrangements therefor
    • E06B9/80Safety measures against dropping or unauthorised opening; Braking or immobilising devices; Devices for limiting unrolling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW096104156A 2006-02-07 2007-02-05 Polishing composition and polishing method TW200736374A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006030108A JP2007214205A (ja) 2006-02-07 2006-02-07 研磨用組成物

Publications (1)

Publication Number Publication Date
TW200736374A true TW200736374A (en) 2007-10-01

Family

ID=37891295

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104156A TW200736374A (en) 2006-02-07 2007-02-05 Polishing composition and polishing method

Country Status (7)

Country Link
US (1) US7998229B2 (zh)
JP (1) JP2007214205A (zh)
KR (1) KR20070080568A (zh)
CN (1) CN101235253A (zh)
DE (1) DE102007005919A1 (zh)
GB (1) GB2434799A (zh)
TW (1) TW200736374A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI783105B (zh) * 2017-12-27 2022-11-11 日商霓塔杜邦股份有限公司 研磨用組合物

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DE102008044646B4 (de) 2008-08-27 2011-06-22 Siltronic AG, 81737 Verfahren zur Herstellung einer Halbleiterscheibe
US8815038B2 (en) * 2008-10-01 2014-08-26 The Boeing Company Joining curved composite sandwich panels
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CN102101976A (zh) * 2009-12-18 2011-06-22 安集微电子(上海)有限公司 一种化学机械抛光液
JP5492603B2 (ja) * 2010-03-02 2014-05-14 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
US8273142B2 (en) * 2010-09-02 2012-09-25 Cabot Microelectronics Corporation Silicon polishing compositions with high rate and low defectivity
SG188597A1 (en) * 2010-09-24 2013-04-30 Fujimi Inc Composition for polishing and composition for rinsing
JP5687939B2 (ja) * 2011-03-31 2015-03-25 Hoya株式会社 マスクブランクス用ガラス基板の製造方法、マスクブランクスの製造方法、転写マスクの製造方法、及び半導体装置の製造方法
US9640407B2 (en) * 2011-06-14 2017-05-02 Fujimi Incorporated Polishing composition
SG11201405381WA (en) * 2012-03-14 2014-10-30 Fujimi Inc Abrasive composition and method for producing semiconductor substrate
SG11201506001VA (en) * 2013-02-13 2015-09-29 Fujimi Inc Polishing composition, method for producing polishing composition and method for producing polished article
JP6389629B2 (ja) * 2014-03-31 2018-09-12 ニッタ・ハース株式会社 研磨用組成物
JP6389630B2 (ja) * 2014-03-31 2018-09-12 ニッタ・ハース株式会社 研磨用組成物
CN105080921A (zh) * 2014-05-22 2015-11-25 宇瀚光电科技(苏州)有限公司 一种盖板玻璃清洗工艺
JP6265542B2 (ja) * 2014-05-30 2018-01-24 花王株式会社 半導体基板の製造方法
CN104313588B (zh) * 2014-09-22 2016-08-31 东莞市德硕化工有限公司 用于抛光不锈钢制品的抛光液及其制备方法
CN104742031B (zh) * 2015-04-07 2017-11-17 蓝思科技(长沙)有限公司 一种调节研磨垫磨削切削力的组合物、方法及模具
JP6524799B2 (ja) * 2015-05-27 2019-06-05 日立化成株式会社 サファイア用研磨液、貯蔵液及び研磨方法
JP7221479B2 (ja) * 2018-08-31 2023-02-14 日化精工株式会社 ダイシング加工用製剤及び加工処理液
CN116804133A (zh) * 2023-07-04 2023-09-26 万华化学集团电子材料有限公司 一种高亲水性抛光组合物及其制备方法和应用

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JP2005209800A (ja) * 2004-01-21 2005-08-04 Fujitsu Ltd 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI783105B (zh) * 2017-12-27 2022-11-11 日商霓塔杜邦股份有限公司 研磨用組合物

Also Published As

Publication number Publication date
JP2007214205A (ja) 2007-08-23
US20070181851A1 (en) 2007-08-09
KR20070080568A (ko) 2007-08-10
GB0702153D0 (en) 2007-03-14
DE102007005919A1 (de) 2007-09-13
US7998229B2 (en) 2011-08-16
GB2434799A (en) 2007-08-08
CN101235253A (zh) 2008-08-06

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