TW200736374A - Polishing composition and polishing method - Google Patents
Polishing composition and polishing methodInfo
- Publication number
- TW200736374A TW200736374A TW096104156A TW96104156A TW200736374A TW 200736374 A TW200736374 A TW 200736374A TW 096104156 A TW096104156 A TW 096104156A TW 96104156 A TW96104156 A TW 96104156A TW 200736374 A TW200736374 A TW 200736374A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- polishing composition
- fatty acid
- acid ester
- polyoxyethylene sorbitan
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title 1
- 229920001214 Polysorbate 60 Polymers 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000194 fatty acid Substances 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000001913 cellulose Substances 0.000 abstract 1
- 229920002678 cellulose Polymers 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B9/00—Screening or protective devices for wall or similar openings, with or without operating or securing mechanisms; Closures of similar construction
- E06B9/24—Screens or other constructions affording protection against light, especially against sunshine; Similar screens for privacy or appearance; Slat blinds
- E06B9/40—Roller blinds
- E06B9/42—Parts or details of roller blinds, e.g. suspension devices, blind boxes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B9/00—Screening or protective devices for wall or similar openings, with or without operating or securing mechanisms; Closures of similar construction
- E06B9/56—Operating, guiding or securing devices or arrangements for roll-type closures; Spring drums; Tape drums; Counterweighting arrangements therefor
- E06B9/58—Guiding devices
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B9/00—Screening or protective devices for wall or similar openings, with or without operating or securing mechanisms; Closures of similar construction
- E06B9/56—Operating, guiding or securing devices or arrangements for roll-type closures; Spring drums; Tape drums; Counterweighting arrangements therefor
- E06B9/80—Safety measures against dropping or unauthorised opening; Braking or immobilising devices; Devices for limiting unrolling
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006030108A JP2007214205A (ja) | 2006-02-07 | 2006-02-07 | 研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200736374A true TW200736374A (en) | 2007-10-01 |
Family
ID=37891295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096104156A TW200736374A (en) | 2006-02-07 | 2007-02-05 | Polishing composition and polishing method |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7998229B2 (zh) |
| JP (1) | JP2007214205A (zh) |
| KR (1) | KR20070080568A (zh) |
| CN (1) | CN101235253A (zh) |
| DE (1) | DE102007005919A1 (zh) |
| GB (1) | GB2434799A (zh) |
| TW (1) | TW200736374A (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI783105B (zh) * | 2017-12-27 | 2022-11-11 | 日商霓塔杜邦股份有限公司 | 研磨用組合物 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8017524B2 (en) * | 2008-05-23 | 2011-09-13 | Cabot Microelectronics Corporation | Stable, high rate silicon slurry |
| DE102008044646B4 (de) | 2008-08-27 | 2011-06-22 | Siltronic AG, 81737 | Verfahren zur Herstellung einer Halbleiterscheibe |
| US8815038B2 (en) * | 2008-10-01 | 2014-08-26 | The Boeing Company | Joining curved composite sandwich panels |
| JP2011171689A (ja) | 2009-07-07 | 2011-09-01 | Kao Corp | シリコンウエハ用研磨液組成物 |
| CN102101976A (zh) * | 2009-12-18 | 2011-06-22 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
| JP5492603B2 (ja) * | 2010-03-02 | 2014-05-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| US8273142B2 (en) * | 2010-09-02 | 2012-09-25 | Cabot Microelectronics Corporation | Silicon polishing compositions with high rate and low defectivity |
| SG188597A1 (en) * | 2010-09-24 | 2013-04-30 | Fujimi Inc | Composition for polishing and composition for rinsing |
| JP5687939B2 (ja) * | 2011-03-31 | 2015-03-25 | Hoya株式会社 | マスクブランクス用ガラス基板の製造方法、マスクブランクスの製造方法、転写マスクの製造方法、及び半導体装置の製造方法 |
| US9640407B2 (en) * | 2011-06-14 | 2017-05-02 | Fujimi Incorporated | Polishing composition |
| SG11201405381WA (en) * | 2012-03-14 | 2014-10-30 | Fujimi Inc | Abrasive composition and method for producing semiconductor substrate |
| SG11201506001VA (en) * | 2013-02-13 | 2015-09-29 | Fujimi Inc | Polishing composition, method for producing polishing composition and method for producing polished article |
| JP6389629B2 (ja) * | 2014-03-31 | 2018-09-12 | ニッタ・ハース株式会社 | 研磨用組成物 |
| JP6389630B2 (ja) * | 2014-03-31 | 2018-09-12 | ニッタ・ハース株式会社 | 研磨用組成物 |
| CN105080921A (zh) * | 2014-05-22 | 2015-11-25 | 宇瀚光电科技(苏州)有限公司 | 一种盖板玻璃清洗工艺 |
| JP6265542B2 (ja) * | 2014-05-30 | 2018-01-24 | 花王株式会社 | 半導体基板の製造方法 |
| CN104313588B (zh) * | 2014-09-22 | 2016-08-31 | 东莞市德硕化工有限公司 | 用于抛光不锈钢制品的抛光液及其制备方法 |
| CN104742031B (zh) * | 2015-04-07 | 2017-11-17 | 蓝思科技(长沙)有限公司 | 一种调节研磨垫磨削切削力的组合物、方法及模具 |
| JP6524799B2 (ja) * | 2015-05-27 | 2019-06-05 | 日立化成株式会社 | サファイア用研磨液、貯蔵液及び研磨方法 |
| JP7221479B2 (ja) * | 2018-08-31 | 2023-02-14 | 日化精工株式会社 | ダイシング加工用製剤及び加工処理液 |
| CN116804133A (zh) * | 2023-07-04 | 2023-09-26 | 万华化学集团电子材料有限公司 | 一种高亲水性抛光组合物及其制备方法和应用 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3715842A (en) | 1970-07-02 | 1973-02-13 | Tizon Chem Corp | Silica polishing compositions having a reduced tendency to scratch silicon and germanium surfaces |
| US4169337A (en) | 1978-03-30 | 1979-10-02 | Nalco Chemical Company | Process for polishing semi-conductor materials |
| US4462188A (en) | 1982-06-21 | 1984-07-31 | Nalco Chemical Company | Silica sol compositions for polishing silicon wafers |
| US4588421A (en) | 1984-10-15 | 1986-05-13 | Nalco Chemical Company | Aqueous silica compositions for polishing silicon wafers |
| US5352277A (en) | 1988-12-12 | 1994-10-04 | E. I. Du Pont De Nemours & Company | Final polishing composition |
| US5230833A (en) | 1989-06-09 | 1993-07-27 | Nalco Chemical Company | Low sodium, low metals silica polishing slurries |
| JPH04291722A (ja) | 1991-03-20 | 1992-10-15 | Asahi Denka Kogyo Kk | シリコンウェハー表面のヘイズ防止方法 |
| US5300130A (en) * | 1993-07-26 | 1994-04-05 | Saint Gobain/Norton Industrial Ceramics Corp. | Polishing material |
| MY133700A (en) * | 1996-05-15 | 2007-11-30 | Kobe Steel Ltd | Polishing fluid composition and polishing method |
| US5916819A (en) | 1996-07-17 | 1999-06-29 | Micron Technology, Inc. | Planarization fluid composition chelating agents and planarization method using same |
| US6099604A (en) | 1997-08-21 | 2000-08-08 | Micron Technology, Inc. | Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto |
| AU2080999A (en) | 1997-12-23 | 1999-07-12 | Akzo Nobel N.V. | A composition for chemical mechanical polishing |
| JP3810588B2 (ja) | 1998-06-22 | 2006-08-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US6759050B1 (en) * | 1998-12-03 | 2004-07-06 | Avigen, Inc. | Excipients for use in adeno-associated virus pharmaceutical formulations, and pharmaceutical formulations made therewith |
| JP2000351956A (ja) * | 1999-06-10 | 2000-12-19 | Seimi Chem Co Ltd | 増粘剤を添加した半導体用研磨剤 |
| US6454820B2 (en) | 2000-02-03 | 2002-09-24 | Kao Corporation | Polishing composition |
| JP3440419B2 (ja) | 2001-02-02 | 2003-08-25 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
| JP4003116B2 (ja) | 2001-11-28 | 2007-11-07 | 株式会社フジミインコーポレーテッド | 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 |
| JP2003297780A (ja) * | 2002-04-03 | 2003-10-17 | Komatsu Electronic Metals Co Ltd | 鏡面半導体ウェーハの製造方法、半導体ウェーハ用研磨スラリの製造方法および半導体ウェーハ用研磨スラリ |
| JP4113380B2 (ja) * | 2002-06-21 | 2008-07-09 | 石原薬品株式会社 | 自動車塗装面のバフ研磨用研磨組成物 |
| JP4593064B2 (ja) | 2002-09-30 | 2010-12-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP4212861B2 (ja) * | 2002-09-30 | 2009-01-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いたシリコンウエハの研磨方法、並びにリンス用組成物及びそれを用いたシリコンウエハのリンス方法 |
| JP2004128069A (ja) | 2002-09-30 | 2004-04-22 | Fujimi Inc | 研磨用組成物及びそれを用いた研磨方法 |
| WO2004037943A1 (en) * | 2002-10-25 | 2004-05-06 | Showa Denko K.K. | Polishing slurry and polished substrate |
| WO2004042812A1 (ja) | 2002-11-08 | 2004-05-21 | Fujimi Incorporated | 研磨用組成物及びリンス用組成物 |
| JP4068499B2 (ja) * | 2003-05-09 | 2008-03-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP4215246B2 (ja) * | 2003-06-05 | 2009-01-28 | 石原薬品株式会社 | 研磨組成物 |
| JP4668528B2 (ja) | 2003-09-05 | 2011-04-13 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US20050090104A1 (en) * | 2003-10-27 | 2005-04-28 | Kai Yang | Slurry compositions for chemical mechanical polishing of copper and barrier films |
| JP2005209800A (ja) * | 2004-01-21 | 2005-08-04 | Fujitsu Ltd | 半導体装置の製造方法 |
-
2006
- 2006-02-07 JP JP2006030108A patent/JP2007214205A/ja active Pending
-
2007
- 2007-02-02 US US11/701,640 patent/US7998229B2/en not_active Expired - Fee Related
- 2007-02-02 CN CNA2007100018772A patent/CN101235253A/zh active Pending
- 2007-02-05 GB GB0702153A patent/GB2434799A/en not_active Withdrawn
- 2007-02-05 TW TW096104156A patent/TW200736374A/zh unknown
- 2007-02-06 DE DE102007005919A patent/DE102007005919A1/de not_active Withdrawn
- 2007-02-06 KR KR1020070011893A patent/KR20070080568A/ko not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI783105B (zh) * | 2017-12-27 | 2022-11-11 | 日商霓塔杜邦股份有限公司 | 研磨用組合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007214205A (ja) | 2007-08-23 |
| US20070181851A1 (en) | 2007-08-09 |
| KR20070080568A (ko) | 2007-08-10 |
| GB0702153D0 (en) | 2007-03-14 |
| DE102007005919A1 (de) | 2007-09-13 |
| US7998229B2 (en) | 2011-08-16 |
| GB2434799A (en) | 2007-08-08 |
| CN101235253A (zh) | 2008-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200736374A (en) | Polishing composition and polishing method | |
| WO2005051358A8 (en) | Composition and method for enhancing bioavailability | |
| TW200628159A (en) | IL-12 modulatory compounds | |
| TW200700545A (en) | Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion | |
| WO2007098352A3 (en) | Substituted pyridineamide compounds useful as soluble epoxide hydrolase inhibitors | |
| ZA200903305B (en) | Concentrated Surfactant Compositions | |
| AU2016204344A1 (en) | Improved methods and compositions for wound healing | |
| WO2007118118A3 (en) | I-iii-vi semiconductor nanocrystals, i-iii-vi water stable semiconductor nanocrystals, and methods of making same | |
| WO2008039472A3 (en) | Stabilizing compositions for antibiotics and methods of use | |
| WO2006020994A3 (en) | Compositions and methods using hyaluronic acid and hyluronidase inhibitors | |
| SG154438A1 (en) | Cleaning compound and method and system for using the cleaning compound | |
| TW200643156A (en) | Aqueous dispersant for chemical polishing, chemical polishing method, and kit used in preparation of aqueous dispersant for chemical polishing | |
| WO2008155979A1 (ja) | 防カビ性を有する石膏ボード | |
| AU2009319796A8 (en) | Substituted octahydrocyclopnta (c) pyrrol-4 -amines as calcium channel blockers | |
| WO2010138544A3 (en) | Oral care formulations that enhance amount of soluble zinc | |
| GB0320020D0 (en) | Improved formulation for providing an enteric coating material | |
| WO2007092343A3 (en) | Novel epoprostenol formulation and method of making thereof | |
| TW200726824A (en) | Cleaning compound and method and system for using the cleaning compound | |
| WO2006072612A3 (en) | Triazolophthalazines as pde2- inhibitors | |
| WO2006121719A3 (en) | Soluble epoxide hydrolase inhibitors and methods of using same | |
| TW200613308A (en) | Cyclobutanetetracarboxylate compound and preparation method thereof | |
| DK1711246T3 (da) | Oxygenabsorberende sammensætninger og fremgangsmåde | |
| WO2007081878A8 (en) | Indoleamine 2,3-dioxygenase pathways in the generation of regulatory t cells | |
| GEP20105031B (en) | Stable emulsion composition | |
| WO2007069909A3 (en) | Method to produce hyperpolarised carboxylates of organic amines |