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AU2080999A - A composition for chemical mechanical polishing - Google Patents

A composition for chemical mechanical polishing

Info

Publication number
AU2080999A
AU2080999A AU20809/99A AU2080999A AU2080999A AU 2080999 A AU2080999 A AU 2080999A AU 20809/99 A AU20809/99 A AU 20809/99A AU 2080999 A AU2080999 A AU 2080999A AU 2080999 A AU2080999 A AU 2080999A
Authority
AU
Australia
Prior art keywords
composition
mechanical polishing
chemical mechanical
polishing
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU20809/99A
Inventor
Kenneth Olof Larsson
Bozena Tokarz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akzo Nobel NV
Original Assignee
Akzo Nobel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel NV filed Critical Akzo Nobel NV
Publication of AU2080999A publication Critical patent/AU2080999A/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • H10P52/402

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU20809/99A 1997-12-23 1998-12-18 A composition for chemical mechanical polishing Abandoned AU2080999A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7129197P 1997-12-23 1997-12-23
US60071291 1997-12-23
US991998A 1998-01-21 1998-01-21
US09009919 1998-01-21
PCT/SE1998/002370 WO1999032570A1 (en) 1997-12-23 1998-12-18 A composition for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
AU2080999A true AU2080999A (en) 1999-07-12

Family

ID=26680020

Family Applications (1)

Application Number Title Priority Date Filing Date
AU20809/99A Abandoned AU2080999A (en) 1997-12-23 1998-12-18 A composition for chemical mechanical polishing

Country Status (2)

Country Link
AU (1) AU2080999A (en)
WO (1) WO1999032570A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3440419B2 (en) * 2001-02-02 2003-08-25 株式会社フジミインコーポレーテッド Polishing composition and polishing method using the same
EP1456313A1 (en) * 2001-12-20 2004-09-15 AKZO Nobel N.V. Cerium oxide coated silica particles and method for production thereof
DE10247201A1 (en) * 2002-10-10 2003-12-18 Wacker Siltronic Halbleitermat Production of boron-doped silicon wafer, used as substrate for electronic element, e.g. processor or memory element, includes polishing with aqueous alkaline polish containing silica and alkali metal or ammonium polyaminocarboxylate
JP4912592B2 (en) 2002-11-08 2012-04-11 株式会社フジミインコーポレーテッド Polishing composition and method of using the same
JP2006005246A (en) 2004-06-18 2006-01-05 Fujimi Inc Rinsing composition and rinsing method using the same
JP2007214205A (en) 2006-02-07 2007-08-23 Fujimi Inc Polishing composition
JP5204960B2 (en) 2006-08-24 2013-06-05 株式会社フジミインコーポレーテッド Polishing composition and polishing method
JP5474400B2 (en) 2008-07-03 2014-04-16 株式会社フジミインコーポレーテッド Semiconductor wetting agent, polishing composition and polishing method using the same
CN102441819B (en) * 2011-10-20 2014-03-19 天津理工大学 Chemical and mechanical polishing method for sulfur phase-change material
CN102952467A (en) * 2012-11-09 2013-03-06 中国电子科技集团公司第四十六研究所 Polishing solution and method for polishing cadmium sulfide (CdS) wafer by applying same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715842A (en) * 1970-07-02 1973-02-13 Tizon Chem Corp Silica polishing compositions having a reduced tendency to scratch silicon and germanium surfaces
US4462188A (en) * 1982-06-21 1984-07-31 Nalco Chemical Company Silica sol compositions for polishing silicon wafers
JPS63272460A (en) * 1987-04-28 1988-11-09 Mitsubishi Monsanto Chem Co Abrasive composition for wafers
US4954142A (en) * 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
JP2726488B2 (en) * 1989-04-10 1998-03-11 株式会社東芝 Method for manufacturing semiconductor device
EP0520109B1 (en) * 1991-05-28 1995-03-29 Rodel, Inc. Low sodium, low metals silica polishing slurries
US5376222A (en) * 1991-09-04 1994-12-27 Fujitsu Limited Polishing method for polycrystalline silicon
US5885899A (en) * 1995-11-14 1999-03-23 International Business Machines Corporation Method of chemically mechanically polishing an electronic component using a non-selective ammonium hydroxide slurry

Also Published As

Publication number Publication date
WO1999032570A1 (en) 1999-07-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase