AU2080999A - A composition for chemical mechanical polishing - Google Patents
A composition for chemical mechanical polishingInfo
- Publication number
- AU2080999A AU2080999A AU20809/99A AU2080999A AU2080999A AU 2080999 A AU2080999 A AU 2080999A AU 20809/99 A AU20809/99 A AU 20809/99A AU 2080999 A AU2080999 A AU 2080999A AU 2080999 A AU2080999 A AU 2080999A
- Authority
- AU
- Australia
- Prior art keywords
- composition
- mechanical polishing
- chemical mechanical
- polishing
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H10P52/402—
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7129197P | 1997-12-23 | 1997-12-23 | |
| US60071291 | 1997-12-23 | ||
| US991998A | 1998-01-21 | 1998-01-21 | |
| US09009919 | 1998-01-21 | ||
| PCT/SE1998/002370 WO1999032570A1 (en) | 1997-12-23 | 1998-12-18 | A composition for chemical mechanical polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2080999A true AU2080999A (en) | 1999-07-12 |
Family
ID=26680020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU20809/99A Abandoned AU2080999A (en) | 1997-12-23 | 1998-12-18 | A composition for chemical mechanical polishing |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2080999A (en) |
| WO (1) | WO1999032570A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3440419B2 (en) * | 2001-02-02 | 2003-08-25 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method using the same |
| EP1456313A1 (en) * | 2001-12-20 | 2004-09-15 | AKZO Nobel N.V. | Cerium oxide coated silica particles and method for production thereof |
| DE10247201A1 (en) * | 2002-10-10 | 2003-12-18 | Wacker Siltronic Halbleitermat | Production of boron-doped silicon wafer, used as substrate for electronic element, e.g. processor or memory element, includes polishing with aqueous alkaline polish containing silica and alkali metal or ammonium polyaminocarboxylate |
| JP4912592B2 (en) | 2002-11-08 | 2012-04-11 | 株式会社フジミインコーポレーテッド | Polishing composition and method of using the same |
| JP2006005246A (en) | 2004-06-18 | 2006-01-05 | Fujimi Inc | Rinsing composition and rinsing method using the same |
| JP2007214205A (en) | 2006-02-07 | 2007-08-23 | Fujimi Inc | Polishing composition |
| JP5204960B2 (en) | 2006-08-24 | 2013-06-05 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
| JP5474400B2 (en) | 2008-07-03 | 2014-04-16 | 株式会社フジミインコーポレーテッド | Semiconductor wetting agent, polishing composition and polishing method using the same |
| CN102441819B (en) * | 2011-10-20 | 2014-03-19 | 天津理工大学 | Chemical and mechanical polishing method for sulfur phase-change material |
| CN102952467A (en) * | 2012-11-09 | 2013-03-06 | 中国电子科技集团公司第四十六研究所 | Polishing solution and method for polishing cadmium sulfide (CdS) wafer by applying same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3715842A (en) * | 1970-07-02 | 1973-02-13 | Tizon Chem Corp | Silica polishing compositions having a reduced tendency to scratch silicon and germanium surfaces |
| US4462188A (en) * | 1982-06-21 | 1984-07-31 | Nalco Chemical Company | Silica sol compositions for polishing silicon wafers |
| JPS63272460A (en) * | 1987-04-28 | 1988-11-09 | Mitsubishi Monsanto Chem Co | Abrasive composition for wafers |
| US4954142A (en) * | 1989-03-07 | 1990-09-04 | International Business Machines Corporation | Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
| JP2726488B2 (en) * | 1989-04-10 | 1998-03-11 | 株式会社東芝 | Method for manufacturing semiconductor device |
| EP0520109B1 (en) * | 1991-05-28 | 1995-03-29 | Rodel, Inc. | Low sodium, low metals silica polishing slurries |
| US5376222A (en) * | 1991-09-04 | 1994-12-27 | Fujitsu Limited | Polishing method for polycrystalline silicon |
| US5885899A (en) * | 1995-11-14 | 1999-03-23 | International Business Machines Corporation | Method of chemically mechanically polishing an electronic component using a non-selective ammonium hydroxide slurry |
-
1998
- 1998-12-18 AU AU20809/99A patent/AU2080999A/en not_active Abandoned
- 1998-12-18 WO PCT/SE1998/002370 patent/WO1999032570A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO1999032570A1 (en) | 1999-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |