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TW200703516A - Active element and switch circuit device - Google Patents

Active element and switch circuit device

Info

Publication number
TW200703516A
TW200703516A TW095110505A TW95110505A TW200703516A TW 200703516 A TW200703516 A TW 200703516A TW 095110505 A TW095110505 A TW 095110505A TW 95110505 A TW95110505 A TW 95110505A TW 200703516 A TW200703516 A TW 200703516A
Authority
TW
Taiwan
Prior art keywords
unit
hbt
fet
active element
base
Prior art date
Application number
TW095110505A
Other languages
English (en)
Other versions
TWI297181B (en
Inventor
Tetsuro Asano
Original Assignee
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005092875A external-priority patent/JP2006278544A/ja
Priority claimed from JP2005092869A external-priority patent/JP2006279316A/ja
Priority claimed from JP2005092874A external-priority patent/JP2006278543A/ja
Priority claimed from JP2006011310A external-priority patent/JP2007194412A/ja
Application filed by Sanyo Electric Co filed Critical Sanyo Electric Co
Publication of TW200703516A publication Critical patent/TW200703516A/zh
Application granted granted Critical
Publication of TWI297181B publication Critical patent/TWI297181B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/30Devices controlled by electric currents or voltages
    • H10D48/32Devices controlled by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H10D48/34Bipolar devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/80Heterojunction BJTs
    • H10D10/821Vertical heterojunction BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/80Heterojunction BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/80FETs having rectifying junction gate electrodes
    • H10D30/87FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/05Manufacture or treatment characterised by using material-based technologies using Group III-V technology
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00

Landscapes

  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
TW095110505A 2005-03-28 2006-03-27 Active element and switch circuit device TWI297181B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005092875A JP2006278544A (ja) 2005-03-28 2005-03-28 能動素子およびその製造方法
JP2005092869A JP2006279316A (ja) 2005-03-28 2005-03-28 スイッチ回路装置
JP2005092874A JP2006278543A (ja) 2005-03-28 2005-03-28 スイッチ回路装置
JP2006011310A JP2007194412A (ja) 2006-01-19 2006-01-19 能動素子およびスイッチ回路装置

Publications (2)

Publication Number Publication Date
TW200703516A true TW200703516A (en) 2007-01-16
TWI297181B TWI297181B (en) 2008-05-21

Family

ID=37393296

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110505A TWI297181B (en) 2005-03-28 2006-03-27 Active element and switch circuit device

Country Status (3)

Country Link
US (1) US7514727B2 (zh)
KR (1) KR100677816B1 (zh)
TW (1) TWI297181B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI751415B (zh) * 2018-08-24 2022-01-01 日商村田製作所股份有限公司 異質接合雙極性電晶體及半導體裝置
TWI794203B (zh) * 2017-02-07 2023-03-01 日商索尼半導體解決方案公司 半導體裝置及半導體裝置之製造方法

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TW200642268A (en) * 2005-04-28 2006-12-01 Sanyo Electric Co Compound semiconductor switching circuit device
JP4810904B2 (ja) 2005-07-20 2011-11-09 ソニー株式会社 高周波スイッチ回路を有する高周波装置
EP2040299A1 (en) * 2007-09-12 2009-03-25 Forschungsverbund Berlin e.V. Electrical devices having improved transfer characteristics and method for tailoring the transfer characteristics of such an electrical device
GB2453115A (en) * 2007-09-25 2009-04-01 Filtronic Compound Semiconduct HBT and FET BiFET hetrostructure and substrate with etch stop layers
US20100213513A1 (en) * 2009-02-26 2010-08-26 Skyworks Solutions, Inc. Hyperabrupt Diode Structure And Method For Making Same
KR101657327B1 (ko) * 2009-04-07 2016-09-13 스미또모 가가꾸 가부시키가이샤 반도체 기판, 반도체 기판의 제조 방법 및 전자 디바이스
JP2010278521A (ja) * 2009-05-26 2010-12-09 Mitsubishi Electric Corp 電力増幅器
KR101649004B1 (ko) * 2009-05-26 2016-08-17 스미또모 가가꾸 가부시키가이샤 반도체 기판, 반도체 기판의 제조 방법 및 전자 디바이스
JP5613474B2 (ja) * 2010-06-24 2014-10-22 ルネサスエレクトロニクス株式会社 半導体装置
US20120112243A1 (en) * 2010-11-04 2012-05-10 Zampardi Peter J Bipolar and FET Device Structure
US9105488B2 (en) 2010-11-04 2015-08-11 Skyworks Solutions, Inc. Devices and methodologies related to structures having HBT and FET
JP5879694B2 (ja) * 2011-02-23 2016-03-08 ソニー株式会社 電界効果トランジスタ、半導体スイッチ回路、および通信機器
US9679869B2 (en) 2011-09-02 2017-06-13 Skyworks Solutions, Inc. Transmission line for high performance radio frequency applications
CN103597742A (zh) 2012-06-14 2014-02-19 西凯渥资讯处理科技公司 包含相关系统、装置及方法的功率放大器模块
US9419567B2 (en) 2012-06-14 2016-08-16 Skyworks Solutions, Inc. Process-compensated HBT power amplifier bias circuits and methods
US9406668B2 (en) * 2013-03-27 2016-08-02 Panasonic Intellectual Property Management Co., Ltd. Power semiconductor element
US9799731B2 (en) 2013-06-24 2017-10-24 Ideal Power, Inc. Multi-level inverters using sequenced drive of double-base bidirectional bipolar transistors
EP2901483B1 (en) 2013-06-24 2016-09-07 Ideal Power Inc. Systems, circuits, devices, and methods with bidirectional bipolar transistors
US9742385B2 (en) 2013-06-24 2017-08-22 Ideal Power, Inc. Bidirectional semiconductor switch with passive turnoff
US11637016B2 (en) 2013-12-11 2023-04-25 Ideal Power Inc. Systems and methods for bidirectional device fabrication
US9355853B2 (en) 2013-12-11 2016-05-31 Ideal Power Inc. Systems and methods for bidirectional device fabrication
US9660551B2 (en) 2014-11-06 2017-05-23 Ideal Power, Inc. Operating point optimization with double-base-contact bidirectional bipolar junction transistor circuits, methods, and systems
JP6071009B2 (ja) 2014-11-27 2017-02-01 株式会社村田製作所 化合物半導体装置
US10868155B2 (en) 2014-11-27 2020-12-15 Murata Manufacturing Co., Ltd. Compound semiconductor device
US11508834B2 (en) 2014-11-27 2022-11-22 Murata Manufacturing Co., Ltd. Compound semiconductor device
US9960157B2 (en) * 2015-10-15 2018-05-01 Infineon Technologies Austria Ag Bidirectional normally-off III-V high electron mobility transistor (HEMT)devices and circuits
WO2017138778A1 (ko) * 2016-02-12 2017-08-17 엘지이노텍(주) 반도체 소자
US10978583B2 (en) * 2017-06-21 2021-04-13 Cree, Inc. Semiconductor devices having a plurality of unit cell transistors that have smoothed turn-on behavior and improved linearity
US10580748B2 (en) * 2017-12-06 2020-03-03 Murata Manufacturing Co., Ltd. Semiconductor apparatus
JP2020184580A (ja) * 2019-05-08 2020-11-12 株式会社村田製作所 半導体装置
JP2021132100A (ja) * 2020-02-19 2021-09-09 株式会社村田製作所 高周波電力増幅素子

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US4396932A (en) * 1978-06-16 1983-08-02 Motorola, Inc. Method for making a light-activated line-operable zero-crossing switch including two lateral transistors, the emitter of one lying between the emitter and collector of the other
US5012318A (en) * 1988-09-05 1991-04-30 Nec Corporation Hybrid semiconductor device implemented by combination of heterojunction bipolar transistor and field effect transistor
JP3323544B2 (ja) * 1992-08-21 2002-09-09 株式会社日立製作所 半導体装置
US5250826A (en) * 1992-09-23 1993-10-05 Rockwell International Corporation Planar HBT-FET Device
JP3322377B2 (ja) 1995-01-31 2002-09-09 ソニー株式会社 信号切換え装置
US6043519A (en) * 1996-09-12 2000-03-28 Hughes Electronics Corporation Junction high electron mobility transistor-heterojunction bipolar transistor (JHEMT-HBT) monolithic microwave integrated circuit (MMIC) and single growth method of fabrication
JP2000058663A (ja) 1998-08-11 2000-02-25 Mitsubishi Electric Corp 集積型バイアス回路素子
JP2000260782A (ja) 1999-03-09 2000-09-22 Sanyo Electric Co Ltd 高周波集積回路
US6919590B2 (en) * 2003-08-29 2005-07-19 Motorola, Inc. Heterojunction bipolar transistor with monolithically integrated junction field effect transistor and method of manufacturing same
JP2005229197A (ja) * 2004-02-10 2005-08-25 Matsushita Electric Ind Co Ltd 電力増幅器モジュール

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI794203B (zh) * 2017-02-07 2023-03-01 日商索尼半導體解決方案公司 半導體裝置及半導體裝置之製造方法
US12414308B2 (en) 2017-02-07 2025-09-09 Sony Semiconductor Solutions Corporation Semiconductor device and method of manufacturing semiconductor device
TWI751415B (zh) * 2018-08-24 2022-01-01 日商村田製作所股份有限公司 異質接合雙極性電晶體及半導體裝置

Also Published As

Publication number Publication date
US20060249752A1 (en) 2006-11-09
KR100677816B1 (ko) 2007-02-02
US7514727B2 (en) 2009-04-07
TWI297181B (en) 2008-05-21
KR20060103843A (ko) 2006-10-04

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