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TW200624817A - Sheet-form probe, probe card, and wafer inspection method - Google Patents

Sheet-form probe, probe card, and wafer inspection method

Info

Publication number
TW200624817A
TW200624817A TW094139465A TW94139465A TW200624817A TW 200624817 A TW200624817 A TW 200624817A TW 094139465 A TW094139465 A TW 094139465A TW 94139465 A TW94139465 A TW 94139465A TW 200624817 A TW200624817 A TW 200624817A
Authority
TW
Taiwan
Prior art keywords
insulation layer
electrode unit
surface electrode
sheet
thermal expansion
Prior art date
Application number
TW094139465A
Other languages
Chinese (zh)
Inventor
Mutsuhiko Yoshioka
Hitoshi Fujiyama
Hisao Igarashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200624817A publication Critical patent/TW200624817A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A sheet-form probe comprising an insulation layer and a contact film provided with a plurality of electrode structures disposed in the surface direction of the insulation layer so as to be separated from each other and extending through the insulation layer in the thickness direction thereof, wherein each of the electrode structures consists of a front surface electrode unit exposed to the surface of the insulation layer and then projecting beyond the surface of the insulation layer, a rear surface electrode unit exposed to the rear surface of the insulation layer, and a short-circuit unit extending from the base end of the front surface electrode unit continuously through the insulation layer in the thickness direction thereof and joined to the rear surface electrode unit, with a shoulder unit provided so that the upper end portion of the short-circuit unit is different in diameter from the base end of the front surface electrode unit, the contact film is supported on the peripheral edge of a through hole in a metal frame sheet formed with the through holes, and a ring-form support member is provided on the outer peripheral edge of the metal frame sheet away from the insulation layer, the following conditions (1)-(3) being satisfied when thermal expansion coefficient of the insulation layer is H1, thermal expansion coefficient of the metal frame sheet H2, thermal expansion coefficient of the ring-form support member H3. Condition (1): H1=0.8x10<SP>-5</SP> through 8x10<SP>-5</SP>/K Condition (2): H2/H1 < 1 Condition (3): H3/H1 < 1.
TW094139465A 2004-11-11 2005-11-10 Sheet-form probe, probe card, and wafer inspection method TW200624817A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004327944 2004-11-11
JP2004329882 2004-11-12

Publications (1)

Publication Number Publication Date
TW200624817A true TW200624817A (en) 2006-07-16

Family

ID=36336556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139465A TW200624817A (en) 2004-11-11 2005-11-10 Sheet-form probe, probe card, and wafer inspection method

Country Status (2)

Country Link
TW (1) TW200624817A (en)
WO (1) WO2006051880A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8598902B2 (en) 2008-06-02 2013-12-03 Advantest Corporation Probe, electronic device test apparatus, and method of producing the same
TWI468695B (en) * 2008-02-26 2015-01-11 Denki Kagaku Kogyo Kk Probe inspection method and curable resin composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019027932A (en) * 2017-07-31 2019-02-21 日東電工株式会社 Substrate for inspection and substrate for inspection with conduction protection

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152019A (en) * 1991-11-28 1993-06-18 Nitto Denko Corp Anisotropic conductive connector
JP3658029B2 (en) * 1994-02-21 2005-06-08 株式会社ルネサステクノロジ Connection apparatus and manufacturing method thereof
JP3565086B2 (en) * 1999-04-16 2004-09-15 富士通株式会社 Probe card and method for testing semiconductor device
JP4640738B2 (en) * 2000-09-04 2011-03-02 Ｈｏｙａ株式会社 Contact component for wafer batch contact board and manufacturing method thereof
JP2004172588A (en) * 2002-10-28 2004-06-17 Jsr Corp Sheet-like connector, method of manufacturing the same, and probe device
JP3781048B2 (en) * 2003-05-13 2006-05-31 Ｊｓｒ株式会社 Sheet probe and its application

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468695B (en) * 2008-02-26 2015-01-11 Denki Kagaku Kogyo Kk Probe inspection method and curable resin composition
US8598902B2 (en) 2008-06-02 2013-12-03 Advantest Corporation Probe, electronic device test apparatus, and method of producing the same
TWI418797B (en) * 2008-06-02 2013-12-11 阿德潘鐵斯特股份有限公司 A probe, an electronic component testing device, and a method of manufacturing the probe

Also Published As

Publication number Publication date
WO2006051880A1 (en) 2006-05-18

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