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TW200624817A - Sheet-form probe, probe card, and wafer inspection method - Google Patents

Sheet-form probe, probe card, and wafer inspection method

Info

Publication number
TW200624817A
TW200624817A TW094139465A TW94139465A TW200624817A TW 200624817 A TW200624817 A TW 200624817A TW 094139465 A TW094139465 A TW 094139465A TW 94139465 A TW94139465 A TW 94139465A TW 200624817 A TW200624817 A TW 200624817A
Authority
TW
Taiwan
Prior art keywords
insulation layer
electrode unit
surface electrode
sheet
thermal expansion
Prior art date
Application number
TW094139465A
Other languages
English (en)
Inventor
Mutsuhiko Yoshioka
Hitoshi Fujiyama
Hisao Igarashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200624817A publication Critical patent/TW200624817A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
TW094139465A 2004-11-11 2005-11-10 Sheet-form probe, probe card, and wafer inspection method TW200624817A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004327944 2004-11-11
JP2004329882 2004-11-12

Publications (1)

Publication Number Publication Date
TW200624817A true TW200624817A (en) 2006-07-16

Family

ID=36336556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139465A TW200624817A (en) 2004-11-11 2005-11-10 Sheet-form probe, probe card, and wafer inspection method

Country Status (2)

Country Link
TW (1) TW200624817A (zh)
WO (1) WO2006051880A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8598902B2 (en) 2008-06-02 2013-12-03 Advantest Corporation Probe, electronic device test apparatus, and method of producing the same
TWI468695B (zh) * 2008-02-26 2015-01-11 Denki Kagaku Kogyo Kk 探針之檢查方法及硬化性樹脂組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019027932A (ja) * 2017-07-31 2019-02-21 日東電工株式会社 検査用基板および導電保護部付検査用基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152019A (ja) * 1991-11-28 1993-06-18 Nitto Denko Corp 異方導電コネクター
JP3658029B2 (ja) * 1994-02-21 2005-06-08 株式会社ルネサステクノロジ 接続装置およびその製造方法
JP3565086B2 (ja) * 1999-04-16 2004-09-15 富士通株式会社 プローブカード及び半導体装置の試験方法
JP4640738B2 (ja) * 2000-09-04 2011-03-02 Ｈｏｙａ株式会社 ウエハ一括コンタクトボード用コンタクト部品及びその製造方法
JP2004172588A (ja) * 2002-10-28 2004-06-17 Jsr Corp シート状コネクターおよびその製造方法並びにプローブ装置
JP3781048B2 (ja) * 2003-05-13 2006-05-31 Ｊｓｒ株式会社 シート状プローブおよびその応用

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468695B (zh) * 2008-02-26 2015-01-11 Denki Kagaku Kogyo Kk 探針之檢查方法及硬化性樹脂組成物
US8598902B2 (en) 2008-06-02 2013-12-03 Advantest Corporation Probe, electronic device test apparatus, and method of producing the same
TWI418797B (zh) * 2008-06-02 2013-12-11 阿德潘鐵斯特股份有限公司 A probe, an electronic component testing device, and a method of manufacturing the probe

Also Published As

Publication number Publication date
WO2006051880A1 (ja) 2006-05-18

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