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TW200603300A - Chip structure - Google Patents

Chip structure

Info

Publication number
TW200603300A
TW200603300A TW093124492A TW93124492A TW200603300A TW 200603300 A TW200603300 A TW 200603300A TW 093124492 A TW093124492 A TW 093124492A TW 93124492 A TW93124492 A TW 93124492A TW 200603300 A TW200603300 A TW 200603300A
Authority
TW
Taiwan
Prior art keywords
thin film
layer
layers
bump
dielectric layers
Prior art date
Application number
TW093124492A
Other languages
English (en)
Other versions
TWI236722B (en
Inventor
Mou-Shiung Lin
Chiu-Ming Chou
Original Assignee
Megic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Megic Corp filed Critical Megic Corp
Priority to US11/178,753 priority Critical patent/US8022544B2/en
Priority to US11/178,541 priority patent/US7465654B2/en
Application granted granted Critical
Publication of TWI236722B publication Critical patent/TWI236722B/zh
Priority to US11/202,730 priority patent/US7452803B2/en
Publication of TW200603300A publication Critical patent/TW200603300A/zh
Priority to US12/025,002 priority patent/US7462558B2/en
Priority to US12/202,342 priority patent/US7964973B2/en
Priority to US12/262,195 priority patent/US8581404B2/en
Priority to US13/098,379 priority patent/US8159074B2/en
Priority to US13/207,346 priority patent/US8519552B2/en

Links

Classifications

    • H10W72/012—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
TW093124492A 2004-07-09 2004-08-12 Chip structure TWI236722B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US11/178,753 US8022544B2 (en) 2004-07-09 2005-07-11 Chip structure
US11/178,541 US7465654B2 (en) 2004-07-09 2005-07-11 Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures
US11/202,730 US7452803B2 (en) 2004-08-12 2005-08-12 Method for fabricating chip structure
US12/025,002 US7462558B2 (en) 2004-08-12 2008-02-02 Method for fabricating a circuit component
US12/202,342 US7964973B2 (en) 2004-08-12 2008-09-01 Chip structure
US12/262,195 US8581404B2 (en) 2004-07-09 2008-10-31 Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures
US13/098,379 US8159074B2 (en) 2004-08-12 2011-04-29 Chip structure
US13/207,346 US8519552B2 (en) 2004-07-09 2011-08-10 Chip structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58684004P 2004-07-09 2004-07-09
US58859504P 2004-07-16 2004-07-16

Publications (2)

Publication Number Publication Date
TWI236722B TWI236722B (en) 2005-07-21
TW200603300A true TW200603300A (en) 2006-01-16

Family

ID=36678597

Family Applications (2)

Application Number Title Priority Date Filing Date
TW093124492A TWI236722B (en) 2004-07-09 2004-08-12 Chip structure
TW093138329A TWI284385B (en) 2004-07-09 2004-12-10 Chip structure and method for fabricating the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW093138329A TWI284385B (en) 2004-07-09 2004-12-10 Chip structure and method for fabricating the same

Country Status (1)

Country Link
TW (2) TWI236722B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119627018A (zh) * 2024-02-02 2025-03-14 芯爱科技(南京)有限公司 电子封装件及其制法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8148822B2 (en) 2005-07-29 2012-04-03 Megica Corporation Bonding pad on IC substrate and method for making the same
US8399989B2 (en) 2005-07-29 2013-03-19 Megica Corporation Metal pad or metal bump over pad exposed by passivation layer
US7990037B2 (en) 2005-11-28 2011-08-02 Megica Corporation Carbon nanotube circuit component structure
US8022552B2 (en) 2006-06-27 2011-09-20 Megica Corporation Integrated circuit and method for fabricating the same
TWI471958B (zh) * 2006-09-06 2015-02-01 高通公司 晶片封裝結構及其製程
US8193636B2 (en) 2007-03-13 2012-06-05 Megica Corporation Chip assembly with interconnection by metal bump

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119627018A (zh) * 2024-02-02 2025-03-14 芯爱科技(南京)有限公司 电子封装件及其制法

Also Published As

Publication number Publication date
TW200603339A (en) 2006-01-16
TWI284385B (en) 2007-07-21
TWI236722B (en) 2005-07-21

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent