DE60320299D1 - Integrierte Schaltung mit mindestens einem Kontakthöcker - Google Patents

Integrierte Schaltung mit mindestens einem Kontakthöcker

Info

Publication number: DE60320299D1
Authority: DE; Germany
Prior art keywords: contact pad; integrated circuit; mum; signal; processing circuit
Prior art date: 2002-11-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60320299T

Other languages

English (en)

Other versions

DE60320299T2 (de

Inventor

Heimo Scheucher

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NXP BV

Original Assignee

NXP BV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-11-08

Filing date

2003-10-31

Publication date

2008-05-21

2003-10-31 Application filed by NXP BV filed Critical NXP BV

2008-05-21 Publication of DE60320299D1 publication Critical patent/DE60320299D1/de

2009-05-20 Application granted granted Critical

2009-05-20 Publication of DE60320299T2 publication Critical patent/DE60320299T2/de

2023-11-01 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H10W72/20—
- H10W72/251—
- H10W72/923—
- H10W72/9415—

Landscapes

Semiconductor Integrated Circuits (AREA)
Wire Bonding (AREA)

DE60320299T 2002-11-08 2003-10-31 Integrierte Schaltung mit mindestens einem Kontakthöcker Expired - Lifetime DE60320299T2 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
EP02102552		2002-11-08
EP02102552		2002-11-08
PCT/IB2003/004877 WO2004042818A1 (en)	2002-11-08	2003-10-31	Integrated circuit with at least one bump

Publications (2)

Publication Number	Publication Date
DE60320299D1 true DE60320299D1 (de)	2008-05-21
DE60320299T2 DE60320299T2 (de)	2009-05-20

Family

ID=32309455

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60320299T Expired - Lifetime DE60320299T2 (de)	2002-11-08	2003-10-31	Integrierte Schaltung mit mindestens einem Kontakthöcker

Country Status (8)

Country	Link
US (1)	US7247943B2 (de)
EP (1)	EP1563537B1 (de)
JP (1)	JP2006505933A (de)
CN (1)	CN100382293C (de)
AT (1)	ATE392012T1 (de)
AU (1)	AU2003274530A1 (de)
DE (1)	DE60320299T2 (de)
WO (1)	WO2004042818A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10337569B4 (de) *	2003-08-14	2008-12-11	Infineon Technologies Ag	Integrierte Anschlussanordnung und Herstellungsverfahren
US20080123335A1 (en) *	2006-11-08	2008-05-29	Jong Kun Yoo	Printed circuit board assembly and display having the same
WO2009007929A2 (en)	2007-07-12	2009-01-15	Nxp B.V.	Integrated circuits on a wafer and methods for manufacturing integrated circuits
US8581423B2 (en) *	2008-11-17	2013-11-12	Taiwan Semiconductor Manufacturing Company, Ltd.	Double solid metal pad with reduced area
US8277651B2 (en) *	2009-03-13	2012-10-02	Terrasep, Llc	Methods and apparatus for centrifugal liquid chromatography
JP5558336B2 (ja)	2010-12-27	2014-07-23	株式会社東芝	半導体装置
US20130320522A1 (en) *	2012-05-30	2013-12-05	Taiwan Semiconductor Manufacturing Company, Ltd.	Re-distribution Layer Via Structure and Method of Making Same
JP6111907B2 (ja) *	2013-07-05	2017-04-12	三菱電機株式会社	半導体装置の製造方法
CN105514085B (zh) *	2014-10-14	2018-05-04	中芯国际集成电路制造(上海)有限公司	晶圆、切割晶圆的方法及芯片
CN115132687B (zh) *	2022-09-02	2022-11-22	甬矽电子(宁波)股份有限公司	封装堆叠结构和封装堆叠方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5719448A (en) *	1989-03-07	1998-02-17	Seiko Epson Corporation	Bonding pad structures for semiconductor integrated circuits
US5281855A (en) *	1991-06-05	1994-01-25	Trovan Limited	Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die
EP0637840A1 (de) *	1993-08-05	1995-02-08	AT&T Corp.	Integrierte Schaltung mit aktiven Elementen unter den Anschlussflächen
JP3432284B2 (ja) *	1994-07-04	2003-08-04	三菱電機株式会社	半導体装置
US5821855A (en)	1997-02-28	1998-10-13	Lewis; Tommy J.	Recognition responsive security system
KR100267105B1 (ko)	1997-12-09	2000-11-01	윤종용	다층패드를구비한반도체소자및그제조방법
TW430935B (en) *	1999-03-19	2001-04-21	Ind Tech Res Inst	Frame type bonding pad structure having a low parasitic capacitance

2003
- 2003-10-31 AU AU2003274530A patent/AU2003274530A1/en not_active Abandoned
- 2003-10-31 EP EP03758504A patent/EP1563537B1/de not_active Expired - Lifetime
- 2003-10-31 CN CNB2003801028818A patent/CN100382293C/zh not_active Expired - Fee Related
- 2003-10-31 WO PCT/IB2003/004877 patent/WO2004042818A1/en not_active Ceased
- 2003-10-31 JP JP2004549466A patent/JP2006505933A/ja active Pending
- 2003-10-31 AT AT03758504T patent/ATE392012T1/de not_active IP Right Cessation
- 2003-10-31 DE DE60320299T patent/DE60320299T2/de not_active Expired - Lifetime
- 2003-10-31 US US10/534,330 patent/US7247943B2/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US7247943B2 (en)	2007-07-24
JP2006505933A (ja)	2006-02-16
EP1563537A1 (de)	2005-08-17
AU2003274530A1 (en)	2004-06-07
WO2004042818A1 (en)	2004-05-21
US20060071240A1 (en)	2006-04-06
EP1563537B1 (de)	2008-04-09
CN1711638A (zh)	2005-12-21
ATE392012T1 (de)	2008-04-15
DE60320299T2 (de)	2009-05-20
CN100382293C (zh)	2008-04-16

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Legal Events

Date	Code	Title	Description
2009-04-30	8364	No opposition during term of opposition