TW200307586A - Scribing method and scribing device - Google Patents

Abstract

In order to inhibit an invisible crack from becoming an overall cut and further expand the output range of a laser beam capable of creating an invisible crack with a suitable depth, the surface of a glass substrate 50 is continuously irradiated by a laser beam at a temperature lower than the softening point of the glass substrate 50 to form a laser dot LS. The interior of the laser dot LS is formed with a cooling point CP. This is used to form a invisible crack along a pre-specified scribing line of the glass substrate 50. The invented method uses a cooling point CP for enforced cooling in the laser dot LS region to prevent the phenomena of overall cutting, while enlarging the movement speed and the suitable output range of the laser beam, as well as stably forming an invisible crack with a suitable depth.

Description

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Bismuth T family licking amaranth abi miscellaneous 蚪 蚪 killing and sister S Yingtao fQT-body miscellaneous E & e tj miscellaneous thick-lacquer || & _ tower 0 are invited ^ reverse listener Kosen trend β) life Research ^ Wei: & 铕 w- 鲥 IANPAN 襻 襻 -ϋWA 35 'invites_ Jun Ling Jun 洚 tj won; Xuan Hui 6 will oblique 10 钎 3027768 Li ^ 镟 钋 ~ ^ Lecture.如 狨 么 鸡 蚪; * -Wuhan 9 neighbors-ramming Miao _ 浒 50-Zhong LING 羞 踯 塔 # 陴 鲥 HS61 卜 踯 大 决 >.洚 Scale Tower Bowl £ 61 Han Tower ~ Scale Tower ^ >-# > Break 蝌 »Holding the net as Qian Miao ^ 浒 50 ^ 崁 定 >-# 二 a 牦 琴 漭 淼; & Ping 50 ^^ ir ^^ fa-rLSS-s: ^^^ 0. Such as Miao Miao ^ 铕 50, Sun Bu 踯 tower ^ > 涸 tower 11 family? # 捽-# t ^^ tj 手 S ^ A 二 Ϊ 令 曹 嘁 鬼 6 2 " tf #; 令 考 兴 鸰 恶 鸰 考 200307586 Media. On the surface of the glass substrate 50 irradiated with the laser beam, a compressive stress is generated by the heating of the laser beam, and then a cooling medium is sprayed to generate a tensile stress. In this way, since tensile stress is formed in the adjacent region of the I-shrinking stress generating region, a stress gradient is generated due to individual stress between the two regions. In the glass substrate 50, the glass substrate 50 is formed in advance from the end of the glass substrate 50. The cut is formed along a predetermined line to form a continuous crack BC. Because the crack is so small that it is generally invisible to the naked eye, it is called a blind crack team. [Summary of the Invention] To divide a brittle material substrate such as a glass substrate, as described above, a scribing process for forming a scribing line on the glass substrate, and a slicing process for slicing along the scribing line formed by the scribing process: . The scribe line formed by the scribe process must be formed to an appropriate depth so that the scribe line can be advanced along the sliver process: the sliver is correctly split. On the other hand, if the scribe line is drawn too deep, the blind cracks that make up the secant line will penetrate below the glass substrate to form an overall cut (fuu b_㈣), and the broken glass substrate has been divided into a state before the split process. The falling and falling of the glass substrate may cause obstacles such as the stop of the glass dividing line. Therefore, it is very important to form a scribe line of appropriate depth on the glass soil of the dividing object. However, it is important to use it according to different applications. In the manufacture of glass plates of various thicknesses, as described above, the heating area of the laser beam is adjusted by the speed of the conveyor belt: as the speed is adjusted to a low speed of 100_ / S or less: It is not easy to reach below the glass plate, so it is very possible to make the blind crack become a whole cut. The output of the 200307586 beam is changed. As the heating area of the glass plate will also vary, the output of the beam will change. / Woodiness changes. In a thin glass plate, the output of the laser beam changes due to the laser beam output that can form a blind crack of an appropriate depth: the method of forming a blind crack The difference in the output of the laser beam is small, and the laser beam output of ^ Tianmudu blind 4 marks can be formed to make the blind crack into a whole cut ::: The difference in the output of the field beam is small, so it is necessary to form a blind crack of appropriate depth. So: The scope of the laser beam output of Imaji Temple is narrow. Even if the laser beam output changes in the same scribe line, there may be areas where blind cracks are not formed, and blind cracks become areas that are cut overall. The purpose of this book is to provide a scribing method and a scribing device, which can avoid 'eyespots and inflammations as a whole' ^ can expand the laser beam output range to obtain blind cracks of appropriate depth. Second, to solve the above problems, The scribing method of the present invention is characterized in that the surface of the material substrate is 'heated at a temperature lower than the softening point of the brittle material substrate' and a cooling area is formed inside the heating area. Blind cracks are formed. Milk shot 2: The moon line method is preferably, the heating area is formed by a laser beam. Above: In the scribing method of the present invention, the root is preferably used to: Measure the temperature distribution of the brittle material substrate (m μ ^ ^ ^ ^ ^ ^). Measure the temperature distribution of the substrate: substrate surface, and move the nozzle of the cold section to an appropriate position. Λ π 1 The scribing device of the present invention is characterized in that it includes a heating mechanism that continuously heats the surface of the brittle material substrate 30307586 at a temperature lower than the softening point of the base material substrate, and cools the surface of the brittle material substrate. Cooling: The structure is moved with the cooling mechanism, and the cooling mechanism is moved to the inside of the heating area: outside, so as to be a predetermined distance from the portion formed by the heating mechanism. μ L »Q No. [Embodiment] Hereinafter, the scribing method and scribing device of the present invention will be described in detail. , 1 is a schematic diagram showing a secant line used for implementing the scribing method of the present invention. This scribing device is, for example, a glass substrate used for cutting, as shown in Figure 丨, Sun and Gu +, and the substrate λα port 1 does not have a predetermined horizontal direction (Υ direction, vertical paper surface) on the horizontal stand 11. ° 12. J is the sliding table 12 which is the main movement of the door h, which is arranged parallel to the gantry in the γ direction: the rail "on 15" is supported to be able to hold the middle of the 14 rails 14 15 in a horizontal state, The ball screw 13 which is parallel to each of the guide rails 14 and 15 can be rotated by a motor (not shown). ”Reversible, the ball screw 13 has a screw man 荽 # i cap 16. Ball。埤 μ „, dry the upper screw. Ball screw — I #,“ 糸 /, in a state that cannot be rotated and the slide table 12 is set to: square :; the ball screw 13 is positive, reverse, and along The ball screw 13 slides in two directions. With this, the two integral parts with the ball nut 16 13 12 are used to slide the sliding body of the body along the guides U and 15 in the direction of Υ, and the base 19 is arranged on the base 12 It is in a horizontal state. The pedestal Η is placed on the pedestal 12-it is slidably supported on the ㈣ 9 11 200307586

. Each of the guide rails 21 is arranged along the X direction which is orthogonal to the sliding direction of the Wanyi moon moving platform 12 in the γ direction and the Jin Fing A. In addition, the ball screws 22 of each guide line between the guide rails 21, the ball screws 22 can be turned forward and backward. The ball screw 22 is screwed with a ball nut 24. Ball nut M series :: French turn: In the state, the pedestal 19 is set to-miscellaneous, and the ball screw 22 is rotated along the ball screw 22 in both directions by the ball screw M rotation, and the pedestal 19 slides along the guide rails 21 in the χ direction. . The rotation mechanism 25 is set on the rotation mechanism 25, and the rotation table 25 on which the broken glass substrate 50 (cutting object) is placed is arranged horizontally. The rotation mechanism 25 is used to make the rotation table 26 The rotary table 26 can be rotated around the center of the staggered direction in an arbitrary rotation with the reference position. On the rotary table 26, for example, the broken glass substrate 50 is fixed. Bay 31. ： Above Π6 ′, the support table is arranged at an appropriate interval. The cutaneous branch = two optical holdings in the prolapsed state ... the end = 4. The upper end portion of the optical holder 33 is mounted on the mounting opening 11 provided on the rack opening 11. The mounting base 32 is provided with a vibration gain 34 for vibrating against the field. The beam of the laser vibrator 34 is irradiated to the optical system held in the optical holder 33. The lower beam irradiated to the optical holder and 33 is borrowed from the optical holder by the remaining 50 ° in the optical holder 33. The optical system of the temple, the laser beam is an oblong laser that extends in a predetermined direction. The filament pattern was irradiated on the surface substrate 50. 12 200307586 A cutter wheel & for forming a cut on the surface of the glass substrate 50 is provided on the support table 3 mounted on the lower end portion of the optical holder 33. The function of the cutter wheel holder is to form a crack (notch) at the end of the glass substrate 50 along the longitudinal direction of the irradiated laser beam, and this notch is the starting point of the blind crack. In addition, it is held so that it can be raised and lowered by the cutter wheel holder 36. A cooling nozzle moving mechanism 37a is provided on the support table 31 so as to be close to the optical holder 33. A cooling nozzle 37 is placed on the cooling nozzle moving machines 7 & The cooling nozzle 37 can inject cooling media such as cooling water, helium, nitrogen, and carbon dioxide onto the glass substrate 50. Cooling nozzle: The moving mechanism 37a can be moved so that the cooling medium released by the cooling nozzle 37 can reach: from the end of the long circular light spot of the laser beam to the inner side of the light spot end of the laser beam at a predetermined distance from the spoon. The two points are positioned at a predetermined distance to the outside to form a cooling point. Also, a pair of CCD cameras 38 and 39 are provided on the scribing device to photograph the alignment marks patterned on the glass substrate 50 in advance, and monitors 28 and 29 are installed on the installation # 32 to respectively Displays images taken by each camera 38 and 39. On the scribing device, a temperature sensor (for detecting the temperature distribution on the surface of the glass substrate 50) 40 and a CCD camera 45 are formed on the scribing device so as to approach the optical holding device 33 and the cooling nozzle 37, respectively. The temperature sensor 40 is provided with a light element, which converts the infrared% of the periphery of the surface of the substrate and converts it into electricity, thereby detecting the laser light point LS and spray on the surface of the glass substrate 50 in a non-contact manner. The temperature of the cooling point cp of the cooling medium. ⑽Camera ^ 'It is used to supply photographic signals to the image processing equipment (not shown). This image processing device uses a fine image processing method to confirm the formation of blind cracks. / 13 200307586 When the substrate 50 is subjected to scribing, first, a glass substrate 50 divided into a predetermined size is placed on a slicing device, a stage, and a fixing mechanism. Next, _: 裇 38, 39 are used to photograph the alignment mark set on the glass substrate 50. The alignment marks of the shadows are displayed on the monitors 28 and 29 t, and the image processing device (not shown) used for positioning of the stage is used to process the position of the alignment marks. The rotation of the glass substrate 5 () placed on the support table 3 is located at a predetermined position, and a laser is applied to the glass substrate 50 to perform a wire opening. When the scribe is performed on the glass substrate 5G, the long side direction of the long laser light spot irradiated from the optical holder 33 to the surface of the broken glass substrate is along the X direction of the scribe line formed on the broken glass substrate. . The positioning of the rotary table 26 is performed by the sliding of the movable port 12, the sliding of the pedestal 19, and the rotation of the rotary table 26 by the rotating mechanism µ. Occurs when the rotary 纟 26 slides in the direction of the positioning table of the support table 31, so that the end of the glass substrate faces = or the cutter wheel 35 is lowered, and the mouth of the glass substrate 5 (TR in Fig. 2). < taste. After the P is formed and cut, the rotary table 26 is scribed along the scribe line to irradiate the laser beam from the laser oscillator 35, and at the same time, the second part emits the cold medium (for example, the cooling water and compressed air are sprayed together) 7: Temperature sensing器 测测 破 璃 校园 5。 5 glass substrate 5. Surface cloth: According to the degree data, the cooling nozzle moving mechanism is used to determine the proper position of the cooling nozzle. This is used to determine the cooling nozzle. The surface temperature of the cooling medium spraying point 14 200307586 f is continuously monitored. When the surface temperature of the glass substrate 50 is close to the melting temperature, the position and spraying of the cooling nozzle 37 for cooling media spraying are controlled. A schematic perspective view of the light beam irradiation state on the broken glass substrate 50 in the scribing method of the wire device of the present invention; FIG. 3 is a top view schematically showing a physical change state on the glass substrate 50. The laser beam oscillated by the laser oscillator 34 forms an oblong laser light spot Ls on the surface of the glass substrate. The laser light spot ^ is irradiated in such a manner that its major axis coincides with the direction of the scribe line to be formed. Laser power point. The size of LS 'is set to, for example, a long circle with a short diameter and a short diameter η ", but it can be changed appropriately. The heating temperature generated by the laser light spot ls is lower than the melting temperature of the glass substrate 50. That is, the temperature is lower than the softening point of the glass substrate 50. Thereby, the surface ′ of the glass substrate 50 irradiated by the laser light spot U can be added in a manner that does not cause melting_

The cold section nozzle 37 sprays a cooling medium such as cooling water in a manner so as to be heavier than the rear part of the laser light LS area to form a cooling point CP. As a result, a temperature gradient is generated between the laser light point LS and the cooling point cp. At the glass substrate 50 heated by the laser light spot LS, compressive stress is generated; and at the cooling point cp of the sprayed cold part water, the tensile stress is generated. In this way, when the "cranium emission light", which generates L stress in the heating area of LS, generates tensile stress at the cooling point h of the cooling water h laser light point LS, the base point; the point LS phase "h at Laser of the cooling point CP; the area on the opposite side generates large tensile stresses. Using this tensile stress, 15 'draws a predetermined line from the end of the glass substrate 50 to form a blind crack Bc. The incision made from the material will be along BC = ::::: When lost, it will be almost visible to the naked eye. ^^ Store λ m The vicinity of the spray area is formed on the surface of the surface substrate 50 due to large tensile stress. When f cracks BG, # are observed in a microscopic manner, a large opening state is formed.

: In general, the blind crack BC depth formed using the above method is related to the size of the laser light point Ls, the lightning point ^, and the relative moving speed V of the cooling point cp relative to the glass substrate 50.

The Rivan method further sprays a cooling medium into the laser light point LS, so that the cooling point CP is formed in the area of the laser light point LS. In this way, the cooling point cp can be formed in a semi-forced cooling manner in the temperature distribution of the surface layer of the glass-based substrate, and the temperature is near or at the highest point. Therefore, when the heating area generated by the laser beam reaches the lower side of the glass substrate 50, the cooling of the glass substrate 50 prevents the blind crack BC from becoming a whole cut. This phenomenon is caused by the laser beam. The generated heating area reaches the lower surface of the glass substrate 50. In addition, even if the output of the laser beam is slightly changed, for example, about 10w, or the laser light point ^ and the cooling point CP are slightly changed relative to the moving speed of the glass substrate 50, a blind crack of an appropriate depth is formed. Therefore, the allowable fluctuation range of the laser light output used for the scribing line can be increased, and the allowable fluctuation range of the moving speed of the laser light point Ls and the cooling point CP relative to the glass substrate 50 can be increased and stabilized. Underline. The experiment example ^ 200307586 in which the cooling point CP is formed in the laser light point ls as described above is described below. The following scribing method is described in detail to confirm the effect. (Experimental example 1) A thick glass plate was used for Behr i. Lei Weiwei in ring mode is 39mm (long diameter, beam shape p3, b) X1.4mm (short diameter &) for broken glass. In Experimental Example 1, the cooling point cp was placed on the side of the cooling point cp at an interval of ^ 1_. That is, the display is the same as in the past __: first of all, the method of scoring in the opposite. The results are shown in Figure 4.

The following “Figures 4 to 8” are all shown, and the bluffs and the fighters each show the following results. 〇. Form a normal blind crack. X · Normal blind cracks cannot be formed, that is, blind cracks cannot be formed (in the case of a low speed region), or a knife. The cross-section quality after J is poor (in the case of a high-speed region). . Formation and non-formation of blind cracks. F: Generates a whole cut. M: The substrate is melted. (Experimental example 2) Bei

board. # ^ 钱 Use thick glass with thickness 0.7 as the glass. As the glass is irradiated, its beam shape is a beam of 27 ^, and a Gaussian beam is used, which will be, person, and _ x I 4_ (short diameter a). In this condition, the interval between the CP and the end of the laser light point Ls is changed variously, and the line is y. The results are shown in the figure

„Α b. FIG. 5 (a) shows the case where the interval of the cooling points CP is formed outside the end of the laser light display 屮 尤” especially the point Ls, that is, the conventional scribing method is not shown. Fig. ^ M p ^ ^ The mouth b (b) shows the case where the uncooled point CP is 1_, and the net is formed on the inside of the laser light point LS. Fig. 5 (c)! 17 200307586 The case where the uncooled points cp are formed at the ends of the laser light point Ls at intervals of 7 mm. (Experimental Example 3) Experimental Example 3 uses a hard glass with a thickness of 0.7 mm as the glass base ^ as a laser beam irradiating the glass substrate, using a Gaussian beam,:, = shape is 22mm (long diameter b) xl. 4 As the (shorter diameter is smaller under this condition, the distance between the end of the LS light spot LS and the point LS is changed in various ways, and the results are shown in Figure 6. ® 6 (a) shows the cooling point cp to show the custom On the outside of the end of the laser light spot LS, that is, when CPa 3rara ^ and on the inside of the end of the W light spot LS are shown. (Experimental Example 4) The hard f-series glass of the plate is used as the glass base and its beam shape Λ ] 7 1 The first beam system uses a ring pattern with a shape of 17 strikes (long diameter b) x. The cooling point ⑶ and the laser light point under this condition are formed at the laser light point at the interval: cold ... to show the conventional Line drawing method 17 (in the case of displaying «e QKD) is not cold standby p fj; rn: formed at the end of the laser light spot; two" ^ ", line drawing method ... (c) shows Cooling :: 'It shows that it is formed on the inside of the end of the laser light point LS; the interval of M 顚 is smaller than the interval of 3_ formed at the laser light point [Figure / ⑷ system shows cold Case 18 on the inner side of the crotch (Experimental Example 5) Experimental Example 5 uses a thickness of 0 05, but also raises the glass A as a glass substrate. As the glass substrate is irradiated,苴 Beam opening ... ⑼ The field of zizhi field is the first beam, which uses a Gaussian beam. The shape of the eight fruits is 28mm (long diameter b) X η β /, and the spleen is u ^ b) X 0.8mm (short diameter a). In this condition, the interval between the ^ part point cp and the laser light point Ls, and the interval of the company-⑹ &# are variously changed, and the order is set. The results are shown in Figure 8. Fig. 8 rg ㈡ 8 (a) shows the case where the cooling points cp are formed on the inside of the laser light "P point CP at a distance of 2 °". Fig. 8 (b) shows that the uncooled point CP is 4 Gate of Ks with 1

The intervals of Λ, θιΙ 6, ^ y are formed in a six shape inside the end of the laser light point LS. FIG. 8 (c) shows a case where a Φ, +. T c, ν P points LP are formed on the inside of the end of the laser advance point LS at an interval of 6 mm. As shown in the results of the auxiliary line of the above experimental example 彳 ~ R 仃 依, depending on the glass substrate and the degree (0.7mm, Q.5π〇, although & 1 &# & & ^ ^, into though ,,,, The optimal conditions of Tian 0 卩 will be different, but the scribing method of the present invention in which the burr point CP is formed inside the laser well point 丨 9 points LS is compared with the method of forming the cooling point CP in the 鼾, (Take the conventional scribe line outside Putian's first point LS, which can be reduced) The occurrence of the overall cutting phenomenon, and the laser light point u and cold

: When the predetermined moving speed is expanded to about 1Ws, and the predetermined output of the laser beam is expanded to about 1QW Zuo Taixi 嗝 ΑM, the blind crack can still be formed. Fig. 10 is a schematic diagram showing a glass substrate automatic dividing production line 1GG, which is an example of an automated glass substrate 50 dividing production line in which a cymbal device is assembled behind a scribing device. . The glass substrate automatic dividing production line is designed to be divided into single glass substrates. It is provided with: a cassette loader m equipped with a glass substrate 50 for storage and will be taken out of the glass substrate 50 from the loader 101. 19 200307586 A conveyor belt 102 with two positions is used for scribing device 103 of the present invention for scribing on glass substrate 50, and the glass substrate 50 after the scribing is placed and carried out. A split device 105 composed of a two-in-one table (by rotating at least one table downward to bend the glass substrate 50 and dividing the glass substrate 50 along the scribe line), the divided glass substrate $ ⑽ Moved to the glass substrate automatic dividing production line 丨 00 and removed the conveyor belt 106. Robotic arms R] l ~ R5 for conveying various glass substrates 50, etc., are provided throughout the glass substrate automatic dividing production line 100. Next, the operation of the glass substrate automatic dividing production line 100 will be described. The glass substrate 50 stored in the cassette of the cassette loader 101 is taken out by a robot arm (feeding robot arm) R1, and the taken-out glass substrate 50 is placed on the conveyor belt 102. Next, the glass substrate 50 is positioned on the front side of the conveyor belt 02. After that, the glass substrate and the plate 50 are held by a robot arm (transfer robot arm) R2 and transferred to the scribing device. The glass substrate 50 that has been transported is placed on a table within the scribing device 103. In the scribing device 103, as described above, a blind crack Bc is formed on the glass substrate 50 along a predetermined line. In the scribing device i 03, when a predetermined blind crack BC cannot be formed well on the surface of the glass substrate 50, the NG signal is sent from the shadow processing (not shown), and the scribing device J 03 is stopped, and Issue an alert to inform you of anomalies. On the other hand, in the scribing device 103, when a blind crack BC can be formed on the surface of the glass substrate 50, the glass substrate 50 is held by a robot arm (conveying robot arm) R3 and placed on a conveyor belt. The glass substrate 50 placed on the conveyor belt 104 is positioned on the front side of the carousel belt 20 200307586 104, and the glass substrate and the plate 50 are transferred to the splitting device 105 by a robot arm (transfer robot arm) R4, and Blind crack B () of the glass substrate 50 is located at the center of each of the one-in-one tables. The glass substrate divided into a plurality of pieces by the splitting device 105 (hereinafter, each glass substrate divided into a plurality of pieces is called It is a glass substrate 50B), and it is placed on the unloading conveyor 105 by a robot arm (conveying robot arm) R5. Alternatively, another production line configuration can be adopted. When the image processing device generates an NG signal, the system The glass substrate 50 without the predetermined blind crack BC is automatically carried out from the production line 100. This can constitute a fully automatic operation. _ The scribe method of the present invention described above, in this embodiment, is directed to the use of FIG. The case where the scribing device is used to form a scribing device will be described, but the effect obtained by the present invention is not limited to this. For example, for a glass substrate transported on a conveyor belt of a glass plate production line, A device for forming a scribing line orthogonal to the conveying direction can of course also be applied. As described above, the scribing method of the present invention is characterized in that the surface of the brittle material substrate is softened below the brittle material substrate The temperature of the point is heated, and a cooling area is formed inside the heating area, thereby forming a blind crack along a predetermined line of the scribe line of the brittle material substrate. Therefore, the scribe method of the present invention 'uses the highest temperature The semi-forced cooling in the heating area near the point or in the middle of the descent can prevent the overall cutting phenomenon and form a blind crack of an appropriate depth. Compared with the habit of forming the cooling area $ on the outside of the heating area, the scribing method of the present invention Knowing the scribing method, it can expand the moving speed of a region of the heating area to about 1 Omm / s, and expand the laser output of the laser beam to an appropriate range of about 10w, and stably. Implement appropriate scribing. 21 200307586 [Brief description of the drawings] (I) Schematic part * Figure 1 shows a schematic diagram of the device used to implement the present invention. The scribing used by the scribing method Fig. 2 is a schematic perspective view of your field m, using the scribing method of the present invention of the sword-line device of Fig. 1 to break the water strike A beam on the substrate 50 ..., and a schematic perspective view of the shot state. Figure 4 shows the results of physical changes. Figure 4 in the middle and the state shows the results of Experimental Example 1. Figures 5 (a) to (c) show the results in Experimental Example 2. Figures 6 (a) and (b) respectively The results of Experimental Example 3 are shown. Figures 7 (a) to (d) are the results of Experimental Example 4. Figures 8 (a) to (c) are the results of Experimental Example 5. Figure 9 is used to illustrate borrowing. The method of forming a scribe line by a laser beam

Fig. 10 is a schematic diagram of a glass substrate automatic dividing production line 100. (Two) the symbol of the component 11 ...

12… Sliding table 13… Ball screw 14… Guide 15… Guide 16… Ball nut 1 9… Base 22 200307586 21 ··· Guide 22 ·· Ball screw 23 ··· Motor 24 ··· Ball nut 25 … Rotating mechanism 26 ··· Rotating table 28 ··· Motor 29 " · Motor 31 ··· Supporting table 32 ··· Mounting table 33 ·· Optical holder 34 ·· Laser oscillator 35 " 36 " knife holder 37 ... cooling nozzle 38 ... CCD camera 39 " CCD camera 50 ... glass substrate

Claims (1)

200307586 Patent application park: It is characterized in that the surface of the brittle material substrate is continuously heated at a temperature lower than the softening point of the brittle material substrate, and a cooling region is formed inside the f plus region, thereby Blind cracks are formed by scribed predetermined lines of the brittle material substrate. "Second, the scribe method of item 1 in the scope of patent application, wherein the heating area is formed by irradiating a laser beam. 3. If the scribe method of item 1 or 2 of the scope of patent application is based on temperature A carrier mechanism (for measuring the temperature distribution on the surface of the brittle material substrate) The temperature distribution on the surface of the substrate of the brittle material is measured, and the cooling nozzle used to form the cooling area is moved to an appropriate position. A scribing device, It is characterized by having: a heating mechanism for continuously heating the surface of the brittle material substrate at a temperature lower than the softening point of the brittle material substrate, a cooling mechanism for cooling the surface of the brittle material substrate, and The cooling mechanism is moved to the inside or outside of the heating area, and the distance from the end of the heating area formed by the heating mechanism is a predetermined distance. Pick up, drawing: as the next page. 24