1292352 玖、發明說明： 【發明所屬之技術領域】 本發明係關於用來在大型脆性材料基板上形成劃線之 適合的劃線裝置。 【先前技術】 以玻璃基板等為代表之脆性材料基板之分割，一般所 採用的方法，係包含劃線製程及裂片製程，在劃線製程， 係將從脆性材料基板表面起以既定深度來形成之垂直裂痕 沿所希望的方向延續而形成劃線；在裂片製程，係接續於 wj線製程，藉由對脆性材料基板施加緊壓力，而沿著劃線 製程所形成之劃線將玻璃板予以分割。 分割脆性材料基板時所進行之劃線製程，已知的方法 係使用超硬合金製或燒結鑽石製的刀輪來形成劃線。然而 這種使用刀輪的方法，劃線形成中所產生之玻璃屑將附 著於脆性材料基板表面，當脆性材料基板使用於顯示裝置 等時則成為顯示缺陷的原因。又，在將脆性材料基板予以 分割之裂片製程實施時，可能在脆性材料基板的端面部分 等產生不想要的缺口，而造成分割後脆性材料基板之品質 不良。 針對此問題，近年來，使用雷射光束來形成劃線的方 法已達實用化。該使用雷射光束來形成劃線的方法，如圖 6所示，係對構成劃線對象之脆性材料基板8，照射來自 雷射振盈裝置61之雷射光束LB。從雷射振盪裝置61照射 1292352 之雷射光I LB ’係沿著劃線預定線而在脆性材料基板s 上形成雷射光點LS。從雷射振盪裝置6丨照射之雷射光束 LB，係在脆性材料基板s上沿著劃線預定線而相對於 脆性材料基板進行移動。 又，在脆性材料基板S表面之雷射光束ΕΒ照射區域 附近，係以形成劃線的方式，從冷卻噴嘴62喷附冷卻水 等的冷卻媒體。在照射雷射光束LB之脆性材料基板s表 面，因雷射光束LB之加熱而產生壓縮應力後，藉由喷附 冷卻媒體，而產生拉伸應力。如此般，由於在壓縮應力產 生區域之鄰近區域形成拉伸應力，故在兩區域間，因個別 的應力而產生應力梯度，而在脆性材料基板s，從藉由刀 輪等而預先形成於脆性材料基板s端部之切口 TR沿著劃 線預定線而形成連續的垂直裂痕（盲裂痕）。 像上述使用雷射光束來形成劃線的方法，所產生的玻 璃屑極少，且由於是利用熱變形應力來形成劃線，在實施 裂片製程時並不會在脆性材料基板之端面產生缺口。 【發明内容】 發明所要解決之譯籲 上述採用雷射光束照射之劃線形成方法，主要是適用 於液晶顯示裝置所使用之小型玻璃基板等的劃線情形，而 在實施大型玻璃基板的劃線時，也能以相同的原理來進行 劃線。 大型玻璃基板劃線用的劃線裝置中，用來振盪出既定 1292352 波長的雷射光束之雷射振盪器，係設置在偏離大型玻璃基 板（劃線對象）的位置，透過透鏡等的傳送系統，而將光束 等的能量傳送至大型玻璃基板的劃線形成面上所設置之光 學頭。在該光學頭附近設置用來喷附冷卻媒體之冷卻噴嘴 。使用該劃線裝置來在大型玻璃基板上形成劃線時，在被 固定住的大型玻璃基板上，係沿著所希望的劃線方法進行 光學頭與冷卻喷嘴之掃描，藉由照射雷射光束所造成之加 熱及來自冷卻喷嘴之冷卻媒體所造成之冷卻，而使垂直裂 痕（盲裂痕）從預先形成於端部之切口開始進展，以形成所 希望的劃線。 然而，如此般之裝置構成，為了在大型玻璃基板上形 成劃線，必須使光學頭及冷卻噴嘴在大型玻璃基板上移動 ，因此，伴隨該光學頭及冷卻喷嘴之移動，雷射光束對玻 璃基板面之光路會產生變動，而使玻璃基板面上所形成之 光束形狀產生變動，又冷卻噴嘴所噴出之冷卻媒體的喷附 位置也會變動。因此，由於產生如此般的變動，要使劃線 =形成維持穩定會有困難，因此沿著劃線將玻璃基板予以 璉片後，要使玻璃基板的分割面之品質能確保穩定會有困 難。 〜又，上述劃線裝置中，要在同一塊大型玻璃基板上設 置複數個光學頭會面臨構造上的困難點，同時也有難以縮 紐加工處理時間（tact)的問題。 本發明係有鑑於上述事情而構成，其目的係提供一劃 、友破置，在利用雷射光束之照射及冷卻媒體之冷卻來形成 1292352 劃線時，對脆性材料基板之劃線形成面之光路完全不致產 生變動，又能設置複數個光學頭，而能縮短加工處理時間 並適用於大型脆性材料基板之劃線。 用以解決謖顳之丰鉛 為了解決上述課題，本發明之劃線裝置，係具備··用 來在脆性材料基板上形成加熱區域之加熱機構、用來在接 近該加熱區域的位置形成冷卻區域之冷卻機構、用來形成 劃線起點的切口之切口形成機構，利用該加熱區域及冷卻 區域間所產生的應力梯度來使垂直裂痕從該切口進展而形 成連續的劃線，其特徵在於：具備將該加熱機構、冷卻機 構、切口形成機構固定成一體之固定構機，使固定於該固 定機構之加熱機構、冷卻機構、切口形成機構三者與該脆 性材料基板，互相以既定的相對速度、在維持一定的相對 位置關係下進行移動。 上述本發明的劃線裝置較佳為，該加熱機構係具備： 用來振盪出雷射光束之雷射振盪器，用來將雷射振盪器所 振盪出之雷射光束整形成既定形狀並照射至脆性材料基板 上之光學單元，配置於雷射振盪器與光學單元間、用來將 雷射振盪器所照射之雷射光束傳送至光學單元之傳送機構 ’该雷射振盪器、光學單元及傳送機構，係和該固定機構 固定成一體。 上述本發明之劃線裝置較佳為，該冷卻機構及切口形 成機構係隔著加熱機構而分別配設於移動方向兩側，該固 定機構相對於脆性材料基板不管朝前進及後退之任一方向 1292352 移動均能進行劃線。 上述本發明之劃線裝置較佳為，該固定構機係具備複 數個’以纟脆性材料基板之複數部㈣時形成劃線。 【實施方式】 t明之f施彬能 以下詳細說明本發明之劃線裝置。 (實施形態1) 圖1係顯示實施形態i的劃線裝置i之概略構成，圖 1(a)為側面圖，圖1(b)為俯視圖，圖i⑷為前視圖。以下 使用圖1 (a)〜(C)來說明本實施形態i之劃線裝置i。 該劃線裝置1，係具有平板狀的支持台2。在支持a 2 之上面，將用來振蘯出具有既定照射能量的雷射光束^1292352 BRIEF DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a suitable scribing device for forming a scribe line on a large brittle material substrate. [Prior Art] The method of dividing a brittle material substrate represented by a glass substrate or the like generally includes a scribing process and a splicing process, and the scribing process is formed from a surface of a brittle material substrate at a predetermined depth. The vertical cracks continue in the desired direction to form a scribe line; in the splicing process, the splicing process is followed by the wj line process, and the glass plate is placed along the scribe line formed by the scribe line by applying a pressing pressure to the substrate of the brittle material. segmentation. In the scribing process performed when the brittle material substrate is divided, a known method is to use a cutter wheel made of a superhard alloy or a sintered diamond to form a scribe line. However, in the method of using the cutter wheel, the glass swarf generated in the scribing formation is attached to the surface of the brittle material substrate, and when the brittle material substrate is used in a display device or the like, it becomes a cause of display defects. Further, when the dicing process for dividing the brittle material substrate is performed, an undesired notch may be formed in the end surface portion of the brittle material substrate, and the quality of the brittle material substrate after the division may be poor. In response to this problem, in recent years, a method of forming a scribe line using a laser beam has been put to practical use. The method of forming a scribe line using a laser beam is as shown in Fig. 6, and the laser beam LB from the laser oscillation device 61 is irradiated to the brittle material substrate 8 constituting the scribe line. The laser light I LB ' irradiated with 1292352 from the laser oscillation device 61 forms a laser spot LS on the brittle material substrate s along a predetermined line of the scribe line. The laser beam LB irradiated from the laser oscillation device 6 is moved on the brittle material substrate s along the predetermined line of the scribe line to move relative to the brittle material substrate. Further, in the vicinity of the laser beam irradiation region on the surface of the brittle material substrate S, a cooling medium such as cooling water is sprayed from the cooling nozzle 62 so as to form a scribe line. On the surface of the brittle material substrate s which irradiates the laser beam LB, after the compressive stress is generated by the heating of the laser beam LB, the tensile stress is generated by spraying the cooling medium. In this manner, since the tensile stress is formed in the vicinity of the region where the compressive stress is generated, a stress gradient is generated between the two regions due to the individual stress, and the brittle material substrate s is previously formed in the brittleness by the cutter wheel or the like. The slit TR at the end of the material substrate s forms a continuous vertical crack (blind crack) along a predetermined line of the scribe line. As described above, the laser beam is used to form the scribe line, and the generated glass swarf is extremely small, and since the scribe line is formed by the thermal deformation stress, no gap is formed in the end surface of the brittle material substrate when the splicing process is performed. SUMMARY OF THE INVENTION The method for forming a scribe line using a laser beam irradiation is mainly applied to a scribe line of a small glass substrate used in a liquid crystal display device, and a scribe line for implementing a large glass substrate. It is also possible to perform scribing on the same principle. In a scribing apparatus for scribing a large-sized glass substrate, a laser oscillator for oscillating a laser beam having a predetermined wavelength of 1,292,352 is provided at a position shifted from a large glass substrate (marked object), and transmitted through a lens or the like. The energy of the light beam or the like is transmitted to the optical head provided on the scribe line forming surface of the large glass substrate. A cooling nozzle for spraying a cooling medium is provided in the vicinity of the optical head. When the scribe line is used to form a scribe line on a large glass substrate, the optical head and the cooling nozzle are scanned along the desired scribe line method on the large glass substrate to be fixed by irradiating the laser beam. The resulting heating and cooling by the cooling medium from the cooling nozzle causes vertical cracks (blind cracks) to progress from the slits formed in advance at the ends to form the desired scribe line. However, in such a device configuration, in order to form a scribe line on a large glass substrate, it is necessary to move the optical head and the cooling nozzle on the large glass substrate. Therefore, with the movement of the optical head and the cooling nozzle, the laser beam is applied to the glass substrate. The optical path of the surface changes, and the shape of the beam formed on the surface of the glass substrate changes, and the position of the cooling medium ejected by the cooling nozzle also changes. Therefore, since such a variation occurs, it is difficult to keep the scribe line formation stable. Therefore, it is difficult to ensure the quality of the divided surface of the glass substrate after the glass substrate is diced along the scribe line. Further, in the above scribing apparatus, it is difficult to reduce the number of optical heads placed on the same large-sized glass substrate, and it is difficult to reduce the processing time (tact). The present invention has been made in view of the above circumstances, and an object thereof is to provide a plan and a friend to break a surface, and to form a surface of a brittle material substrate by forming a 1292352 scribe line by irradiation of a laser beam and cooling of a cooling medium. The optical path does not change at all, and a plurality of optical heads can be provided, which can shorten the processing time and is suitable for scribing of a large brittle material substrate. In order to solve the above problems, the scribing apparatus of the present invention includes a heating mechanism for forming a heating region on a brittle material substrate, and a cooling region for forming a heating region close to the heating region. a cooling mechanism, a slit forming mechanism for forming a slit for starting the scribe line, and a vertical gradient is formed by the stress gradient generated between the heating region and the cooling region to form a continuous scribe line from the slit, and is characterized in that: The heating mechanism, the cooling mechanism, and the slit forming mechanism are fixed to an integrated fixing machine, and the heating mechanism, the cooling mechanism, and the slit forming mechanism fixed to the fixing mechanism and the brittle material substrate are mutually at a predetermined relative speed. Move while maintaining a certain relative positional relationship. Preferably, in the above-described scribing apparatus of the present invention, the heating mechanism is provided with: a laser oscillator for oscillating a laser beam for shaping a laser beam oscillated by the laser oscillator into a predetermined shape and illuminating An optical unit on the substrate of the brittle material, disposed between the laser oscillator and the optical unit, and configured to transmit the laser beam irradiated by the laser oscillator to the optical unit. The laser oscillator and the optical unit The conveying mechanism is fixed integrally with the fixing mechanism. In the above-described scribing apparatus of the present invention, it is preferable that the cooling mechanism and the slit forming mechanism are disposed on both sides in the moving direction via the heating mechanism, and the fixing mechanism is oriented in any of the forward and backward directions with respect to the brittle material substrate. 1292352 can be scribed by moving. Preferably, in the above-described scribing apparatus of the present invention, the fixed structure machine has a plurality of scribe lines formed by a plurality of portions (four) of the brittle material substrate. [Embodiment] The present invention will be described in detail with reference to the scribing apparatus of the present invention. (Embodiment 1) Fig. 1 shows a schematic configuration of a scribing device i according to Embodiment i, Fig. 1(a) is a side view, Fig. 1(b) is a plan view, and Fig. 1(4) is a front view. Hereinafter, the scribing device i of the embodiment i will be described with reference to Figs. 1(a) to 1(C). The scribing device 1 has a flat support table 2. Above the support a 2 , it will be used to vibrate the laser beam with a given illumination energy ^
射振盪器3安裝成和支持台形成一體。支持台2中，在L 射振盪器3之雷射光束出射側形成開口部，在開口部: 下面，將光學單it 4安裝成和支持台形成—體；該光學二 元4，係將雷射振盪器3所照射之雷射光束射入，經整= 成既定形狀後，射出至脆性材料基板（劃線對象）s表面f 又，在支持台2之開口部2a上方，將2個彎曲鏡5安裝成 和支持台形成一體；該2個彎曲鏡5，係將雷射振盪器$ 所照射之雷射光束朝開口部2a下面所設之光學單元 反射。 方向 在支持台2下面，於光學單元4附近將冷卻噴嘴$ a 裝成和支持台形成一體，該冷卻喷嘴6係將冷卻媒體噴= 1292352 至脆性材料基板s表面。又，隔著光學單元4而在冷卻喷 嘴6之相反側，係設有用來在脆性材料基板s的端:等形 成劃線起點（起動點）的切口之起動機構7。 冷卻喷嘴6、光學單元4、起動機構7,係沿著劃線預 定線而依序配置於同-直線上。冷卻喷嘴6與光學單元4 係配置成互相接近，以使脆性材料基s ±藉 媒體所形成之冷卻區域與藉由照射雷射光束所形成的^ Q域具備互相接近的位置關係。起動機構7,只要能形成 劃線起點之切口即可’對藉由光學單A 4之雷射光束昭射 所形成之加熱區域不管是形成接近或遠離皆可置 置可任意選擇。 、又 又’將雷射振3、f曲鏡5、光學單元4、 嘴6起動機構7等各構成安裝成一體之支持台2,係藉 由未圖不之驅動機構來沿劃線預定線移動，在形成割線時 ，支持台2似料_7餘於前頭的方向相對於脆性 材枓基板S進行移動。又，藉由該移動機構，能將支持么 2的移動速度調整成適合形成劃線的速度。 雷射振盪器3所振盪出之雷射光束’在脆性材料基板 S上所形成的加熱區域之加熱溫度，係比脆性材料基板$ 之溶融溫度為低，以防止脆性材料基S表面之熔融。亦 即，所使用的照射台t曰 , 耵此置，係加熱溫度比脆性材料基板s 軟化點低者。這睥 i 牙由於軟化點會依脆性材料基板（加熱對 象）S之種類而有不@，從雷射振盪器3所振i出之雷射光 束之照射此里，較佳為設定成可依脆性材料基;fe S之種類 1292352 而進行變更。 弯曲^學單元4’係將從雷射振盘器出而透過2個 =5所射入之雷射光束，整形為適合形成劃線之所希 Z形狀、例如為長轴沿劃線預定線方向之長圓形。 冷卻噴嘴6所喷出之冷卻媒體，基於容易 ::冷部為代表’但也能變更成冷卻叫氣體、氮氣、氮 =的乳體狀冷卻媒體，或冷卻有機溶劑等的液狀冷卻媒 體0 ，動機構7’係設有刀料的機械機構，以在脆性材 枓基板S之所希望位置、例如脆性材料基板s之接近表面 ^端部’將刀輪緊壓於脆性材料基板S表面，藉此形㈣ 線起點之切π。該機械機構’ #位在脆性材料基板s上的 既定位置料時必須不致壓到脆性材料基s，因此在起 動機構7中設有使該機械機構上下移動之移動機構（未圖示 )°又’作為脆性材料基板S表面之切口形成機構，除機械 機構外’也能使用YAG雷射等的光學機構。這時，由於 該光學機構對於脆性材料基s表“形成非接觸，故不 須設置上下移動機構。 其次，說明使用上述構成的劃線裝置丨之劃線方法。 首先，將作為劃線對象之脆性材料基板s，載置在叫 線裝置1之位於光學單元4、冷卻喷嘴6、起動機構U 方之載台。載置時’是以脆性材料基s表面之割線預定 線的方向和劃線裝4 i的劃線方向呈—致的方式來 置對準。 11 1292352 八人，藉由驅動移動機構，而使支持台（將光學單元4 〜 W噴嘴6、起動機構7安裝成一體相對於脆性材料 基板S進行移動。當支持台2移動時，首先起動機構了會 到達脆性材料基板S的端部。在該端部位置，將安裝於起 動機構7則端之刀輪等的機械機構緊壓於脆性材料基板s 表面，藉此在該位置形成劃線起點之切口。 、在脆材料基板s表面形成切口後，為避免在脆性材 料基板s表面不小心產生傷痕等，係使起動機構7前端《 機械機構對於脆性材料基板S表面形成非接觸狀態後，再 繼續支持台2的移動。接著’當支持台2下面之光學單元 4、冷卻噴嘴6到達脆性材料基板s表面的切口位置時， 開始驅動雷射振盪器3，又開始從冷卻噴嘴6喷出冷卻水 等的冷卻媒體。 雷射振盪器3被驅動後會振盪出具有既定能量的雷射 光束所振盪出的雷射光束，被2個彎曲鏡5往形成於支 持口 2的開口部2a方向反射，通過開口部2a之雷射光束 _ 會射入光學單元4。在雷射光束所射入之光學單元4，雷 射光束整形成長圓形等的既定形狀後，朝脆性材料基板s 表面^射。在脆性材料基板S表面，係對應於所照射之雷 射光束之雷射光點而形成加熱區域。 冷卻噴嘴6，係將冷卻水等的冷卻媒體喷附於脆性材 料基板S表面’而在照射雷射光束所造成之加熱區域附近 形成冷卻區域。 在形成於脆性材料基板S表面之加熱區域會產生壓縮 12 1292352 應力’而在喷附冷卻媒體的冷卻區域會產生拉伸應力。如 此般使照射雷射光束所產生之壓縮應力、及形成於其後方 側之冷部媒體所產生之冷卻區域的拉伸應力形成於脆性材 料基板s之劃線預定線上，而使加熱區域及冷卻區域依序 移動於劃線預定線上，藉此從脆性材料基板s端部所形成 之切口連續生成垂直方向的垂直裂痕（盲裂痕），而形成所 希望的劃線。 本實施形態1之劃線裝置1，係將雷射振盪器3、實曲 鏡5、光學單元4、冷卻喷嘴6、起動機構7等形成劃線所 需的所有構件均和支持台2安裝成一體。因此，就算各構 件相對於脆性材料基板S表面產生移動，也能防止雷射光 束對脆性材料基板S表面之光路產生變動，故脆性材料基 板S表面所照射的雷射光束之光束形狀不致產生變動。又 ，冷卻喷嘴6所喷出之冷卻媒體的喷附位置也不致產生變 動而維持一定。因此，能使劃線的形成維持穩定，劃線形 成後實施裂片製程而分割之脆性材料基板s，可確保分割 面品質之穩定。 又，在本實施形恶1係說明使支持台2移動的例子， 但使脆性材料基板S相對於支持台2進行移動亦可。 (實施形態2) 圖2係顯不本實施形態2的劃線裝置丨〇之側視圖。 該劃線裝置1〇，係具有和上述圖丨所示的實施形態i 之劃線裝置1大致相同的構成，除實施形態丨之劃線裝置 1的構成外，係將起動機構7及冷卻喷嘴6分別設在光學 13 1292352 單元4的兩側，又將用來移動支持台2之移動機構設成可 往前後方向移動。該劃線裝置10中，關於與劃線裝置1 相同的構成係附上相同的元件符號。 本實施形態2之劃線裝置10，由於在光學單元4之前 後兩側分別設置起動機構7及冷卻喷嘴6，在完成1次脆 性材料基板S的劃線後，移動脆性材料基板S的位置，並 使支持台往第1次劃線的反方向移動，藉此即可繼續形成 劃線。 因此，本實施形態2之劃線裝置1〇，除實施形態丨的 劃線裝置1所得的效果外，由於可進行往復切斷，故進_ 步可謀求加工處理時間之縮短化，而適用於大型脆性材料 基板之劃線形成。 在本實施形態2係說明使支持台2移動的例子，但使 脆性材料基板S相對於支持台2進行移動亦可。 (實施形態3) 圖3〜圖5係顯示實施形態3的劃線裝置2〇的概略構 成，圖3為側視圖，圖4為俯視圖，圖5為前視圖。以下 使用圖3〜圖5來說明本實施形態3之劃線裝置2〇。The oscillator 3 is mounted to be integral with the support table. In the support table 2, an opening portion is formed on the exit side of the laser beam of the L-oscillator 3, and in the opening portion: below, the optical unit it 4 is mounted to form a body with the support table; The laser beam irradiated by the oscillating oscillator 3 is incident on the surface of the brittle material substrate (marked object) s, and is bent over the opening portion 2a of the support table 2, and is bent. The mirror 5 is mounted integrally with the support table; the two curved mirrors 5 reflect the laser beam irradiated by the laser oscillator $ toward the optical unit provided under the opening 2a. Direction Below the support table 2, the cooling nozzle $a is mounted integrally with the support table in the vicinity of the optical unit 4, which sprays the cooling medium = 1292352 to the surface of the brittle material substrate s. Further, on the side opposite to the cooling nozzle 6 via the optical unit 4, a start mechanism 7 for forming a slit at the end of the brittle material substrate s: the starting point (starting point) of the scribing line is provided. The cooling nozzle 6, the optical unit 4, and the starting mechanism 7 are sequentially arranged on the same line along the scribe line. The cooling nozzles 6 and the optical unit 4 are disposed close to each other such that the brittle material base s ± the cooling region formed by the medium and the Q domain formed by irradiating the laser beam have a positional relationship close to each other. The starting mechanism 7 can be arbitrarily selected as long as it can form a slit of the starting point of the scribing line, and the heating region formed by the laser beam projection by the optical single A 4 can be placed close to or away from each other. Further, the support table 2 in which the laser oscillation 3, the f-curve 5, the optical unit 4, and the mouth 6 start mechanism 7 are integrally assembled is arranged along the scribe line by a drive mechanism not shown. When moving, when the secant is formed, the support table 2 moves in the direction of the front side with respect to the brittle material 枓 substrate S. Further, by the moving mechanism, the moving speed of the support 2 can be adjusted to a speed suitable for forming a scribe line. The heating temperature of the laser beam oscillated by the laser oscillator 3 on the brittle material substrate S is lower than the melting temperature of the brittle material substrate $ to prevent melting of the surface of the brittle material substrate S. That is, the irradiation table t曰 used is such that the heating temperature is lower than the softening point of the brittle material substrate s. Since the softening point is different depending on the type of the brittle material substrate (heating target) S, the laser light emitted from the laser oscillator 3 is preferably set to be compliant. The brittle material base; the type of fe S 1,292,352 was changed. The bending unit 4' is a laser beam that is emitted from the laser disc and transmitted through two =5, shaped into a z-shape suitable for forming a scribe line, for example, a long axis along a predetermined line The long circle of direction. The cooling medium ejected from the cooling nozzle 6 is based on the following: "The cold portion is representative" but it can be changed to a cooling medium for cooling a gas, nitrogen or nitrogen, or a liquid cooling medium for cooling an organic solvent. The moving mechanism 7' is a mechanical mechanism provided with a blade material to press the cutter wheel against the surface of the brittle material substrate S at a desired position of the brittle material substrate S, for example, the end surface of the brittle material substrate s. This cuts the starting point of the line (four) line. The mechanical mechanism '# position must not be pressed to the brittle material base s at a predetermined position on the brittle material substrate s, so the starting mechanism 7 is provided with a moving mechanism (not shown) for moving the mechanical mechanism up and down. 'As a slit forming mechanism on the surface of the brittle material substrate S, an optical mechanism such as a YAG laser can be used in addition to the mechanical mechanism. At this time, since the optical mechanism "forms non-contact with respect to the brittle material base s table, it is not necessary to provide a vertical movement mechanism. Next, a scribing method using the scribing device of the above configuration will be described. First, brittleness as a scribing object will be described. The material substrate s is placed on the stage of the optical unit 4, the cooling nozzle 6, and the U-starter of the calling unit 1. When placed, the direction is the line of the secant line of the brittle material base s and the scribe line is mounted. The direction of the dash of 4 i is aligned in a manner of 11. 11 1292352 Eight people, by driving the moving mechanism, the support table (the optical unit 4 to W nozzle 6 and the starting mechanism 7 are integrally mounted with respect to brittleness) The material substrate S moves. When the support table 2 moves, the starting mechanism first reaches the end portion of the brittle material substrate S. At the end position, the mechanical mechanism attached to the cutter wheel or the like at the end of the starting mechanism 7 is pressed. On the surface of the brittle material substrate s, a slit of the starting point of the scribe line is formed at the position. After the slit is formed on the surface of the brittle material substrate s, in order to avoid inadvertent occurrence of scratches on the surface of the brittle material substrate s, After the front end of the starting mechanism 7 "mechanical mechanism forms a non-contact state with respect to the surface of the brittle material substrate S, the movement of the support table 2 is continued. Then, when the optical unit 4 and the cooling nozzle 6 under the support table 2 reach the surface of the brittle material substrate s At the incision position, the laser oscillator 3 is started to be driven, and a cooling medium such as cooling water is ejected from the cooling nozzle 6. The laser oscillator 3 is driven to oscillate and oscillate with a laser beam having a predetermined energy. The laser beam is reflected by the two curved mirrors 5 in the direction of the opening 2a formed in the support port 2, and the laser beam _ passing through the opening 2a is incident on the optical unit 4. The optical unit 4 in which the laser beam is incident After the laser beam is shaped into a circular shape and the like, the surface of the brittle material substrate s is irradiated. On the surface of the brittle material substrate S, a heating region is formed corresponding to the laser spot of the irradiated laser beam. 6. A cooling medium such as cooling water is sprayed onto the surface of the brittle material substrate S to form a cooling region in the vicinity of the heating region caused by the irradiation of the laser beam. The heated region on the surface of the substrate S will generate a compressive stress of 12 1292352, and tensile stress will be generated in the cooling region where the cooling medium is sprayed. Thus, the compressive stress generated by the irradiation of the laser beam and the cold formed on the rear side thereof The tensile stress of the cooling region generated by the portion of the medium is formed on the scribe line of the brittle material substrate s, and the heating region and the cooling region are sequentially moved on the predetermined line of the scribe line, thereby forming from the end portion of the brittle material substrate s. The slits continuously generate vertical cracks (blind cracks) in the vertical direction to form a desired scribe line. The scribing device 1 of the first embodiment is a laser oscillator 3, a real curved mirror 5, an optical unit 4, and a cooling device. All the members required for forming the scribe line by the nozzle 6, the starting mechanism 7, and the like are integrally mounted with the support table 2. Therefore, even if the members are moved relative to the surface of the brittle material substrate S, the laser beam can be prevented from being applied to the brittle material substrate S. The light path of the surface changes, so that the beam shape of the laser beam irradiated on the surface of the brittle material substrate S does not change. Further, the position at which the cooling medium ejected from the cooling nozzle 6 is sprayed is not maintained and is maintained constant. Therefore, the formation of the scribe line can be stabilized, and the brittle material substrate s which is divided by the dicing process and formed by the dicing process can be stabilized. In the present embodiment, the example in which the support table 2 is moved will be described. However, the brittle material substrate S may be moved relative to the support table 2. (Second Embodiment) Fig. 2 is a side view showing a scribing device (丨〇) according to a second embodiment. The scribing device 1A has substantially the same configuration as the scribing device 1 of the embodiment i shown in the above-mentioned figure, and the starting mechanism 7 and the cooling nozzle are provided in addition to the configuration of the scribing device 1 of the embodiment. 6 are respectively disposed on both sides of the optical 13 1292352 unit 4, and the moving mechanism for moving the support table 2 is set to be movable in the front-rear direction. In the scribing device 10, the same components as those of the scribing device 1 are denoted by the same reference numerals. In the scribing device 10 of the second embodiment, since the starter mechanism 7 and the cooling nozzle 6 are provided on the front and rear sides of the optical unit 4, the position of the brittle material substrate S is moved after the scribing of the brittle material substrate S is completed once. The support table is moved in the opposite direction of the first scribing line, whereby the scribing can be continued. Therefore, in addition to the effects obtained by the scribing device 1 of the embodiment, the scribing device 1 of the second embodiment can perform the reciprocating cutting, so that the processing time can be shortened and the processing can be shortened. The scribing of the large brittle material substrate is formed. In the second embodiment, an example in which the support table 2 is moved will be described. However, the brittle material substrate S may be moved relative to the support table 2. (Embodiment 3) Fig. 3 to Fig. 5 show a schematic configuration of a scribing device 2A according to a third embodiment, Fig. 3 is a side view, Fig. 4 is a plan view, and Fig. 5 is a front view. Hereinafter, the scribing device 2 of the third embodiment will be described with reference to Figs. 3 to 5 .
;該光學單元23， 22之雷射光束出射侧形成開口部2丨a，在 將光學單兀23安裝成和支持台形成一體 •，係將雷射振盪器22所照射之雷射光束 1292352 射入’經整形成既定形狀後’射出至脆性材料基板（劃線對 象）s表面。又’在支持台21之開口部2u上方將2個 彎曲鏡24安裝成和支持台21形成—體；該2個變曲鏡μ ’係將雷射振盪器22所照射之雷射光束朝開口部⑴下面 所設之光學單元23方向反射。 在支持台21下面’於光學單元23附近將冷卻喷嘴乃 安裝成和支持台21形成-體’該冷卻噴嘴25係將冷卻媒 體喷附至脆性材料基板S表面。著光學單元23而 在冷卻喷嘴25之相反側，係設有用來在脆性材料基板s 的端部等形成劃線起點（起動點）的七刀口之起動機構2 6。 本實施形態3，如此般將雷射振盪器22、彎曲鏡24、 光學單元23、冷卻噴嘴25、起動機構26安裝成一體之支 持台21，係設有複數個，對一片脆性材料基板s實施i次 劃線即可同時在複數部位形成劃線。 “亦即，本實施形態3之劃線裝置20，係將複數個支持 台21設置在i個移動機構27。移動機構27係具有用來設 置各支持台21之移動台部28。在該劃線裝置2〇，在移動 機構27之移勳台部28兩侧係形成和劃線預定線平行之一 對導軌29，移動台部28係置於導軌29上而能沿劃線預定 線移動。該移動台部28，係藉由未圖示的驅動機構來沿導 軌29移動。 β 又，將具備各支持台21之移動台部28予以固定，而 藉由未圖示的移動機構來移動脆性材料基板S以進行劃線 亦可。 一 15 1292352 又，設於移動台部28上之各支持台21，如圖4之虛 線所示般，可在移動台部28上沿劃線預定線的正交方向 進行位置調整，以在脆性材料基板s表面上之既定位置形 成劃線。 關於雷射振盪器22等的詳細構成，由於和實施形態i 的雷射振盪器1等相同’故在此省略其等構成的詳細說明 又，關於使用該劃線裝置20之劃線方法，由於和使用 實施形態1的劃線裝置i之劃線方法相同，故省略其詳細 說明。但在本實施形態、3巾，由於具備雷射振盈S 22等 形成劃線所需的構成之支持台21係具備複數個，故對一 片脆性材料基板S實施i次劃線即可同時形成複數條劃線 如此般，本實施形態3之劃線裝置2〇,由於實施i次 劃線即可同時形成複數條劃線，相較於實施形態ι之劃線 裝置1可進一步謀求加工處理時間之縮短化。 如此般，本實施形態3之劃線裝置20,由於具備雷射 振遨器Μ等形成劃線所需的構成之支持台21係具備複數 對-片脆性材料基板S實施丨次劃線即可同時形成複 ^ 孓脆性材料基板上形成多數條劃 1的 劃線 又，本實施形態3 劃線裝置之支持台 ，但和實施形態2 中’各支持台21 2相同的構成， 所說明的劃線裝 係採用和實施形態 而僅能進行單方向 置10的支持台2 16 1292352 6分別設於光學單元4的 方向亦可。依據這種構成 而能更進一步縮短加工處 同樣地將起動機構7及冷卻噴嘴 兩側，而使支持台能移勳於前後 ，即可朝前後兩方向進行劃線， 理時間。 發明之#罢The optical unit 23, 22 forms an opening 2丨a on the exit side of the laser beam, and mounts the optical unit 23 to form an integral body with the support unit. The laser beam 12932352 is irradiated by the laser oscillator 22. After being formed into a predetermined shape, it is ejected onto the surface of the brittle material substrate (line object). Further, 'the two curved mirrors 24 are mounted on the support portion 21 above the opening portion 2u of the support table 21 to form a body; the two change mirrors μ' direct the laser beam irradiated by the laser oscillator 22 toward the opening The optical unit 23 provided under the portion (1) is reflected in the direction. Below the support table 21, a cooling nozzle is mounted in the vicinity of the optical unit 23 to form a body with the support table 21. The cooling nozzle 25 sprays a cooling medium onto the surface of the brittle material substrate S. On the opposite side of the cooling nozzle 25, the optical unit 23 is provided with a seven-knife starting mechanism 26 for forming a starting point (starting point) of a scribe line at the end of the brittle material substrate s. In the third embodiment, the laser oscillator 22, the bending mirror 24, the optical unit 23, the cooling nozzle 25, and the starter mechanism 26 are integrally mounted as a support base 21, and a plurality of the support tables 21 are provided, and a plurality of brittle material substrates s are implemented. The i-line can be used to form a scribe line at the same time. In other words, in the scribing device 20 of the third embodiment, a plurality of support tables 21 are provided in the i moving mechanisms 27. The moving mechanism 27 has a moving table portion 28 for providing the respective support tables 21. The line device 2A forms a pair of guide rails 29 parallel to the predetermined line of the scribe line on both sides of the shifting portion 28 of the moving mechanism 27, and the moving table portion 28 is placed on the guide rail 29 to be movable along the predetermined line of the scribe line. The moving table unit 28 is moved along the guide rail 29 by a drive mechanism (not shown). β Further, the moving table unit 28 including each of the support bases 21 is fixed, and the fragility is moved by a moving mechanism (not shown). The material substrate S may be subjected to scribing. A 15 1292352 Further, each of the support bases 21 provided on the moving table portion 28 may be lined along the scribe line on the moving table portion 28 as indicated by a broken line in FIG. Position adjustment is performed in the orthogonal direction to form a scribe line at a predetermined position on the surface of the brittle material substrate s. The detailed configuration of the laser oscillator 22 and the like is the same as that of the laser oscillator 1 of the embodiment i. Omit the detailed description of the composition, etc. The scribing method of 20 is the same as the scribing method using the scribing device i of the first embodiment, and thus detailed description thereof will be omitted. However, in the present embodiment, the three towels are provided with a laser oscillation S 22 or the like. Since the number of the support bases 21 required for the line is plural, the scribing device 2 of the third embodiment can be implemented by performing the scribing of one piece of the brittle material substrate S at the same time. When the scribe line is formed by i-times, a plurality of scribe lines can be formed at the same time, and the scribe line device 1 of the embodiment ι can further shorten the processing time. Thus, the scribe device 20 of the third embodiment has the ray The support table 21 which is configured to form a scribe line, such as a vibrating squeegee, is provided with a plurality of pairs of fragile material substrates S, and a plurality of scribe lines can be formed simultaneously to form a plurality of stripes 1 on the substrate. Further, in the third embodiment, the support table of the scribing device is the same as the configuration of each of the support tables 21 2 in the second embodiment, and the scribe line system and the embodiment described above can be placed in only one direction. Support desk 2 16 1292352 6 may be provided in the direction of the optical unit 4 respectively. According to this configuration, the starting mechanism 7 and the cooling nozzles can be further shortened in the same manner, so that the support table can be moved forward and backward, and the front and rear can be moved forward and backward. Directions are crossed, and time is taken.
域及冷卻區域的位置產生變動。因此，能使劃線的形成維 持穩定’劃線形成後實施裂片製程而分割出之脆性材料基 板S ’可碟保分割面品質之穩定。 又本發明之另一劃線裝置，係隔著加熱機構而將冷 卻機構及切口形成機構分別配設於脆性材料基板之行進方 向兩側，而使該固定機構相對於脆性材料基板朝前進及後 退之任一方向移動均能進行脆性材料基板之劃線。藉此， 以上所說明之本發明的劃線裝置，其特徵在於 備將加熱機構（用來在脆性材料基板上形成加熱區域）糸ς 部機構（用來在接近該加熱區域的位置形成冷卻區域）、切 口形成機構（用來形成劃線起點的切σ)固定成—體之固定 構機，藉由該固定機構，使加熱機構、冷卻機構、切口形 成機構三者相對於該脆性材料基板在維持-定的相對位置 關係下進行移動。本發明之劃線裝置，就算形成劃線所需 之各構成相對於脆性材料基板產生移動，仍能防止加熱區The position of the domain and the cooling zone changes. Therefore, the formation of the scribe line can be stabilized. The brittle material substrate S ′ which is formed by performing the splicing process after the scribe line formation can be stabilized. According to another scribe apparatus of the present invention, the cooling mechanism and the slit forming mechanism are disposed on both sides of the brittle material substrate in the traveling direction via the heating mechanism, and the fixing mechanism is advanced and retracted with respect to the brittle material substrate. The blanking of the brittle material substrate can be performed in any direction. Accordingly, the scribing apparatus of the present invention described above is characterized in that a heating mechanism (for forming a heating region on a brittle material substrate) is provided for forming a cooling region at a position close to the heating region. a slit forming mechanism (a slit σ for forming a starting point of the scribing line) is fixed as a body fixing mechanism, and the fixing mechanism causes the heating mechanism, the cooling mechanism, and the slit forming mechanism to be opposed to the brittle material substrate Move in a maintained-fixed relative positional relationship. The scribing apparatus of the present invention can prevent the heating zone even if the respective structures required for forming the scribing are moved relative to the brittle material substrate.
可谋求加工處理時間之縮短化，而適用於在大型脆性材料 基板上形成劃線。 又，本發明之其他劃線裝置，係設置複數個固定構機（ 用來將加熱機構、冷卻機構及切口形成機構固定成一體）， 17 1292352 並具有可使各固定機構往相同方a教心 丨』方向移動之移動機構，藉由 該移動機構之移動以使各固定趟接Λ 疋機構往相同方向移動，而在 跪性材料基板表面之複數部位同卑 m μ時形成劃線。藉此，對一 片脆性材料基板，藉由進行1今查丨丨 人劃線即可形成複數條劃線 ’可谋求加工處理時間之縮短化 化而適用於在大型脆性材 料基板上形成劃線。 【圖式簡單說明】 (一） 圖式部分 · 圖1係顯示實施形態1的劃線裝置之概略構成，圖 1(a)係側視圖，圖1(b)係俯視圖，停i(c)係前視圖。 圖2係顯示實施形態2的劃線裝置之側視圖。 圖3係顯示實施形態3的劃線裝置之側視圖。 圖4係顯示實施形態3的劃線裝置之俯視圖。 圖5係顯示實施形態3的劃線裝置之前視圖。 圖6係用來說明採用雷射光束照射之脆性材料基板的 分割方法之示意圖。 (二） 元件代表符號 1…劃線裝置 2…支持台 3…雷射振盪器 4…光學單元 5…彎曲鏡 6…冷卻喷嘴 18 1292352 7···起動機構 10…劃線裝置 20…劃線裝置 21…支持台 22…雷射振盪器 23…光學單元 24…彎曲鏡 25···冷卻喷嘴 26…起動機構 27…移動機構 28…移動台部 29…導執It is possible to shorten the processing time and to form a scribe line on a large brittle material substrate. Moreover, the other scribing device of the present invention is provided with a plurality of fixing mechanisms (for fixing the heating mechanism, the cooling mechanism and the slit forming mechanism integrally), 17 1292352 and having the fixing mechanism to the same side. The moving mechanism that moves in the 丨 direction moves the fixed 趟 Λ mechanism in the same direction by the movement of the moving mechanism, and forms a scribe line when the plurality of parts of the surface of the sturdy material substrate are the same as the mm μ. As a result, a plurality of slabs can be formed by performing a slashing of a single brittle material substrate. The processing time can be shortened and the scribe line can be formed on a large brittle material substrate. BRIEF DESCRIPTION OF THE DRAWINGS (1) Fig. 1 is a schematic view showing a schematic configuration of a scribing apparatus according to a first embodiment, wherein Fig. 1(a) is a side view, and Fig. 1(b) is a plan view, and i(c) is stopped. The front view. Fig. 2 is a side view showing the scribing device of the second embodiment. Fig. 3 is a side view showing the scribing device of the third embodiment. Fig. 4 is a plan view showing the scribing device of the third embodiment. Fig. 5 is a front view showing the scribing device of the third embodiment. Fig. 6 is a view for explaining a division method of a brittle material substrate irradiated with a laser beam. (2) Component symbol 1: scribe device 2... support table 3... laser oscillator 4... optical unit 5... curved mirror 6... cooling nozzle 18 1292352 7···starting mechanism 10... scribe device 20... Device 21... support table 22... laser oscillator 23... optical unit 24... curved mirror 25... cooling nozzle 26... starter mechanism 27... moving mechanism 28... mobile station 29...