SK16912000A3 - Spôsob galvanického pomeďovania substrátov - Google Patents
Spôsob galvanického pomeďovania substrátov Download PDFInfo
- Publication number
- SK16912000A3 SK16912000A3 SK1691-2000A SK16912000A SK16912000A3 SK 16912000 A3 SK16912000 A3 SK 16912000A3 SK 16912000 A SK16912000 A SK 16912000A SK 16912000 A3 SK16912000 A3 SK 16912000A3
- Authority
- SK
- Slovakia
- Prior art keywords
- copper
- carbonate
- precipitation
- electrolyte
- ions
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 title claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 13
- 229940116318 copper carbonate Drugs 0.000 claims abstract description 12
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims abstract description 12
- 239000003792 electrolyte Substances 0.000 claims description 24
- 239000000243 solution Substances 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 150000001879 copper Chemical class 0.000 claims description 5
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- 238000001556 precipitation Methods 0.000 claims description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical class CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000001298 alcohols Chemical class 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 239000005750 Copper hydroxide Substances 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 230000001588 bifunctional effect Effects 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- 229910001956 copper hydroxide Inorganic materials 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 230000000379 polymerizing effect Effects 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 239000003814 drug Substances 0.000 claims 1
- 229940079593 drug Drugs 0.000 claims 1
- 239000012266 salt solution Substances 0.000 claims 1
- 230000009469 supplementation Effects 0.000 claims 1
- 239000002253 acid Substances 0.000 abstract description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 239000006259 organic additive Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 230000008929 regeneration Effects 0.000 description 4
- 238000011069 regeneration method Methods 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- -1 for example Substances 0.000 description 3
- 238000005246 galvanizing Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000029142 excretion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 235000011149 sulphuric acid Nutrition 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004128 Copper(II) sulphate Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910001779 copper mineral Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- 229910000009 copper(II) carbonate Inorganic materials 0.000 description 1
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 description 1
- 239000011646 cupric carbonate Substances 0.000 description 1
- 235000019854 cupric carbonate Nutrition 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 239000001177 diphosphate Substances 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011707 mineral Chemical class 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910003446 platinum oxide Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000012224 working solution Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Optical Integrated Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- ing And Chemical Polishing (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19822076 | 1998-05-16 | ||
| PCT/EP1999/003321 WO1999060188A2 (de) | 1998-05-16 | 1999-05-14 | Verfahren zur galvanischen verkupferung von substraten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SK16912000A3 true SK16912000A3 (sk) | 2001-08-06 |
Family
ID=7868038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SK1691-2000A SK16912000A3 (sk) | 1998-05-16 | 1999-05-14 | Spôsob galvanického pomeďovania substrátov |
Country Status (22)
| Country | Link |
|---|---|
| US (1) | US6576111B1 (is) |
| EP (1) | EP1080252B1 (is) |
| JP (1) | JP2002515549A (is) |
| KR (1) | KR100545664B1 (is) |
| CN (1) | CN1170965C (is) |
| AT (1) | ATE221930T1 (is) |
| AU (1) | AU4261799A (is) |
| CA (1) | CA2331750A1 (is) |
| DE (1) | DE59902276D1 (is) |
| DK (1) | DK1080252T3 (is) |
| HU (1) | HUP0102016A3 (is) |
| IL (1) | IL139418A0 (is) |
| IS (1) | IS5703A (is) |
| NO (1) | NO20005777L (is) |
| PL (1) | PL344529A1 (is) |
| RO (1) | RO119838B1 (is) |
| RU (1) | RU2222643C2 (is) |
| SK (1) | SK16912000A3 (is) |
| TR (1) | TR200003368T2 (is) |
| WO (1) | WO1999060188A2 (is) |
| YU (1) | YU70900A (is) |
| ZA (1) | ZA200006624B (is) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3725083B2 (ja) * | 2002-02-21 | 2005-12-07 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | メッキ設備における金属イオン供給源の有効保存を可能とする方法 |
| US7776741B2 (en) | 2008-08-18 | 2010-08-17 | Novellus Systems, Inc. | Process for through silicon via filing |
| US9109295B2 (en) * | 2009-10-12 | 2015-08-18 | Novellus Systems, Inc. | Electrolyte concentration control system for high rate electroplating |
| US10472730B2 (en) | 2009-10-12 | 2019-11-12 | Novellus Systems, Inc. | Electrolyte concentration control system for high rate electroplating |
| CN107636209B (zh) * | 2015-06-26 | 2021-07-02 | 住友金属矿山股份有限公司 | 导电性基板 |
| US10692735B2 (en) | 2017-07-28 | 2020-06-23 | Lam Research Corporation | Electro-oxidative metal removal in through mask interconnect fabrication |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU60230A1 (ru) * | 1939-06-25 | 1940-11-30 | М.И. Бердников | Способ электролитического осаждени меди на железе и других металлах |
| SU116447A1 (ru) * | 1958-06-11 | 1958-11-30 | А.М. Ямпольский | Способ нанесени медных покрытий электролизом нецианистых электролитов |
| EP0137397B1 (de) * | 1983-09-28 | 1990-08-29 | Blasberg-Oberflächentechnik GmbH | Saures galvanisches Kupferbad und Verfahren zu seiner Herstellung |
| JPS62112996A (ja) * | 1985-11-11 | 1987-05-23 | Mitsubishi Metal Corp | 伝熱体 |
| DE4001960A1 (de) * | 1990-01-24 | 1991-07-25 | Roland Schnetteler | Verfahren zum elektrochemischen beschichten von stahlbaendern mit zink-nickellegierungen |
| JPH04320088A (ja) | 1991-04-18 | 1992-11-10 | Cmk Corp | プリント配線板の製造方法 |
| EP0667923B1 (en) * | 1992-09-15 | 1997-05-02 | ATR WIRE & CABLE CO., INC. | Method and apparatus for electrolytically plating copper |
-
1999
- 1999-05-14 CN CNB998062502A patent/CN1170965C/zh not_active Expired - Fee Related
- 1999-05-14 YU YU70900A patent/YU70900A/sh unknown
- 1999-05-14 AT AT99952102T patent/ATE221930T1/de not_active IP Right Cessation
- 1999-05-14 DE DE59902276T patent/DE59902276D1/de not_active Expired - Lifetime
- 1999-05-14 AU AU42617/99A patent/AU4261799A/en not_active Abandoned
- 1999-05-14 KR KR1020007012742A patent/KR100545664B1/ko not_active Expired - Lifetime
- 1999-05-14 RU RU2000131604/02A patent/RU2222643C2/ru not_active IP Right Cessation
- 1999-05-14 CA CA002331750A patent/CA2331750A1/en not_active Abandoned
- 1999-05-14 PL PL99344529A patent/PL344529A1/xx unknown
- 1999-05-14 HU HU0102016A patent/HUP0102016A3/hu unknown
- 1999-05-14 JP JP2000549788A patent/JP2002515549A/ja active Pending
- 1999-05-14 EP EP99952102A patent/EP1080252B1/de not_active Expired - Lifetime
- 1999-05-14 IL IL13941899A patent/IL139418A0/xx unknown
- 1999-05-14 US US09/674,509 patent/US6576111B1/en not_active Expired - Fee Related
- 1999-05-14 WO PCT/EP1999/003321 patent/WO1999060188A2/de not_active Ceased
- 1999-05-14 RO ROA200001121A patent/RO119838B1/ro unknown
- 1999-05-14 DK DK99952102T patent/DK1080252T3/da active
- 1999-05-14 SK SK1691-2000A patent/SK16912000A3/sk unknown
- 1999-05-14 TR TR2000/03368T patent/TR200003368T2/xx unknown
-
2000
- 2000-11-02 IS IS5703A patent/IS5703A/is unknown
- 2000-11-15 NO NO20005777A patent/NO20005777L/no not_active Application Discontinuation
- 2000-11-15 ZA ZA200006624A patent/ZA200006624B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| HUP0102016A3 (en) | 2002-03-28 |
| US6576111B1 (en) | 2003-06-10 |
| JP2002515549A (ja) | 2002-05-28 |
| CA2331750A1 (en) | 1999-11-25 |
| RU2222643C2 (ru) | 2004-01-27 |
| NO20005777D0 (no) | 2000-11-15 |
| AU4261799A (en) | 1999-12-06 |
| CN1170965C (zh) | 2004-10-13 |
| HUP0102016A2 (hu) | 2001-09-28 |
| DE59902276D1 (de) | 2002-09-12 |
| TR200003368T2 (tr) | 2001-04-20 |
| ZA200006624B (en) | 2001-06-01 |
| EP1080252B1 (de) | 2002-08-07 |
| IS5703A (is) | 2000-11-02 |
| WO1999060188A3 (de) | 2000-01-13 |
| WO1999060188A2 (de) | 1999-11-25 |
| KR20010043597A (ko) | 2001-05-25 |
| CN1301313A (zh) | 2001-06-27 |
| ATE221930T1 (de) | 2002-08-15 |
| KR100545664B1 (ko) | 2006-01-24 |
| RO119838B1 (ro) | 2005-04-29 |
| DK1080252T3 (da) | 2003-01-06 |
| PL344529A1 (en) | 2001-11-05 |
| EP1080252A1 (de) | 2001-03-07 |
| IL139418A0 (en) | 2001-11-25 |
| YU70900A (sh) | 2003-02-28 |
| NO20005777L (no) | 2000-11-15 |
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