IS5703A - Aðferð við koparhúðun undirlags - Google Patents
Aðferð við koparhúðun undirlagsInfo
- Publication number
- IS5703A IS5703A IS5703A IS5703A IS5703A IS 5703 A IS5703 A IS 5703A IS 5703 A IS5703 A IS 5703A IS 5703 A IS5703 A IS 5703A IS 5703 A IS5703 A IS 5703A
- Authority
- IS
- Iceland
- Prior art keywords
- copper
- separate
- separate tank
- copper coating
- carbonate
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 2
- 229940116318 copper carbonate Drugs 0.000 abstract 2
- 229910001431 copper ion Inorganic materials 0.000 abstract 2
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 abstract 2
- 239000003792 electrolyte Substances 0.000 abstract 2
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Optical Integrated Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- ing And Chemical Polishing (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19822076 | 1998-05-16 | ||
| PCT/EP1999/003321 WO1999060188A2 (de) | 1998-05-16 | 1999-05-14 | Verfahren zur galvanischen verkupferung von substraten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IS5703A true IS5703A (is) | 2000-11-02 |
Family
ID=7868038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IS5703A IS5703A (is) | 1998-05-16 | 2000-11-02 | Aðferð við koparhúðun undirlags |
Country Status (22)
| Country | Link |
|---|---|
| US (1) | US6576111B1 (is) |
| EP (1) | EP1080252B1 (is) |
| JP (1) | JP2002515549A (is) |
| KR (1) | KR100545664B1 (is) |
| CN (1) | CN1170965C (is) |
| AT (1) | ATE221930T1 (is) |
| AU (1) | AU4261799A (is) |
| CA (1) | CA2331750A1 (is) |
| DE (1) | DE59902276D1 (is) |
| DK (1) | DK1080252T3 (is) |
| HU (1) | HUP0102016A3 (is) |
| IL (1) | IL139418A0 (is) |
| IS (1) | IS5703A (is) |
| NO (1) | NO20005777L (is) |
| PL (1) | PL344529A1 (is) |
| RO (1) | RO119838B1 (is) |
| RU (1) | RU2222643C2 (is) |
| SK (1) | SK16912000A3 (is) |
| TR (1) | TR200003368T2 (is) |
| WO (1) | WO1999060188A2 (is) |
| YU (1) | YU70900A (is) |
| ZA (1) | ZA200006624B (is) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3725083B2 (ja) * | 2002-02-21 | 2005-12-07 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | メッキ設備における金属イオン供給源の有効保存を可能とする方法 |
| US7776741B2 (en) | 2008-08-18 | 2010-08-17 | Novellus Systems, Inc. | Process for through silicon via filing |
| US9109295B2 (en) * | 2009-10-12 | 2015-08-18 | Novellus Systems, Inc. | Electrolyte concentration control system for high rate electroplating |
| US10472730B2 (en) | 2009-10-12 | 2019-11-12 | Novellus Systems, Inc. | Electrolyte concentration control system for high rate electroplating |
| CN107636209B (zh) * | 2015-06-26 | 2021-07-02 | 住友金属矿山股份有限公司 | 导电性基板 |
| US10692735B2 (en) | 2017-07-28 | 2020-06-23 | Lam Research Corporation | Electro-oxidative metal removal in through mask interconnect fabrication |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU60230A1 (ru) * | 1939-06-25 | 1940-11-30 | М.И. Бердников | Способ электролитического осаждени меди на железе и других металлах |
| SU116447A1 (ru) * | 1958-06-11 | 1958-11-30 | А.М. Ямпольский | Способ нанесени медных покрытий электролизом нецианистых электролитов |
| EP0137397B1 (de) * | 1983-09-28 | 1990-08-29 | Blasberg-Oberflächentechnik GmbH | Saures galvanisches Kupferbad und Verfahren zu seiner Herstellung |
| JPS62112996A (ja) * | 1985-11-11 | 1987-05-23 | Mitsubishi Metal Corp | 伝熱体 |
| DE4001960A1 (de) * | 1990-01-24 | 1991-07-25 | Roland Schnetteler | Verfahren zum elektrochemischen beschichten von stahlbaendern mit zink-nickellegierungen |
| JPH04320088A (ja) | 1991-04-18 | 1992-11-10 | Cmk Corp | プリント配線板の製造方法 |
| EP0667923B1 (en) * | 1992-09-15 | 1997-05-02 | ATR WIRE & CABLE CO., INC. | Method and apparatus for electrolytically plating copper |
-
1999
- 1999-05-14 CN CNB998062502A patent/CN1170965C/zh not_active Expired - Fee Related
- 1999-05-14 YU YU70900A patent/YU70900A/sh unknown
- 1999-05-14 AT AT99952102T patent/ATE221930T1/de not_active IP Right Cessation
- 1999-05-14 DE DE59902276T patent/DE59902276D1/de not_active Expired - Lifetime
- 1999-05-14 AU AU42617/99A patent/AU4261799A/en not_active Abandoned
- 1999-05-14 KR KR1020007012742A patent/KR100545664B1/ko not_active Expired - Lifetime
- 1999-05-14 RU RU2000131604/02A patent/RU2222643C2/ru not_active IP Right Cessation
- 1999-05-14 CA CA002331750A patent/CA2331750A1/en not_active Abandoned
- 1999-05-14 PL PL99344529A patent/PL344529A1/xx unknown
- 1999-05-14 HU HU0102016A patent/HUP0102016A3/hu unknown
- 1999-05-14 JP JP2000549788A patent/JP2002515549A/ja active Pending
- 1999-05-14 EP EP99952102A patent/EP1080252B1/de not_active Expired - Lifetime
- 1999-05-14 IL IL13941899A patent/IL139418A0/xx unknown
- 1999-05-14 US US09/674,509 patent/US6576111B1/en not_active Expired - Fee Related
- 1999-05-14 WO PCT/EP1999/003321 patent/WO1999060188A2/de not_active Ceased
- 1999-05-14 RO ROA200001121A patent/RO119838B1/ro unknown
- 1999-05-14 DK DK99952102T patent/DK1080252T3/da active
- 1999-05-14 SK SK1691-2000A patent/SK16912000A3/sk unknown
- 1999-05-14 TR TR2000/03368T patent/TR200003368T2/xx unknown
-
2000
- 2000-11-02 IS IS5703A patent/IS5703A/is unknown
- 2000-11-15 NO NO20005777A patent/NO20005777L/no not_active Application Discontinuation
- 2000-11-15 ZA ZA200006624A patent/ZA200006624B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| HUP0102016A3 (en) | 2002-03-28 |
| US6576111B1 (en) | 2003-06-10 |
| JP2002515549A (ja) | 2002-05-28 |
| CA2331750A1 (en) | 1999-11-25 |
| RU2222643C2 (ru) | 2004-01-27 |
| NO20005777D0 (no) | 2000-11-15 |
| AU4261799A (en) | 1999-12-06 |
| CN1170965C (zh) | 2004-10-13 |
| HUP0102016A2 (hu) | 2001-09-28 |
| DE59902276D1 (de) | 2002-09-12 |
| TR200003368T2 (tr) | 2001-04-20 |
| ZA200006624B (en) | 2001-06-01 |
| EP1080252B1 (de) | 2002-08-07 |
| WO1999060188A3 (de) | 2000-01-13 |
| WO1999060188A2 (de) | 1999-11-25 |
| KR20010043597A (ko) | 2001-05-25 |
| CN1301313A (zh) | 2001-06-27 |
| ATE221930T1 (de) | 2002-08-15 |
| KR100545664B1 (ko) | 2006-01-24 |
| RO119838B1 (ro) | 2005-04-29 |
| DK1080252T3 (da) | 2003-01-06 |
| PL344529A1 (en) | 2001-11-05 |
| SK16912000A3 (sk) | 2001-08-06 |
| EP1080252A1 (de) | 2001-03-07 |
| IL139418A0 (en) | 2001-11-25 |
| YU70900A (sh) | 2003-02-28 |
| NO20005777L (no) | 2000-11-15 |
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