[go: up one dir, main page]

SG97878A1 - Apparatus and method for continuous delivery and conditioning of a polishing slurry - Google Patents

Apparatus and method for continuous delivery and conditioning of a polishing slurry

Info

Publication number
SG97878A1
SG97878A1 SG200001868A SG200001868A SG97878A1 SG 97878 A1 SG97878 A1 SG 97878A1 SG 200001868 A SG200001868 A SG 200001868A SG 200001868 A SG200001868 A SG 200001868A SG 97878 A1 SG97878 A1 SG 97878A1
Authority
SG
Singapore
Prior art keywords
conditioning
polishing slurry
continuous delivery
delivery
continuous
Prior art date
Application number
SG200001868A
Other languages
English (en)
Inventor
Samuel Obeng Yaw
Darnell Schultz Laurence
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of SG97878A1 publication Critical patent/SG97878A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG200001868A 1999-04-06 2000-03-31 Apparatus and method for continuous delivery and conditioning of a polishing slurry SG97878A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/286,869 US6048256A (en) 1999-04-06 1999-04-06 Apparatus and method for continuous delivery and conditioning of a polishing slurry

Publications (1)

Publication Number Publication Date
SG97878A1 true SG97878A1 (en) 2003-08-20

Family

ID=23100520

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200001868A SG97878A1 (en) 1999-04-06 2000-03-31 Apparatus and method for continuous delivery and conditioning of a polishing slurry

Country Status (6)

Country Link
US (1) US6048256A (ja)
EP (1) EP1043122A3 (ja)
JP (2) JP2000308957A (ja)
KR (1) KR20010020713A (ja)
SG (1) SG97878A1 (ja)
TW (1) TW467806B (ja)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000071172A (ja) * 1998-08-28 2000-03-07 Nec Corp 化学機械研磨用スラリーの再生装置及び再生方法
US6280300B1 (en) * 1998-11-25 2001-08-28 Ebara Corporation Filter apparatus
JP3426149B2 (ja) * 1998-12-25 2003-07-14 富士通株式会社 半導体製造における研磨廃液再利用方法及び再利用装置
US7530877B1 (en) * 1999-06-03 2009-05-12 Micron Technology, Inc. Semiconductor processor systems, a system configured to provide a semiconductor workpiece process fluid
US7180591B1 (en) 1999-06-03 2007-02-20 Micron Technology, Inc Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods
US6290576B1 (en) * 1999-06-03 2001-09-18 Micron Technology, Inc. Semiconductor processors, sensors, and semiconductor processing systems
US6306012B1 (en) * 1999-07-20 2001-10-23 Micron Technology, Inc. Methods and apparatuses for planarizing microelectronic substrate assemblies
US6179699B1 (en) * 1999-09-27 2001-01-30 Advanced Micro Devices, Inc. Shape memory alloy-controlled slurry dispense system for CMP processing
EP1094506A3 (en) 1999-10-18 2004-03-03 Applied Materials, Inc. Capping layer for extreme low dielectric constant films
US6267641B1 (en) * 2000-05-19 2001-07-31 Motorola, Inc. Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor
JP2002016029A (ja) * 2000-06-27 2002-01-18 Mitsubishi Chemical Engineering Corp 研磨液の調製方法および調製装置
JP2002016030A (ja) * 2000-06-27 2002-01-18 Mitsubishi Chemical Engineering Corp 研磨液の調製方法および調製装置
EP1749565A1 (en) * 2000-07-31 2007-02-07 Kinetics Chempure Systems, Inc. Method and apparatus for blending process materials
EP1305107B1 (en) * 2000-07-31 2006-09-20 Kinetics Chempure Systems, Inc. Method and apparatus for blending process materials
US7905653B2 (en) * 2001-07-31 2011-03-15 Mega Fluid Systems, Inc. Method and apparatus for blending process materials
US6431950B1 (en) 2000-10-18 2002-08-13 Micron Technology, Inc. Point-of-use fluid regulating system for use in the chemical-mechanical planarization of semiconductor wafers
JP2002170792A (ja) * 2000-11-29 2002-06-14 Mitsubishi Electric Corp 研磨液供給装置及び研磨液供給方法、研磨装置及び研磨方法、並びに、半導体装置の製造方法
US6575823B1 (en) 2001-03-06 2003-06-10 Psiloquest Inc. Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
GB2375072A (en) * 2001-05-05 2002-11-06 Psi Global Ltd Method and apparatus for making moulded filter elements
US20030098069A1 (en) * 2001-11-26 2003-05-29 Sund Wesley E. High purity fluid delivery system
KR100428787B1 (ko) * 2001-11-28 2004-04-28 삼성전자주식회사 슬러리 저장 유니트 및 사용점에서의 혼합 유니트를 갖는슬러리 공급장치
DE20205819U1 (de) 2002-04-12 2003-08-21 Kinetics Germany GmbH, 63863 Eschau Vorrichtung zur Bereitstellung von hochreinen Prozesschemikalien
KR20020037316A (ko) * 2002-04-23 2002-05-18 이성희 디브이디 시스템에서 틸트 서보 제어방법
JP2004006499A (ja) * 2002-05-31 2004-01-08 Mitsubishi Electric Corp 半導体製造装置、研磨液供給装置、研磨液の特性検出方法及び半導体装置の製造方法
US20040014403A1 (en) * 2002-07-16 2004-01-22 Oberkampf Brandon L. CMP point of use filtration
DE60310099T2 (de) * 2002-07-19 2007-05-10 Kinetic Systems Inc., Tempe Verfahren und vorrichtung zum mischen von prozessmaterialien
US20040049301A1 (en) * 2002-09-10 2004-03-11 M Fsi Ltd. Apparatus and method for preparing and supplying slurry for CMP machine
US6884145B2 (en) 2002-11-22 2005-04-26 Samsung Austin Semiconductor, L.P. High selectivity slurry delivery system
KR100570371B1 (ko) * 2002-12-30 2006-04-11 동부아남반도체 주식회사 슬러리 유량 제어 장치 및 방법
TWI250202B (en) * 2003-05-13 2006-03-01 Eternal Chemical Co Ltd Process and slurry for chemical mechanical polishing
US7515994B2 (en) * 2003-10-17 2009-04-07 Technikrom, Inc. Accurate blending module and method
US8271139B2 (en) * 2003-10-17 2012-09-18 Asahi Kasei Bioprocess, Inc. Multi-stage accurate blending system and method
US7072742B1 (en) * 2003-10-17 2006-07-04 Technikrom, Inc. Accurate blending module and method
DE102004005741A1 (de) * 2004-02-05 2005-09-01 Infineon Technologies Ag Verfahren zum Aufbereiten eines Poliertuchs
JP4645056B2 (ja) * 2004-03-31 2011-03-09 パナソニック株式会社 研磨液供給装置
JP2005340328A (ja) * 2004-05-25 2005-12-08 Fujitsu Ltd 半導体装置の製造方法
US8137580B2 (en) * 2006-12-29 2012-03-20 Lg Chem, Ltd. CMP slurry composition for forming metal wiring line
US7651384B2 (en) * 2007-01-09 2010-01-26 Applied Materials, Inc. Method and system for point of use recycling of ECMP fluids
WO2008141206A2 (en) * 2007-05-09 2008-11-20 Advanced Technology Materials, Inc. Systems and methods for material blending and distribution
WO2009076276A2 (en) 2007-12-06 2009-06-18 Advanced Technology Materials, Inc. Systems and methods for delivery of fluid-containing process material combinations
CN102257604B (zh) * 2008-12-20 2013-07-03 嘉柏微电子材料股份公司 线锯切割方法
US8557134B2 (en) * 2010-01-28 2013-10-15 Environmental Process Solutions, Inc. Accurately monitored CMP recycling
US9670809B2 (en) 2011-11-29 2017-06-06 Corning Incorporated Apparatus and method for skinning articles
TWI641936B (zh) * 2012-11-13 2018-11-21 美商慧盛材料美國責任有限公司 漿料供應及／或化學品摻合物供應設備、方法、使用方法及製造方法
KR102152964B1 (ko) 2013-01-11 2020-09-07 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱 장치 및 방법
US9484211B2 (en) 2013-01-24 2016-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Etchant and etching process
US9490133B2 (en) * 2013-01-24 2016-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Etching apparatus
US9770804B2 (en) 2013-03-18 2017-09-26 Versum Materials Us, Llc Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
US9239296B2 (en) 2014-03-18 2016-01-19 Corning Incorporated Skinning of ceramic honeycomb bodies
US10611051B2 (en) 2013-10-15 2020-04-07 Corning Incorporated Systems and methods for skinning articles
JP2015199134A (ja) * 2014-04-04 2015-11-12 株式会社ディスコ 研磨装置及び板状物の研磨方法
US10688623B2 (en) * 2014-09-30 2020-06-23 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry dispersion system with real time control
SG11201807521WA (en) * 2016-03-11 2018-09-27 Fujifilm Planar Solutions Llc Advanced fluid processing methods and systems
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
US20200338688A1 (en) * 2019-04-25 2020-10-29 Lth Co., Ltd. Method for automatically verifying and cleaning large-sized particle counter for analyzing cmp slurry and verification system suitable for same
US20230256561A1 (en) * 2022-02-17 2023-08-17 Taiwan Semiconductor Manufacturing Company Ltd. Method of chemical mechanical polish operation and chemical mechanical polishing system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0709166A1 (en) * 1994-10-24 1996-05-01 Motorola, Inc. Chemical-mechanical polisher and a process for polishing
US5750440A (en) * 1995-11-20 1998-05-12 Motorola, Inc. Apparatus and method for dynamically mixing slurry for chemical mechanical polishing
JPH10315135A (ja) * 1997-05-23 1998-12-02 Nec Corp 研磨溶液濃度の制御方法及び制御装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527475B1 (fr) * 1982-06-01 1989-08-18 Oenologie Ste Fse Lab Installation permettant le melange de deux liquides en proportion determinee pour obtenir la regulation du ph dans le milieu reactionnel
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
US5522660A (en) * 1994-12-14 1996-06-04 Fsi International, Inc. Apparatus for blending and controlling the concentration of a liquid chemical in a diluent liquid
US5478435A (en) * 1994-12-16 1995-12-26 National Semiconductor Corp. Point of use slurry dispensing system
JP3633062B2 (ja) * 1994-12-22 2005-03-30 株式会社デンソー 研磨方法および研磨装置
US5637185A (en) * 1995-03-30 1997-06-10 Rensselaer Polytechnic Institute Systems for performing chemical mechanical planarization and process for conducting same
US5668063A (en) * 1995-05-23 1997-09-16 Watkins Johnson Company Method of planarizing a layer of material
AU6178196A (en) * 1995-06-05 1996-12-24 Startec Ventures, Inc. System and method for on-site mixing of ultra-high-purity ch emicals for semiconductor processing
JPH0957609A (ja) * 1995-08-28 1997-03-04 Speedfam Co Ltd 化学的機械研磨のための研磨材液供給装置
JPH09290368A (ja) * 1996-04-26 1997-11-11 Toshiba Mach Co Ltd スラリ供給装置
US5863838A (en) * 1996-07-22 1999-01-26 Motorola, Inc. Method for chemically-mechanically polishing a metal layer
US5664990A (en) * 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
US5857893A (en) * 1996-10-02 1999-01-12 Speedfam Corporation Methods and apparatus for measuring and dispensing processing solutions to a CMP machine
TW426556B (en) * 1997-01-24 2001-03-21 United Microelectronics Corp Method of cleaning slurry remnants left on a chemical-mechanical polish machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0709166A1 (en) * 1994-10-24 1996-05-01 Motorola, Inc. Chemical-mechanical polisher and a process for polishing
US5750440A (en) * 1995-11-20 1998-05-12 Motorola, Inc. Apparatus and method for dynamically mixing slurry for chemical mechanical polishing
JPH10315135A (ja) * 1997-05-23 1998-12-02 Nec Corp 研磨溶液濃度の制御方法及び制御装置

Also Published As

Publication number Publication date
TW467806B (en) 2001-12-11
JP2008103770A (ja) 2008-05-01
US6048256A (en) 2000-04-11
JP2000308957A (ja) 2000-11-07
EP1043122A3 (en) 2003-04-16
EP1043122A2 (en) 2000-10-11
KR20010020713A (ko) 2001-03-15

Similar Documents

Publication Publication Date Title
SG97878A1 (en) Apparatus and method for continuous delivery and conditioning of a polishing slurry
GB2344780B (en) Slurry recycling apparatus and slurry recycling method for chemical-mechanical polishing technique
GB2370054B (en) Improved abrasive slurry delivery apparatus and methods of using same
SG99868A1 (en) Polishing apparatus and dressing method
GB9924527D0 (en) Chemical-mechanical polishing apparatus and method
EP1055486B8 (en) Dressing apparatus and polishing apparatus
SG84551A1 (en) Abrasive slurry and preparation process thereof
SG86364A1 (en) Planarization apparatus and method
GB9914484D0 (en) Polishing apparatus and method for polishing a substrate
AU5445899A (en) Abrasive liquid for metal and method for polishing
IL140301A0 (en) Chemical mechanical polishing slurry and method for using same
SG75972A1 (en) Apparatus and process for delivering an abrasive suspension for the mechanical polishing of a substrate
IL126495A (en) Slurry mixing apparatus and method
PL331758A1 (en) Method of and apparatus for making abrasive tools
EP0951960A4 (en) METHOD AND APPARATUS FOR POLISHING THE INTERIOR SURFACE OF THE CYLINDRICAL PART OF AN ELONGATED CYLINDRICAL PART AND AN ELONGATED CYLINDRICAL PART
SG91268A1 (en) Method and apparatus for grinding a workpiece
SG74122A1 (en) Electrodeless electrolytic dressing grinding method and apparatus
AU2604001A (en) Method and apparatus for conditioning a polishing pad
GB9928705D0 (en) Methods and apparatus for conditioning grinding stones
SG55295A1 (en) Apparatus and method for shaping polishing pads
SG97157A1 (en) Chemical-mechanical abrasive composition and method
TW479841U (en) Polishing slurry supply apparatus
GB0108751D0 (en) Polishing apparatus and method
PL338978A1 (en) Method of dispensing dedusted material and apparatus therefor
SG70675A1 (en) Method and apparatus for profile mirror surface grinding