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SG169268A1 - Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package - Google Patents

Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package

Info

Publication number
SG169268A1
SG169268A1 SG201004638-1A SG2010046381A SG169268A1 SG 169268 A1 SG169268 A1 SG 169268A1 SG 2010046381 A SG2010046381 A SG 2010046381A SG 169268 A1 SG169268 A1 SG 169268A1
Authority
SG
Singapore
Prior art keywords
semiconductor die
active
fan
semiconductor device
wafer level
Prior art date
Application number
SG201004638-1A
Other languages
English (en)
Inventor
Reza A Pagaila
Original Assignee
Stats Chippac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stats Chippac Ltd filed Critical Stats Chippac Ltd
Publication of SG169268A1 publication Critical patent/SG169268A1/en

Links

Classifications

    • H10W70/09—
    • H10W42/276—
    • H10W70/614—
    • H10W72/0198—
    • H10W70/60—
    • H10W72/241—
    • H10W72/536—
    • H10W72/874—
    • H10W72/9413—
    • H10W72/944—
    • H10W74/00—
    • H10W90/10—
    • H10W90/701—
    • H10W90/722—
    • H10W90/754—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
SG201004638-1A 2009-08-21 2010-06-28 Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package SG169268A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/545,390 US9324672B2 (en) 2009-08-21 2009-08-21 Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package

Publications (1)

Publication Number Publication Date
SG169268A1 true SG169268A1 (en) 2011-03-30

Family

ID=43605692

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201004638-1A SG169268A1 (en) 2009-08-21 2010-06-28 Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package

Country Status (4)

Country Link
US (1) US9324672B2 (zh)
CN (1) CN101996896B (zh)
SG (1) SG169268A1 (zh)
TW (1) TWI499000B (zh)

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Also Published As

Publication number Publication date
TWI499000B (zh) 2015-09-01
CN101996896A (zh) 2011-03-30
US20110045634A1 (en) 2011-02-24
US9324672B2 (en) 2016-04-26
TW201108355A (en) 2011-03-01
CN101996896B (zh) 2016-01-20

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