RU2008101976A - THERMOELECTRIC SEMICONDUCTOR DEVICE FOR INFLUENCE ON ENDONASAL ACUPUNCTURE POINTS - Google Patents
THERMOELECTRIC SEMICONDUCTOR DEVICE FOR INFLUENCE ON ENDONASAL ACUPUNCTURE POINTS Download PDFInfo
- Publication number
- RU2008101976A RU2008101976A RU2008101976/14A RU2008101976A RU2008101976A RU 2008101976 A RU2008101976 A RU 2008101976A RU 2008101976/14 A RU2008101976/14 A RU 2008101976/14A RU 2008101976 A RU2008101976 A RU 2008101976A RU 2008101976 A RU2008101976 A RU 2008101976A
- Authority
- RU
- Russia
- Prior art keywords
- thermoelectric module
- exposure
- junctions
- probe
- endonasal
- Prior art date
Links
- 238000001467 acupuncture Methods 0.000 title claims abstract 3
- 239000004065 semiconductor Substances 0.000 title claims abstract 3
- 238000010438 heat treatment Methods 0.000 claims abstract 4
- 239000000523 sample Substances 0.000 claims abstract 4
- 239000004020 conductor Substances 0.000 claims abstract 2
- 239000003989 dielectric material Substances 0.000 claims abstract 2
Landscapes
- Finger-Pressure Massage (AREA)
Abstract
Термоэлектрическое полупроводниковое устройство для воздействия на эндоназальные точки акупунктуры, содержащее зонд с изогнутым активным концом сферической поверхностью, и нагревательным элементом, отличающееся тем, что нагревательный элемент дополнительно к функции теплового воздействия снабжен функцией холодового воздействия, обеспечивающего контрастность, при этом элемент воздействия представляет собой рабочую головку, выполненную из высокотеплопроводного материала, имеющего на конце полусферическое закругление, находящуюся в температурном контакте с первыми спаями термоэлектрического модуля, вторые спаи которого сопряжены с воздушным радиатором, а диэлектрический компаунд занимает пространство между элементом воздействия и теплообменником, свободное от термоэлектрического модуля, причем цепи питания термоэлектрического модуля проложены в зонде устройства, служащего рукояткой.Thermoelectric semiconductor device for influencing the endonasal points of acupuncture, containing a probe with a curved active end spherical surface, and a heating element, characterized in that the heating element is in addition to the function of the thermal effect is equipped with a cold exposure function, providing contrast, while the exposure element is a working head made of a highly thermally conductive material having a hemispherical rounding at the end located I am in temperature contact with the first junctions of the thermoelectric module, the second junctions of which are interfaced with an air radiator, and the dielectric compound occupies the space between the exposure element and the heat exchanger free from the thermoelectric module, and the power supply circuits of the thermoelectric module are laid in the probe of the device serving as a handle.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2008101976/14A RU2008101976A (en) | 2008-01-18 | 2008-01-18 | THERMOELECTRIC SEMICONDUCTOR DEVICE FOR INFLUENCE ON ENDONASAL ACUPUNCTURE POINTS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2008101976/14A RU2008101976A (en) | 2008-01-18 | 2008-01-18 | THERMOELECTRIC SEMICONDUCTOR DEVICE FOR INFLUENCE ON ENDONASAL ACUPUNCTURE POINTS |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2008101976A true RU2008101976A (en) | 2009-07-27 |
Family
ID=41047933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2008101976/14A RU2008101976A (en) | 2008-01-18 | 2008-01-18 | THERMOELECTRIC SEMICONDUCTOR DEVICE FOR INFLUENCE ON ENDONASAL ACUPUNCTURE POINTS |
Country Status (1)
| Country | Link |
|---|---|
| RU (1) | RU2008101976A (en) |
-
2008
- 2008-01-18 RU RU2008101976/14A patent/RU2008101976A/en not_active Application Discontinuation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA92 | Acknowledgement of application withdrawn (lack of supplementary materials submitted) |
Effective date: 20090902 |