RU2013109250A - IP COOLING DEVICE - Google Patents
IP COOLING DEVICE Download PDFInfo
- Publication number
- RU2013109250A RU2013109250A RU2013109250/07A RU2013109250A RU2013109250A RU 2013109250 A RU2013109250 A RU 2013109250A RU 2013109250/07 A RU2013109250/07 A RU 2013109250/07A RU 2013109250 A RU2013109250 A RU 2013109250A RU 2013109250 A RU2013109250 A RU 2013109250A
- Authority
- RU
- Russia
- Prior art keywords
- heat transfer
- temperature
- cooling
- semiconductor
- thermocouple
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims abstract 10
- 238000001816 cooling Methods 0.000 claims abstract 8
- 230000005679 Peltier effect Effects 0.000 claims abstract 4
- 238000005476 soldering Methods 0.000 claims abstract 4
- 239000000758 substrate Substances 0.000 claims abstract 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 2
- 239000000919 ceramic Substances 0.000 claims abstract 2
- 239000013078 crystal Substances 0.000 claims abstract 2
- 238000010438 heat treatment Methods 0.000 claims abstract 2
- 238000001465 metallisation Methods 0.000 claims abstract 2
- 230000007704 transition Effects 0.000 claims abstract 2
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Устройство охлаждения ИС, основанное на использовании эффекта Пельтье, по которому на ИС в керамическом корпусе наклеивается алюминиевый теплорассекатель, а на него охлаждающий полупроводниковый блок, использующий эффект Пельтье, отличающееся тем, что основание корпуса ИС является одновременно верхним теплопереходом охлаждающего полупроводникового блока, при этом пайка кристаллов к подложке, подложки с основанием корпуса (верхним теплопереходом ТЭМ), верхнего теплоперехода с одной поверхностью полупроводниковых ветвей p- и n-типа происходит при температуре на 20-25°C ниже температуры пайки другой поверхности полупроводниковых ветвей к нижнему теплопереходу, причем полупроводниковые ветви размещены между теплопереходами таким образом, что все горячие поверхности контактируют с одним теплопереходом, а все холодные - с противоположным и с помощью металлизации соединены в единую электрическую цепь, которая подключена к источнику питания, для контроля температуры корпуса ИС к нему крепится термопара, а для стабилизации температуры (нагрева или охлаждения) термопара соединена с блоком переключения полярности источника питания.IC cooling device based on the use of the Peltier effect, by which an aluminum heat dissipator is glued to the IC in a ceramic case, and a cooling semiconductor block using the Peltier effect is used, characterized in that the base of the IC case is simultaneously the upper heat transfer of the cooling semiconductor block, while soldering crystals to the substrate, the substrate with the base of the body (the upper heat transfer TEM), the upper heat transfer with one surface of semiconductor branches of p- and n-type comes at a temperature of 20-25 ° C below the soldering temperature of the other surface of the semiconductor branches to the lower heat transfer, the semiconductor branches are placed between the heat transitions in such a way that all hot surfaces are in contact with one heat transfer, and all cold surfaces are connected to the opposite and with the help of metallization in a single electrical circuit that is connected to a power source, a thermocouple is attached to it to control the temperature of the IP housing, and to stabilize the temperature (heating or cooling), the thermocouple inena with power source polarity switching unit.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2013109250/07A RU2528392C1 (en) | 2013-03-01 | 2013-03-01 | Ic cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2013109250/07A RU2528392C1 (en) | 2013-03-01 | 2013-03-01 | Ic cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2013109250A true RU2013109250A (en) | 2014-09-10 |
| RU2528392C1 RU2528392C1 (en) | 2014-09-20 |
Family
ID=51539769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2013109250/07A RU2528392C1 (en) | 2013-03-01 | 2013-03-01 | Ic cooling device |
Country Status (1)
| Country | Link |
|---|---|
| RU (1) | RU2528392C1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180315679A1 (en) * | 2015-10-07 | 2018-11-01 | Ceramtec Gmbh | Circuit cooled on two-sides |
| RU168761U1 (en) * | 2016-09-20 | 2017-02-17 | Акционерное общество "Научно-исследовательский институт "Полюс" им. М.Ф. Стельмаха" | Device for cooling secondary power supplies |
| RU2718547C1 (en) * | 2018-12-20 | 2020-04-08 | Общество с ограниченной ответственностью "ПСО-Проджект" | Cooling method of solid-state relay |
| RU201912U1 (en) * | 2020-09-25 | 2021-01-21 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Петрозаводский государственный университет" | Top Heatsink Multichip |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5457342A (en) * | 1994-03-30 | 1995-10-10 | Herbst, Ii; Gerhardt G. | Integrated circuit cooling apparatus |
| US20040155251A1 (en) * | 2003-02-07 | 2004-08-12 | Vladimir Abramov | Peltier cooler integrated with electronic device(s) |
| RU2310950C1 (en) * | 2006-05-24 | 2007-11-20 | Закрытое акционерное общество "Конструкторское бюро Технотроник" | Thermoelectric element |
-
2013
- 2013-03-01 RU RU2013109250/07A patent/RU2528392C1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| RU2528392C1 (en) | 2014-09-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20180302 |