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PH12021552725A1 - Cover tape for packing electronic component and package - Google Patents

Cover tape for packing electronic component and package

Info

Publication number
PH12021552725A1
PH12021552725A1 PH1/2021/552725A PH12021552725A PH12021552725A1 PH 12021552725 A1 PH12021552725 A1 PH 12021552725A1 PH 12021552725 A PH12021552725 A PH 12021552725A PH 12021552725 A1 PH12021552725 A1 PH 12021552725A1
Authority
PH
Philippines
Prior art keywords
cover tape
package
electronic component
base material
packing electronic
Prior art date
Application number
PH1/2021/552725A
Inventor
Masakuni Inoue
Yasunori Nagatsuka
Shunpei Yanagisawa
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of PH12021552725A1 publication Critical patent/PH12021552725A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a cover tape which is for packaging electronic components and which has: a base material layer; a heat seal layer that is disposed on one surface side of the base material layer and that contains an ethylene-vinyl acetate copolymer and a polyethylene resin; and an antistatic layer disposed on a surface side opposite to the surface on the side of the heat seal layer of the base material layer.
PH1/2021/552725A 2019-04-03 2020-04-02 Cover tape for packing electronic component and package PH12021552725A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019071334 2019-04-03
PCT/JP2020/015204 WO2020204138A1 (en) 2019-04-03 2020-04-02 Electronic component packaging cover tape and package

Publications (1)

Publication Number Publication Date
PH12021552725A1 true PH12021552725A1 (en) 2022-07-11

Family

ID=72668046

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2021/552725A PH12021552725A1 (en) 2019-04-03 2020-04-02 Cover tape for packing electronic component and package

Country Status (6)

Country Link
JP (2) JP6822626B1 (en)
KR (1) KR102646543B1 (en)
CN (1) CN113646242B (en)
PH (1) PH12021552725A1 (en)
TW (1) TWI841722B (en)
WO (1) WO2020204138A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7409542B1 (en) * 2023-03-24 2024-01-09 住友ベークライト株式会社 Cover tape for electronic component packaging and electronic component packaging

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131106A (en) * 1981-02-05 1982-08-13 Matsushita Electric Ind Co Ltd Synchronizing detecting device
JPH1095448A (en) 1996-09-18 1998-04-14 Dainippon Printing Co Ltd Cover material for carrier tape
JP2000280411A (en) * 1999-03-31 2000-10-10 Dainippon Printing Co Ltd Laminated plastic film, transparent conductive cover tape and package
JP3514699B2 (en) * 2000-05-01 2004-03-31 電気化学工業株式会社 Cover tape
JP4460870B2 (en) * 2003-10-09 2010-05-12 北越紀州製紙株式会社 Carrier tape paper for chip electronic devices
JP2005178073A (en) * 2003-12-17 2005-07-07 Shin Etsu Polymer Co Ltd Cover tape and package
WO2012079258A1 (en) * 2010-12-17 2012-06-21 3M Innovative Properties Company Heat-sealing film and cover tape for packaging electronic components
WO2013042727A1 (en) * 2011-09-22 2013-03-28 東ソー株式会社 Adhesive resin composition and easy-peeling film
KR20160030135A (en) * 2013-07-09 2016-03-16 스미또모 베이크라이트 가부시키가이샤 Cover tape for packaging electronic components
TWI647297B (en) * 2014-11-12 2019-01-11 Sumitomo Bakelite Co., Ltd. Cover tape for electronic component packaging, packaging material for electronic component packaging, and electronic component package
JP6358403B1 (en) * 2016-09-28 2018-07-18 住友ベークライト株式会社 Resin composition, cover tape, and packaging for electronic parts
WO2018235606A1 (en) * 2017-06-22 2018-12-27 住友ベークライト株式会社 RECOVERY BAND AND ELECTRONIC COMPONENT HOUSING
JP6763421B2 (en) * 2018-09-18 2020-09-30 大日本印刷株式会社 Cover tape and packaging for electronic component packaging

Also Published As

Publication number Publication date
TWI841722B (en) 2024-05-11
JPWO2020204138A1 (en) 2021-04-30
WO2020204138A1 (en) 2020-10-08
JP2021062923A (en) 2021-04-22
TW202043111A (en) 2020-12-01
CN113646242B (en) 2023-04-21
KR20210144738A (en) 2021-11-30
CN113646242A (en) 2021-11-12
JP6822626B1 (en) 2021-01-27
KR102646543B1 (en) 2024-03-13

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