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PH12017502122A1 - Tape for semiconductor processing - Google Patents

Tape for semiconductor processing

Info

Publication number
PH12017502122A1
PH12017502122A1 PH12017502122A PH12017502122A PH12017502122A1 PH 12017502122 A1 PH12017502122 A1 PH 12017502122A1 PH 12017502122 A PH12017502122 A PH 12017502122A PH 12017502122 A PH12017502122 A PH 12017502122A PH 12017502122 A1 PH12017502122 A1 PH 12017502122A1
Authority
PH
Philippines
Prior art keywords
tape
metal layer
semiconductor processing
adhesive layer
semiconductor
Prior art date
Application number
PH12017502122A
Other versions
PH12017502122B1 (en
Inventor
Masami Aoyama
Toru Sano
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of PH12017502122A1 publication Critical patent/PH12017502122A1/en
Publication of PH12017502122B1 publication Critical patent/PH12017502122B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

A tape for semiconductor processing is provided which enables excellent singulation of semiconductor wafers during dicing and which enables preventing package cracking during packaging. This semiconductor processing tape 10 is characterized by comprising: a dicing tape 13 comprising a substrate film 11 and an adhesive layer 12; a metal layer 14 provided on the adhesive layer 12 to protect the back surface of the semiconductor chip; and an adhesive layer 15 provided on the metal layer 14 to adhere the metal layer 14 to the back surface of the semiconductor chip, wherein the surface roughness RzJIS of the metal layer 14, based on the 10-point mean roughness, is greater than or equal to 0.5 mm and less than 10.0 mm.
PH12017502122A 2015-12-25 2017-11-21 Tape for semiconductor processing PH12017502122B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015255312 2015-12-25
PCT/JP2016/079626 WO2017110202A1 (en) 2015-12-25 2016-10-05 Tape for semiconductor processing

Publications (2)

Publication Number Publication Date
PH12017502122A1 true PH12017502122A1 (en) 2018-05-28
PH12017502122B1 PH12017502122B1 (en) 2018-05-28

Family

ID=59089986

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12017502122A PH12017502122B1 (en) 2015-12-25 2017-11-21 Tape for semiconductor processing

Country Status (8)

Country Link
JP (1) JP6757743B2 (en)
KR (1) KR102580602B1 (en)
CN (1) CN107614641B (en)
MY (1) MY184346A (en)
PH (1) PH12017502122B1 (en)
SG (1) SG11201708850VA (en)
TW (1) TWI636886B (en)
WO (1) WO2017110202A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102561868B1 (en) * 2017-07-25 2023-07-31 세키스이가가쿠 고교가부시키가이샤 Adhesive tape for protecting semiconductors and methods for processing semiconductors
CN109454955B (en) * 2018-12-19 2021-07-06 广东生益科技股份有限公司 A kind of packaging carrier tape base material and preparation method thereof
JP7512848B2 (en) * 2020-11-02 2024-07-09 大日本印刷株式会社 LAMINATE AND METHOD FOR MANUFACTURING LAMINATE
CN115410927B (en) * 2022-09-29 2024-09-27 北京超材信息科技有限公司 Semiconductor device cutting method

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167699A (en) * 1997-08-13 1999-03-09 Texas Instr Japan Ltd Method for manufacturing semiconductor device
JP3071764B2 (en) * 1998-08-31 2000-07-31 京セラ株式会社 Film with metal foil and method of manufacturing wiring board using the same
JP2003298230A (en) * 2002-03-28 2003-10-17 Tokai Rubber Ind Ltd Substrate for flexible printed wiring board
JP2004189981A (en) * 2002-12-13 2004-07-08 Kanegafuchi Chem Ind Co Ltd Thermoplastic polyimide resin material, laminate, and method for producing printed wiring board
JP2006103108A (en) * 2004-10-04 2006-04-20 Sekisui Chem Co Ltd Film with metal foil
JP4865312B2 (en) 2005-12-05 2012-02-01 古河電気工業株式会社 Chip protection film forming sheet
JP2007235022A (en) 2006-03-03 2007-09-13 Mitsui Chemicals Inc Adhesive film
JP4849993B2 (en) * 2006-08-14 2012-01-11 日東電工株式会社 Adhesive sheet, method for producing the same, and method for cutting laminated ceramic sheet
JP5298913B2 (en) * 2009-02-12 2013-09-25 信越化学工業株式会社 Adhesive composition and protective sheet for semiconductor wafer using the same
JP5486831B2 (en) * 2009-03-19 2014-05-07 積水化学工業株式会社 Dicing tape and semiconductor chip manufacturing method
JP5681374B2 (en) * 2010-04-19 2015-03-04 日東電工株式会社 Dicing tape integrated semiconductor backside film
JP5356326B2 (en) * 2010-07-20 2013-12-04 日東電工株式会社 Manufacturing method of semiconductor device
JP5419226B2 (en) * 2010-07-29 2014-02-19 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof
JP6144868B2 (en) * 2010-11-18 2017-06-07 日東電工株式会社 Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, and flip chip semiconductor back film manufacturing method
JP6007576B2 (en) * 2012-05-09 2016-10-12 日立化成株式会社 Manufacturing method of semiconductor device
JP6213055B2 (en) * 2013-08-26 2017-10-18 日立化成株式会社 Wafer processing tape
JP2015129247A (en) * 2014-01-09 2015-07-16 住友ベークライト株式会社 Resin composition, adhesive film, adhesive sheet, dicing tape integrated adhesive sheet, back grind tape integrated adhesive sheet, dicing tape and back grind tape integrated adhesive sheet, and electronic device
JP6229528B2 (en) * 2014-02-17 2017-11-15 日立化成株式会社 Semiconductor device manufacturing method, semiconductor device, and adhesive composition
TWI653312B (en) * 2014-03-11 2019-03-11 日商味之素股份有限公司 Film
JP6299315B2 (en) * 2014-03-20 2018-03-28 日立化成株式会社 Wafer processing tape
JP6078578B2 (en) * 2015-04-22 2017-02-08 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof

Also Published As

Publication number Publication date
JPWO2017110202A1 (en) 2018-10-11
CN107614641A (en) 2018-01-19
MY184346A (en) 2021-04-01
KR102580602B1 (en) 2023-09-20
JP6757743B2 (en) 2020-09-23
PH12017502122B1 (en) 2018-05-28
TWI636886B (en) 2018-10-01
CN107614641B (en) 2021-07-09
WO2017110202A1 (en) 2017-06-29
TW201728443A (en) 2017-08-16
SG11201708850VA (en) 2018-07-30
KR20180097445A (en) 2018-08-31

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