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PE20070092A1 - Unidad electronica de control y proceso para su produccion - Google Patents

Unidad electronica de control y proceso para su produccion

Info

Publication number
PE20070092A1
PE20070092A1 PE2006000694A PE2006000694A PE20070092A1 PE 20070092 A1 PE20070092 A1 PE 20070092A1 PE 2006000694 A PE2006000694 A PE 2006000694A PE 2006000694 A PE2006000694 A PE 2006000694A PE 20070092 A1 PE20070092 A1 PE 20070092A1
Authority
PE
Peru
Prior art keywords
electronic component
coating
injection
electronic
uec
Prior art date
Application number
PE2006000694A
Other languages
English (en)
Inventor
Ryuichi Kimata
Keiichuro Bungo
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Publication of PE20070092A1 publication Critical patent/PE20070092A1/es

Links

Classifications

    • H10W74/10—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/01—
    • H10W74/016—
    • H10W74/121—
    • H10W74/40—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Means For Warming Up And Starting Carburetors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Control Of Throttle Valves Provided In The Intake System Or In The Exhaust System (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

DONDE LA UNIDAD ELECTRONICA DE CONTROL (UEC) INCLUYE: a) UNA PLAQUETA DE CIRCUITO IMPRESO, EL CUAL INCLUYE UN COMPONENTE ELECTRONICO MONTADO EN EL; Y, b) UN RECUBRIMIENTO DE RESINA SINTETICA, FORMADO POR MOLDEO POR INYECCION, PARA CUBRIR (a). EL COMPONENTE ELECTRONICO ESTA ALOJADO EN UNA CAJA PROTECTORA QUE PUEDE RESISTIR LA PRESION Y EL CALOR DURANTE EL MOLDEO POR INYECCION DEL RECUBRIMIENTO, DE MODO QUE EN LA (UEC) EL COMPONENTE ELECTRONICO NO SE DANA DEBIDO A LA FORMACION DEL RECUBRIMIENTO POR MOLDEO POR INYECCION, Y LA UEC PUEDE FUNCIONAR SIEMPRE NORMALMENTE. EL COMPONENTE ELECTRONICO SE LIMITA A UNO QUE TIENE UNA ALTURA PARTICULARMENTE ELEVADA ENTRE VARIOS TIPOS DE COMPONENTES ELECTRONICOS MONTADOS EN (a). EL PROCESO COMPRENDE: i) MONTAJE EN (a) DEL COMPONENTE ELECTRONICO, Y, ii) MOLDEO DEL RECUBRIMIENTO QUE CONSISTE EN COLOCAR DENTRO DE UN MOLDE (a), EN LA QUE SE MONTO EL COMPONENTE ELECTRONICO, INYECTANDO UN MATERIAL FUNDIDO CALIENTE EN UNA CAVIDAD QUE POSEE UN ESPACIO UNIFORME DEFINIDO POR EL MOLDE QUE RODEA (a) Y EL COMPONENTE ELECTRONICO
PE2006000694A 2005-06-23 2006-06-21 Unidad electronica de control y proceso para su produccion PE20070092A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005183609A JP4744947B2 (ja) 2005-06-23 2005-06-23 電子制御ユニット及びその製造方法

Publications (1)

Publication Number Publication Date
PE20070092A1 true PE20070092A1 (es) 2007-02-07

Family

ID=37570540

Family Applications (1)

Application Number Title Priority Date Filing Date
PE2006000694A PE20070092A1 (es) 2005-06-23 2006-06-21 Unidad electronica de control y proceso para su produccion

Country Status (14)

Country Link
US (1) US7829798B2 (es)
EP (1) EP1895583B1 (es)
JP (1) JP4744947B2 (es)
KR (1) KR101070720B1 (es)
CN (1) CN101203955B (es)
AR (1) AR054494A1 (es)
AU (1) AU2006260110B2 (es)
BR (1) BRPI0611776A2 (es)
CA (1) CA2608550C (es)
MY (1) MY150899A (es)
PA (1) PA8682101A1 (es)
PE (1) PE20070092A1 (es)
TW (1) TWI305035B (es)
WO (1) WO2006137523A1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006045146A1 (de) * 2006-07-17 2008-01-31 Diehl Ako Stiftung & Co. Kg Antriebsvorrichtung für eine Waschmaschine
GB2464475B (en) * 2008-10-15 2013-05-15 Haldex Brake Products Ltd Method of protecting electronic components
JP5256994B2 (ja) * 2008-10-24 2013-08-07 富士電機株式会社 半導体装置
JP2010245174A (ja) * 2009-04-02 2010-10-28 Denso Corp 電子制御ユニット及びその製造方法
CN104682722B (zh) 2013-11-26 2018-01-26 台达电子企业管理（上海）有限公司 电源转换装置及其组装方法
CN106414959A (zh) * 2014-05-01 2017-02-15 布里格斯和斯特拉顿公司 电子调速器系统和负荷感测系统
DE102015225099A1 (de) * 2015-12-14 2017-06-14 Robert Bosch Gmbh Elektronikmodul, insbesondere für Getriebesteuergerät, und Verfahren zum Fertigen eines solchen
DE102018218783A1 (de) * 2018-11-05 2020-05-07 Zf Friedrichshafen Ag Elektronische Einheit mit elektronischen Bauelementen und einer Anordnung zum Schutz derselben vor Druckbeaufschlagung
KR102765498B1 (ko) * 2020-06-23 2025-02-12 주식회사 엘지에너지솔루션 회로 기판 어셈블리 제조 방법, 이에 의해 제조된 회로 기판 어셈블리 및 이를 구비하는 전기 자동차

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2737010C2 (de) * 1977-08-17 1983-06-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mit einer elektrisch isoloerenden Tauchumhüllung bedeckte, hybride Schichtschaltung mit zugänglichen Bauelementen
GB8323755D0 (en) * 1983-09-05 1983-10-05 Marconi Avionics Encapsulation process
CN2105804U (zh) * 1991-08-05 1992-05-27 无锡市晶体管厂 电力电子控制驱动执行装置
JP3353526B2 (ja) * 1995-03-23 2002-12-03 株式会社デンソー 半導体パッケージ及びその製造方法
US6117382A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Method for encasing array packages
US6259157B1 (en) 1998-03-11 2001-07-10 Sanyo Electric Co., Ltd. Hybrid integrated circuit device, and method of manufacturing thereof
JP3469804B2 (ja) * 1999-02-22 2003-11-25 株式会社コージン Ｉｃのパッケージ成形方法
JP2001054286A (ja) * 1999-08-06 2001-02-23 Mitsubishi Electric Corp 電子制御基板
JP4230679B2 (ja) * 2000-06-26 2009-02-25 株式会社東芝 半導体樹脂モールド装置および半導体樹脂モールド方法
DE10042636C1 (de) * 2000-08-30 2002-04-11 Epcos Ag Elektrisches Bauelement und Verfahren zu dessen Herstellung
JP2004363406A (ja) * 2003-06-06 2004-12-24 Honda Motor Co Ltd 樹脂封止電子部品ユニット及びその製造方法
US20050000726A1 (en) * 2003-06-06 2005-01-06 Honda Motor Co., Ltd. Resin encapsulated electronic component unit and method of manufacturing the same

Also Published As

Publication number Publication date
US20090101390A1 (en) 2009-04-23
MY150899A (en) 2014-03-14
KR101070720B1 (ko) 2011-10-07
EP1895583B1 (en) 2014-05-07
JP2007005551A (ja) 2007-01-11
US7829798B2 (en) 2010-11-09
KR20080014022A (ko) 2008-02-13
WO2006137523A1 (ja) 2006-12-28
PA8682101A1 (es) 2007-01-17
CN101203955B (zh) 2010-05-19
CA2608550A1 (en) 2006-12-28
CA2608550C (en) 2012-02-07
AU2006260110A1 (en) 2006-12-28
EP1895583A1 (en) 2008-03-05
JP4744947B2 (ja) 2011-08-10
AR054494A1 (es) 2007-06-27
BRPI0611776A2 (pt) 2010-09-28
EP1895583A4 (en) 2008-11-19
TW200703595A (en) 2007-01-16
AU2006260110B2 (en) 2010-05-27
TWI305035B (en) 2009-01-01
CN101203955A (zh) 2008-06-18

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Legal Events

Date Code Title Description
FG Grant, registration
FD Application declared void or lapsed