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TW200704309A - Manufacturing method of mounting substrate with reflector - Google Patents

Manufacturing method of mounting substrate with reflector

Info

Publication number
TW200704309A
TW200704309A TW094133473A TW94133473A TW200704309A TW 200704309 A TW200704309 A TW 200704309A TW 094133473 A TW094133473 A TW 094133473A TW 94133473 A TW94133473 A TW 94133473A TW 200704309 A TW200704309 A TW 200704309A
Authority
TW
Taiwan
Prior art keywords
reflector
electric conduction
plating film
foils
manufacturing
Prior art date
Application number
TW094133473A
Other languages
Chinese (zh)
Other versions
TWI353807B (en
Inventor
Goro Narita
Original Assignee
Element Denshi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Element Denshi Co Ltd filed Critical Element Denshi Co Ltd
Publication of TW200704309A publication Critical patent/TW200704309A/en
Application granted granted Critical
Publication of TWI353807B publication Critical patent/TWI353807B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Conventionally, white resin with high reflectivity is much used as a reflector for reflecting the light from illuminating elements, but the reflector needs a mold for resin molding and it takes time for trial production. In the present invention, reflector substrate (34) is provided with electric conduction foils (35, 36) on both sides, through hole (31) is so formed as to pass through electric conduction foils (35, 36), slant surface (32) of inner wall of through hole is formed with electric conduction plating film (37), and reflection plating film (33) is formed on the electric conduction foil (35) and electric conduction plating film(37), thereby the reflector can be mechanically formed on a glass epoxy substrate.
TW094133473A 2005-07-04 2005-09-27 Manufacturing method of mounting substrate withref TWI353807B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005195610A JP3963923B2 (en) 2005-07-04 2005-07-04 Manufacturing method of mounting substrate with reflector

Publications (2)

Publication Number Publication Date
TW200704309A true TW200704309A (en) 2007-01-16
TWI353807B TWI353807B (en) 2011-12-01

Family

ID=37597689

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133473A TWI353807B (en) 2005-07-04 2005-09-27 Manufacturing method of mounting substrate withref

Country Status (4)

Country Link
JP (1) JP3963923B2 (en)
KR (1) KR101155693B1 (en)
CN (1) CN1892979A (en)
TW (1) TWI353807B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100958329B1 (en) 2009-08-14 2010-05-17 (주)참빛 Light emitting diode package substrate having side reflective surface coated with metals using mask and manufacturing method thereof
JP5780044B2 (en) * 2011-08-05 2015-09-16 大日本印刷株式会社 Manufacturing method of substrate with reflector
JP2013110179A (en) * 2011-11-18 2013-06-06 Citizen Holdings Co Ltd Semiconductor light-emitting device
KR101292197B1 (en) * 2012-04-10 2013-08-01 대덕전자 주식회사 Method for manufacturing a reflector for led chip mounted printed circuit board
JP2014063777A (en) * 2012-09-19 2014-04-10 Chang Wah Electromaterials Inc Method of manufacturing light-emitting diode package and structure thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220178A (en) * 1998-01-30 1999-08-10 Rohm Co Ltd Semiconductor light-emitting device

Also Published As

Publication number Publication date
KR101155693B1 (en) 2012-06-12
CN1892979A (en) 2007-01-10
TWI353807B (en) 2011-12-01
JP3963923B2 (en) 2007-08-22
KR20070004402A (en) 2007-01-09
JP2007013067A (en) 2007-01-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees