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KR900700556A - 실리콘 웨이퍼 연마용 화합물 - Google Patents

실리콘 웨이퍼 연마용 화합물

Info

Publication number
KR900700556A
KR900700556A KR1019890701994A KR890701994A KR900700556A KR 900700556 A KR900700556 A KR 900700556A KR 1019890701994 A KR1019890701994 A KR 1019890701994A KR 890701994 A KR890701994 A KR 890701994A KR 900700556 A KR900700556 A KR 900700556A
Authority
KR
South Korea
Prior art keywords
silicon wafer
wafer polishing
polishing compound
compound
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019890701994A
Other languages
English (en)
Other versions
KR930002764B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR900700556A publication Critical patent/KR900700556A/ko
Application granted granted Critical
Publication of KR930002764B1 publication Critical patent/KR930002764B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H10P52/402—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Silicon Compounds (AREA)
KR1019890701994A 1988-06-03 1989-06-02 실리콘 웨이퍼 연마용 화합물 Expired - Lifetime KR930002764B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP135451 1988-06-03
JP13545188 1988-06-03
JP69881 1989-03-22
JP6988189 1989-03-22
PCT/JP1989/000558 WO1989012082A1 (fr) 1988-06-03 1989-06-02 Substance abrasive pour tranches de silicium

Publications (2)

Publication Number Publication Date
KR900700556A true KR900700556A (ko) 1990-08-16
KR930002764B1 KR930002764B1 (ko) 1993-04-10

Family

ID=26411060

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890701994A Expired - Lifetime KR930002764B1 (ko) 1988-06-03 1989-06-02 실리콘 웨이퍼 연마용 화합물

Country Status (4)

Country Link
EP (1) EP0371147B1 (ko)
JP (1) JP2782692B2 (ko)
KR (1) KR930002764B1 (ko)
WO (1) WO1989012082A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030013146A (ko) * 2001-08-07 2003-02-14 에이스하이텍 주식회사 실리콘 웨이퍼 연마제 조성물과 그 제조방법

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2862073B2 (ja) * 1995-12-08 1999-02-24 日本電気株式会社 ウェハー研磨方法
US6646348B1 (en) * 2000-07-05 2003-11-11 Cabot Microelectronics Corporation Silane containing polishing composition for CMP
WO2003038883A1 (en) 2001-10-31 2003-05-08 Hitachi Chemical Co., Ltd. Polishing fluid and polishing method
DE10164262A1 (de) * 2001-12-27 2003-07-17 Bayer Ag Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen
JP2003277731A (ja) * 2002-03-26 2003-10-02 Catalysts & Chem Ind Co Ltd 研磨用粒子および研磨材
JP4554142B2 (ja) * 2002-04-30 2010-09-29 日揮触媒化成株式会社 基板洗浄用粒子および該基板洗浄用粒子を含む洗浄材、基材の洗浄方法
US8202502B2 (en) 2006-09-15 2012-06-19 Cabot Corporation Method of preparing hydrophobic silica
US20080070146A1 (en) 2006-09-15 2008-03-20 Cabot Corporation Hydrophobic-treated metal oxide
US8455165B2 (en) 2006-09-15 2013-06-04 Cabot Corporation Cyclic-treated metal oxide
US8435474B2 (en) 2006-09-15 2013-05-07 Cabot Corporation Surface-treated metal oxide particles
JP2008288398A (ja) 2007-05-18 2008-11-27 Nippon Chem Ind Co Ltd 半導体ウェハーの研磨用組成物、その製造方法、及び研磨加工方法
CN101338082A (zh) * 2007-07-06 2009-01-07 安集微电子（上海）有限公司 改性二氧化硅溶胶及其制备方法和应用
JP5385619B2 (ja) * 2009-01-15 2014-01-08 株式会社アドマテックス 研磨用組成物、研磨用部材、及び研磨方法
CN104371552B (zh) * 2013-08-14 2017-09-15 安集微电子（上海）有限公司 含硅有机化合物在延长化学机械抛光液中研磨颗粒稳定性中的应用
CN104371553B (zh) * 2013-08-14 2017-10-13 安集微电子（上海）有限公司 一种化学机械抛光液以及应用
CN104371550B (zh) * 2013-08-14 2018-02-09 安集微电子（上海）有限公司 一种用于抛光硅材料的化学机械抛光液
WO2020092789A1 (en) 2018-10-31 2020-05-07 Kvh Industries, Inc. Method and apparatus for control and suppression of stray light in a photonic integrated circuit
US12352571B2 (en) 2021-08-11 2025-07-08 Emcore Corporation In-situ residual intensity noise measurement method and system
WO2023211518A2 (en) 2021-11-30 2023-11-02 Emcore Corporation Multi-axis fiber optic gyroscope photonic integrated circuit for inertial measurement units and inertial navigation systems

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3170273A (en) * 1963-01-10 1965-02-23 Monsanto Co Process for polishing semiconductor materials
US3485608A (en) * 1968-01-02 1969-12-23 Texas Instruments Inc Slurry for polishing silicon slices
US4260396A (en) * 1978-01-16 1981-04-07 W. R. Grace & Co. Compositions for polishing silicon and germanium
JP3146395B2 (ja) * 1993-01-29 2001-03-12 ローム株式会社 液晶セルの位置決め装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030013146A (ko) * 2001-08-07 2003-02-14 에이스하이텍 주식회사 실리콘 웨이퍼 연마제 조성물과 그 제조방법

Also Published As

Publication number Publication date
EP0371147B1 (en) 1993-05-19
EP0371147A4 (en) 1990-09-19
JP2782692B2 (ja) 1998-08-06
EP0371147A1 (en) 1990-06-06
WO1989012082A1 (fr) 1989-12-14
KR930002764B1 (ko) 1993-04-10

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